Abstract: A cooling device for integrated circuits. The device includes: a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device; and a single power connector that provides power to all the cells in the array. The controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector.

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

Abstract: A drive includes an electric motor disposed in a housing and driving a motor shaft, a Hall effect sensor adjacent to the motor, a power and control assembly, and a pinion gear driven by the motor shaft. A planetary gear reduction assembly is driven by the pinion gear, and an output axle has an axis of rotation that is offset from and parallel to the motor shaft axis of rotation. The reduction drive is substantially bilaterally symmetrical about a plane passing through the motor shaft axis of rotation and the output axle axis of rotation. The power and control assembly comprises a control board oriented perpendicular to a power board and includes a heat dissipation apparatus that applies multi-point, localized, indirect pressure to a plurality of field effect transistors mounted on the power board.

Abstract: A temperature modulation assembly and a multi-layer retention mechanism for such a temperature therapy device are disclosed. According to one embodiment, a temperature modulation assembly for a temperature therapy device has a heat spreader and a mounting plate coupled to a bottom portion of a spacer, wherein the heat spreader is disposed between the mounting plate and the spacer. The temperature modulation assembly has a heatsink and a fan coupled to a top portion of the spacer, wherein the heatsink is disposed between the top portion of the spacer and the fan. The temperature modulation assembly further includes a heating and/or cooling device disposed within a central opening of the spacer, wherein the heating and/or cooling device is located between the heatsink and the heat spreader.

Abstract: A package that includes a substrate, an integrated device, a plurality of first wire bonds, at least one second wire bond, and an encapsulation layer. The integrated device is coupled to the substrate. The plurality of first wire bonds is coupled to the integrated device and the substrate. The plurality of first wire bonds is configured to provide at least one electrical path between the integrated device and the substrate. The at least one second wire bond is coupled to the integrated device. The at least one second wire bond is configured to be free of an electrical connection with a circuit of the integrated device. The encapsulation layer is located over the substrate and the integrated device. The encapsulation layer encapsulates the integrated device, the plurality of first wire bonds and the at least one second wire bond.

Abstract: An arrangement for exchanging heat between two bodies comprises a circuit board, having at least one first via and at least one second via, wherein at least one heat exchange structure is integrated in the circuit board, wherein the at least one heat exchange structure comprises two heat exchange layers and an intermediate layer arranged between the two heat exchange layers, wherein the two heat exchange layers are thermally joined to each other and electrically separated from each other by the intermediate layer, wherein a first heat exchange layer is associated with the first body and can be brought into thermal contact with it and a second heat exchange layer is associated with the second body and can be brought into thermal contact with it, wherein the at least one first via and the at least one second via are each led through the two heat exchange layers and the intermediate layer arranged between the two heat exchange layers, wherein the at least one first via is in contact only with the first heat exch

Abstract: An apparatus and a method are provided for an air box configured to cool an engine control unit (ECU) by way of an airstream being communicated to an air intake system of an internal combustion engine of a vehicle. The air box is comprised of a housing to support an air filter within an interior of the housing. An opening in the housing fixedly receives at least one surface of the ECU to transfer heat from the ECU to the airstream. A mount portion within the housing receives the air filter. A conduit to a clean side of the air filter is configured to be coupled with the air intake system. An inlet to the housing is configured to couple with an air inlet duct of the vehicle so as to direct the airstream into the interior of the housing.

Abstract: The present disclosure provides a power module and a method for manufacturing the power module. The power module includes a chip, a passive element and connection pins. The connection pins are provided on a pin-out surface of the power module, and are electrically connected to at least one of a chip terminal of the chip and the passive element; a projection of the chip on the pin-out surface of the power module does not overlap with a projection of the passive element on the pin-out surface of the power module, and an angle between the terminal-out surface of the chip and the pin-out surface of the power module is greater than 45° and less than 135°.

Abstract: A module panel and method include an exterior housing, at least one heat sink disposed in the housing, a power delivery circuit disposed in the housing and coupled to one side of the at least one heat sink, and a controller circuit disposed in the housing and coupled to an opposite side of the at least one heat sink. The power delivery circuit operates using one or more different voltages than the controller circuit.

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

Abstract: A casing for the thermal management and protection of an electrochemical cell, the casing comprises a first material, an inner surface configured to be in physical contact with an electrochemical cell, wherein the inner surface is substantially solid at room temperature; and a polymer matrix dispersed within the first material and comprising two or more temperature management materials. At least one of the two or more temperature management materials comprise a phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and an elastomeric material. The polymer matrix is substantially homogeneous, and in an environment where the electrochemical cell and a second electrochemical cell operate under the same charging and discharging conditions, the casing reduces a first operating temperature of the electrochemical cell by at least 10° C.

Abstract: An air-duct module for a server comprises a main body that includes an upper wall and a plurality of side walls extending downwardly away from the upper wall. The main body further includes a plurality of channel walls extending from the upper wall and defining a cable-routing channel located within the main body. The cable-routing channel receives an electronics cable that extends across the main body. The air-duct module has an air passage for guiding air across a heat exchanger within the server. The air-duct passage is defined by the upper wall, the plurality of side walls, and at least some of the plurality of channel walls.

Abstract: An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.

Abstract: The invention relates to a heat sink (10, 60, 120, 150) having a body (12) which includes a channel-shaped mounting formation configured to hold an electronic unit (40) in the form of an LED strip captive therein. The channel-shaped mounting formation defines has a slot which includes a mouth (22) having a transverse width which is less than a width of the electronic unit (40), and a nook (30) which is configured to permit mounting of the electronic unit (40) to the heat sink by passing the electronic unit through the mouth (22) and angularly displacing the electronic unit (40) relative to the mounting formation of the body (12). Instead of sliding the LED strip into the slot, which could damage the strip or result in poor application of thermal paste, the strip is mounted by applying paste and angularly and transversely displacing the strip relative to the body.

Abstract: The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.

Abstract: The present disclosure provides a power supply module. The power supply module is applied to an integrated circuit chip assembly which includes a first carrier board and an integrated circuit chip located at a first side of the first carrier board; the power supply module includes: a second carrier board; a first-stage power supply unit; and a second-stage power supply unit, power input terminals of the second-stage power supply unit are electrically connected with corresponding power output terminals of the first-stage power supply unit through the second carrier board; power output terminals of the second-stage power supply unit are electrically connected with corresponding power terminals of the integrated circuit chip, a projection of the second-stage power supply unit on a first plane is at least partially located within a projection range of the integrated circuit chip on the first plane, the first plane is parallel to the first carrier board.

Abstract: A circuit device includes a circuit component electrically connected to a conductor and a first heat dissipation member includes an insulation member interposed between the conductor and the attachment surface. A control element outputs a control signal, a circuit board is spaced apart from the first heat dissipation member and the conductor. A housing member includes a housing chamber housing the circuit component and the circuit board, a heat dissipation chamber through which air flows while being in contact with a heat dissipation surface of a second heat dissipation member, and a partition plate has a plurality of communication holes placing the heat dissipation chamber and the housing chamber in communication with each other. A portion of the first heat dissipation member excluding the attachment surface and a portion of the second heat dissipation member excluding the heat dissipation surface are in contact with air outside the circuit device.

Abstract: A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate. The connection member has an inclined fluid channel that descends from the inlet to the base plate. The semiconductor device is disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer. The fixing mechanism fixes the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together.

Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.

Abstract: A power module includes one of more bus capacitors and one or more power switching modules. The bus capacitors and power switching modules have positive and negative terminals. The positive terminals of the bus capacitors are arranged diagonally opposite to the positive terminals of the power switching modules. The negative terminals of the bus capacitors are arranged diagonally opposite to the negative terminals of the power switching modules. A laminated busbar assembly connects a positive conducting layer to the positive terminals and a negative conducting layer to the negative terminals. The laminated busbar assembly includes sets of tabs arranged diagonally opposite one another to match the arrangement of the terminals.

Abstract: An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

Abstract: A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.

Abstract: An electronic device and a power module are provided. The power module includes a power housing; a circuit board, connected to the power housing and arranged with a plurality of pads on a surface of the circuit board facing the power housing; an electronic component, arranged on the circuit board and comprising a plurality of pins; wherein the plurality of pins are soldered and connected to the plurality of pads; and a first sealant layer, arranged on the surface of the circuit board facing the power housing, and covering the plurality of pins and the plurality of pads.

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

Abstract: A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed.

Abstract: Apparatus electronically interconnecting first electronic circuitry (72) in a hazardous environment with second electronic circuitry (74) whilst partitioning the second electronic circuitry from the hazardous environment includes a metallic body (42) defining a passage (56) which opens at one end into the hazardous environment. A PCB (58) extends across the passage and is encased within a layer of insulating material (66) on one side to form a gas tight barrier across the passage. The PCB has a first connector (78) connected with said first electronic circuity and at least one second connector (80) extending through the layer of insulating material and connected with said second electronic circuitry. The first and second connectors are electronically coupled so that the first electronic circuitry is electronically connected with the second electronic circuity through the PCB and insulating layer.

Abstract: The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A power module includes a double-sided electrode module, a power semiconductor element, a pair of base plates, and a connecting member. The double-sided electrode module has a plurality of electrode wiring boards and a power semiconductor element which are molded with a resin material. The pair of base plates has the double-sided electrode module sandwiched therebetween. The pair of base plates are connected via the connecting member. The connecting member is formed in a curved shape.

Abstract: A cooling apparatus includes a casing including a top wall, a bottom wall, and a cooling fluid passage. A heat radiator arranged in the cooling fluid passage includes heat radiation units arranged in a vertical direction and at least one intermediate plate each of which is arranged between adjacent heat radiation units of the heat radiation units in the vertical direction. Each of the heat radiation units includes a substrate and pin fins provided on the substrate. The substrate of each of the heat radiation units and the at least one intermediate plate are spaced apart in the vertical direction. The pin fins of the adjacent heat radiation units are in thermal contact with the at least one intermediate plate. The pin fins of the uppermost and lowermost heat radiation units of the heat radiation units are in thermal contact with the top and bottom walls of the casing, respectively.

Abstract: The invention relates to an electronics module (100) for power control. The electronics module (100) comprises a carrier element (102), which has at least a first power switch element (104) with a first cooling surface (106) and a second power switch element (108) with a second cooling surface (110), a heat sink (126), and a cooling plate (122), which connects the first cooling surface (105) and the second cooling surface (110) to one another as well as to the heat sink (126) in a thermally conductive manner, when the electronics module (100) is installed.

Abstract: A system for transferring heat from printed circuit boards (PCBs) with light emitting diodes (LEDs) includes a PCB having a first side and a second side and configured to be coupled to an exterior portion of an aircraft. The system further includes a LED located on the first side of the PCB. The system further includes a first metal strip located on the second side of the PCB. The system further includes a heat sink configured to contact the first metal strip to dissipate heat from the PCB.

Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

Abstract: A cooler mounting system is provided. The cooler mounting system includes at least one front bracket system and at least on rear bracket system. Each bracket system includes at least one arm portion and a base portion. The mounting system also includes a cooler that includes a front rail portion located on a front face of the cooler and a rear rail portion located on a rear face of the cooler.

Abstract: An electronic component unit includes a heatsink, a substrate on which electronic component is installed, a fixing metal fitting that fixes the electronic component and the substrate to the heatsink, and a fastening member that fixes the fixing metal fitting to the heatsink, and the heatsink includes a body portion, and a fixing portion that is projecting from the body portion toward the substrate side and to which the fixing metal fitting is fixed, and the substrate includes a through-hole that the fixing portion penetrates through, and the fixing metal fitting includes a base portion that contacts the fixing portion and is fixed to the fixing portion by the fastening member, and a pressing portion that extends from one end of the base portion, elastically deforms with respect to the base portion, and presses the electronic component toward the substrate side.

Abstract: To achieve heat dissipation of a wiring pattern inexpensively with a simple configuration, a printed circuit board includes an insulating substrate having a plurality of wiring patterns on a main surface thereof, and an electronic component mounted on the main surface and connected to the wiring patterns. Further, the printed circuit board includes a heat-dissipating surface mount component that is a surface mount component. The heat-dissipating surface mount component is joined via a solder to each of the wiring patterns on the main surface to dissipate heat of the wiring pattern.

Abstract: A computing device includes a support structure with at least one edge. The computing device includes a cover connected to the support structure. The cover extends to or beyond the at least one edge of the support structure by no more than between 0 and 100 microns over an edge length of at least 100 mm. A fabric cover includes a cover edge and a cover surface. The cover edge and/or the cover surface include an edge feature. A method of manufacturing a computing device is described. The method includes determining an edge of a computing device and based on the edge that was determined, cutting the fabric cover between 0 and 100 microns of the edge of the computing device over an edge length of the computing device of at least 100 mm.

Abstract: A package structure includes a first insulation layer, a first redistribution structure, at least one electronic component, a second redistribution structure, a second insulation layer, a first heat spreader, a heat dissipation substrate, a second heat spreader and plural thermal conduction structures. A part of the second redistribution structure is disposed on a part of a top surface of the first insulation layer, and the other part of the second redistribution is located in the first insulation layer. At least one of the conducting terminals is connected with the second redistribution structure. At least one of the thermal conduction structures is connected with at least one of the first redistribution structure and the second redistribution structure, and the thermal conduction structures are respectively extended outwardly from the opposite sides of the first insulation layer to form pins.

Abstract: A clamping mechanism adapted to clamp a heat sink on a housing of an electronic device comprises a frame, a plurality of mounting legs connected on the frame, and a plurality of elastic tabs obliquely extending from the frame towards the heat sink. The frame has a rectangular shape and includes a first arm adapted to be connected to a front end of the housing, a second arm adapted to be connected to a rear end of the housing, and a pair of third arms connected between the first arm and the second arm. The mounting legs are configured to mount the frame on the housing. The elastic tabs press the heat sink against the housing. Each of the third arms has at least one of the elastic tabs.

Abstract: An information handling system includes a first device including a first heat generating region, a second device including a second heat generating region, and a cooling device. The cooling device has a first hot surface on a first side of the cooling device, a first cold surface on a second side of the cooling device, a second hot surface on the second side of the cooling device, and a second cold surface on the first side of the cooling device. The first heat generating region is thermally attached to the first hot surface. First heat from the first heat generating region is transmitted to the first cold surface. The second heat generating region is thermally attached to the second hot surface. Second heat from the second heat generating region is transmitted to the second cold surface.

Abstract: A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.

Abstract: A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.

Abstract: A system may include a component cage to house a heat-generating component, a cold plate assembly, and a mounting mechanism. The cold plate assembly may include a cold plate having a mating surface and a non-mating surface, the mating surface to contact a thermal transfer device of a heat-generating component installed in the component cage. The mounting mechanism movably mounts the cold plate to the component cage with the non-mating surface facing a surface of the component cage located in a first plane. The mounting mechanism allows the cold plate to move from a first orientation to a second orientation as the heat-generating component is being installed in the component cage. In the first orientation, the mating surface is inclined relative to the first plane. In the second orientation, the mating surface is parallel to the first plane when the heat-generating component is installed in the component cage.

Abstract: A power module for medium and high-voltage frequency converter and a frequency converter comprising same. The power module has a three-phase alternating current input and a single-phase alternating current output, and comprises a circuit board (100), a rectifying module (120), a capacitor bank (130), and an inverting module (140), wherein the rectifying module, the capacitor bank and the inverting module are all mounted on the circuit board. The power module has a compact structure and is convenient to cool.

Abstract: An optical transceiver includes a housing and an optical transceiving module. The housing includes a main body and a heat conductive component. The heat conductive component is disposed on the main body, and a thermal conductivity of the heat conductive component is larger than a thermal conductivity of the main body. The optical transceiving module is disposed in an accommodation space of the main body of the housing.

Abstract: A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

Abstract: A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.

Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.

Abstract: This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises a multilayer printed circuit board (PCB) having an asymmetric core structure. A cavity extends from an exterior layer of the multilayer PCB to an exposed portion of an interior layer of the multilayer PCB. The interior layer can be formed on the asymmetric core structure or another PCB layer above the asymmetric core structure. An image sensor is mounted at least partially in the cavity and electrically connected to conductive pads embodied on the exposed portion of the interior layer of the multilayer PCB. By mounting the image sensor in the cavity, height and planar dimensions of the image sensor assembly can be reduced, thereby enabling thinner profile imaging devices.

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.