Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

Abstract: A motor includes a base having a fixing seat, an axial tube mounted to the fixing seat, a rotor mounted to the axial tube, and a circuit board mounted to the base and including a stator and at least one heat-generating component. The base includes at least one slot. At least one fixed plate is located adjacent to the slot. The fixed plate is at a different height from the base. The fixed plate is smaller than the slot. The heat-generating component is fixed to the fixed plate. The fixed plate assists in dissipation of heat generated by the heat-generating component.

Abstract: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

Abstract: Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.

Abstract: The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

Abstract: An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing.

Abstract: The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing (1) or into recesses (3) corresponding to the geometry of the components by means of pressure elements, and electrical isolation, preferably a thermally conductive silicone rubber, is provided between the housing (1) and the components.

Abstract: An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.

Abstract: A multi-component housing including a housing shell and a housing lid is disclosed. A support plate that is fitted with at least one power electronics component is disposed on a base plate of the housing shell. The housing lid supports a mounting device for fastening the housing to a cooling body by pressing the support plate to a supporting area of the cooling body. At least one supporting element is provided for transferring a pressing force that is applied in the direction of the base plate from the housing lid to the housing shell.

Abstract: A structure comprises a high thermally conductive case with a receiver space for a power module, a thermally conductive part being provided on the case to contact a heating component of the power module in the power supply to induct the heat by the heating component to the case and contact the exterior air through the outside surface of case to dissipate the heat; and a housing the inner surface of which directly contact and cover the outside of high thermally conductive case, a grid-formed structure being formed at most of the region of housing to prevent the heat from scalding the person who touches or takes the power supply. With the large heat dissipation area, the heat is transferred through the external air to increase the efficiency of heat dissipation, and further all power parts may operate in a lower temperature to increase the work efficiency of power supply.

Abstract: An electronic circuit apparatus has a casing, a circuit board at which electronic members and power transistors are mounted, and a connector for connecting the circuit board with an external electrical circuit. The casing is insertion-molded by a resin, with the circuit board where the electronic members, the power transistors and the connector have been mounted being held at a predetermined position in a die for molding the casing through the resin. Thus, in the electronic circuit apparatus, damage to circuit components and noise due to a vibration excitation can be restricted, without increasing the number of construction members of the electronic circuit apparatus.

Abstract: An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Abstract: A power adapter includes a housing formed of a bottom cover shell and a top cover shell and having an air passage extending across the bottom cover shell and an exhaust port in the top cover shell, a PC board mounted in the housing, two heat sinks covered on the PC board for absorbing heat from the primary and secondary sides of the PC board respectively for enabling absorbed heat to be carried to the outside of the housing by outside cooling air that is circulating through the exhaust port and the air passage, and a spacer set in the air passage between the heat sinks and working with the heat sinks to protect the PC board against outside dust and water.

Abstract: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.

Abstract: A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

Abstract: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

Abstract: A structural unit having a frame, a connecting face that surrounds an opening and a cover that is attached to the connecting face to cover the opening. The frame and the cover are formed of materials with different coefficients of thermal expansion, and the connecting face has a channel that opens towards the cover. At least one duct communicates with the channel so that when a filling compound is injected into the duct it is received in the channel. The filling compound thereby attaches the cover to the frame and provides a seal therebetween.

Abstract: An utility meter is provided. The meter includes a base and a first barrier operably associated with the base. The base and the first barrier define a first compartment between the base and the first barrier. The meter also includes a heat generating component positioned in the first compartment and operably associated with the base. The meter also includes a second barrier extending from the base. The second barrier and the first barrier define a second compartment between the second barrier and the first barrier. The meter further includes an arrangement for moving heat connected to the heat generating component and extending from the first compartment to the second compartment.

Abstract: An engine control unit for controlling an automobile engine, which is equipped with a booster circuit for boosting the voltage of battery power source, an injector driving circuit for driving an injector by making use of a boosted high voltage, and a microcomputer for controlling the engine; wherein the engine control unit is featured in that an LC module mounted with a booster coil constituting the booster circuit and with an electrolytic capacitor, a power module mounted with a rectifying device constituting the booster circuit and the injector driving circuit and with a switching device, and a control circuit board mounted with the microcomputer and with a connector acting as an interface for an external member of the engine control unit are laminated each other.

Abstract: A plasma display apparatus is capable of enhancing the heat dissipating ability of a plasma display panel, and of reducing the total weight of the plasma display apparatus. The plasma display apparatus comprises a plasma display panel, a frame to which the plasma display panel is attached and by which the plasma display panel is supported, and a boss plate fixed to a rear surface of the frame and fitted with driving circuit boards. The frame is formed in the shape of a rectangular frame which contacts edges of the plasma display panel. A vertical member is vertically disposed in the rectangular frame. The vertical member has wall-mounted bosses which support the total weight of the plasma display apparatus. Other features include a thermally conductive member formed on the rear surface of the frame, and formation of an air passage between the thermally conductive member and the driving circuit boards.

Abstract: A progammable power supply for providing a regulated DC output power is disclosed. The power supply provides the output power to any one of a plurality of electronic devices adapted for receiving the output power at an operational voltage or an operational current. The power supply receives a programming signal to maintain the output power at the operational voltage or operational current associated with a particular selected electronic device. Accordingly, by varying the programming signal, the power supply can be programmed to provide output power to any one of several electronic devices having differing input power requirements.

Abstract: A chassis base assembly including a chassis base, a driving circuit unit located at a rear side of the chassis base, the driving circuit unit including a circuit element protruding from the driving circuit unit toward the chassis base, and a heat sink attached to the circuit element, and a flat panel display device having the same.

Abstract: A computer has a casing that accommodates a main board having a heat generating component that generates heat therein. The computer includes an internal heat discharging part disposed in the casing and coupled with the main board to discharge a first portion of the heat generated by the heat generating component, an external heat discharging part provided on an external surface of the casing to discharge a second portion of the heat generated by the heat generating component, and a heat transmission part to transmit the first and second portions of the heat generated by the heat generating component to the internal and the external heat discharging parts, respectively, such that the first and second portions of the heat generated from the heat generating component is discharged through the internal and the external heat discharging parts, respectively. Accordingly, the computer has a simple structure and assembly and an improved heat discharging efficiency.

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract: A semiconductor device includes a semiconductor chip, a metal disc portion, a lead, and a sealing material. The semiconductor chip has surfaces both serve as primary electrode surfaces. The metal disc portion is secured to an external cooling metal body. One primary electrode surface of the semiconductor chip is soldered to the disc portion. The lead has a head portion at an end thereof and the head portion is soldered to the other primary electrode surface of the semiconductor chip. The sealing material seals at least a side face of the semiconductor chip and two soldered portions of the disc portion and the head portion. The disc portion is provided with projections on a surface opposite to the surface to which the semiconductor chip is soldered.

Abstract: The invention provides an electrical device having improved insulation and reduced partial discharge. The electrical device comprises an electrically conductive resistive element provided on a heat transfer medium for transferring heat from the element. The heat transfer medium includes a layer or body of electrically conductive material and a layer of thermally conductive dielectric material disposed between the element and the electrically conductive material. A continuous film of electrically insulating material, for example a silica over-glaze or polymer encapsulant, is applied around the perimeter of the resistive element to surround the element with the film overlying the edge or edges of the element and the ceramic material adjacent thereto.

Abstract: A closed type device having excellent waterproofness and dustproofness, capable of preventing the entry of a corrosive gas, and having humidity conditioning function. In the heat radiating structure of the device (10), a ventilation hole (13) is formed in a part of the casing of the device formed of a casing body (11) and a door (12), and a composite sheet (14) formed by overlapping a carbon sheet in which the layer of activated carbon is held by permeable non-woven fabric with a fine-hole sheet having air permeability, waterproofness and dustproofness is fitted to the casing with the fine-hole sheet facing outward so as to cover the ventilation hole (13).

Abstract: A semiconductor package structure and manufacturing method thereof are provided, wherein the semiconductor package structure comprises a multi-layer circuit board, an electronic device and a slug. The multi-layer circuit board has at least one via hole, and the electronic device having a upper surface is buried in the multi-layer circuit board, wherein a portion of the upper surface is connected with the via hole. The slug is set in the via hole. One end of the slug is in contact with the upper surface of the electronic device and the other end of the slug is exposed out of the multi-layer circuit board through the via hole.

Abstract: A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a plasma display panel and includes an electronic device covered by a protecting member, is provided. The heat radiating assembly may include a heat absorbing member, a heat radiating member, and a heat transferring member. The heat absorbing member may absorb the heat generated by the electronic device and transmitted to the protecting member. The heat radiating member may radiate heat out from the plasma display apparatus. The heat transferring member may transfer the heat from the heat absorbing member to the heat radiating member.

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A plasma display apparatus including: a plasma display panel; a non-conductive chassis disposed on a rear portion of the plasma display panel to support the plasma display panel; a circuit unit disposed on a rear portion of the chassis to drive the plasma display panel; and a conductive member disposed between the plasma display panel and the chassis, having at least a part that is slit and protruded toward the chassis. In addition, the circuit unit includes a grounding portion having a grounding voltage and the grounding portion is electrically connected to the protruding portion of the conductive member.

Abstract: An optical disk device of the present invention has a main PC board carrying a semiconductor element and attached at the rear of a drawer to efficiently dissipate a heat generated from the semiconductor element. The drawer is formed of a material having good thermal conductivity. A thermal conductive member having good thermal conductivity is interposed between the IC desired to be dissipate heat and the drawer.

Abstract: An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition wall. The first chamber accommodates a CPU generating heat. The suction port and the exhaust port are open to the second chamber. A heat pipe which transfers a heat of the CPU from the first chamber to the second chamber is disposed pass through the partition wall. A fan is disposed in the second chamber. The fan suctions air from the suction ports and discharges the suctioned air from the exhaust port. The heat of the CPU transferred to the second chamber is emitted out of the housing. A part where the heat pipe pass through the partition wall is liquid-tightly sealed through a sealing member.

Abstract: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.

Abstract: An exemplary display device (1) includes a chassis (12), a circuit board (14) and a heat sink (16). The heat sink connects with the circuit board and the chassis. The chassis covers the circuit board and includes at least one heat conducting member (120) connecting with the heat sink. The display device performs an increased heat dissipating efficiency, and can be conveniently assembled or disassembled.

Abstract: The enclosed electronic ballast housing provides improved convection heat transfer for lowering the ambient housing temperature for keeping the junction temperature of power semiconductors inside the enclosed electronic ballast housing within certain specified temperature ranges for long-term reliable operation. The enclosed electronic ballast housing includes at least one folded fin on at least one of the enclosed electronic ballast housing surfaces, the folded fin may be manufactured from the same piece of material as the ballast housing for improved heat transfer. The folded fins are substantially parallel to their respective adjacent surfaces. Additionally, the enclosed electronic ballast housing includes separating portions of heat dissipating sections of ballast circuitry outside of the housing ballast.

Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.

Abstract: A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

Abstract: The present invention provides an inverter assembly which comprises a casing with a top part, a base and two sidewalls, and the top part. The base and the two sidewalls are integrally manufactured as a one-piece. A printed circuit board with a plurality of electronic parts is received in the casing. A heat sink member has a guide member and a body, wherein the guide member is slidably engaged with a groove defined in an inside of either of the two sidewalls is able to be pivoted about the guide member in a limited angle so as to adjust a gap between the inside of the sidewall and an inside of the heat sink member. The electronic part is clamped between the inside of the sidewall and an inside of the heat sink member. The front and rear sides of the electronic part are in contact with the heat sink member and the sidewall so as to efficiently dispense the heat.

Abstract: A printer apparatus is disclosed. The printer apparatus includes a heat dissipation plate structure including a thermally conductive material, and a processor comprising a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor. An array of pins is substantially perpendicular to the major surface of the processor. The apparatus also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly. The apparatus also includes a memory for storing print image data, the memory being operatively coupled to the processor. It also includes a printing unit operatively coupled to the memory for printing on paper.

Abstract: An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting feature. At least one electrical component is in thermal contact with a portion of the at least one heat sink.

Abstract: Thermally dynamic housings and methods of utilizing and manufacturing such housings are disclosed and described. In one embodiment, a thermally dynamic housing is provided which encloses and cools an area containing a heat source. The housing may include a metal layer having internal and exterior surfaces and a diamond-like carbon layer coupled to the exterior surface of the housing.

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Abstract: An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible portions are folded by 180° to dispose respective rigid portions to be parallel to each other. The rigid portions, positioned at both ends of the circuit substrate, mount connectors so as to face to mutually opposed directions. Other rigid portions mount electronic components and heater components. The outermost connectors are connected to different connection objects. The casing is made of a metal material so that heat generating from the heater components can be transmitted via heat dissipation gel to the casing and efficiently released to the outside.

Abstract: A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.

Abstract: A plasma display apparatus assembly having high heat-dissipation efficiency is disclosed. In one embodiment, the plasma display apparatus assembly includes: i) a plasma display panel, ii) a chassis base coupled with a rear surface of the plasma display panel and supporting the plasma display panel, iii) a driver circuit board disposed behind the chassis base and having a circuit for driving the plasma display panel, iv) a signal transmission member transmitting an electric signal from the driver circuit board to the plasma display panel, the signal transmission member being connected at one side to the driver circuit board and at the other side to the plasma display panel and including at least one electronic device, v) a protective cover plate covering a portion of the signal transmission member on which the at least one electronic device is mounted, and vi) a heat pipe transferring heat generated by the electronic device to the protective cover plate.

Abstract: The present invention discloses a compact converter including a compact casing having an air inlet defined thereon, a printed circuit board supported within the compact casing at a position between a top and a bottom wall of the compact casing to form an upper air channel between the printed circuit board and the top wall of the compact casing and a lower air channel between the printed circuit board and the bottom wall of the compact casing, wherein the lower air channel is communicating with the upper channel; a cooling fan is electrically mounted on the printed circuit board at a position aligning with the air inlet for drawing exterior air through the air inlet to the lower air channel to create an air circulation between the lower air channel and the upper air channel, so as to cool down the printed circuit board.

Abstract: A portable computer system having a computer body and a display unit coupled to the computer body includes a docking station to be connectable to and disconnectable from the computer body, a heat discharging member provided on the computer body to cool a heat generating component mounted on the computer body, at least one first heat transmission member provided on the computer body and connected to the heat discharging member to be in contact with the docking station, and at least one second heat transmission member provided on the docking station to be in contact with the first heat transmission member and to discharge heat from the computer body. Thus, the portable computer system is capable of discharging the heat generated from the computer body through the docking station.

Abstract: A lighting device contains a plurality of light emitting sources mounted on a thermally conductive housing and electrically connected to a circuit board. The housing includes a base portion which is spaced apart from the circuit board, and an intermediate heat dissipation structure which is disposed between the circuit board and the base portion of the housing, for promoting cooling by convection. The plurality of light emitting sources are in thermal communication with the intermediate heat dissipation structure.