Abstract: An optical transceiver with an enhanced EMI shielding is disclosed. The optical transceiver of the invention provides an optical receptacle made of metal and an optical subassembly with a metal cover assembled with the optical receptacle. The metal cover electro-magnetically divides the inside from the outside of the transceiver. The metal cover provides a plate portion and an edge portion, where the former portion forms an opening through which the sleeve passes without coming in contact with the metal cover, while, the latter of which comes in contact with the receptacle.

Abstract: A transparent capacitive touch panel has electromagnetic shielding effect. No extra process and cost is increased. A side of the capacitive touch panel facing electromagnetic interference is formed with an electromagnetic (EM) shielding for avoiding the interference of EMI and RFI. As comparing with the prior art, advantages of the present invention are that the present invention achieves a complete EM-proof effect so as to provide a preferred EM shielding; the effect of EM proof of the present invention has no relation with the arrangement of X traces, Y traces; and the gaps between the traces of the present invention can be widened for having a better effect of EM proof so as to simplify the technology in manufacturing with a higher yield ratio and a lower cost.

Abstract: A shielding assembly comprises a pair of opposite first sidewalls, a pair of opposite second sidewalls, a pair of opposite first covers, a pair of latching portion and a pair of opposite second covers. The first sidewalls and the second sidewalls are connected with each other to collectively form a hollow frame. The first covers are resiliently connected to the first sidewalls, respectively, and suitable to be bent to collectively cover the hollow frame. The pair of latching portions extend the first covers and are bent perpendicular to the first covers, respectively. A pair of gaps are defined respectively on two tail ends of each of the latching portions. The second covers are resiliently connected to the second sidewalls, respectively, and are bent to cover on the first covers and latched in corresponding gaps.

Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.

Abstract: There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield over a first area of the circuit board and placing a second electromagnetic shield over a second area of the circuit board. At least one of the electromagnetic shields has at least one projection therefrom that contacts and makes electrical connection with a surface of the other electromagnetic shield when the shields are placed on the circuit board.

Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

Abstract: An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell.

Abstract: A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: A chassis for an electronic device includes a main housing and a removable cover. The main housing includes a base plate and two opposite side plates integrally formed together. The removable cover includes a main portion and two opposite side portions. The side portions are latched on the side plates. A space is defined between each side portion of the cover and each side plates of the main housing. A waveguide is formed between each side portion and each side plate to attenuate electromagnetic radiation in the space.

Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.

Abstract: An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Abstract: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Abstract: A radial optical data interchange packaging comprises a central core; a plurality of central core photo transceivers emerging from an exterior side surface of the central core; a mother board coupled to the central core, wherein the mother board is perpendicularly oriented below and abutting the central core; a plurality of retention slots on the mother board, wherein the retention slots radially extend away from the central core; and a plurality of cards held by the retention slots, wherein each of the plurality of cards comprises a set of card photo transceivers that optically communicate with the central core photo transceivers.

Abstract: An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.

Abstract: An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.

Abstract: A method for performing chip level electromagnetic interference (EMI) reduction is provided, where the method is applied to an electronic device. The method includes: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. In particular, the at least one chip includes a first chip and a second chip; and the at least one EMI suppression circuit includes a first EMI suppression circuit positioned within the first chip, and further includes a second EMI suppression circuit positioned within the second chip. An associated apparatus is also provided.

Abstract: The dielectric sheet of the present invention is made of a sheet having a thickness of 5-30 ?m, which is formed by drying a coated film of a coating liquid containing a resin and a natural graphite powder having an average particle diameter of 10 ?m or less. Preferably, the sheet is formed from a coating liquid containing a resin, a natural graphite powder having an average particle diameter of 10 ?m or less, and a solvent, wherein the content rate of the natural graphite powder to the resin exceeds 5% by volume and is not more than 20% by volume, and the total content of the resin and the natural graphite powder is 10-55 wt %.

Abstract: A wireless power receiver according to an embodiment wirelessly receives power from a wireless power transmitter. The wireless power receiver includes a printed circuit board having a reception space in a predetermined area, a receiving coil disposed in the reception space of the printed circuit board for receiving power from the wireless power transmitter, and a short-range communication antenna disposed on the printed circuit board while surrounding the receiving coil.

Abstract: An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material.

Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

Abstract: An electromagnetic wave suppression material is fixed to a case of a communication module. The electromagnetic wave suppression material suppresses radiation of electromagnetic waves by coming into contact with a cage that is a module insertion portion of a chassis when the communication module is inserted into the cage. A piezoelectric element is provided on the case, and located between the case and the electromagnetic wave suppression material. When the communication module is inserted into the cage, the controller applies a voltage to the piezoelectric element to stretch it by the applied voltage, thereby increasing contact pressure between the cage and the electromagnetic wave suppression material.

Abstract: An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.

Abstract: Methods and systems for providing electromagnetic protection of optical equipment are disclosed. One assembly includes an optical device and an electromagnetically shielding enclosure including a plurality of shielding surfaces, the enclosure defining an interior volume containing the optical device. The assembly further includes a waveguide beyond cutoff extending through a shielding surface of the electromagnetically shielding enclosure. The assembly also includes a first lens located on a first side of the shielding surface, and positioned and oriented to focus light through the waveguide beyond cutoff. The assembly further includes a second lens located on a second side of the shielding surface opposite the first side, positioned and oriented to receive light transmitted through the waveguide beyond cutoff.

Abstract: An electric apparatus module 1 includes an upper casing 6, a lower casing 7 to which the upper casing 6 is attached and which is attached to a rear panel 2, an electronic device unit 8 accommodated in the upper casing 6 and the lower casing 7, a conductive shield shell 9 covering the electronic device unit 8, and a conductive ground shell 10 which is attached to the lower casing 7 at a side of the rear panel 2. The ground shell 10 includes a flat plate portion 83 piled on the rear panel 2, a contact piece 84 erected from an outer edge 83c of the flat plate portion 83 toward the lower case 7, and a contact member 85 protruded from a rear surface 83b of the flat plate portion 83 at the side of the rear panel 2. The contact piece 84 is inserted through a through hole 56 formed on the lower casing 7 to contact with the shield shell 9. The contact member 85 is inserted through a through hole 11 formed on the rear panel 2 to contact a cylindrical shield member 22 of an external device.

Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.

Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

Abstract: Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.

Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.

Abstract: In a flat panel display (FPD), a conductive heat proof plate is inserted between the back surface of a display panel, on which printed circuit boards (PCBs) and signal lines are formed, and signal lines. A back frame positioned on the back surface of the display panel is provided to cover the printed circuit boards and the signal lines. A shield can is formed in the internal surface region of the back frame corresponding to the printed circuit board on which a timing controller is mounted. The shield can is electrically coupled to the heat proof plate to improve resistance against the electromagnetic compatibility of a large flat panel display and to improve a thermal characteristic.

Abstract: A gasket for use with an electromagnetic interference (EMI) shielding cage for a connector includes a conductive body having an opening configured to receive a first end of the EMI shielding cage near a gasket mating wall incorporated on the EMI shielding cage. The conductive body has a first face designed to face away from the gasket mating wall, a second face designed to face the gasket mating wall, an inner perimeter and an outer perimeter. A plurality of engagement tabs are disposed along the outer perimeter and extend away from the first face. A plurality of spring tabs are disposed along the inner perimeter and extend away from the second face.

Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

Abstract: An electronic device is within a housing that has an aperture through an enclosure surface of the housing. A ferrite block is attached to an edge of the aperture, thus transforming electromagnetically-induced current next to the aperture into heat in order to reduce a voltage across the aperture, thereby suppressing aperture edge emissions.

Abstract: An apparatus includes: a circuit board which is disposed in a main unit of the apparatus; a shielding conductor which is placed outside the circuit board as viewed from the apparatus main unit; a covering member which covers an outer side face of the apparatus main unit; and an electrically conductive member which is fixed to an inside of the covering member to cross an opening which exists between a main unit frame on which the circuit board is disposed, and the shielding conductor, one end portion of the electrically conductive member being connected to the shielding conductor, another end portion of the electrically conductive member being connected to a grounded frame of the apparatus main unit.

Abstract: A magnetic shield is presented. The shield may be used to protect a microelectronic device from stray magnetic fields. The shield includes at least two layers. A first layer includes a magnetic material that may be used to block DC magnetic fields. A second layer includes a conductive material that may be used to block AC magnetic fields. Depending on the type of material that the first and second layers include, a third layer may be inserted in between the first and second layers. The third layer may include a non-conductive material that may be used to ensure that separate eddy current regions form in the first and second layers.

Abstract: Disclosed is a display device wherein moving of a display panel in the planar direction is suppressed, while reducing EMI. The liquid crystal display device is provided with the liquid crystal display panel, and a holding member, which holds the end portion of the liquid crystal display panel. The holding member includes: a front side holding section, which is disposed on the front side of the liquid crystal display panel; a rear side holding section, which is disposed on the rear side of the liquid crystal display panel; and regulating sections, which are disposed on the side of the liquid crystal display panel, and which regulate moving of the liquid crystal display panel in the planar direction of the liquid crystal display panel. The front side holding section has a function of blocking electromagnetic waves.

Abstract: A receiver includes a housing and a sleeve. The housing forms a chamber, and the coil is disposed in the chamber and radiates a flux. The sleeve at least partially surrounds the coil such that a majority of flux radiated from the coil is blocked by the sleeve.

Abstract: A display panel easily implements reflection color of a display. The display panel includes a panel which has a plate shape to implement an image, and an optical filter which is attached to the panel. The optical filter includes a color compensating layer which implements transmittance color by controlling transmittance light passing from an interior to an exterior of the panel, and a reflection layer which implements reflection color by controlling reflection light which is incident from the exterior to the panel, and which is reflected.

Abstract: A display apparatus is provided. The display apparatus includes a display panel; a base chassis which is disposed on a surface of the display panel, includes a first surface having a convex area and a second surface opposite the first surface and having a concave area corresponding to the convex area of the first surface; a driving circuit which is connected to the display panel to operate the display panel; a connection element which attaches the driving circuit to the convex area of the first surface of the base chassis; and a conductor which is attached to the concave area of the second surface of the base chassis.

Abstract: A shield case is configured for supporting a memory card. The shield case includes a recessed portion, and a first edge, a second edge, and a third edge arranged around the recessed portion. The first edge forms a first support plate. The second edge forms a second support plate. The first support plate and the second support plate cooperatively support the memory card.

Abstract: A device for protecting a circuit board from electromagnetic interference, and which includes shield to be attached to the circuit board. The device includes a metal plate and a plurality of tangs. The metal plate has a perimeter portion. The plurality of tangs are spaced about and extend transversely away from at least a portion of the perimeter portion of the metal plate. Each tang includes a bridge portion and a finger portion. The bridge portion has a first end attached to the perimeter portion and a second end spaced away from the perimeter portion and attached to the finger portion. The finger portion extends away from the second end of the bridge potion and is disposed at an obtuse angle relative to the bridge portion such that the plurality of tangs, in combination, are adapted to receive the circuit board.

Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.

Abstract: An energy management system. The system includes a coax controller apparatus comprising an exterior housing and plurality of coax modules numbered from 2 through N, where N is an integer greater than 3. In a specific embodiment, each of the coax modules comprises a powerline chip (PLC) module coupled to an analog front end, which is coupled to a coaxial connector. The system also has an electromagnetic shield configured to each of the coax modules. In a specific embodiment, the electromagnetic shield is configured to substantially maintain the coax module substantially free from interference noise or other disturbances. The system has a power meter coupled to one or more ports of the coax controller apparatus.

Abstract: An exemplary electronic device includes a case, an inner body and a pivotable arm pivotally connected on the inner body by a pivot. The case defines an opening at a first lateral side thereof and a latching hole at a second lateral side thereof adjacent to the opening. The inner body is inserted in the case through the opening. The pivotable arm includes a frame engaged in the latching hole of the case, a latching member pivotally connected to the frame by the pivot, and a resilient member. The latching member includes an inner end and an outer end at opposite sides of the pivot. The outer end of the latching member is engaged in the latching hole. The resilient member abuts against the inner end of the latching member such that the inner end of the latching member biases the inner body.

Abstract: The invention relates to a system for magnetically shielding a charged particle lithography apparatus. The system comprises a first chamber, a second chamber and a set of two coils. The first chamber has walls comprising a magnetic shielding material, and, at least partially, encloses the charged particle lithography apparatus. The second chamber also has walls comprising a magnetic shielding material, and encloses the first chamber. The set of two coils is disposed in the second chamber on opposing sides of the first chamber. The two coils have a common axis.

Abstract: A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising a semiconductor wafer having a multitude of microchips. The multitude of microchips forming a plurality of independently functioning computers, each computer having independent communication capabilities.

Abstract: A touch panel is characterized in that one side of a top panel protrudes beyond a side of a bottom panel, signals of sensing areas or conductive layer on the top panel for sensing capacitive variation or voltage variation are transmitted to a bottom surface of the protruded side, signals of sensing areas or conductive layer on the bottom panel for sensing capacitive variation or voltage variation are transmitted to a bottom surface of the top panel through conductive adhesives and to the bottom surface of the protruded side, and the top panel has a flexible PCB formed on the bottom surface of the protruded side to receive those signals. As the flexible PCB is not sandwiched between the top and bottom panels, all layers of the touch panel can be uniformly and tightly bonded and touch insensitivity caused by air penetration into the touch panel can be prevented.

Abstract: Provided are an electromagnetic shield structure capable of reducing the contamination of electromagnetic noise which is radiated from a digital device into a wireless device, and a wireless apparatus using the electromagnetic shield structure. This structure has a shield function to reduce the influence of the noise radiated from an LSI (102), by a first shield (3) and a second shield (4). An open face (4g) of a first L-shaped structure portion (4a) and an open face (4h) of a second L-shaped structure portion (4b) are opposed to each other. Accordingly, even if the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b) are excited by the LSI (102), the electromagnetic fields radiated from the open faces (4g and 4h) cancel each other out to reduce the radiation of noise from the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b).

Abstract: A shield that protects high-value input resistors in a power meter against unwanted effects due to electromagnetic interference from a nearby power supply and/or due to crosstalk from adjacent phases. The shield includes multiple printed circuit board shields that are arranged between each of the input resistors on a main printed circuit board in the power meter. Each PCB shield has a conductive layer that provides the shielding against unwanted energy. The resistors are arranged in a diagonal or parallel manner between each pair of PCB shields to prevent the resistor from movement, which prevents pin fatigue and fixes the value of the parasitic capacitance that is produced in the resistor-PCB-shield combination. In another configuration, the PCB shield is made of a flexible material, and snakes between and over the top or around the side ends of each resistor in a serpentine fashion, protecting the resistors from unwanted energies from both the top and the sides.