Abstract: A fiber distribution hub (FDH) provides an interface between an incoming fiber and a plurality of outgoing fibers. The FDH includes a cabinet, at least one door pivotably mounted to the cabinet, and a frame pivotably mounted within the cabinet. The doors wrap around the sides and the front of the cabinet to provide access to both the front and sides of the frame when the doors are open. The frame can pivot out of the cabinet through the open doors to enable access to the rear of the cabinet and the rear side of the frame. The frame includes a termination region and a splitter region. The frame can include a storage region and/or a pass-through region.

Abstract: An apparatus is provided in one example embodiment and includes a plate having a plurality of perforations configured in a pattern. The pattern includes the plurality of perforations arranged in concentric circles centered at a point. Each of the perforations is a closed shape comprising four edges, with rounded corners between adjacent edges, with two opposite edges of each of the perforations including non-parallel straight lines and two other opposite edges comprise concentric, offset curved lines. The non-parallel straight lines may form an angle with a vertex at the point, and the concentric curved lines may be centered at the point. The perforations in each concentric circle may be angularly spaced around the point. The apparatus may further include a substantially circular fan.

Abstract: Shielding liquid from electronic components may be accomplished by a variety of systems, devices, and techniques. A shielding device may include a substantially vertical channel mounted to a fuel dispenser component; an airflow inlet; a plurality of arrays of angled protrusions; and a plurality of substantially vertical protrusions. The channel is adapted to guide an airflow. The plurality of arrays of angled protrusions are, disposed within the channel and are substantially parallel in arrangement within each array. The angled protrusions within each array are angularly offset in arrangement relative to the angled protrusions within adjacent arrays. The arrays of angled protrusions are adapted to form a tortuous path for the airflow through the channel. The plurality of substantially vertical protrusions are disposed within the channel and are located between the airflow inlet and the plurality of arrays. The vertical protrusions are adapted to substantially straighten the airflow within the channel.

Abstract: A fan assembly for an electrical device which comprises a number of heat generating electrical components mounted in an enclosure that includes a front wall, a rear wall and two generally parallel sidewalls. The fan assembly comprises a plurality of fans which are arranged in a row that extends generally perpendicularly between the sidewalls. Each fan comprises an axis of rotation which is oriented at an angle relative to the sidewalls, and the fan assembly further includes a plurality of inlet plenums which each communicate with an inlet end of a corresponding fan and a plurality of exhaust plenums which each communicate with an outlet end of a corresponding fan. In operation, the fans generate an airflow which is distributed through the enclosure by the inlet and exhaust plenums to thereby cool the electrical components.

Abstract: An apparatus having a plurality of storage slots aids in storing tablet computers, specifically iPad, for charging and/or transmitting data to and/or from. Moreover, the apparatus allows for automatically plugging a tablet computer into either a charging cable and/or a data transmission cable when disposing in the apparatus. Methods of making and using the same are provided.

Abstract: An image projection apparatus includes an optical part disposed in a light path of an projection image; an enclosing unit to enclose the light path of the projection image and having an window for projecting the projection image onto a projection plane; and an air supply unit to supply air into an internal space of the enclosing unit enclosing the light path. Pressure of the internal space of the enclosing unit is kept at a positive pressure with respect to an external pressure of the enclosing unit during an image projection operation.

Abstract: An electronic device includes: a touch panel 30; an elastic member 70 that supports the panel 30 to be capable of vibration in a position of an opening 11 of a housing 10; a vibration unit 60 that vibrates the panel 30; a display unit 40 on a rear side of the panel 30 with space therebetween; a substrate 50 on a rear side of the unit 40 with space therebetween; and a support portion 13 provided in the housing 10 to support a periphery of the rear of the unit 40. A surface 31 of the panel 30 and a surface 15 of the housing 10 are provided with a flexible member 20 over a gap 14 between a periphery of the panel 30 and the housing 10. The unit 40 is supported air-tightly to the portion 13 around the periphery of the rear of the unit 40.

Abstract: An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening.

Abstract: A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is introduced and which is disposed at an upper front surface of the airflow channel and extends perpendicularly to the airflow channel, a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct, an air outlet duct disposed at a lower portion of the airflow channel to discharge air from the airflow channel, and a heat-radiating unit disposed to the rear of a circuit board mounted with electronic components on a front surface thereof to absorb heat from the circuit board. The heat-radiating unit is located, apart from the blower fan, in the airflow channel. Through the improved cooling airflow structure, cooling efficiency is increased, noise is reduced and continuous cooling operation is achieved.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.

Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Abstract: According to one embodiment, an electronic device includes: a first housing including a first wall; a reinforcing member that is overlapped on an inner surface of the first wall and is bonded to the first wall; an electric component including a second wall located at a side opposite to the first wall with respect to the reinforcing member, a third wall located at a side opposite to the reinforcing member with respect to the second wall and spaced from the second wall, and a fourth wall connecting the second wall and the third wall, the electric component being accommodated in the first housing, and a first protrusion that is provided to the reinforcing member and projects toward the fourth wall.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: Housing for at least one electric or electronic device, the housing surrounding a housing interior comprising a storage space, the electric or electronic device being arrangeable in the storage space, the housing comprising a housing upper part, which delimits the housing interior, the housing comprising at least one intermediate ceiling portion, which is arranged in the housing interior below the housing upper part and, together with the housing upper part, encloses at least one intermediate space, the intermediate ceiling portion having at least one cooling air passage, through which cooling air can flow from the storage space into the intermediate space, the housing upper part having at least one cooling air outlet, through which the cooling air can escape outwardly from the intermediate space, wherein the intermediate ceiling portion forms a catching arrangement for dripping water, which infiltrates the intermediate space through the cooling air outlet.

Abstract: A backplane device may include an electrical bus, an optical fabric, and a plurality of card sockets. A particular one of the plurality of card sockets may include a first socket configured to receive a first electrical connector of a card and electrically connect the first electrical connector to the electrical bus; and a conversion device comprising a second socket configured to receive a second electrical connector of the card; and an optical transceiver configured to convert electrical signals received from the second electrical connector to optical signals and provide the optical signals to the optical fabric; and convert optical signals received from the optical fabric to electrical signals and provide the electrical signals to the second electrical connector.

Abstract: An electronics module for a data storage device enclosure, and, data storage device enclosures. The module comprises an enclosure connector for connecting to the enclosure, at least one bay constructed and arranged to receive a data storage device, and a controller arranged to selectively provide access to storage devices to which it is connected. The module has a communications path between the controller and the enclosure connector by which the controller can communicate with storage devices in the enclosure. The module also has a first communications path to the data storage device when received in the bay by which the controller can communicate with that data storage device. The module also has a second communications path to the data storage device when received in the bay by which that data storage device can be accessed from outside the module.

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.

Abstract: According to one embodiment, a stand for an electronic device, includes a first housing and a connector. The connector is configured to detachably connect to the electronic device and to be rotatably supported by the first housing. The electronic device includes a display face and a second housing. The second housing includes a first opening formed at an end thereof. The connector includes a support, a protrusion, and a base member. The support is configured to support the second housing from outside. The protrusion is spaced from the support and inserted into the first opening. The base member includes a first part configuring at least a portion of the support and a second part integrated with the first part and configuring at least a portion of the protrusion.

Abstract: A housing for electronic equipment includes a fan and a plurality of coolant channels in a passage of a cooling fluid introduced by the fan. A passage width defined by a cooling member blocking the passage, the member being one of the plurality of coolant channels closer to the fan, is smaller than a passage width defined by a cooling member blocking the passage, the member being one of the plurality of coolant channels farther away from the fan.

Abstract: An electronic device includes a fan field replaceable unit (FRU). The fan FRU includes a fan FRU chassis defining an airflow pathway through the fan FRU. A fan within the fan FRU chassis causes air to flow along the airflow pathway. The fan FRU further includes an edge connector located at a front face of the fan FRU out of the way of the airflow pathway. Accordingly, the edge connector does not block airflow through the fan FRU thus maximizing the efficiency of the fan FRU and the cooling of the electronic device.

Abstract: A cooling apparatus of an array of fan cradles holding fans where a movable baffle assembly directs airflow and blocks removal of more than one fan at a time. A plurality of fans held in a fan cradle assembly in which the fan cradle for a fan to be replaced mechanically moves and is engaged with the movable baffle assembly to prevent removal of the other fans. A method is provided by which an operator may remove and replace an existing fan in an array of fans.

Abstract: A ventilation device includes an impeller rotatable to move air from an air inlet end to an air outlet end of the impeller. An opening is defined in a rear end of the housing. The rear end of the housing is fixed to the air inlet end of the impeller. The housing includes a hemispherical wall defining an interior space. The hemispherical wall has a plurality of annularly spaced and a plurality of annularly spaced outer holes, with the inner holes spaced from the outer holes in a radial direction. A plurality of tubes is formed on an inner face of the semispherical wall, with each tube extending from a corresponding one of the inner and outer holes into the interior space but spaced from the rear end of the housing.

Abstract: The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

Abstract: Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.

Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.

Abstract: A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. The mobile data center can be moved to remote locations, and the electronic equipment can be placed in communication with a network when at the remote location. Other embodiments are disclosed.

Abstract: A power converter includes: a plurality of heat generators, at least some of which are arranged within a wind tunnel portion; and a housing for enclosing the wind tunnel portion through which a cooling air flows. The wind tunnel portion includes a first and second duct each having a cooling air inlet and outlet port, a cooling air flow path, and a blower fan. Further, the cooling air flow paths overlap with each other in a parallel arrangement relationship; the cooling air inlet ports of the first duct and the second duct, and the cooling air outlet ports of the first duct and the second duct are arranged adjacent to each other; and the heat generators divisionally arranged within the first duct and the second duct.

Abstract: An electronic device includes a server unit, a storage apparatus, and a heat dissipation apparatus. The server unit includes a bottom plate defining a first air inlet. The heat dissipation apparatus includes an exhaust fan located above the bottom plate and an air adjusting member. The exhaust fan includes a second air inlet aligning with the first air inlet. The adjusting member is slidably located between the first air inlet and the second air inlet. The bottom plate and the storage apparatus cooperatively bound an airflow channel communicating with the first air inlet. The second air inlet is partitioned into a first air inlet communicating with the airflow channel and a second air inlet communicating with the server unit by the air adjusting member. The air adjusting member is operated to slide to change sizes of the first air inlet and the second air inlet.

Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract: Retention systems are disclosed. In some embodiments, a retainer apparatus is configured to retain a battery of the type used to power a pitch-control drivetrain for adjusting a pitch angle of a wind-turbine rotor. In a working embodiment, the retainer apparatus has a separable housing member and sleeve member configured to matingly engage each other in an interlocking relationship and to define a retention chamber having an open interior region sized to receive the battery. Adjustable pitch rotors having one or more innovative retainer apparatus are also disclosed. Innovative principles disclosed herein can be adapted to retainers for a wide variety of retainable elements, other than batteries.

Abstract: An electronic device includes a motherboard, at least one heat dissipation module, a fan module and a wind scooper. The heat dissipation module is arranged on the motherboard and provided with a first positioning component. The fan module is arranged on one side of the motherboard and faces the heat dissipation module. The wind scooper has a second positioning component corresponding to the first positioning component. The wind scooper is fixed on the heat dissipation module through the cooperation between the first positioning component and the second positioning component. The wind scooper is connected between the fan module and the heat dissipation modules, so that the airflow provided by the fan module can flow through the heat dissipation module.

Abstract: A server includes a chassis including a first sidewall, a second sidewall, a rear wall, a front wall, and a partition wall. A receiving space to receive a power module is bound by the front wall, the partition wall, and front portions of the first and second sidewalls. A number of through holes is defined in each of the rear wall, the front wall, and the front portions of the first and second sidewalls. An outlet and an inlet of the power module face the first sidewall and the second sidewall, respectively. A part of the partition wall between the inlet and the first sidewall does not define through holes. Another part of the partition wall defines a number of through holes. A number of data storage devices is located between the partition wall and the rear wall. A number of fans is located outside the rear wall.

Abstract: A baffle facilitates the flow of air from a first side of a data center rack into an intake on the opposite side of the data center rack. The baffle may be configured to couple to the bottom side of the rack. The rack itself may be located in a data center with at least one cold aisle and at least one hot aisle, such that cold air from the cold aisle may flow through the baffle and into an air intake of the rack facing the hot aisle. The baffle may additionally include fans to pull air into and through the baffle, and may include an air conditioning unit or a chiller system to cool air flowing through the baffle.

Abstract: Techniques are described for controlling the climate in a data center. Using the input of an administrator, multiple desired attributes of a data center (e.g., temperature, energy consumption, costs, or system performance) may be balanced using a utility function that maximizes the utility of the computing systems in the data center according to the administrator's preferences. Additionally, a cooling model is generated that represents the affect of a control parameter (e.g., the fan speed of a CRAC) on the desire attributes of the data center. The cooling model may then be substituted into the utility function to replace the desired attributes. Using this new utility function, the control parameters may be varied such that the maximum utility is achieved.

Abstract: In one embodiment of the present invention, a system selectively cools a set of at least one rack-mounted server in a chassis. The system comprises: a chassis; a chassis manager; a set of at least one thermal sensor coupled to each rack-mounted server in a chassis; a trolley track oriented functionally proximate to the multiple rack-mounted servers; and a cold air trolley movably mounted to the trolley track. The cold air trolley moves along the trolley track in order to be selectively oriented next to a particular overheating rack-mounted server in the chassis, thus providing a fluid conduit from a cold air source to the particular overheating rack-mounted server in response to the chassis manager detecting that the particular overheating rack-mounted server is exceeding a predetermined temperature.

Abstract: An electronic device includes a chassis, an air-guiding housing mounted in the chassis, and an airflow control member. The chassis includes a base panel with a plurality of ventilation holes. The air-guiding housing comprises an airflow passage aligned with the plurality of ventilation holes. The airflow control member includes a shielding plate attached on the base panel. The airflow control member is movable between a first position and a second position. In the first position, the shielding plate is located beside the air-guiding housing, and the airflow passage is communicated with the plurality of ventilation holes for allowing air flowing to an outside of the chassis via the plurality of ventilation holes. In the second position, the shielding plate is located between the air-guiding housing and the base panel for closing the plurality of ventilation holes and preventing air flowing to the outside of the chassis.

Abstract: A heat dissipation assembly is configured in an enclosure of a network device. The enclosure defines an air flue. The heat dissipating assembly includes a fan module received in the air flue, and a damper module secured in one end of the air flue adjacent to the inside of the enclosure. The fan module includes a first bracket and a plurality of fans fixed with the first bracket. The damper module includes a frame and a plurality of vanes located in the frame. When a direction of airflow of the plurality of fans changes, the plurality of fans in the air flue is reversed, and the first bracket supports the plurality of vanes of the damper module to keep the air flue open.

Abstract: An enclosure for electronics includes a chassis and an interface connector positioned within the chassis and configured to provide power. A fan shelf module is received within the chassis and has at least one fan to provide air flow through the chassis. The fan shelf module includes a pinout connector along a horizontal or vertical line of symmetry and configured to engage the interface connector and receive power therefrom, such that the fan shelf module is selectively installed in one of two opposing directions allowing a fan air flow direction to the chassis to be selected as either pulling air or pushing air through the chassis depending on the installed direction of the fan shelf module.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: Memories, and methods of operating such memories, having a memory cell, sense circuitry having a gate, program circuitry and a decoder having a first signal line connected to the gate of the sense circuitry, a second signal line connected to the program circuitry, and an output selectively connected to the memory cell. The decoder is configured to selectively connect the output to the first signal line responsive to a first control signal and to selectively connect the output to the second signal line responsive to the first control signal and a second control signal. The sense circuitry is configured to selectively activate the gate responsive to a third control signal.

Abstract: Provided is a battery pack that can uniformly cool a plurality of electric cells, prevent a breakdown of the electric cells, and provide high performance of all electric cells. The battery pack includes a packaging case in which: each adjacent ones of a plurality of electric cells in the first direction define a ventilation space; first and second passages are defined that extend in the first direction and that are arranged to have the plurality of electric cells located between the first and second passages in a second direction intersecting the first direction, wherein gas supplied to the first passage flows through the ventilation spaces to the second passage; and a flow rate limitation device is provided that is arranged in an upstream area of the first passage and that limits a flow rate of the gas flowing through one of the plurality of ventilation spaces, which leads to the upstream area of the first passage, to a predetermined flow rate.

Abstract: Techniques are described for controlling the climate in a data center. Using the input of an administrator, multiple desired attributes of a data center (e.g., temperature, energy consumption, costs, or system performance) may be balanced using a utility function that maximizes the utility of the computing systems in the data center according to the administrator's preferences. Additionally, a cooling model is generated that represents the affect of a control parameter (e.g., the fan speed of a CRAC) on the desire attributes of the data center. The cooling model may then be substituted into the utility function to replace the desired attributes. Using this new utility function, the control parameters may be varied such that the maximum utility is achieved.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: There is provided a switchboard including a boards each including an opening portion which is provided in a ceiling surface and configured to exhaust heat, and an intake portion which is provided in a lower portion and configured to taken in cooling air, a fan provided to cover the opening portion of a board of the boards and configured to exhaust air in a horizontal direction to cool the inside of the board, and a duct configured to supply the cooling air from the opening portion of a board not provided with the fan to the inside of the board provided with the fan.

Abstract: Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.

Abstract: A portable electronic device includes a main body and a heat dissipation module with a tiltedly installed centrifugal fan inside thereof. The main body includes an upper housing wall and a lower housing wall. The heat dissipation module includes a centrifugal fan, a heat dissipation fin array and a heat pipe. The centrifugal fan includes an impeller, a radial air outlet, an upper axial air inlet and a lower axial air inlet, wherein the centrifugal fan has a first side that is in contact with the upper housing wall and an opposite second side that is in contact with the lower housing wall. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat pipe has a first end connected with the heat dissipation fin array and a second opposite end connected with a heat source.

Abstract: A cooling jacket for a battery pack includes a first half and a second half. The first half and the second half are substantially identical and flip-ably connected to each other. A channel is provided in between the first half and the second half. Further, a coolant flows in the channel provided between the first half and the second half.

Abstract: A heat dissipating module includes a heat sink and an aerofoil deflector above the heat sink. The heat sink has an upper surface corresponding to the camber of the deflector, to increase the speed and efficiency of a cooling airflow passing therethrough, the airflow generated by a fan.