Abstract: A satellite is formed with a signal translation and amplification system which includes at least one communication path. Each communication path includes a plurality of radiation-cooled TWTs powered by a single EPC. Also included in the communication path is a high efficiency radiation panel capable of transmitting heat generated by said TWTs and EPC into space; as well as a radiating collector which is directly applied to each TWT, and is capable of transmitting heat generated by said TWT into space.

Abstract: A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction, relative to prior art OMPAC devices. The MCM tile includes an interconnection substrate with peripheral metallizations and at least one chip or integrated circuit (IC) mounted on the substrate by solder reflow or conductive adhesive technology. The PWB which may be a single level or a multilevel, is provided with an aperture for accommodation of at least one chip therein. Depending on the type of interconnection between the substrate and the PWB, the aperture may be larger than the substrate of the MCM tile for wire bonding interconnection or smaller than the substrate for solder reflow or conductive adhesive interconnection. In the wire bonding case, the MCM tile is positioned within the aperture resting on the surface of the PWB or of a structural member or of a heat sink which encloses one end of the aperture.

Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.

Abstract: A semiconductor integrated circuit includes a semiconductor circuit chip housed in a package. The package provides for electrical interface of the integrated circuit chip with external circuitry, and also provides environmental protection for the circuit chip. The circuit chip includes a circuit portion which liberates heat into the semiconductor substrate of the chip during operation of the integrated circuit. The integrated circuit chip also includes a layer of insulative material which overlies the semiconductor substrate. A thermally conductive plug member penetrates through the layer of insulative material and extends into a hole formed in the semiconductor substrate. This plug member is in conductive heat transfer relation with the material of the semiconductor substrate, and connects thermally with high-conductivity heat transfer structure conducting heat from the substrate to the package for liberation to the ambient.

Abstract: A method and multicoupler for a receiver at a base station in a cellular/PCS radio communication system includes a cooled container that is mounted on an antenna tower at the base station. The container is mounted on the antenna tower adjacent an antenna and contains thereinside a preselector filter, a highly linear amplifier, and a directional coupler that are cooled to a temperature less than 175.degree. K. and greater than 100.degree. K. A power splitter is connected between the output from the container and the radio system receiver, and is located at a ground station near the base of the antenna tower. Cooling the components inside the container, particularly the amplifier, to a temperature of about 150.degree. K. reduces the noise from the multicoupler so that base station range is extended, building penetration is improved, and subscriber transmit power may be reduced.

Abstract: An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

Abstract: A central carrier, which is constructed as a stamped part or a metallized plastic part is used for the mutual electrical and mechanical connection of the other components of the system. A plastic material and molded part is sprayed around the carrier. In turn, this molded part holds together the carrier which, after the plastic was sprayed around it, was divided into electrically insulated conductor parts, and which molded part forms housing walls as well as a plug casing.

Abstract: Discrete circuit devices constructed on a component substrate thermally matched to the supporting substrate of a higher level circuit assembly. Upon securing each component to the supporting substrate of a higher level circuit assembly, a connection subject to reduced thermal stress is obtained. In the construction of an exemplary surface mount, hybrid component containing resistors and capacitors, a component substrate of a polyimide impregnated material is populated with a repeating matrix of chip capacitors and chip resistors, which are adhesively bound and soldered to selected termination pads containing high temperature solder filled through vias. The substrate is epoxy encapsulated and then diced at selected ones of the through vias into multiple components. Each thermally matched component is resoldered at the separated vias to obtain surface mount terminations. Portions of the vias may be exposed through the component sidewall to permit circuit test.

Abstract: An apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, includes first and second heat sinks, each having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage, and a substrate for mounting at least one switching element to each of the first and second heat sinks. An ac terminal connects the switching element attached to the first heat sink in series with the switching element attached to the second heat sink, and inlet and outlet manifolds, coupled to the inlet and outlet ports of the first and second heat sinks, circulate cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

Abstract: A thermally enhanced semiconductor device (10) having an exposed backside (22) is described. In one embodiment, a PC board substrate (12) is provided having a pattern of conductive traces (14) on both upper and lower surfaces of the substrate. Electrical continuity is maintained between the two surfaces with conductive vias (16). A semiconductor die (18) is flip-mounted to the upper surface of the substrate. Solder bumps (26) electrically connect the die to the conductive traces, and an underfill (28) couples the active side (20) of the die to the upper surface of the substrate. A package body (40) is formed around the perimeter (24) of the die leaving the inactive backside exposed for enhanced thermal dissipation. The inactive backside can also be coupled to a heat sink for increased thermal dissipation. A plurality of solder balls (42) electrically connected to the conductive traces is attached to the lower surface of the substrate.

Abstract: Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreader.

Abstract: An electronic device comprising at least one heat-generating electronic component and a passive electronic component in association with the heat generating component. The passive component comprises a porous preform of green silicon carbide or polygranular graphite, and a metal filling the porosities of the preform which can be aluminum, an aluminum alloy, magnesium or a magnesium alloy. The preform forms about 50 to 90% by volume of the passive component.