Abstract: A printed circuit board for connecting, in n different ways, connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on the printed circuit board, where n is an integer .gtoreq.2. The printed circuit board comprises contact holes which are electrically connected to the printed circuitry and are each suitable for receiving a connection pin of the DIL package. To avoid the use of so-called jumper blocks for the different ways of connection, the contact holes form a matrix of p columns and q rows, with p being at least equal to the number of connection pins on a long side of the DIL package, q being at least equal to 2n, and the distance between successive rows of contact holes being such that n-1 rows of free contact holes are located between the rows of connection pins on the opposite long sides of the DIL package when these rows of connection pins have been mounted in two rows of contact holes.

Abstract: An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition.