Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.

Abstract: The disclosure relates to modem and router modules for use with digital display systems, including televisions. A modem module is configurable to attach to a set-top box, a set-back box, directly to a digital display, or may even be integrated into display equipment. Router functions and ports can be integrated into the module to provide for networking of additional devices in proximity to the module and/or display, using either or both wired and wireless access technologies. Systems including the module convert power to the appropriate forms for delivery to the different devices, hardware, and components associated with the module. The modem and routing functions are configurable to provide separate security domains to isolate or direct traffic among the various networked devices.

Abstract: A portable keyboard structure includes a plastic substrate, multiple metal support plates, a plastic bottom cover and multiple buffer members. The plastic substrate has a mounting surface, the metal support plates are mounted on corners of the mounting surface, the plastic bottom cover is disposed corresponding to the mounting surface and in conjunction with the plastic substrate clamps and secures the metal support plates, and the buffer members are respectively configured corresponding to the metal support plates. Each buffer member includes a fixing portion and a protection portion, the fixing portion are respectively disposed at the corresponding metal support plates, and the protection portions respectively envelop corners of the plastic substrate. Thus, the weight of the keyboard structure is significantly reduced, the production cost is lowered, and certain structural strength and fall-resistance are maintained at the same time.

Abstract: A method for encapsulating electronic devices comprises, successively, placing a profiled strip on a conveyor belt, the profiled strip comprising a base, at least one flap protruding with respect to said base; positioning an electronic device, in the longitudinal direction, on the receiving zone of the profiled strip; and plastically deforming the flap by application of an application force in a predetermined direction.

Abstract: This application relates to an independent active electromagnetic interference filter module. In one aspect, the filter module includes a first element group including a noise sensing unit provided to sense electromagnetic noise, and a second element group including a compensating unit provided to generate a compensation signal for the electromagnetic noise. The first group and the second group may be respectively mounted on different substrates. According to some embodiments, the filter module can reduce a volume of each element constituting an electromagnetic interference filter module, implement a single modularization of a compact structure. The filter module can also improve electromagnetic interference noise reduction performance and a manufacturing method thereof.

Abstract: A replacement device includes a replacement module and a slider. The replacement module includes a sliding portion. The sliding portion is provided with a limiting column, which is formed with a fixing hole. The slider includes a slider body. The slider body is provided with a first latch, a limiting hole and a fixing element, wherein the first latch is arranged on a first side edge of the slider body. The slider is correspondingly arranged on the sliding portion of the replacement module, and the limiting column of the sliding portion passes through the limiting hole. The fixing element has a top portion, and is fixed in the fixing hole. The size of the top portion is greater than the size of the limiting hole, so that the slider moves relative to the replacement module within a limit range of the limiting hole.

Abstract: A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.

Abstract: A shell structure includes a shell and a shielding cover. The shell has an accommodating space, the accommodating space has an inner wall, and the inner wall has a first buckling portion. The shielding cover is arranged in the accommodating space, the shielding cover has an outer wall, the outer wall corresponds to the inner wall, and the outer wall has a second buckling portion corresponding to the first buckling portion. The first buckling portion and the second buckling portion are buckled with each other to limit relative degrees of freedom of the shell and the shielding cover.

Abstract: A multilayer coil component includes a multilayer body that includes insulating layers that are stacked; a coil disposed in the multilayer body; and outer electrodes disposed on surfaces of the multilayer body and electrically connected to the coil. The coil includes at least two coil conductor groups that each include at least two coil conductors connected to each other in parallel through two coupling conductors. The at least two coil conductor groups are connected to each other in series through a connecting conductor. The connecting conductor connects the coil conductor between the two coupling conductors in one of the at least two coil conductor groups to the coil conductor between the two coupling conductors in another one of the at least two coil conductor groups.

Abstract: A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.

Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.

Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a first plate, a second plate facing in the opposite direction as the first plate, and side members surrounding the space between the second plate and the second plate; a printed circuit board which is disposed within the space and on which at least one electrical component is mounted; a shield can mounted on the printed circuit board and disposed to surround the at least one electrical component; and an insulating tape member attached to the inner surface of the shield can between the shield can and the electrical component. The insulating tape member may include: a first layer including a first material and formed to a first thickness; a second layer laminated on the first layer by means of an adhesive, including a second material, and formed to a second thickness that is the same as or thicker than the first thickness; and an adhesive layer formed on the second layer and for being attached to the shield can.

Abstract: A pluggable network interface device is provided comprising a split-shell housing having a shielded side portion that protects a side of a circuit substrate disposed in the split-shell housing. The split-shell housing comprises a first shell portion that covers a first side of the circuit substrate and a second shell portion that covers a second side of the circuit substrate that is arranged opposite the first side. The shielded side portion is inset from a width of the split-shell housing and offset a distance from an electrical interconnection end of the circuit substrate. The shielded side portion is arranged at least partially in a notch of the circuit substrate disposed at the electrical interconnection end of the circuit substrate.

Abstract: An optical module includes: a module body that is configured to be inserted into a cage, at an entrance of the cage an electromagnetic wave shielding terminal being provided, and has a groove formed on one surface thereof and configured to engage with a latch part formed on the cage; and an engagement release member including a body that is provided with a pull tab, the body being slidably attached to the module body and configured to slide in response to an external force, and an arm part that extends from the body along the groove, and slides with respect to the groove in conjunction with the sliding of the body and release the engagement in a state in which the electromagnetic wave shielding terminal is pressed. The module body has a concave part on a surface of the groove, the surface being in contact with the arm part.

Abstract: Tools and techniques are described to automate line testing when wiring devices (such as equipment and sensors) to controllers. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. After testing, a reporting device rapidly shows the results of the line testing.

Abstract: The present application provides a battery, a power consumption apparatus, and a method for producing a battery. The battery includes a box body, a battery module and a mounting plate, the battery module is disposed in the box body and includes a battery cell arrangement structure and a first end plate, the battery cell arrangement structure includes a plurality of battery cells stacked and is disposed on one side of the battery cell arrangement structure, the first end plate is fixedly connected to the battery cell arrangement structure, the mounting plate is disposed between the first end plate and the box body and is fixedly connected to the box body; the first end plate has a first elastic support part configured to be capable of abutting the mounting plate, being squeezed by the battery cell arrangement structure and deforming when the battery cell arrangement structure expands.

Abstract: An object is to provide a semiconductor device capable of reducing inductance between a high potential terminal and a low potential terminal while achieving downsizing of the semiconductor device. A semiconductor device includes: the insulating substrate; the circuit pattern including a low potential circuit pattern and a high potential circuit pattern provided on a region adjacent to the low potential circuit pattern; a plurality of semiconductor chips mounted on the circuit pattern; a low potential terminal having one end portion connected to the low potential circuit pattern; and a high potential terminal having one end portion connected to the high potential circuit pattern, wherein the high potential terminal and the low potential terminal include electrode parts and constituting parallel flat plates vertically disposed in parallel to each other and extending on a side of the low potential circuit pattern and electrode parts and protruding from the insulating substrate.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

Abstract: The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

Abstract: A piezo-electric actuator on the side of a mobile device will enable pressure exerted by the user to be sensed at the conventional button locations, while providing a haptic feedback. Unfortunately, mechanical integration of piezo-electric actuators at the side of a mobile device is challenging. A mobile device in accordance with the present disclosure comprises a PCB; an outer frame surrounding the PCB; and a switch. The switch comprises: a first piezo-electric actuator configured to generate a first actuator voltage signal in response to a first force applied by a user, and to generate a first haptic feedback to the user in response to a first haptic voltage signal transmitted from the controller thereto; and a first virtual button in the outer frame configured to transmit the first force to the first piezo-electric actuator, and to transmit the first haptic feedback to the user.

Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.

Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.

Abstract: The present application provides a flexible display device. A housing includes a first housing and a second housing, which are relatively slidably arranged. A first end of a flexible display screen is connected to the first support member of the first housing. A second end of the flexible display screen bypasses the second support member of the second housing and is connected to a stretching mechanism in the housing. A packaging member is disposed on at least one first side plate of the second housing and covers at least a portion of an edge of the flexible display screen. The present application prevents dust from intruding into a bottom of the flexible display.

Abstract: The invention relates to an electrical equipment, in particular for electrical or hybrid vehicles, comprising a casing, said casing comprising a casing element comprising a side wall and defining an inner space. The side wall of the casing element comprises a material offset towards the inner space thereof forming a zone for connecting the positive terminal and the negative terminal of the electrical energy source such that said material offset overlaps the first electrical conductor and the second electrical conductor only making visible, from the outside of said side wall, the positive visible terminal and the negative visible terminal.

Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.

Abstract: Systems and methods are disclosed that provide smart alerts to users, e.g., alerts to users about diabetic states that are only provided when it makes sense to do so, e.g., when the system can predict or estimate that the user is not already cognitively aware of their current condition, e.g., particularly where the current condition is a diabetic state warranting attention. In this way, the alert or alarm is personalized and made particularly effective for that user. Such systems and methods still alert the user when action is necessary, e.g., a bolus or temporary basal rate change, or provide a response to a missed bolus or a need for correction, but do not alert when action is unnecessary, e.g., if the user is already estimated or predicted to be cognitively aware of the diabetic state warranting attention, or if corrective action was already taken.

Abstract: An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Abstract: A protective cover for a tablet computer includes a main body, a peripheral device and a protective cover signal transmission member. The main body includes a first supporting member and a second supporting member connected to each other and can be opened and closed relative to each other. The peripheral device is disposed on the first supporting member. The protective cover signal transmission member is disposed on the second supporting member and electrically connected with the peripheral device. The second supporting member supports the tablet computer. The tablet computer includes a computer signal transmission member. The protective cover signal transmission member is used to dock with the computer signal transmission member to perform signal transmission. One of the computer signal transmission member and the protective cover signal transmission member is an electrical block, and the other is an electrical guide rail. A portable electronic device is also provided.

Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Abstract: An apparatus for power conversion includes a transformation stage for transforming a first voltage into a second voltage. The transformation stage includes a switching network, a filter, and a controller. The filter is configured to connect the transformation stage to a regulator. The controller controls the switching network.

Abstract: An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.

Abstract: A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer on a surface of the insulating substrate; a semiconductor chip including an upper electrode and a lower electrode, the upper electrode being electrically connected to the first metal layer, the lower electrode being electrically connected to the second metal layer; a first main terminal including a first end and a second end, the first end being electrically connected to the first metal layer; a second main terminal including a third end and a fourth end, the third end being electrically connected to the second metal layer; a first detection terminal being electrically connected between the first end and the second end of the first main terminal; and a second detection terminal being electrically connected to the first metal layer.

Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.

Abstract: A semiconductor package includes a lower redistribution layer having a plurality of lower ball pads forming a plurality of lower ball pad groups, a semiconductor chip on the lower redistribution layer, an expanded layer surrounding the semiconductor chip on the lower redistribution layer, and an upper redistribution layer on the semiconductor chip and the expanded layer and having a plurality of upper ball pads forming a plurality of upper ball pad groups. The number of the plurality of upper ball pad groups may be the same as the number of the of the plurality lower ball pad groups. Each of the upper ball pads in one of the plurality of upper ball pad groups, from among the plurality of upper ball pads, may be a dummy ball pad.

Abstract: A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that are stacked, and having a first main face and a second main face, and a plurality of external electrodes, the plurality of external electrodes being spaced from each other, each of the plurality of external electrodes being connected to a part of the plurality of internal electrode layers, the plurality of external electrodes having a predetermined area in the planar view. On at least one of the first main face and the second main face, at least one of the plurality of external electrodes has an extension portion extending along a side of the rectangular shape toward at least one of external electrodes adjacent to the at least one of the plurality of external electrodes.

Abstract: Microwave antenna systems include a parabolic reflector antenna having a feed bore and a feed assembly. The feed assembly includes a coaxial waveguide structure that extends through the feed bore, a sub-reflector, and a first dielectric block that is positioned between the coaxial waveguide structure and the sub-reflector. The coaxial waveguide structure includes a central waveguide and an outer waveguide that circumferentially surrounds the central waveguide. One of the central waveguide and the outer waveguide extends further from the feed bore towards the sub-reflector than the other of the central waveguide and the outer waveguide.

Abstract: An integrated circuit (IC) package that is to be incorporated into a computing device may include a metallization structure with circuits and/or other elements such as capacitors or inductors thereon. Pads for input/output (I/O) (or other) purposes may also be present at different locations on the metallization structure. Exemplary aspects of the present disclosure allow mold material to be placed over the circuits and/or other elements in readily-customizable configurations so as to allow placement of the I/O pads in any desired location on the metallization structure. Specifically, before the mold material is applied to the metallization structure, a mask material such as tape may be applied to portions of the metallization structure that contain I/O pads or otherwise have reasons to not have mold material thereon. The mold material is applied, and the mask material is removed, taking unwanted mold material with the mask material.

Abstract: A quartz crystal resonator unit includes a quartz crystal resonator that includes a quartz crystal blank. A pair of excitation electrodes are disposed on opposed main surfaces of the quartz crystal blank so as to face each other. A pair of connection electrodes are electrically connected to respective ones of the pair of excitation electrodes. A base member has a surface on which the quartz crystal resonator is mounted. A lid member is joined to the surface of the base member via a joining member. The quartz crystal resonator is accommodated in an inner space defined by the lid member and the base member on the surface of the base member. Parts of the joining member that cover protruding portions are in contact with a side wall of the lid member so as to restrain movement of the lid member when seen in a plan view in a direction normal to the surface of the base member.

Abstract: Embodiments of the disclosure provide for a system and method for determining a circuit breaker position in a power distribution/load center. In one embodiment, the load center includes a plurality of circuit breakers. Each circuit breaker includes a base and a plurality of contact components coupled to the base. In that regard, an activation of a combination of the contact components indicates a position of the circuit breaker within the load center. The activation of the combination indicates that one or more of the contact components is in contact with one or more pegs coupled to the load center. When this occurs, a data transceiver coupled to each of the contact components transmits a data signal. The data signal includes a plurality of data bits, where each data bit indicates whether a corresponding contact component of the combination is activated or not activated.

Abstract: A frame for installing an arc-shaped LED display screen composed of a plurality of LED display modules. The top partition panel and the bottom partition panel have arc edges with the same arc, and are parallel to and spaced apart from each other and both fixed to the primary support, the secondary support, the plurality of module supports, the left support, and the right support. The left support, the right support, and the plurality of module supports are equally spaced apart and fixed along the arc edge of each of the top partition panel and the bottom partition panel, and are configured to connect the plurality of LED display modules, to achieve a seamless assemblage of the arc-shaped LED display screen.

Abstract: A position adjustment device for a display module and a display device including the same are provided. A position adjustment device for a display module includes: a first direction control module including a first stage to which a display module is fixable, the first stage being movable in a first direction; a second direction control module coupled to the first direction control module and including a second stage movable in a second direction perpendicular to the first direction, and a first controller coupled to the second stage; and a third direction control module coupled to the second direction control module and including a third stage movable in a third direction perpendicular to the first direction and crossing the second direction, and a second controller coupled to the third stage.

Abstract: Embodiments may relate to a microelectronic package that includes an overmold material, a redistribution layer (RDL) in the overmold material, and a die in the overmold material electrically coupled with the RDL on an active side of the die. The RDL is configured to provide electrical interconnection within the overmold material and includes at least one mold interconnect. The microelectronic package may also include a through-mold via (TMV) disposed in the overmold material and electrically coupled to the RDL by the mold interconnect. In some embodiments, the microelectronics package further includes a surface mount device (SMD) in the overmold material. The microelectronics package may also include a substrate having a face on which the overmold is disposed.

Abstract: A method for fabricating a semiconductor die package includes: providing a semiconductor transistor die, the semiconductor transistor die having a first contact pad on a first lower main face and/or a second contact pad on an upper main face; fabricating a frontside electrical conductor onto the second contact pad and a backside electrical conductor onto the first contact pad; and applying an encapsulant covering the semiconductor die and at least a portion of the electrical conductor, wherein the frontside electrical conductor and/or the backside electrical conductor is fabricated by laser-assisted structuring of a metallic structure.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

Abstract: Embodiments of the disclosure provide for a system and method for determining a circuit breaker position in a power distribution/load center. In one embodiment, the load center includes a plurality of circuit breakers. Each circuit breaker includes a base and a plurality of contact components coupled to the base. In that regard, an activation of a combination of the contact components indicates a position of the circuit breaker within the load center. The activation of the combination indicates that one or more of the contact components is in contact with one or more pegs coupled to the load center. When this occurs, a data transceiver coupled to each of the contact components transmits a data signal. The data signal includes a plurality of data bits, where each data bit indicates whether a corresponding contact component of the combination is activated or not activated.