Abstract: A tight-fit riveting structure for a clustered radiation fin set and a heat pipe and a riveting method include a radiation fin set formed by locking a plurality of radiation fins together and at least one heat pipe. The radiation fin set has an accommodation slot for accommodating the heat pipe. The heat pipe is positioned in the accommodation slot for a tight fit by subjecting two sides of the accommodation slot of the radiation fin set to a riveting operation. First riveting and deforming portions defined on two sides of a communication mouth of the accommodation slot are riveted towards a surface of the heat pipe, which causes the deformation of the first riveting and deforming portions whereby the heat pipe is clamped in a tight fit manner.

Abstract: A power conversion device includes a semiconductor unit, a terminal unit, a capacitor unit, a control board, and a case. The semiconductor unit is arranged at a position facing a plate surface of the control board. The terminal unit and the capacitor unit are arranged side by side in a x direction along the plate surface of the control board on the opposite side of the control board with respect to the semiconductor unit. At least a part of the capacitor unit or the terminal unit is located outside a first end of the semiconductor unit in the x direction. A first recess in which a first electrical wiring is arranged is formed in a portion of the case facing the first end so as to be recessed inside the case.

Abstract: A power module includes at least one power semiconductor element between first and second conductive layers, a first cooling member on the first conductive layer, a second cooling member under the second conductive layer, and at least one snubber capacitor between the first and second conductive layers. Each snubber capacitor has a capacitor core between first and second electrodes and first and second transition layers. The first transition layer is between the first conductive layer and the first electrode and the second transition layer is between the second electrode and the second conductive layer, or the first transition layer is between the first electrode and the capacitor core and the second transition layer is between the capacitor core and the second electrode. The first and second transition layers are conductive. A thermal expansion coefficient of the transition layers is between thermal expansion coefficients of adjacent elements of the snubber capacitor.

Abstract: In accordance with various embodiments, a method for processing a layer structure is provided, where the layer structure includes a first layer, a sacrificial layer arranged above the first layer, and a second layer arranged above the sacrificial layer, where the second layer includes at least one opening, and the at least one opening extends from a first side of the second layer as far as the sacrificial layer. The method includes forming a liner layer covering at least one inner wall of the at least one opening; forming a cover layer above the liner layer, where the cover layer extends at least in sections into the at least one opening; and wet-chemically etching the cover layer, the liner layer and the sacrificial layer using an etching solution, where the etching solution has a greater etching rate for the liner layer than for the cover layer.

Abstract: Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

Abstract: An optical transceiver, attachable and detachable along a first direction with respect to an apparatus, includes an optical module having a first surface intersecting the first direction and first and second sleeves extending from the first surface in a direction of the optical transceiver, a housing extending along the first direction and accommodating the optical module, and first and second receptacles connected to the first and second sleeves and aligned according to deviations of the first and second sleeves on the first surface from first and second reference positions, respectively. An accommodating part on one end of the housing along the first direction accommodates the first and second receptacles which are fixed to the housing via a conductive resin filled between the housing and the first and second receptacles.

Abstract: A floating heat sink includes an elastic support and a heat dissipating piece. The elastic support is integrally formed and includes at least two fasteners and at least two elastic arms. The fasteners are configured to mount the heat dissipating piece. All the fasteners and all the elastic arms are arranged around the heat dissipating piece. Two ends of the elastic arm are both connected to the fastener, and the two ends of the elastic arm are arranged in a circumferential direction of the heat dissipating piece. A middle part of the elastic arm is configured to be connected to a board in a fastened manner, and the middle part of the elastic arm is bent toward the board.

Abstract: Embodiments include a microelectronic package structure having a substrate with one or more substrate pads on a first side of the package substrate. A ball interconnect structure is on the substrate pad, the ball interconnect structure comprising at least 99.0 percent gold. A discrete component having two or more component terminals is on the ball interconnect structure.

Abstract: A portable server data center and server rack system, includes a carrying case sized to allow the carrying case to be carried onboard an aircraft. A server tray rack rail apparatus is disposed within the carrying case to accommodate a plurality of server trays that are slidable along the rack rail apparatus. Each of the server trays are capable of accommodating a motherboard section and its components, a power supply section and its components, and a cooling apparatus for the motherboard and power supply sections.

Abstract: An interface connector disposed at a circuit board, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space is disposed in the housing. The first accommodating space accommodates a first mating connector. One side of the housing is disposed at the circuit board. The first heat dissipating member is disposed at the outside of the housing. The first heat dissipating member passes through the housing and extends into the first accommodating space to be connected with the first mating connector. The second heat dissipating member is disposed at the circuit board. The second heat dissipating member passes through the circuit board and the housing and extends into the housing. The heat from the first mating connector is dissipated through the components of the first heat dissipating member. Thus the heat dissipation issue of mating connector having high power chips can be solved.

Abstract: A heat exchange device and a freeze dryer. The freeze dryer comprises a bearing device, and an evaporation device and a condensation device which are provided on the bearing device, at least one of the evaporation device and the condensation device comprising a structure of the heat exchange device. The heat exchange device is integrally molded by extrusion, and the heat exchange device is provided with at least one medium flow passage, a plurality of fins are formed on the outer periphery of the medium flow passage, and the fins being provided at intervals to form gaps allowing airflows to pass therethrough. The heat exchange device and the freeze dryer of the present disclosure can be designed to be smaller, reducing the volume, and facilitating miniaturization of products.

Abstract: A control device includes a first substrate provided with a chip electronic component; a second substrate having a surface provided with electronic components including a tall component taller than the chip electronic component, the surface of the second substrate facing a surface of the first substrate that is provided with the chip electronic component; and a heat sink disposed between the first substrate and the second substrate. The heat sink includes a component receiving portion and a heat dissipation portion, the component receiving portion being configured to receive the tall component, the heat dissipation portion being configured to perform heat exchange between the first substrate and the second substrate, and the component receiving portion and the heat dissipation portion being provided so as not to overlap with each other as viewed in a facing direction in which the first substrate and the second substrate face each other.

Abstract: An electric-power conversion apparatus has a heat sink in which one side portion out of a pair of side portions that extend in a direction perpendicular to the axial direction of a motor is formed shorter than the other side portion thereof; a lower case to which the heat sink is fixed is fastened to a driving apparatus through the intermediary of fixing portions at the both end portions of each of the pair of side portions of the heat sink or at respective positions in the vicinity of the both end portions of each of the pair of side portions of the heat sink; at least one of a reactor and capacitors is disproportionately disposed to be closer to said one side portion than to said the other side portion of the heat sink.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Abstract: An object is to provide a technique capable of suppressing reduction in sticking force of a semiconductor package and a radiation fin in a semiconductor device including the semiconductor package and the radiation fin when the semiconductor package and the radiation fin stick and are fixed to each other by magnetic force. A semiconductor device includes: a semiconductor package; an insulating substrate; a radiation fin; a first fixed part made up of one of a magnetic body and a bond magnet integrally formed with the semiconductor package; and a second fixed part made up of another one of the magnetic body and the bond magnet integrally formed with the radiation fin, wherein the semiconductor package and the radiation fin stick to each other by magnetic force occurring between the first fixed part and the second fixed part.

Abstract: An enclosed heat sink with a side wall structure is provided. The side wall structure includes a welding body having a first welding plane and a side wall structure having a second welding plane. The first welding plane and the second welding plane are pressured and welded to each other, such that the welding body and the side wall structure encapsulate a cavity. A width of the second welding plane is smaller than a width between two side surfaces of the side wall structure.

Abstract: Aspects described herein include an apparatus comprising a receptacle comprising a cage dimensioned to receive a pluggable optical module into an interior volume, An opening is defined in an exterior surface of the cage. The apparatus further comprises a heat sink assembly rigidly attached to the cage. The heat sink assembly comprises a thermal interface material extending through the opening into the interior volume. The thermal interface material is configured to compress when the pluggable optical module is received into the interior volume and contacts the thermal interface material.

Abstract: A chip package structure is provided. The chip package structure includes a wiring structure. The chip package structure includes a first chip structure over the wiring structure. The chip package structure includes a first molding layer surrounding the first chip structure. The chip package structure includes a second chip structure over the first chip structure and the first molding layer. The chip package structure includes a second molding layer surrounding the second chip structure and over the first chip structure and the first molding layer. The chip package structure includes a third chip structure over the second chip structure and the second molding layer. The chip package structure includes a third molding layer surrounding the third chip structure and over the second chip structure and the second molding layer. The chip package structure includes a fourth molding layer surrounding the second molding layer and the third molding layer.

Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.

Abstract: A multi-cavity package includes a single metal flange having first and second opposing main surfaces. The multi-cavity package also includes a circuit board attached to the first main surface of the single metal flange. The circuit board includes a first surface facing the single metal flange, and a second surface facing away from the first surface. The circuit board also includes a plurality of openings exposing different regions of the first main surface of the single metal flange. The circuit board also includes a lateral extension that overhangs the single metal flange. A corresponding method of manufacturing is also provided.

Abstract: A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.

Abstract: The present invention provides a display module and a display device. By disposing a second heat dissipation layer between a first heat dissipation layer and a first substrate, and connecting the first heat dissipation layer with the second heat dissipation layer, heat in a driving chip is transmitted to the second heat dissipation layer and then directly transmitted to the first heat dissipation layer, thereby the display module allows the heat to be quickly distributed throughout the panel and reducing the temperature in the areas corresponding to the driving chip. Therefore, the present invention solves the technical problem that areas corresponding to driving chips have higher temperature when current display modules are in operation.

Abstract: The electronic device unit includes: a control target device; and an electronic control device, the control target device including: a control target housing; a control target component; and an inner connector, the electronic control device including: an electronic circuit including a circuit board and an electronic control component; and a first connector, which is electrically connected to the electronic control component. The control target housing has formed therein an opening, which allows the electronic control device to be placed in and taken out of the control target housing. When the first connector is connected to the inner connector, the electronic control device is located inside the control target housing.

Abstract: Electronic module for the mounting of electronic components comprising a housing that is bounded in a longitudinal direction by two end faces, each with an opening. The housing can be fitted via the openings with at least one first circuit board, equipped with electronic components, and with at least one second circuit board, equipped with plug and/or clamp connectors. On an inner side of one housing wall, the housing comprises at least one dome, configured in a longitudinal direction, on which the at least one first circuit board can be attached essentially transversely to the longitudinal direction. At two opposite-facing inner sides and/or two opposite-facing domes, the housing furthermore comprises a retaining groove in which to insert at least one second circuit board in a longitudinal direction.

Abstract: A thermoacoustic device includes a stage coupled to a bar, wherein the stage includes a first heating component on a first terminus of the stage. The stage further includes a first cooling component on a second terminus of the stage. A thermal conductivity of the stage is higher than a thermal conductivity of the bar. A heat capacity of the stage is higher than a heat capacity of the bar.

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

Abstract: A power module of the present invention includes a power device for converting and outputting a frequency of an input power source, and a housing accommodating the power device therein and forming flow paths for a cooling fluid on both sides of the power device such that the cooling fluid can contact both sides of the power device. Accordingly, both plate surfaces of the power device can be in direct contact with the cooling fluid so as to be quickly cooled.

Abstract: The proposed design concerns RF shielding can that has the benefits of an RF can, but without compromising the thermal design of the system.

Abstract: A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.

Abstract: A shielding member includes a frame body and an outer cover. Two sides of a first end of the frame body respectively include a first shaft portion. Two sides of the frame body respectively include a first side plate. The frame body is covered by the outer cover. Two sides of a first end of the outer cover respectively include a second shaft portion, and each of the second shaft portions is pivotally connected to the corresponding first shaft portion. Two sides of the outer cover respectively include a second side plate, and each of the second side plates covers an outer side of the corresponding first side plate. Accordingly, the frame body and the outer cover are assembled to form a one-piece metallic shielding member. The structure of the shielding member is simple, the manufacturing for the shielding member is easy, and the cost for manufacturing the shielding member is reduced.

Abstract: An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.

Abstract: This disclosure provides a thermal-dispersion type thermal mass flowmeter having a sleeve and a measuring module. Two ends of the sleeve are respectively a fixed end and a measuring end. The measuring module is accommodated in the sleeve. The measuring module has a bracket. A heater, a first temperature sensor, and a second temperature sensor are arranged on the bracket. The first temperature sensor is thermally connected to an internal surface of the sleeve, the second temperature sensor and the heater are thermally connected to the measuring end, and the second temperature sensor and the heater are arranged on the central axis of the sleeve.

Abstract: A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.

Abstract: A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface that is configured to be engaged in thermal communication with a heat source. The lower block also having an inclined upper surface, that is configured to be in thermal communication with a block directly above, having a complemental inclined surface, wherein the blocks are elastically coupled with elastic components. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block and to a cooling source.

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Abstract: A DC link capacitor cooling system having an integrated heat sink disposed across a bottom surface of a DC link capacitor with a dielectric thermal interface material covering the integrated heat sink, and a chassis contacting the dielectric thermal interface material, wherein the chassis has an active fluid coolant domain therein.

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

Abstract: Disclosed is a direct cooling-type display device having a double-sided display, the display device being configured to implement efficient heat radiation and comprising: a first display; a second display provided such that the back surface thereof faces the back surface of the first display; a housing for mounting the first display; an inlet port formed in the housing so as to form a path along which external air flows in; a first discharge port formed in a first area in which the first display is provided; a second discharge port formed in a second area in which the second display is provided; a first temperature measurement portion for measuring the temperature in the second area; a first outlet fan for discharging air in the first are through the first discharge port; a second outlet fan for discharging air in the second area through the second discharge port; a first backflow prevention portion provided in the first discharge port so as to prevent air from flowing from outside the housing into the same t

Abstract: A wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are stacked on and contact one another. The conductive through via extends through the dam portions.

Abstract: An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.

Abstract: The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.

Abstract: Heat sink devices that use a phase change material (PCM) as a heat sink material, and methods of using such devices in thermal management applications. Such a heat sink device includes a base wall, a top wall spaced apart from the base wall, and an internal structure in intimate thermal and physical contact with the base wall and the top wall. The internal structure includes multiple compartments defined and separated by fins that extend between the base and top walls. At least one PCM is within the compartments and the fins serve as thermal enhancement structures to augment the surface area to volume ratio of the heat sink device.

Abstract: A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.

Abstract: A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.

Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.

Abstract: The present invention relates to a package-before-etch three-dimensional package structure electrically connected by plated copper pillars and a process thereof. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.

Abstract: A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.

Abstract: A packaged semiconductor device including an integrated passive device-containing package component disposed between a power module and an integrated circuit-containing package and a method of forming the same are disclosed. In an embodiment, a device includes a first package component including a first integrated circuit die; a first encapsulant at least partially surrounding the first integrated circuit die; and a redistribution structure on the first encapsulant and coupled to the first integrated circuit die; a second package component bonded to the first package component, the second package component including an integrated passive device; and a second encapsulant at least partially surrounding the integrated passive device; and a power module attached to the first package component through the second package component.

Abstract: A battery pack for an electric vehicle or a hybrid vehicle may include a housing, a stack of battery cells disposed within the housing, and a cooling subassembly. The housing typically holds the cell stack together, and the cooling subassembly typically cools the cell stack to prevent damage to the battery cells and to maintain the performance of the battery cells. The cooling subassembly may include a cold plate defining a liquid flow channel and one or more thermoelectric devices (TEDs) that are operable to cool the cell stack when current is supplied thereto. Heat spreaders may be employed within the battery pack, and exemplary configurations of components to thermally and mechanically couple the cooling subassembly are described.

Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.