Abstract: The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electronic component and a cooling electrical component. Embodiments include a rotatable latch fastened to the heat generating electrical component, the rotatable latch including a hook; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages a pin extending from the cooling electrical component such that the thermal interface material adhered to the heat generating electrical component is coupled to the cooling component; when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the cooling electrical component; a load screw; wherein when the rotatable latch is in the engaged position, threading the load screw into the rotatable latch moves the rotatable latch into a locked state; and a spring leaf that is coupled to the heat generating electrical component.

Abstract: Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.

Abstract: It is an object to effectively reduce minute clearances generated between a heat radiating member and a vehicle body and ensure good cooling performance while avoiding the occurrence of impact and noise caused by the vibration of a vehicle. A circuit unit U is mounted such that an outer surface 11B of the heat radiating member 10 to which the circuit body 30 is fixed faces a body surface S of the vehicle with a clearance. Preferably, the mounting part 12 fixed to the body of the vehicle is extended, the surface 13 of the mounting part 12 which is in contact with the body is positioned to be substantially parallel to the outer surface 11B of the heat radiating member and a step is provided in both surfaces 13, 11B. In a mounted state, the body and the outer surface 11B of the heat radiating member are facing each other in a substantially parallel state and a clearance is formed between the body and the outer surface of the heat radiating member over the entire area excluding the mounting part 12.

Abstract: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.

Abstract: An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.

Abstract: A container data center includes a mobile container and a number of server systems. The mobile container includes a bottom wall, an inner container portion and an outer container portion. The inner container portion includes a first top wall opposite to the bottom wall, and a number of first sidewalls connected between the first top wall and the bottom wall. The outer container portion includes a second top wall facing the bottom wall, and a number of second sidewalls connected between the second top wall and the bottom wall. The second sidewalls surround the inner container portion. A passage is formed between the first and second top walls and between the first and second sidewalls. The second top wall and the second sidewalls define a number of through holes. The server systems are installed in the inner container portion.

Abstract: An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, and a heat radiating member that is disposed opposing the electro-optical panel through an opening of the holding member from the opposite side of the light incident plane of the electro-optical panel.

Abstract: An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package.

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.

Abstract: A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder extends from the end surface of the heat sink. A thermal interface material (TIM) layer extends on the module side of the heat sink. The TIM layer is configured to engage the pluggable module. The TIM layer includes an end that is engaged between the end surface and the holder of the heat sink.

Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.

Abstract: An electronic module for an integrated mecatronic transmission control includes a housing cover and at least one multi-layer circuit board as an electrical connection between an interior of the housing and components located outside the housing. The multi-layer circuit board is a circuit carrier for electronic components of central control electronics and at the same time is a thermal connection to a base plate.

Abstract: A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.

Abstract: A subsea electronics module or pressure bottle with greatly enhanced capabilities for conducting heat away from internal electronics boards by means of an adjustable heat conduction wedge system.

Abstract: According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element.

Abstract: A mobile device having a flip-around keyboard includes a housing, a display, and a keyboard rotatably coupled to the housing. The housing has a top end, a bottom end, a front surface, and a back surface. The display is located on the front surface of the housing. The keyboard is rotatably coupled at about the bottom end of the housing. The keyboard has a front face having a plurality of keys and a rear face opposite the front surface. In a first configuration, the rear face of the keyboard faces the display of the housing. In a second configuration, the front face of the keyboard faces the back surface of the housing. The keyboard can be rotatably coupled to the housing by a coupler that permits greater than two hundred seventy degrees of rotation about a lateral axis parallel to an edge of the housing.

Abstract: A pluggable module, includes: an insertion gate through which an electronic module is inserted and removed; a guide rail, including a spring support unit provided with a spring unit and a bearing unit located near the insertion gate, to guide the electronic module; and a heat sink plate, including, at one end portion, a fulcrum bar to be inserted into the bearing unit so as to move in a pressing direction of the spring unit, the heat sink plate being pushed up at the other end portion by a leading end of the electronic module so as to be pressed against the electronic module.

Abstract: For improving a cooling efficiency of a display panel in a flat-type image display, various substrates and an image display element are disposed within a thin-sized housing thereof, including: a display panel; a chassis supporting the display panel from a rear surface side thereof; a front surface-side cover on a front side of the display panel; a rear surface-side cover on a rear side of the display panel; an image display element connected to the display panel; a display driver substrate connected to the display panel, and on a surface thereof opposite to the chassis are provided circuit parts; a power source substrate, supplying driving power to the display driver substrate and the image display element, and on a surface thereof opposite to the chassis are provided circuit parts thereof; and a first insulator board opposite to the display driver substrates and the power source substrate of the chassis.

Abstract: One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach.

Abstract: A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.

Abstract: A multilayer circuit board in which wirings are arranged so that the inductance thereof is reduced. A ground wiring and a power source wiring which are provided in a multilayer circuit board are arranged so that most of the wirings are superposed vertically along a direction of a longer side of the circuit board, and since currents flow in an opposite direction to each other in the portions which are superposed, magnetic fields generated by the currents so flowing are canceled by each other. Similarly, a W-phase wiring, a V-phase wiring and a W-phase wiring are also arranged so that the wirings are partially superposed along their longer side direction vertically, and magnetic fields generated by currents flowing in the portions which are superposed vertically are canceled by one another. By this, the inductance of the wirings can be reduced by increasing a mutual inductance between these wirings.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.

Abstract: A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.

Abstract: The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.

Abstract: A number of structural modules are configured to be secured together and to be secured to a foundation. Each of the structural modules is without one or more sidewalls, such that when the structural modules are secured together they form a building structure that encloses an open region which continuously extends through interiors of the structural modules. Each of the number of structural modules is structurally formed to be independently transported. A power module is configured to be secured to one of the structural modules and to the foundation. The power module is defined as an enclosed structure and is structurally formed to be independently transported. The power module is equipped with electrical components for supplying and distributing electrical power to a pre-defined layout of data equipment to be deployed within the open region of the building structure formed by the number of structural modules.

Abstract: An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component.

Abstract: A mounting apparatus for mounting an expansion card to a printed circuit board (PCB), includes a connector on the PCB, and a latch member pivotably connected to the connector. The connector defines a slot to receive the expansion card. The latch member is a rectangular wire frame comprising a lock portion, two connection arms extending down from the lock portion, and two pivot portions extending from distal ends of the connection arms toward each other. The pivot portions are pivotably attached to two sidewalls of the connector. After the expansion card is plugged into the slot of the connector, the latch member is pivoted to make the lock portion press against a portion of the expansion card, thereby locking the expansion card to the connector.

Abstract: An electronic circuit device includes a bus bar, a base component and an electronic component. The bus bar has an external connector terminal capable of receiving electric power from an external power source. The base component has a metallic heat radiation portion and is disposed to oppose the bus bar. The electronic component is held between the bus bar and heat the radiation portion of the base component. The bus bar further includes fixing terminals extending toward the base component. The fixing terminals are fixed to the base component to constitute fixing portions. The fixing portions are configured to have elasticity and exert a restoring force such that a distance between the bus bar and the base component reduces. The electronic component is in pressure contact with the bus bar and the base component by the restoration force of the elasticity of the fixing portions.

Abstract: A machine tool with a heat conduction structure comprises a machine tool and a heat dissipation seat installed on the machine tool. The machine tool has a handle. The handle has an accommodation space accommodating a circuit board and having an opening at one end. The heat dissipation seat has a heat dissipation member arranged on the opening and a carrying member connected with the heat dissipation member and extended to the accommodation space. The carrying member carries the circuit board, contacts heat sources of the circuit board, and conducts heat to the heat dissipation member. As the machine tool is exempted from forming heat dissipation holes on the handle, the present invention can effectively prevent dust from entering the handle and damaging the circuit board. Further, the present invention can dissipate heat generated by the circuit board and maintain normal operation of the circuit board and the machine tool.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission disposed at a position that is higher than the oil surface in the automatic transmission when the transmission is installed in a vehicle and on a side face of a valve body in the transmission case. The apparatus further includes a radiator that contacts the electronic component or the substrate in order to conduct heat generated by the electronic component. At least a part of the radiator is immersed in the oil when the transmission is installed in the vehicle.

Abstract: The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A fixing mechanism for fixing an object to a base plate is provided. The object defines a hole and includes a ring extending from an edge of the hole. The ring includes a threaded hole. The base plate includes a post on its top surface and respectively opposing to the hole. The fixing mechanism includes an elastic element, a first hollow bolt and a second bolt. The first hollow bolt passes through the hole and the elastic element, and includes an externally threaded portion engaging with the threaded hole of the ring. The second bolt is inserted into the first hollow bolt, and engages with the post of the base plate.

Abstract: An electronic apparatus includes a rectangular-parallelepiped first casing, a rectangular-parallelepiped second casing, and a first connecting apparatus. The first connecting apparatus connects the first casing and the second casing such that the first casing and the second casing are capable of being rotated relatively in one of a first rotation direction and a second rotation direction orthogonal to each other between a first state and a second state. The first state is a state where a first main surface of the first casing comes to be faced with a third main surface of the second casing. The second state is a state where a second main surface of the first casing comes to be faced with a fourth main surface of the second casing.

Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

Abstract: The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device 13 comprises a larger heat-dissipating part 7, and at least one smaller heat-dissipating part 6. The larger part 7 is arranged with at least one cavity 8 for housing the at least one smaller part 6. The at least one smaller part 6 is adapted to be attached to at least one heat-generating source 2, and at the same time more mobile in the cavity 8 and/or less affected by changes in temperature than the larger part.

Abstract: A power supply device (10) comprises a casing (26), a support structure (14) and driving means (42) for selectively rotating the casing (26) relative to the support structure (14). The casing (26) houses electrical equipment (36) and electrical sockets (30,32,34). The support structure (14) is attachable to the top (12) of an article of furniture and supports the casing (26) for rotation about an axis (28), parallel to the top (12). The casing (26) can be rotated by the driving means between an operative position in which the electrical sockets (30,32,34) face upwards and are accessible above the top (12), and a stowed position in which the electrical sockets (30,32,34) are not accessible from above the top (12). The casing (26) has a protuberance (40) that extends around the electrical sockets (30,32,34) and the protuberance (40) stands proud of the top (12) when the casing (26) is in its operative position.

Abstract: An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at opposed ends of the module, and the at least one interiorly positioned fastener, wherein the base is capable of accepting electronic components and further includes at least one layer, and wherein the at least one interiorly positioned fastener is interposed between the at least two peripheral fasteners.

Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.

Abstract: A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.