Abstract: The disclosure relates to a battery lower casing and a battery system. The battery lower casing comprises: a support frame comprising a plurality of fixing beams that are connected end to end to form an accommodating space, wherein each of two fixing beams opposite to each other comprises a fixing portion extending toward the accommodating space, each of the fixing beams comprises fixing tabs at a side of the fixing beam away from the accommodating space, and the battery lower casing is connected to a target object through the fixing tabs; and a bottom plate connected to the fixing beams.

Abstract: A battery wherein a first housing element (2) forms a first temperature-control structure (101) on a side averted from the interior space (5), wherein a second housing element (3) forms a second temperature-control structure (102) on a side averted from the interior space (5), and a cover element (100) is connected to the second housing element (3) such that the cover element (100) delimits a temperature-control fluid receptacle (112), which can be flowed through by temperature-control fluid, and the second temperature-control structure (102) is formed such that it can be flowed around by the temperature-control fluid, wherein the cover element (100) is formed in a planar configuration from a metal or has a deformed portion for accommodating a second element (9) of the battery controller.

Abstract: Disclosed herein is an instrument suitable for processing cells for example culturing, concentrating or washing said cells, the instrument comprising: a housing for accommodating mechanical elements including at least one fluid pump; and a disposable processing kit complementary to the mechanical elements within the housing and comprising a fluid circuit including a fluid reservoir and plural fluid paths capable of carrying fluid flow caused by said pump(s), the instrument further including a mechanism for determining the quantity, or change in quantity of the fluid in the reservoir resulting from said fluid flow, the instrument yet further comprising a controller operable to control at least the pump and operable to perform a fault determination process, which includes the steps of determining the expected flow rate of said pump(s) calculated from the speed of the pump(s) and comparing that expected flow with the change in quantity of the fluid in the reservoir as determined by said mechanism.

Abstract: An electronic control device comprises at least three connectors, a case, and a board. The case has at least three openings through which the connectors are inserted, the connectors are provided on a plane. The board is housed inside the case and to the connectors are electrically connected thereto. The at least three openings includes a first opening, a second opening, and a third opening. The third opening is disposed between the first opening and the second opening. The case includes the first, second, and third openings, and a heat dissipation fin or a rib provided between the first opening and the second opening.

Abstract: A breathing air laboratory on location gas sample test and data collecting system and method, at a remote breathing air provider's facility, that includes an air compressor, for remotely testing, collecting, and monitoring the quality and purity of the breathing air being produced at the provider's facility, that allows an accredited independent monitoring, testing, and analyzing facility to provide breathing air validation and certification to a cloud-based air quality test and analysis account belonging to the breathing air provider facility at any time. The system includes redundant gas sample air sensors for O2 and CO to ensure quality and accuracy in the breathing air test and data collection, and analysis and a “canary” gas sample test module securely mounted in a laboratory chassis, but manually swappable, to ensure credibility and accuracy of the sensors being used to test gas/air samples.

Abstract: An avionics system for an unmanned aerial vehicle (UAV) includes a housing having a mounting hole, a flight control circuit board arranged inside the housing, a wireless communication circuit board integrated with the flight control circuit board on a printed circuit board (PCB), a positioning circuit arranged inside the housing and above or below the PCB, and a connection wire passing through the mounting hole and connecting the flight control circuit board with an electronic governor of the UAV arranged outside the housing.

Abstract: A plug-in connector with a plug side and a connector side is provided, the plug-in connector comprising a housing, a frame, and at least one contact insert. The contact insert comprises sensors and a circuit board with electronics. According to prior art, the risk of overheating of the electronics, occurring inside the plug-in connector as a result of power dissipation, is a reason for the failure of plug-in connectors known to date. Embodiments described herein ensure heat dissipation via a cooling element so that overheating is prevented.

Abstract: A measuring device with at least one sensor and at least one transmitter housing, wherein the transmitter housing has at least one terminal space and an electronics space adjacent to the terminal space and connected via a partition wall, wherein at least a first electronic device for the connection of supply and/or I/O lines is arranged in the terminal space and wherein at least a second electronic device is arranged in the electronics space with electronics for controlling the sensor, wherein the first electronic device and the second electronic device are electrically conductively connected to one another via a contacting unit, wherein the contacting unit is removably inserted into a recess of the partition wall. The A measuring device that is simple to produce and whose components can be particularly easily replaced is achieved by the contacting unit being firmly connected to the first electronic device.

Abstract: A motor electronics unit includes a printed circuit board having a first side and a second side with electronic components connected to the printed circuit board. An electrical conductor is connected to the printed circuit board. A heat sink is connected to the printed circuit board. A pre-molded electrical connector shroud has a portion of the electrical conductor positioned within the electrical connector shroud. A housing has an endcap, both co-molded in a low pressure injection molding process of a thermally conductive polymeric material. The endcap encapsulates the printed circuit board including the electronic components connected to the printed circuit board and covers a first portion of the heat sink, with a second portion of the heat sink uncovered by the polymeric material of the endcap to permit heat transfer away from the printed circuit board. The endcap also encapsulates a portion of the electrical connector shroud.

Abstract: A computer case configured to dispose a motherboard and a graphics card therein is provided. The computer case includes an outer frame and a motherboard carrier. The outer frame includes a side surface. The motherboard carrier is connected to the outer frame and configured to dispose the motherboard thereon. A body of the motherboard carrier and the side surface form a predetermined angle of greater than 0°.

Abstract: A breathing air laboratory on location gas sample test and data collecting system and method, at a remote breathing air provider's facility, that includes an air compressor, for remotely testing, collecting, and monitoring the quality and purity of the breathing air being produced at the provider's facility, that allows an accredited independent monitoring, testing, and analyzing facility to provide breathing air validation and certification to a cloud-based air quality test and analysis account belonging to the breathing air provider facility at any time. The system includes redundant gas sample air sensors for O2 and CO to ensure quality and accuracy in the breathing air test and data collection, and analysis and a “canary” gas sample test module securely mounted in a laboratory chassis, but manually swappable, to ensure credibility and accuracy of the sensors being used to test gas/air samples.

Abstract: According to one embodiment, an inverter device configured to be capable of switching an on or off state of each of a plurality of switching elements, on the basis of a control command signal, and operable as a single-phase inverter, includes: a pulse width modulator configured to set a voltage value at a time when one of the switching elements is set to the on state to a first voltage, and set a voltage value at a time when the other three of the switching elements are set to the on state to a second voltage larger than the first voltage, in operation as the single-phase inverter; and a detection unit configured to detect the control command signal in operation as the single-phase inverter.

Abstract: A closure (100/200) protects telecommunications circuitry from water and dust. The closure (100/200) includes a base (128) that has a sidewall (134) that extends upwardly from a bottom (118), and the sidewall (134) has at least one cable port (122/222). The closure (100/200) also includes a cover (126) that attaches to the base (128) to close an interior (130) of the closure (100/200). Further, a galvanic anode (124) is removably secured to the sidewall (134) of the base (128) of the closure (100/200) and electronic circuitry (132) is disposed within the interior (130) of the closure (100/200). The electronic circuitry (132) is active electronic circuitry.

Abstract: An article of manufacture comprising a heat sink to be attached a heat source, being coupled thermally and directly for conductive flow of heat from the heat source to the heat sink. The heat sink is formed via extrusion of material of suitable density and mass to absorb heat from the heat source based on design requirements. The extruded heat sink is configured with specially oriented extruded fins and machined cross cuts to increase surface area available to air flow, and arranged for efficient passage of air around the extruded heat sink, thus effecting efficient convection of heat into the air ambient. Cross cuts and fin are specifically arranged to enhance the “stack effect,” or “chimney effect,” associated with air flow. An objective is to maximize air flow across available surface area, and thus to enhance removal of heat into the air ambient.

Abstract: An electricity storage device (1) which is provided with an electricity storage element (40) and an outer case (10). This electricity storage device (1) is also provided with: a measurement substrate (81) which is connected to the electricity storage element (40), and through which a first electric current passes; and a main circuit substrate (82) through which a second electric current that is larger than the first electric current passes. The main circuit substrate (82) is arranged so as to face a part of a container (410) of the electricity storage element (40), said part being different from a long lateral surface (411) of the container (410).

Abstract: A amplifier with improved space efficiency includes a housing that dissipates heat having an upper wall and two side walls and having an interior with upper and lower portions. The amplifier further includes an upper circuit board in the upper portion and a lower circuit board in a lower portion. The amplifier further includes a connector that electrically connects the upper and lower circuit boards.

Abstract: A plurality of parts built in an electronic apparatus are attached to a frame. Further, the frame has a peripheral wall portion formed along an outer peripheral face of the electronic apparatus. An upper cover has a rear face portion attached to a rear wall portion of the frame by a screw. Further, a lower cover has a rear face portion attached to the rear wall portion of the frame by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.

Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.

Abstract: An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.

Abstract: An apparatus and method for keeping mobile devices warm in cold climates are disclosed. A particular embodiment includes: a frame structure wherein a first portion of the frame structure being in proximity to the body of a user to receive body heat from the user, the frame structure including a second portion to support electronic components of the apparatus; and a thermal conduit thermally coupled between the first and second portions of the frame structure, the thermal conduit transferring body heat received at the first portion to the electronic components of the apparatus at the second portion.

Abstract: A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.

Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.

Abstract: An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing.

Abstract: An apparatus or method for providing thermal energy transfer comprising; a circuit board, a housing connected to the circuit board, at least one electronic component contained within said housing, said housing comprising a aperture, wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.

Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.

Abstract: Modules, systems, and methods are provided for cooling components of an inspection or testing apparatus, such as a borescope. In some exemplary embodiments, the modules include two heat sinks, with the top-most heat sink having a fan assembly approximately centrally disposed therein. The fan assembly can be operated to draw air into the top-most heat sink, and then exhaust airflow out of the top-most heat sink such that the exhaust air passes across at least a portion of the second heat sink to help cool both the first and second heat sinks, and components of the apparatus associated therewith, using the same fan assembly. As a result, the components of the apparatus can be cooled more easily, and the performance and efficiency of these components is improved, all while reducing the overall size and weight of the inspection apparatus.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.

Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner.

Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.

Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.

Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Abstract: Reliability of power semiconductor modules that excel in cooling performance is to be improved. To achieve the above object, each power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.

Abstract: An electric equipment includes: an electric component box; a control board accommodated in the electric component box and provided thereon with a heat-generating electric component; a heat sink thermally connected with the electric component; and a sheet material provided between the electric component box and the control board, wherein the sheet material is made of an elastic material and provided with an opening section through which the heat sink projects outward, the opening section is provided with a convex section formed integrally with the sheet material and configured to be elastically deformed to engage the sheet material with the heat sink, and the electric component box is provided with a heat sink hole through which the heat sink and the convex section project outward of the electric component box. An air conditioner is provided with such electric equipment.

Abstract: An electronic signal transmitting device is disposed in a housing of an integrated circuit. The integrated circuit includes at least one first signal end and at least one second signal end. The electronic signal transmitting device includes at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end; and an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference.

Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).

Abstract: An electric vehicle supply equipment may include a first cover element including a well portion to accommodate a first circuitry, wherein the first circuitry includes a chimney stack that couples to a venting hole. Also, the electric vehicle supply equipment may include a second cover element including a recess portion to accommodate a second circuitry, wherein the second circuitry includes a charcoal filter that couples to the chimney stack to absorb impurities generated by the first circuitry and the second circuitry. Further, the electric vehicle supply equipment includes a universal/serial connection port configured to couple to peripheral devices, wherein the universal/serial connection port is an optical coupled connection.

Abstract: The present invention provides a flat panel display device, which includes a backlight system and a display panel. The backlight system includes a light source, a light homogenization mechanism, and a back frame. The back frame carries the light source and the light homogenization mechanism, and the light homogenization mechanism guides light from the light source into the display panel. The back frame includes primary assembling pieces, secondary assembling pieces, and an adjustable bracing piece. Through the arrangement of a reinforcement structure on a joint section of the primary assembling piece, the strength of the back frame is improved. Available mounting points between the bracing piece and the primary assembling pieces or the secondary assembling pieces are of a number of at least two so that the bracing piece is selectively mounted to the back frame at different positions. The present invention also provides a stereoscopic display device and a plasma display device.

Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.

Abstract: An electronics module for a vehicle includes a plate element, a circuit carrier element, and a cover element. The electronics module further includes an inner region and an outer region. The plate element is configured to provide at least one conductive connection between the inner region and the outer region in order to electrically connect the circuit carrier element. The circuit carrier element is positioned on the cover element, and at least one electrical connection element is positioned between the circuit carrier element and the plate element. The at least one electrical connection element is an automatic connection element which is configured to automatically provide an electrically conductive connection between the circuit carrier element and the conductive connection of the plate element when the cover element and the plate element are fitted.

Abstract: An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.

Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.

Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Abstract: Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.

Abstract: An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.