Abstract: An arrangement of electronic components in a housing includes a housing, at least one circuit board arranged in the housing with electronic components of a first type (such as SMDs) mounted thereon, at least one electronic component of a second type (such as a non-SMD coil or capacitor) that is not arranged on the circuit board but rather is mounted on a mounting surface in the housing, and an electrical connection established between the second electronic component and the circuit board. The electrical connection may be established by a connector member having two connecting shanks connected to the wires of the second component and two mounting shanks that are press-fit into contact holes of the circuit board. Alternatively, the electrical connection may be established by respective contact clips electrically and mechanically clamped onto the wires of the second component, whereby the contact clips have contact pins that plug into contact holes in the circuit board.

Abstract: A printed circuit board is provided with at least one component having one or more leads which are secured to contact faces of the printed circuit board. The leads of the component are secured to the printed circuit board via wire clamps soldered onto the surface of the contact faces. The formation of through-holes in the printed circuit board is rendered superfluous by the wire clamps. For the leaded components use can be made of resistors and capacitors, but also of a single electroconductive wire. Also described is a method of manufacturing the invented printed circuit board.

Abstract: An electronic component (100) includes a body portion (105) for enclosing first and second electronic devices (415, 430). The component (100) has first and second leads (110, 115) extending therefrom for providing a connection to the first device (415) and third and fourth leads (125, 130) extending from the component (100) for providing a connection to the second device (430). The first device (415) can be a short circuit connection, a fuse, or a resistor, while the second device (430) can be a different device, such as an open circuit connection. When the first and second leads (110, 115) are inserted into a connector (205) of an external circuit (202), the first device (415) is electrically coupled to the circuit (202). When, alternatively, the third and fourth leads (125, 130) are inserted into the connector (205), the second device (430) is electrically coupled to the circuit (202).

Abstract: A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.

Abstract: A capacitor assembly which positively disconnects failing capacitors is disclosed. This assembly will disconnect electrical power from a capacitor when internal pressure builds up inside the capacitor as a result of an internal short circuit. One or more capacitors are connected electrically into a circuit. Terminals are fixedly connected at each end of the capacitor. The protruding ends of the terminals slidably couple the capacitor to a source of alternating current (AC) power. The normal failure mode for capacitors is to develop internal short circuits. The failed capacitor then heats up rapidly and generates internal pressure. This pressure deforms the end portion of the capacitor. When the end of the capacitor moves in a longitudinal axis of motion, the slidable connection of the terminal is moved to a non-contacting position and the electrical connection is interrupted.

Abstract: A memory module has DRAM chips mounted on both a front and a back surface but decoupling capacitors mounted on only the front surface. Each decoupling capacitor is for suppressing current spikes from a pair of DRAM chips. The pair of DRAM chips includes a first DRAM chip on the same surface as the capacitor and a second DRAM chip opposite the first DRAM chip on the back surface of the module. The first DRAM chip belongs to a first bank while the second DRAM chip belongs to a second bank. Two RAS signals are for controlling access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one DRAM chip in the pair of DRAM chips creates a current spike at any time. Thus a capacitor can be shared between the two DRAM chips in the pair. The shared capacitor can be mounted next to or under one of the DRAM chips, or formed within the multi-layer substrate itself.

Abstract: A flexible circuit board includes a plurality of discrete circuits for use with different types of rechargeable battery packs. Conductive traces formed on the circuit board include gaps which cause certain portions of the circuitry to be disconnected from the circuit rendering that portion of the circuit inactive. The process of bridging the gaps by attaching one or more components over the gaps causes the corresponding inactive portion of the circuit to be activated. By selectively activating certain portions of the circuit, a desired result is obtained.

Abstract: First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.

Abstract: A processor module has a cache of SRAM chips mounted on both a back and a front surface but de-coupling capacitors mounted on only the back surface. Each de-coupling capacitor is for suppressing current spikes from a pair of SRAM chips. The pair of SRAM chips includes a first SRAM chip on the same surface as the capacitor and a second SRAM chip opposite the first SRAM chip on the front surface of the module. The first SRAM chip belongs to a first bank while the second SRAM chip belongs to a second bank. Two chip-enable signals control access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one SRAM chip in the pair of SRAM chips creates a current spike at any time. Thus, a capacitor can be shared between the two SRAM chips in the pair. The shared capacitor can be mounted next to or under one of the SRAM chips, or formed within the multi-layer substrate itself.

Abstract: On the front surface of an insulating substrate, there are formed first and second terminal electrodes at one end portion of the substrate, a third terminal electrode at the other end portion, a resistor portion connected to the first and second terminal electrodes, and a capacitor portion connected to the second and third terminal electrodes. The capacitor portion has a multilayer structure consisting of a bottom electrode, dielectric layer and a top electrode.

Abstract: An arrangement of an isolating support board having conductive surfaces between busbars, the support board having a portion projecting beyond the busbars in the transverse direction, and filter capacitors connected to the conductive surfaces being fastened on the projecting portion.

Abstract: A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or lower surface of the closure. The capacitor has a dielectric film interposed between a pair of electrode films. The dielectric film includes a ceramic filler and an amorphous glass. The closure and the package main body are sealed. A terminal formed in the package main body and the electrode film of the capacitor are connected electrically. High-density packaging on a substrate can be achieved. High strength of the closure itself can be maintained. Thermal stress developed in the closure itself, or the conjugated portion between the closure and the package main body, can be suppressed. Reliability of a sealed structure in the semiconductor device for a long period of time can be increased.

Abstract: The device is disclosed for the mounting and cooling of a capacitor. The device comprises of a pair of metal bars made of a thermally and electrically conductive material. The capacitor is fastened to the pair of metal bars. Water is circulated through channels defined in the pair of metal bars for cooling the capacitor.

Abstract: A capacitor has first and second pin contacts. A first female contact receives the first pin contact of the capacitor, and a second female contact receives the second pin contact of the capacitor. Electrical contact is established between the first and second pin contacts and the corresponding first and second female contacts. The first and second female contacts are in corresponding first and second displaced planes.

Abstract: A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings.

Abstract: The present invention relates to a chip coil for use in the electronic appliance or such other equipment, and intended to present a chip coil of an excellent mounting capability. Recesses (6) are provided only in the top and bottom surfaces of main body (1) having a square pillar shape, and in the bottom surface of main body (1) an insulation resin (4) is provided in the recess (6) to cover coil (2) within the space of recess (6).

Abstract: An apparatus comprises a condenser such as a condenser for reducing power source noise to be implemented on a board, a conductor for supplying a current passing through the condenser, and a current path comprising conductors and components which are installed in the neighborhood of at least one of the condenser and conductor and the effective inductance component of the condenser is reduced by passing a current through the current path in the phase opposite to that of a current passing through the condenser and conductor.

Abstract: An assembly board with a matrix of depending pegs uniformly spaced on orthogonal intersecting lines with pegs at intersections at half the distance adapted to selectively receive from a set, detachable and reusable electrical components housed in uniformly-shaped casings comprising at least 2 electrical connections uniformly spaced for interchangeability of components and stackable at the connections. Components with 2 connections are elongated with connection terminals at each end a standard distance apart. Components requiring a third connection are constructed in an equilateral triangular housing with a base having 2 terminals spaced apart the standard distance and a third connection half the standard distance from the base. Components having 4 or more connections are housed in a rectangular housing having terminals at corners with first opposing sides having terminals the standard distance apart at corners and the sides being spaced apart half the standard distance.

Abstract: A hybrid vehicle includes a power unit communicating power between a turbine alternator, flywheel and traction motor. The power unit stores, dc power in capacitors and places power on a dc bus for use in driving the induction machines. The dc bus includes two spaced buses, each of the bus members include a positive plate and a negative plate electrically insulated from one another. A conducting strap member interconnects the first and second bus members. The conducting strap member includes first and second strap plates electrically insulated from one another and secured to one another. A first of the strap plates is connected to the positive plates and a second of the strap plates is connected to the negative plates. Also included is a capacitor bank for storing DC power. The capacitor bank is connected to the DC bus by laminated brackets carrying positive and negative signals.

Abstract: A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a circuit board or other circuit substrate. The device can change shape through compression, distension, flexure, and other external forces while maintaining its electrical performance and mechanical integrity. The device can be compressed and deformed to fit snugly within another device, such as the shell of an electrical connector or a plastic clamshell, simultaneously creating spring forces for reliable electrical contacts and an environmental seal. Accordingly, the device and method can be used for a wide variety of purposes such as electrical filtering for avionics, computer or automotive connectors, or a non-intrusive manner to package electronics for medical implants.

Abstract: A tubular shaped device for insulating an electrical component such as, but not limited to, a dry film capacitor. Along one edge of the device is a rectangular shaped cutout for receiving radially extending leads of the electrical component. The electrical component is secured within the device by spreading the device open, placing the electrical component within the spread-open device, positioning the leads of the electrical component within the cutout and finally permitting the device to once again assume its tubular shape.

Abstract: A power supply circuit is set forth which overcomes the problems associated with incorrect battery insertion. The power supply circuit includes first and second battery terminals for electrical connection to the battery. The first and second battery terminals are connected to a first transistor switching circuit. The first transistor switching circuit is responsive to power from the battery to through-connect a negative polarity power signal therethrough irrespective of the polarity orientation of the battery. The first and second battery terminals are also connected to a second transistor switching circuit. The second switching circuit is responsive to power from the battery to through-connect a positive polarity power signal therethrough irrespective of polarity orientation of the battery. The negative and positive polarity power signals are available for connection to a load device, such as a hearing aid amplifier.

Abstract: A transformer mount (11) supports a transformer (12) over a component (22) on a substrate (23) of a hybrid module (10). The transformer mount (11) conserves space in the hybrid module (10), improves high frequency performance by minimizing parasitic capacitances and inductances of the transformer mount (11), is compatible with subsequent high temperature and batch processing for faster assembly, permits the flow of defluxing materials beneath the transformer mount (11), is inexpensive, and provides appropriate access to fine tune the transformer (12) during assembly.

Abstract: An electrical capacitor, particularly an electrolyte capacitor, that is built into a housing, particularly a metallic housing, has a male fastening member at the floor with the assistance of which the capacitor is secured to a fastening plate in vibration-proof fashion. The male fastening member is fixed with a snap mount composed of an insulating material that is pressed in a bore of the fastening plate. A formed portion that presses the snap mount against the fastening plate is arranged at the snap mount. The male fastening member comprises a constriction into which parts of the snap mount engage.

Abstract: A device and method for insulating a dry film capacitor includes a pair of electrically non-conductive discs having knurled protrusions extending therefrom. The dry film capacitor includes a core for receivingly engaging the protrusions to thereby secure the discs to the capacitor. The discs are dimensioned such that the discs when placed on the interior surface of a ballast can serve as supports for the capacitor by raising the capacitor away from contact with the ballast can. In connecting the discs to the capacitor, the protrusions are twistingly pushed into the core of the capacitor.

Abstract: A small toroidal inductor is mounted by inserting a high valued resistor or a ceramic coil form into the central hole of the toroid. The fine leads of the inductor are then soldered to the much stiffer leads of the part that has been inserted. These stiffer leads may be bent in any desired way, and will hold their shape. This makes insertion easier and is strong enough to withstand the necessary amounts of shock and vibration. The toroid may be glued or otherwise affixed with an adhesive to the resistor or coil form.

Abstract: In an arrangement in which the earphone cord 16 of earphones 15 is connected to a remote control unit 11 and the remote control cord 12 of this remote control unit 11 is detachably connected to a portable audio unit 10 by means of a plug 14, a battery 19 that drives the elements inside the remote control unit 11 is embodied in a plug unit 13 having the plug 14. Specifically, a battery accommodation recess 23 is formed in the plug unit 13, and a battery holder 26 into which the battery 19 is fitted is detachably attached to this battery accommodation recess 23. As a result, with the plug 14 inserted into the portable audio unit 10, the portable audio unit 10 and the plug unit 13 are an integral unit and do not have the weight of the remote control unit 11 if the portable audio unit 10 is kept in a pocket or handbag. The remote control unit 11 becomes lighter and smaller to the extent of the battery 19.

Abstract: A method of producing a composite component and a composite device which are small in size, high in the mass-production aptitude, and stable in the electrical characteristics. The composite component includes an inductor (1), coupling unit (3), and at least one circuit component (2) different from the inductor (1). The inductor (1) includes a coil support (12) having a coil winding portion (123) at the middle body thereof, and has a coil (11) wound around the coil winding portion (123). The coupling unit (3) is arranged such that one end of metal pieces (31 and 32) is fixed to one end face of the two end faces of the coil support (12) and the other ends of the metal pieces face each other across a space. The circuit component (2) is a chip component having electrodes (22 and 23) at two opposite ends of a base body (21), and is disposed between the metal pieces (31 and 32). The electrodes ( 22 and 23) are mounted fixedly to the metal pieces (31 and 32).

Abstract: A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as tungsten (W) on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the conductive material layers. Thick film conductor layers are formed on the copper-plated layers, to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.