Abstract: An information handling system may include a chassis having a first region and a second region, wherein the first region includes a memory module, and wherein the second region includes a processing unit; at least one air mover configured to provide airflow; and an airflow shroud including an airflow baffle. When the airflow shroud is installed in the information handling system in a first orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the first region. When the airflow shroud is installed in the information handling system in a second orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the second region.

Abstract: A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: A data storage system includes a chassis housing multiple data storage devices, such as hard disk drives, a compartment housing cooling fans, and an air plenum positioned between the fans and the storage devices. A multibody chambered acoustic attenuator, which may be installed in the air plenum, includes a plate part having airflow holes therethrough and may include a convex arched part having airflow holes therethrough and coupled with the plate part to form a chamber. Acoustic damping material lines an interior surface of the plate part and the interior and exterior surfaces of the arched part, and the airflow holes of the plate part and of the arched part are not aligned, such that direct acoustic emissions and reflections would contact the acoustic damping material and a circuitous airflow path is provided from the cooling fans to the storage devices, to reduce the acoustic sound pressure upon the devices.

Abstract: Embodiments of the invention provide an adjustable barrier assembly for enclosure, and related methods of installation. The adjustable barrier assembly includes a barrier panel that includes a first panel slidable relative to a second panel to accommodate different depths of different enclosures. The assembly further includes a top support bracket, an upper barrier plate, a bottom support bracket, and a lower barrier plate. Each of the upper barrier plate and the lower barrier plate can be secured to the top support bracket and the bottom support bracket, respectively, at different relative orientations in order to accommodate different heights of different enclosures.

Abstract: Disclosed is a prefabricating and stacking combined data center. The data center is formed block structures in a multi-dimensional stacking manner. The block structures are disposed to be a fire protection layer, an air return layer, a bridge architecture wiring layer, a top-cabinet wiring layer, a cabinet device layer, and an air supply layer from up to down, which are independent from each other. Provided is a prefabricating and stacking combined data center. Operation difficulty of site construction is greatly reduced by prefabricating block structures by a factory, forming the data center by multi-dimensional stacking, and connecting the block structures with each other by splicing on site. In addition, according to different requirements of customers, corresponding ancillary facilities may be designed based on volume of an IT device, and the device and a computer room may be reasonably and effectively arranged according to the corresponding national standards and specifications.

Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.

Abstract: A power converter includes: a plurality of semiconductor devices; a heat receiving plate; and a first partition member. The semiconductor devices constitute a power conversion unit. The heat receiving plate includes a first surface supporting the semiconductor devices. The first partition member is fixed to the heat receiving plate and partitions the semiconductor devices.

Abstract: A server information handling system may include a processor; a network interface device (NID); a power source; a vertical backplane for providing electrical and data coupling to a plurality of hard disk drives (HDDs) operatively coupled to the vertical back plane; a plurality of vent holes formed through the vertical backplane; and an acoustic dampening device including a duct extension protruding away from the plurality of vent holes formed through the vertical backplane; the duct extensions to acoustically separate a fan system of the server information handling system from the plurality of HDDs within the information handling system server by mitigation of acoustic energy transmission generated by airflow through the plurality of vent holes.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The present disclosure relates to a display device, an electronic device and a device mounting member. The display device includes: a first display module having a first backplane; a second display module having a second backplane located on an opposite side of the first backplane; a first heat sink located between the first backplane and the second backplane; and a second heat sink connected to the first heat sink in thermal conduction.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: A disclosed system includes (1) at least one hardware component mounted to a drawer of a chassis, (2) a fan module capable of generating airflow to cool the hardware component, and (3) an extensible airduct coupled between the hardware component and the fan module such that, when the drawer of the chassis is opened, the extensible airduct stretches out to lengthen a distance between the hardware component and the fan module and, when the drawer of the chassis is closed, the extensible airduct contracts to shorten the distance between the hardware component and the fan module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A data centre (10) includes one or more controllable air circulation systems (e.g. air optimiser (11)), one or more cold aisles (15) and/or one or more hot aisles (16), one or more rows of racks (14), the data centre being so arranged that in use cooling air (18) passes, under the control of the one or more controllable air circulation systems, from a cold aisle (15) through the racks (14) and/or through the racks (14) to a hot aisle (16). An access door (20), which provides access to at least one of the aisles, is movable between an open position allowing personnel access to the aisle and a closed position. The door (20) has an aperture (25) in which is provided a controllable air intake arrangement, for example comprising a vent (17) in the form of multiple vertically extending rotatable blades (28).

Abstract: Systems and methods that may be implemented to provide supplemental cooling air for a portable information handling system from one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned at multiple different locations relative to a portable information handling system, such as notebook computer or laptop computer. In one example, the disclosed systems and methods may be implemented to have one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned to align with differing geometries of cooling air inlet opening locations that correspond to different portable information handling system sizes and/or designs.

Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: An air mover assembly may be configured such that during insertion of the assembly into an air mover gantry, one or more spring features integral to the gantry apply a first spring force opposite to a direction of insertion of the assembly relative to the gantry in order to maintain the assembly in an unseated position until the first spring force is overcome by an opposite force to fully seat assembly into the gantry and when the assembly is fully seated within the gantry, the one or more spring features integral to the gantry apply a second spring force to the assembly in a direction of air flow through an air mover of the assembly that biases an exhaust portion of the air mover toward a face of the gantry opposite of the one or more spring features.

Abstract: A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.

Abstract: A fan module frame is configured to fix a fan module in a chassis. The fan module frame includes a first frame component, a second frame component and two latches. The first frame component connects a server fan unit to the second frame component by an elastic fastener. The second frame component has a plurality of chambers, and each of the chambers is configured for the server fan unit to be placed therein. The latches are disposed on two opposite sides of the second frame component and connected to the second frame component. The second frame component fixes the fan module in the chassis through the latches. As such, the fan module is detachably fixed in the chassis and can be removed from the chassis without additional tools, and the fan module frame is compatible with various servers and models, thereby saving design costs and saving space.

Abstract: The disclosure provides a luminous fan including a main body, a light guide member and a light source. The main body includes a fan frame and a plurality of propellers, and the plurality of propellers are rotatably mounted on the fan frame. The light guide member includes an outer light guide ring and a plurality of inner light guide rings, the plurality of inner light guide rings are mounted on the fan frame, the plurality of inner light guide rings each have an air channel, the plurality of propellers are respectively located in the air channels, the outer light guide ring is mounted on the plurality of inner light guide rings and surrounds the plurality of inner light guide rings, and the outer light guide ring is exposed from the luminous fan. The light source is disposed between the outer light guide ring and the inner light guide ring.

Abstract: An enclosure configured to at least partially surround a data storage library, and a system including a data storage library and enclosure(s). The enclosure includes at least one surface configured to surround the at least one library access opening and form a chamber and to permit movement of the movable panel to permit access to the interior of the data storage library, and at least one enclosure access opening in the at least one of the surface to permit access to the interior of the chamber. The enclosure is configured to resist environmental conditions from intruding into the interior of the enclosure, and is further configured to permit exterior environmental conditions from within the interior of the library to intrude into the chamber of the enclosure.

Abstract: Apparatuses and methods include at least one push fan assembly and at least one pull fan assembly and at least one constriction channel or pathway designed to compress air pulled in by the push fan so that as the compressed air exits the at least one constriction channel or pathway, the air undergoes an expansion and cools and the push-pull fan arrangement pulls the cooled air through the housing improving the cooling of computer or electronic components housed in the housing.

Abstract: A power conversion device includes a housing, a power conversion unit, a fan, and a flexible shutter. The shutter is in a sheet shape. The shutter includes an end portion and a movable portion, the end portion being fixed to at least one of the housing and a frame body, the movable portion being movable with respect to the housing. The shutter is configured to be deformed by wind from the fan in a case where the fan is driven and to form a gap through which the wind passes between the shutter and at least one of the housing and the frame body.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: An air baffle insertable between a chassis wall and a computer component such as a GPU and heat sink mounted on a GPU tray to divert air flow to the computer component is disclosed. The air baffle includes a single sheet having a bottom panel, a top panel, and a pair of parallel side walls. Each of the parallel side walls are connected to the bottom and top panels. A first end wall is joined to the side walls and the top and bottom panel. The first end wall directs air flow toward the computer component.

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Abstract: A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.

Abstract: A micro light emitting diode display includes a display module and a hydrophobic layer. The display module includes a substrate, an electrode layer, and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2. The hydrophobic layer at least partially covers a side of the display module.

Abstract: An adaptive airflow flapper assembly may be configured to when present in a first chassis bay adjacent to a second chassis bay unpopulated with a another information handling resource module, close to a closed position relative to the enclosure such that, due to non-overlap of the enclosure airflow openings relative to the flapper airflow openings, the adaptive airflow flapper assembly prevents airflow between the interior and the exterior of an enclosure, and when present in the first chassis bay adjacent to the second chassis bay populated with the second information handling resource module, open to an open position relative to the enclosure to allow airflow between the interior and the exterior of the enclosure.

Abstract: Embodiments are disclosed of a fan module. The fan module includes a module housing having a module inlet and a module outlet. A fan compartment matrix is positioned within the housing to move air between the module inlet and the module outlet. The fan compartment matrix includes an M×N matrix of fan compartments, each fan compartment having an upstream side and a downstream side. A longitudinal air channel positioned between each pair of fan columns and a transverse air channel positioned between each pair of fan rows, the transverse air channel being fluidly coupled to the fan compartments between which it is positioned. A control chamber is positioned at each confluence of the at least one longitudinal air channel and the transverse air channel, the control chamber including one or more valves to control airflow between the longitudinal air channel and the transverse air channel. A fan is positioned in each fan compartment.

Abstract: Disclosed is a blade adjustment mechanism and an air circulator. The air circulator includes a housing defining an air outlet. The blade adjustment mechanism includes: a fixing bracket fixedly connected with the housing and defining a sliding space; at least two adjustment members, a part of each of the at least two adjustment members is accommodated in the sliding space and slidably connected with the fixing bracket, each of the at least two adjustment members defining a first adjustment slot at an end adjacent to the air outlet; at least two first wind deflectors, a part of one of the at least two first wind deflectors being configured to extend into the air outlet and being rotationally connected with the fixing bracket, a part of one of the at least two first wind deflectors facing away from the air outlet being movably accommodated in the first adjustment slot.

Abstract: An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.

Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.

Abstract: An air handling system includes a housing, a blower, a sensor, an air intake valve, and a controller. The housing includes an outlet to a passenger compartment, a fresh air inlet providing fresh air into the housing and a recirculated air inlet that guides air flow from the passenger compartment into the housing. The blower moves air through the housing. The air intake valve moves between a closed position blocking air flow from the fresh air inlet into the housing and an open position unblocking air flow from the fresh air inlet into the housing. The controller positions the air intake valve relative to the fresh air inlet controlling the flow of fresh air into the housing and thereby maintaining moisture density of the air flow entering the passenger compartment within a prescribed range based on humidity and temperature values from the sensor.

Abstract: A system for cooling a plurality of electrical equipment components inside a mobile platform may include at least one manifold and a plurality of flexible tubing ducts. The manifold may have an outlet, and a plurality of inlet tubing connections in fluid communication with the outlet. The outlet may be coupled to an interface of a cooling system of the platform by exhaust tubing. Each of the flexible tubing ducts may have a proximal end and a distal end. Each proximal end may be selectively connectable to the inlet tubing connections. Each distal end may have an air intake port that is alternatively positionable in two or more thermal dissipation zones of the electrical equipment components for permitting an exhaust profile inside the platform to the interface to be reconfigured based at least in part on respective positions of the electrical equipment components.

Abstract: An outdoor display apparatus having a heat dissipation structure includes a first display module configured to display an image in a first direction, a second display module configured to display an image in a second direction opposite to the first direction, a housing configured to accommodate the first display module and the second display module, and having an inlet and an outlet, and a heat exchange device configured to receive heat from one of the first display module and the second display module and perform heat exchange, wherein the heat exchange device includes: a first heat exchange portion having at least one cooling passage to cool the first display module; a second heat exchange portion having at least one cooling passage to cool the second display module; and a heat exchanger configured to be selectively shared by the first heat exchange portion and the second heat exchange portion.

Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

Abstract: A vehicle includes a drive unit. The driving unit includes an electric rotary machine and a power conversion device. The drive unit is connected to a cooling liquid introduction pipe for introducing a cooling liquid to the drive unit, and the drive unit is connected to a cooling liquid discharge pipe for discharging the cooling liquid from the drive unit. The cooling liquid introduction pipe is connected to a cooling liquid introduction pipe connecting portion. The cooling liquid discharge pipe is connected to a cooling liquid discharge pipe connecting portion. The cooling liquid introduction pipe connecting portion and the cooling liquid discharge pipe connecting portion are provided above a lower end portion of the drive unit to connect the cooling liquid introduction pipe and the cooling liquid discharge pipe from the vehicle width direction of the drive unit.

Abstract: A heat sink 7A is disposed on a circuit board, an air duct is disposed on the heat sink, external cooling air is supplied by the fan attached to the sink air inlet of the heat sink and the air duct inlet of the air duct. Cooling air flowing out of the air duct outlet of the air duct comes into contact with the magnetic component mounted on the circuit board.

Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

Abstract: A cooling device includes at least two cooling units, each cooling unit including a plate-shaped cold plate extending in a horizontal direction, a radiator extending in a first direction perpendicular to the horizontal direction and having a plurality of plate-shaped fins which, on the cold plate, is disposed parallel to a second direction perpendicular to the first direction, and a pump which supplies a refrigerant liquid to the cold plate and the radiator, in which the pump is adjacent to the radiator and is disposed in the second direction of the radiator, and the pump of one first cooling unit of the two cooling units faces the other second cooling unit of the two cooling units in the second direction or in a third direction orthogonal to the first direction and the second direction.

Abstract: Embodiments are disclosed of an airflow cooling solution for a battery backup unit (BBU) using a crossflow cooling module. The cooling module includes a housing with a module inlet and a module outlet positioned at a non-zero angle relative to each other. The module outlet has an area greater than the module inlet. A crossflow fan package is positioned in the cooling module housing. The crossflow fan package includes a fan housing having a fan inlet and a fan outlet; the fan inlet is fluidly coupled to the module inlet, and the fan outlet is fluidly coupled to the module outlet. One or more inlet air baffles form an inlet air channel between the module inlet and the fan inlet, and one or more outlet air baffles form a diverging outlet air channel between the fan outlet and the module outlet. The cooling module can distribute the airflow to a much wider area to the BBU module. Then a rack level crossflow air cooling configuration is proposed.

Abstract: A case adapted to be selectively connected to a first interface module, a second interface module and a third interface module is provided. The case includes a substrate. The substrate includes a first connection area and a second connection area. The first connection area is adjacent to the second connection area. The first connection area includes a first post. The second connection area includes a second post and a third post. In a first state, the first interface module is disposed in the first connection area. The second interface module is disposed in the second connection area. In a second state, the third interface module is disposed in the first connection area and the second connection area. The case is adapted to be selectively connected to different types of storage units.

Abstract: Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.

Abstract: A display device includes a display panel, a bottom cover at a rear surface of the display panel, and a heat dissipation assembly. The heat dissipation assembly includes a housing between the display panel and the bottom cover, conductive lines on two lateral sides within the housing and configured to supply electricity therethrough, and a movable member having both ends thereof supported by and electrically connected to the conductive lines to thereby be movable in a longitudinal direction of the housing.

Abstract: A computer server includes a plurality of layers of fixed plates each having at least one corresponding component provided thereon. An air inlet and an air outlet are provided on side panels of an outer shell of the server case. A first set of fans is provided on an inward-facing side of the air inlet, and a second set of fans is provided on an inward-facing side of the air outlet. The first set of fans and the second set of fans generate a high-pressure airflow from the air inlet to the air outlet. The computer server further comprises at least one first heat sink and a second heat sink, wherein the at least one first heat sink is connected to a heat generating component on the plurality of layers of fixed plates.