Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.

Abstract: A connection apparatus of a battery cell module having a battery cell cover with connecting plates formed at opposing ends thereof, a main frame having guide channels that receive the cell cover, and a top cover to secured the cell cover to the main frame, the connection apparatus having holes at opposing sides of a bottom of the main frame, connecting units configured for insertion into the holes and for contacting the connecting plates, and a conductive bridge electrically connecting the connecting units is disclosed.

Abstract: An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.

Abstract: A vehicle control device includes plural functional modules each of which is a minimum part unit that contributes to change in input/output potentials, and has an input and an output of one power line or one set of power lines, except for power lines having a same potential as that on an overhead wire side or that on a ground side. The functional module has an interface surface on one side surface, to which both of a signal line and the power line are connected. Each interface surface is divided into a first interface area in which a signal line terminal connected to the signal line is placed, and a second interface area in which a power line terminal connected to the power line is placed. The plural functional modules are adjacently arranged such that the interface surfaces face in a same direction, the first interface areas are located on one end side in common, and the second interface areas are located on the other end side in common.

Abstract: A group protection module for a switchgear arrangement is provided in order to protect a group of load feeders, each having a contactor for connecting or disconnecting a respective load. The group protection module has a circuit breaker for providing short-circuit protection, said circuit breaker being connected to a supply-side input and to a load-side output of the group protection module for connection to a power supply system and for connecting the group of load feeders. The group protection module has a safety evaluation unit via which the circuit breaker can be tripped if a status signal detectable by the respective load feeders indicates that one of the contactors of the load feeders can no longer be de-energized. The group protection module is implemented as a constructional unit.

Abstract: An LED lamp includes a board, a metal wiring provided on the board, an LED mounted on the metal wiring, and a metal heat dissipation film mainly made of a metal different from a metal for forming the metal wiring. The metal heat dissipation film partially overlaps the metal wiring. The metal heat dissipation film has an irregular surface. The metal heat dissipation film is mainly made of a metal that is softer than the metal wiring. The metal heat dissipation film intervenes between the board and the metal wiring, and part of the metal heat dissipation film that is in contact with the metal wiring has an irregular surface.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: The present invention provides an electronic control unit which is capable of suppressing harmful effects caused by liquid while suppressing increase in the size thereof. The electronic control unit includes an electronic component in which a circuit element coated with an anti-splash agent is implemented, a casing, and a liquid discharge portion. The casing includes a base on which the electronic component is mounted, a cover which is connected to the base in the state where the electronic component is covered with the cover, and a connector which electrically connects the electronic component to the outside. The liquid discharge portion includes a flow passage in which liquid which has intruded into an internal space in the casing formed by the base, the cover and the connector for housing the electronic component flows, and an opening portion which discharges the liquid to the outside of the internal space via the flow passage.

Abstract: A portable electronic device includes a main body and a power converter. The main body includes a first housing and a main circuit disposed within the first housing. The main circuit includes a power input end located on a side surface of the first housing. The power converter includes a second housing and a power modulating circuit. A side surface of the second housing is detachably assembled to the side surface of the first housing. The modulating circuit is disposed in the second housing, and includes a power output end and a utility power input end. The power output end is located on the side surface of the second housing, and the utility power input end is located on another side surface of the second housing. The power modulating circuit is capable of modulating utility power from the utility power input end to modulated power suitable for the main circuit, and the modulated power s outputted from the power output end.

Abstract: A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.

Abstract: Providing an electrical assembly, which can protect electric components provided at the electrical assembly from damage, and minimize output amount of recycle material and waste material, a functional module as the electric assembly includes a lamp and a switch as the electric components. The lamp extends from a center area of a bottom wall of a housing so as to slant toward an outside of the housing according to going apart from the bottom wall. The switch extends vertically from one end of the bottom wall. Ends of the lamp and the switch far from the bottom wall project out of the housing. When the functional modules are transported to an assembling line, the pair of functional modules is stacked on each other so as to arrange the lamp face to each other in parallel, and fixed to each other.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: An improved smoke detector device comprising a base for mounting to a place on a ceiling or a wall via a mounting means; and a ring for removably attaching to the base, the ring comprising at least two modules that removably connect together via a connecting means to form the ring, wherein each module comprises an inner chamber and a door, the inner chamber of each module can hold an item, the door of each module can move between an open position and a closed position for respectively allowing and preventing access to the inner chamber of the module.

Abstract: An all-in-one electrical device includes a front enclosure module, a rear enclosure module, a touch screen, and a middle module. The front enclosure module includes a frame. An opening is defined in the frame. A number of restricting members extend backwards from the frame. The rear enclosure module includes a cover detachably fixed to the frame. The touch screen is received in the frame and exposed through the opening. A forward freedom of motion (FOM) of the touch screen is restricted by the frame. Leftward, rightward, upward and downward FOMs of the touch screen are restricted by the number of restricting members. The middle module is detachably fixed to the frame and received between the frame and the cover. The middle module restricts a backward FOM of the touch screen.

Abstract: The invention pertains to a modular data transmission system with several modules or bus nodes that can be arranged adjacent to one another in a row. The data transmission system comprises a first bus node that features a first transmitter for the wireless transmission of data and an electrical connector, as well as a second bus node that features a first receiver for the wireless reception of data and an electrical connector. Both bus nodes are detachably fixed on a mounting rail such that they are arranged adjacent to one another in a row. The first and second bus nodes are respectively detachably connected to a bus receptacle, wherein each bus receptacle features an electrical mating connector that is coupled to the electrical connector of the respective bus node in the connected state in order to transmit energy, as well as a positioning device for positioning the respective bus node.

Abstract: A mounting assembly is provided for mounting equipment on a frame including a front pair of vertical rails and a back pair of vertical rails. The mounting assembly includes a bracket for attaching a front side of the equipment to one of the front rails and a hinge for attaching a back side of the equipment to one of the back rails.

Abstract: A protocol analyzer for analyzing traffic on a bus. A tap card is used to tap into a bidirectional bus. The tap provides a pass through connection from the card to the host and taps off of the bus. While tapping off the bus, stubs lengths are minimized and input capacitance is minimized. A repeater that preferably has no internal termination provides a differential input and a differential output or a single ended output. The bus lines are input to one of the inputs in the differential inputs and a reference voltage is provided to the other differential input. The reference voltage enables the tap to determine if the data is high or low. A jumper is also included in the tap such that the reference voltage can be selected from the host or from the pod.

Abstract: A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector.

Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.

Abstract: A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.

Abstract: A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair.

Abstract: A number of structural modules are configured to be secured together and to be secured to a foundation. Each of the structural modules is without one or more sidewalls, such that when the structural modules are secured together they form a building structure that encloses an open region which continuously extends through interiors of the structural modules. Each of the number of structural modules is structurally formed to be independently transported. A power module is configured to be secured to one of the structural modules and to the foundation. The power module is defined as an enclosed structure and is structurally formed to be independently transported. The power module is equipped with electrical components for supplying and distributing electrical power to a pre-defined layout of data equipment to be deployed within the open region of the building structure formed by the number of structural modules.

Abstract: A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: An device bracket for mounting devices to a flat panel display incorporates a device hub able to form a network with devices coupled to it where the device hub associates one or more physical characteristics to devices coupled to it, including locality, orientation and position relative to the device hub. The device hub is conveys data indicating these physical characteristics associated with these devices to one or more of the devices coupled to it, thereby either enabling the devices with those physical characteristics to modify the manner in which they perform their own functions in response to those physical characteristics, or enabling other devices to modify data that they exchange with the devices having those physical characteristics in response to those physical characteristics.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A fastening element for connecting a housing to a printed circuit board comprises a first surface having a through hole for receiving a connecting element for connecting the fastening element to the housing, at least one first mounting pin extending from the first surface for mounting the fastening element to the printed circuit board, a second surface from which a second mounting pin extends for mounting a fastening element to the printed circuit board and a third surface connecting the first surface and the second surface.

Abstract: An electronic component includes a multi-layer substrate having an upper side and under side, and at least one integrated impedance converter. The electronic component also includes at least one chip component having external contacts. The at least one chip component is disposed on the upper side of the multi-layer substrate, and is electrically connected to the at least one integrated impedance converter.

Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.

Abstract: The present invention relates to a modular electric system with a base module (2, 11) comprising a substrate (3, 12), a power supply (40), power/data transmission means (4, 16) and holding means; at least one load module (7, 20, 30) comprising an cc electric load, a power/data receiving means (8, 26) and a holding means, said load module (7, 20, 30) being adapted to be placeable on said substrate (3, 12) in first and second positions, wherein in said first position (connecting position) the transmission means (4, 16) of said base module interact with said receiving means (8, 26) of said load module (7, 20, 30) and in said second position (repelling position) interaction of said transmission means (4, 16) and said receiving means (26) is not allowed or possible.

Abstract: A mobile terminal having a detachable sub-module is disclosed. The mobile terminal includes a sub-module having a sub-function configuration unit formed with parts for performing a function and a main terminal having a display unit at a front surface and a connection unit at a rear surface for coupling the sub-module to the main terminal. A magnet is installed at a side surface of the connection unit or the sub-module, and the sub-module is coupled to the main terminal or is detached from the main terminal through the magnet. Enhancement of the portability and function quality of mobile terminals that support various functions is achieved by coupling a sub-module for performing a function to the main terminal having a display unit that allows user interactivity with the mobile terminal.

Abstract: The invention is directed to an apparatus (1) for accommodating a plurality of individual inverters (2), comprising a rack, the individual inverters (2) being removably mountable to the side elements of said rack, said rack having at least one terminal block (10) for receiving cables for current supply and evacuation.

Abstract: A system for mounting a device to a host, such as an appliance, includes elongated, substantially parallel device interfaces for removably mounting the device to the host. The device interfaces can include rails, slots and/or electrical conductors.

Abstract: Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate.

Abstract: An electronic module includes a board unit having a handle and a module housing. The handle includes a grip portion and a pair of leg portions. The leg portions have engagement convex portions extending from portions serving as rotary pivots, of the leg portions. The module housing includes an engagement concave portion provided to correspond to the engagement convex portions. When the board unit is inserted into the module housing, by rotating the handle around the rotary pivots in a direction along which the grip portion approaches the panel portion, the engagement convex portions are brought into contact with a part of the engagement concave portion to produce a force in a direction, along which the board unit is pressed into the module housing.

Abstract: A modular building system arrangement includes a plurality of electrical building systems. Each electrical building system has a housing with a mechanical connector that is connectable with a like connector of each other building system housing. Members of any subset of the building system housings are connectable with each other to form a building system assembly. The building systems of the building system assembly conjointly define an electrically conductive pathway interconnecting each of the building systems of the building system assembly. The pathway carries power and/or data.

Abstract: A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.

Abstract: A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.

Abstract: A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs.

Abstract: A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.

Abstract: An electronic device is provided, including a first module, a second module, a control module, and a torsion hinge. The second module is rotatably disposed on the first module between a first position and a second position. The control module is slidably disposed on the first module between a third position and a fourth position. When the control module is in the third position, the second module is restricted to rotate with respect to the first module. When the control module is in the fourth position, the second module is released by the control module and rotatable with respect to the first module.

Abstract: A structural configuration and methods. A structural configuration includes a support structure having at least one module supporting a computer server disposed therein. Each module includes at least one support member separating the module from each adjacent module. The support member is configured to transmit simultaneously both power and data. A method for connecting servers includes placing a first server inside a first module which includes a first structural member configured to conduct both electrical power and data to the first server. A second server is placed inside a second module which includes a second structural member. The second module is placed on top of the first module. The first member supports the second module and separates the second module from the first module, resulting in the first member connecting to the second member. A method for using a computer support structure is also included.

Abstract: A module is provided. The module includes a first module unit provided at a top surface with a cavity and a second module unit on which one or more electronic devices are mounted. The second module unit is at least partly received in the cavity of the first module unit.

Abstract: A panel assembly structure including a first connecting portion, a first screw, a second connecting portion and a second screw for fixing a display panel on a panel cover is provided. The first connecting portion having a first connecting through hole is formed on the cover and extends toward a first side of the panel. The first screw is screwed into the first connecting through hole and a first panel threaded hole on the first side for fastening the first connecting portion and the first side. The second connecting portion having a second connecting through hole is formed on the inner surface of the cover and extends toward a second side of the panel. The second screw is screwed into the second connecting through hole and a second panel threaded hole on the second side of the panel for fastening the second connecting portion and the second side.

Abstract: A device, a module being insertible into a housing-forming recess of the device, energy and/or data being transmittable in a contactless manner.

Abstract: An expendable electrical connector uses a plurality of modular housings sequentially assembled for receiving receptacle assemblies. The expendable electrical connector does not use dedicated moulds for different numbers of the receptacle assemblies and cost is decreased. Two neighboring modular housings share a side plate so that total length of the expendable electrical connector will be shortened and cost will also be decreased. Each of the modular housings may be made from a metallic sheet by punching process, and used to cover each of the receptacle assemblies and the modular housings can be connected with each other. The modular housings provide a good performance of grounding and shielding electromagnetic interference without dedicated grounding steps for individual receptacle assemblies.

Abstract: A mobile communication device with replaceable function modules includes a main body and an externally connected device. The main body serves as a central member, and has a main hybrid joint including an electrical contact and a magnetic joint. The main hybrid joint of the main body is joined to a device hybrid joint of the externally connected device, so as to realize the function thereof. When joined together, the main body activates a functional module of the externally connected device functional module. In addition, the main body and the externally connected device are further joined through the magnetic joints. Therefore, when separated by accidentally falling onto the ground, the mobile communication device can be rejoined through the magnetic joints, and thus it is unnecessary to worry about the unavailability due to the break-down of the joint portion.

Abstract: An device bracket for mounting devices to a flat panel display incorporates a device hub able to form a network with devices coupled to it where the device hub associates one or more physical characteristics to devices coupled to it, including locality, orientation and position relative to the device hub. The device hub is conveys data indicating these physical characteristics associated with these devices to one or more of the devices coupled to it, thereby either enabling the devices with those physical characteristics to modify the manner in which they perform their own functions in response to those physical characteristics, or enabling other devices to modify data that they exchange with the devices having those physical characteristics in response to those physical characteristics.