Abstract: According to certain embodiments, an electronic device comprises: a housing; an electronic component disposed in the housing, wherein the electronic component generates heat during operation; a support cover disposed on the electronic component; a metal member overlapping with the electronic component while interposing the support cover between the metal member and the electronic component; a switching unit selectively forming or disconnecting an electrical connection path of the support cover and the metal member; and at least one processor configured to select an antenna tuning code, based at least in part on whether the switching unit forms or disconnects the electrical connection path, wherein the switching unit includes: a receiving member electrically connected to the support cover and providing a receiving space; a thermally deforming member received in the receiving space, wherein the thermally deforming member deforms based on a temperature; and an elevating member configured to move upwardly to elec

Abstract: Disclosed is a power conversion device comprising: a case; a switching unit comprising a plurality of switches which are disposed on one side of the case; a transformer disposed on one side of the case; and a clip for fixing the plurality of switches. The clip comprises: a body part which is fixed to the case; and elastic parts which extend from the body part and are for pressing the plurality of switches to the case. The body part comprises a plurality of first through holes into which screws are coupled. And the first through holes are disposed between two adjacent elastic parts.

Abstract: A semiconductor device includes a first semiconductor element, a first connection terminal formed on a lower surface of the first semiconductor element, a second semiconductor element mounted on the lower surface of the first semiconductor element so that the second semiconductor element partially overlaps the first semiconductor element in plan view, a second connection terminal formed on a lower surface of the second semiconductor element, and a wiring substrate on which the first and second semiconductor elements are mounted. The wiring substrate includes first and second connection pads electrically connected to the first connection terminal and the second connection terminal, respectively. The semiconductor device further includes a third connection terminal formed on the first connection pad and electrically connected to the first connection terminal. One of the first connection terminal and the third connection terminal is a metal post, and the other is a solder ball.

Abstract: A light sensing module and a display apparatus are provided. The light sensing module includes a circuit board and a light sensing device, wherein the circuit board includes a mounting region and a device region surrounding the mounting region, an encapsulation layer is disposed on the device region, and a light sensing device, a light sensing hole and a barrier structure are provided on the mounting region, a vertical projection of the light sensing device on the mounting region at least partially overlaps with a vertical projection of the light sensing hole on the mounting region, and the barrier structure is disposed around the periphery of the light sensing hole, and separates the encapsulation layer from the light sensing hole.

Abstract: A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

Abstract: A semiconductor module includes a substrate having a central region, an outer region that surrounds the central region, and a middle region disposed between the central and the outer region, a first semiconductor package mounted on the central region of the substrate, a plurality of second semiconductor packages mounted on the middle region of the substrate, and a heat radiation structure disposed on the first semiconductor package and second semiconductor packages. The heat radiation structure includes a first part that is disposed on top surfaces of the first and second semiconductor packages, a second part that surrounds the middle region, a third part that is spaced apart from the second part and surrounds the first semiconductor package, and a fourth part that connects the second part to the third part.

Abstract: A chip-on-film (CoF) package and a display apparatus, the package including a base film having an upper surface and a lower surface facing each other; a conductive line on the upper surface of the base film; a semiconductor chip on the upper surface of the base film and connected to the conductive line through a bump structure; a heat radiator on the lower surface of the base film and underlying the semiconductor chip; an adhesive layer between the lower surface of the base film and the heat radiator; and a plurality of dam structures in the adhesive layer and overlapping the bump structure.

Abstract: A portable information handling system glass ceramic housing integrates a heat sink of thermally conductive wire disposed in a coil or mesh pattern that is difficult to discern from the housing exterior. A thermal transfer device communicates thermal energy from internal processing components to the heat sink in aesthetically pleasing manner. For example, a plastic logo is coated with graphene to transfer thermal energy by pressing against the thermally conductive wire so that that logo is visible from the housing exterior. Through glass via opening provide air passages between the housing interior and exterior to promote rejection of the thermal energy from the housing.

Abstract: A semiconductor device package includes a substrate, a first heat-generating component positioned on a surface of the substrate, an encapsulant at least partially encapsulating the first heat-generating component, and one or more channels extending through a portion of the encapsulant toward the first heat-generating component. Each of the one or more channels contains a thermally conductive material having a thermal conductivity greater than a thermal conductivity of the encapsulant.

Abstract: A drive unit includes: a rotating electric machine having a rotation axis extending in a horizontal direction; a rotating electric machine case; and a power conversion device. The power conversion device is arranged on one side of the rotating electric machine in an orthogonal direction. The power conversion device includes a first connector to which a first electric power line through which electric power supplied to the rotating electric machine and electric power supplied from the rotating electric machine flow are connected. The first connector is provided on a first end side and is arranged to protrude from the power conversion device at a predetermined angle in a direction away from the rotating electric machine in the orthogonal direction, as the first connector goes away from the power conversion device in the rotation axis direction, when viewed from above.

Abstract: The invention relates to a communication system (1), comprising at least one housing (2) having a first and an additional housing part (201, 202). In the housing (2), a circuit board (10) having electronic components (11) is arranged, and outside the housing (2), at least one antenna element is arranged. The invention is characterized in that an antenna support (7) that is connectable to the housing (2) is provided, wherein the at least one antenna element (14) is arranged on the surface and/or inside the antenna support (7).

Abstract: Embodiments promote the maintenance of a designed flow of cooling air through a chassis during the servicing of one or more electronic components contained by the chassis. A top opening created by the removal of server chassis from a rack may be significantly reduced by internal lids that provide access to groups of components. Gaps created by the partial removal of groups of components may be significantly reduced by air dams attached to the components that inhibit the flow of air between the components. And the opening created by the removal of a circuit board may be significantly reduced by a flap configured to cover the opening upon removal of the circuit board. The various embodiments may be used individually or in combination to reduce openings in the chassis that may allow air to flow in paths that negatively affect the designed air flow.

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.

Abstract: A motor includes a shaft to rotate about a central axis extending in a vertical direction, a metal heat sink including a through-hole through which the shaft extends, a substrate disposed at an upper side of the heat sink through a gap, a sensor magnet fixed to an upper end of the shaft, a rotation sensor located at an upper side of the sensor magnet, and a heat dissipating material located in a gap between the substrate and the heat sink. The heat sink includes a heat sink main body portion and a wall portion located between the substrate and the heat sink main body portion and between the heat dissipating material and the through-hole when viewed from the vertical direction.

Abstract: Assemblies having multi-functionalities of any combination of heat spreading, absorption of stray radiation, signal focusing, and shielding are provided. The assemblies may include a heat spreading layer of at least one sheet of a compressed particles of exfoliated graphite, graphitized polymers and combinations thereof. The assemblies may also include at least one magnetic layer, which may provide the benefits of magnetic flux management and/or stray radiation absorption. The assemblies may include an optional plastic coating on one or both of the exterior surfaces. The assemblies may be used to enable fast wireless charging of electronic devices by efficiently focusing magnetic flux for better power transmission efficiency.

Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.

Abstract: Provided is a method for compensating a stress-sensitive parameter, and the method is applied to an electronic devices. The method includes: calculating (51) a deformation value of a first panel according to a pressure borne by the first panel; calculating (52) according to the deformation value of the first panel a deformation value of a second panel that is deformed due to the deformation of the first panel; calculating (53) according to the deformation value of the second panel a change in a stress-sensitive parameter of a stress-sensitive element on the second panel; and compensating (54) the stress-sensitive parameter according to the change in the stress-sensitive parameter. The quality of the parameters of corresponding electronic elements and electronic modules are thereby improved, ultimately enhancing the performance of electronic device.

Abstract: This disclosure details exemplary battery pack designs for use in electrified vehicles. An exemplary battery pack assembly process may include supporting one or more components, such as a heat exchanger plate, of the battery pack against deflection during the assembly process. Supporting the heat exchanger plate to keep the plate relatively flat during the battery pack assembly process improves the flow distribution of a thermal interface material (TIM), thereby achieving improved TIM coverage and improved heat transfer between battery cells and the heat exchanger plate of the battery pack.

Abstract: The present disclosure provides a package structure, a manufacturing method for the same, and a display device. The package structure includes a substrate, an organic light emitting device disposed on the substrate, and an encapsulation film layer disposed above the organic light emitting device, the encapsulation film layer encapsulating the organic light emitting device onto the substrate, wherein an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.

Abstract: A LED leadframe for securing a LED chip includes a metallic base and an insulating layer. The metallic base includes a die bonding region and a peripheral region surrounding the die bonding region, and the die bonding region is for securing the LED chip. The insulating layer is disposed on the metallic base and located in the peripheral region to define the die bonding region. The insulating layer includes a bar-shaped insulating section disposed in the metallic base and corresponding to the die bonding region. The metallic base includes a first groove(s) defined corresponding to the die bonding region. The first groove(s) is/are filled with a thermally conductive filler. The invention improves the LED leadframe to allow heat conducting efficiencies of various regions of the base to be controllable and adjustable so as to reduce temperature differences among various regions of the base and thereby unify the temperature.

Abstract: An electronic device includes pairs of guide rails and elastic members. The pairs of guide rails are provided in a slot correspondingly to both ends of the circuit board in a direction intersecting the insertion direction, the guide rails of each pair extending along the insertion direction respectively on sides of both surfaces of the circuit board inserted in the slot, the pair of guide rails being configured to guide insertion of the circuit board into the slot. When the circuit board is inserted in the slot, each elastic member presses the circuit board against one or the other of the guide rails of the pair.

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

Abstract: An electric connection structure (1) is provided with: a glass plate (10); a power supply part (15) formed in the glass plate (10); a terminal (20) having a base part (21) opposing the glass plate (10); and a spring member (35) formed from a conductor and disposed between the power supply part (15) and the base part (21). The power supply part (15) and the base part (21) make contact with the spring member (35), whereby the power supply part (15) and the base part (21) are electrically connected via the spring member (35).

Abstract: An ultrasound transducer array with at least one composite material layer. The layer having a polymer base in which polymer particles are embedded. The polymer particles are coated with a material that has a thermal conductivity that is higher than the thermal conductivity of the polymer base and the polymer particles.

Abstract: In one aspect, a device includes a processor and storage accessible to the processor. The storage bears instructions executable by the processor to determine that a trigger regarding an apparatus has been satisfied and, in response to the determination, activate a thermoelectric cooling element (TCE) accessible to the processor.

Abstract: Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components and the device skin, the switchable heat path configured to be switched between an on state and an off state, the switchable heat path configured to conduct a first amount of heat from the components to the device skin when in the on state and configured to conduct a second, lesser amount of heat from the components to the device skin when in an off state.

Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.

Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

Abstract: The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for cooling the component, comprising: a thermoelectric module comprising a cold surface and a hot surface, the cold surface being thermally coupled with the component; a heat sink thermally coupled with the hot surface of the module, the heat sink including an exchange surface with the surrounding environment and at least one cell containing a phase-change material (PCM), the PCM material contained in the cell or cells being suitable for melting when the heat released from the cold surface of the module is that of the thermally overloaded component, the exchange surface being suitable for bringing the PCM material from the molten phase to the solid phase thereof when the heat released from the cold surface of the module is that of the operational component which is not thermally overloaded.

Abstract: A holder is provided for holding an electrical component on a circuit board having a lead hole. The holder includes a body having a base for holding the electrical component and a connection member for mounting the body to the circuit board. The base includes a lead opening that is configured to hold a solder lead of the electrical component therein. The connection member extends from the base and is configured to mechanically connect to the circuit board such that the base holds an end of the solder lead of the electrical component within the lead hole of the circuit board.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.

Abstract: According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.

Abstract: Methods of forming microelectronic interconnect under device structures are described. Those methods and structures may include forming a device layer in a first substrate, forming at least one routing layer in a second substrate, and then coupling the first substrate with the second substrate, wherein the first substrate is bonded to the second substrate.

Abstract: A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.

Abstract: Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer.

Abstract: The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.

Abstract: Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.

Abstract: An image display device having improved properties, comprising an image display panel, heat dispersion material positioned proximate to the image display panel, an open frame positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic components engaging the open frame, the image display device exhibits a support factor of less than about 375 mm-W/m° K.

Abstract: An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.

Abstract: A mobile terminal is provided. The mobile terminal includes a terminal body, a display module located in the terminal body, a printed circuit board located within the terminal body, at least one electric device mounted on the printed circuit board, a sealing unit coupled to the printed circuit board to shield the electric device, a frame having a first surface contacting the sealing unit and a second surface coupled to the display module and a first heat transfer portion to radiate heat generated by the electric device.

Abstract: Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board.

Abstract: According to an exemplary embodiment, a dual compartment semiconductor package includes a conductive clip having first and second compartments. The first compartment is electrically and mechanically connected to a top surface of the first die. The second compartment electrically and mechanically connected to a top surface of a second die. The dual compartment semiconductor package also includes a groove formed between the first and second compartments, the groove preventing contact between the first and second dies. The dual compartment package electrically connects the top surface of the first die to the top surface of the second die. The first die can include an insulated-gate bipolar transistor (IGBT) and the second die can include a diode. A temperature sensor can be situated adjacent to, over, or within the groove for measuring a temperature of the dual compartment semiconductor package.

Abstract: A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.