Abstract: An optical transmitter device is disclosed. The optical transmitter device includes an optical integrating device, a carrier, and a thermo-electric cooler (TEC). The carrier has a top surface and a back surface opposite to the top surface. The carrier includes an insulating slab and a metal plate attached to the insulating slab. The metal plate has thermal conductivity better than thermal conductivity of the insulating slab. The insulating slab forms the top surface of the carrier that provides an interconnection thereon. The back surface mounts the optical integrating device thereon. The TEC faces the carrier and mounts the carrier thereon. The carrier has a base overlapped with the TEC and an extension not overlapped with the TEC, the extension mounting the optical integrating device thereon.

Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.

Abstract: An electronic-device housing stores an electronic circuit and a cooling fan. The electronic-device housing includes a first surface having at least one opening to release heat outside. At least one projected portion projects toward an outside of the electronic-device housing, and when the electronic-device housing is installed on an installation surface so that the first surface is opposed to the installation surface and the projected portion comes into contact with the installation surface, a rotation moment acting on a gravity center of the electronic-device housing acts in a direction where the rotation moment causes the first surface to move away from the installation surface.

Abstract: An electro-optic device includes an electro-optic panel, a first holding member that holds the electro-optic panel, and a second holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered. In the electro-optic device, a predetermined gap is provided between the first holding member and the second holding member.

Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Abstract: An electric power conversion apparatus includes a stacked body, a capacitor, a metal frame and a case. The stacked body is formed by stacking semiconductor modules with coolant passages formed therebetween. The frame has both the stacked body and the capacitor fixed therein. The case has all of the stacked body, the capacitor and the frame received therein. Further, the frame has a separation wall that separates the stacked body and the capacitor from each other, a stacked body-surrounding wall that surrounds the stacked body with the help of the separation wall, and a capacitor-surrounding that surrounds the capacitor with the help of the separation wall. The capacitor has a pair of end portions that are opposite to each other in a predetermined direction, in which control terminals of the semiconductor modules of the stacked body protrude, and each at least partially exposed from the capacitor-surrounding wall of the frame.

Abstract: A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides.

Abstract: In one implementation, an environmental controller operates a cooling system in an electronic device. The environmental controller includes a closed loop control system for operating a cooling fan at a target speed. The environmental controller may select the target speed based on one or more temperature sensors. The environmental controller may select the target speed based on the speeds of additional fans or the fans may be controlled in unison. The closed loop control system includes a proportional weight. When a measured cooling fan speed deviates from the target speed by more than a threshold error value, the proportional weight is constant. As the measured cooling fan speed approaches the target speed, and the threshold error value is crossed, the proportional weight is variable. The variance may be a function of time such as a periodic stair step function.

Abstract: A device may include multiple power supplies that are cooled by a system fan. The power supplies may be cross-connected to supply power to one another and the device may monitor temperatures of the power supplies. Based on the temperatures of the power supplies, the device may determine whether any of the power supplies are likely to be on fire. The device may shut off the fan when a power supply is determined to be likely to be on fire.

Abstract: A matrix converter includes first to third AC reactors connected in series with first- to third-phase outputs of three-phase AC electric power, and a first cooling fan that generates cool air for cooling the first to third AC reactors. The first to third AC reactors are arranged side-by-side in a direction intersecting a direction in which the cool air flows.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: A cabinet to be interposed between an above ground or underground sump and the control panel for said sump. All electrical connections between the control panel for the operation of the sump or lift station and the sump or lift station itself are disposed within this cabinet. The cabinet has two abutting closed sections, an A section having an open bottom and at least one vented side and a vented door; and a B section having a bottom panel and non-perforated sides and door. A pair of aligned intermediate rear panels close off each section, the only connection between said sections being a cable entry seal disposed in aligned openings in each intermediate rear panel for the passage of cabling from the A section to be mounted for termination in the B section. Any conventional cabling termination means can be employed in the B section.

Abstract: The invention relates to a modular assembly for fastening electronic modules carried on board an aircraft, characterized in that it comprises: a frame (10) having a more or less planar vertical front surface, comprising several mechanical fastening interfaces each intended for mechanically fastening an electronic module, at least one electronic module (80) comprising a mechanical fastening interface and which is attached to the front surface of the frame in suspended position via cooperation of the mechanical fastening interface of the said at least one electronic module with one of the mechanical fastening interfaces of the frame.

Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.

Abstract: A premises power source accessory panel for an outdoor unit, a method of adapting an outdoor unit with a premises power source accessory panel and an outdoor unit incorporating the panel or the method. In one embodiment, the panel includes: (1) a bracket having at least one electrical conduit aperture and (2) a circuit protection element mounted to the bracket and configured to be coupled to a premises power source, the bracket removably couplable to the outdoor unit in lieu of a conventional electrical conduit panel.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A housing structure for a vehicle electronic control unit (“ECU”) includes an ECU case, a mounting bracket, and a seal ring. The ECU case is for housing a vehicle ECU and includes a ventilation opening. The mounting bracket connects with the ECU case and is configured to connect with an associated vehicle frame for mounting the ECU case to the associated vehicle frame. The seal ring surrounds the ventilation opening and seals against both the ECU case and the mounting bracket. A method for mounting an electronic control unit (“ECU”) case to a vehicle frame is also disclosed.

Abstract: A power electronic device with cooling arrangement includes a housing that accommodates power electronic components. At least two adjacent axial fans are connected to the housing for inducing an airflow from outside into the housing in order to cool the power electronic components. Furthermore, the device can include a separating wall that extends outside the housing from between the at least two adjacent axial fans in order to reduce noise caused by the fans. Such a cooling arrangement can provide a power electronic device with effective cooling in compact size and also having an acceptable level of noise.

Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.

Abstract: The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body.

Abstract: Cooling arrangement for an electrically conductive element in an electrical installation. A casting body (3) is provided for electrically isolating the electrically conductive element (2). The casting body has an outer wall, part of which forms a contact surface 5 (5) for contact with a heat conducting surface (1) of the electrical installation. The outer wall of the casting body (3) is provided with an electrically conductive layer (4; 7) at its outer surface.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: Optical subassemblies including integral thermoelectric cooler (TEC) drivers. In one example embodiment, an optical subassembly includes a thermoelectric cooler (TEC) driver, a first substrate to which the TEC driver is structurally mounted, a second substrate, a laser temperature sensor structurally mounted on the second substrate, a TEC thermally coupled to the second substrate, and a thermal resistance mechanism including a thermally insulating material. The laser temperature sensor is structurally coupled directly between a laser and the second substrate with the laser being in direct contact with the laser temperature sensor.

Abstract: The present invention relates to a self-cooled thyistor device for ultra-high voltage fault current limiter. a self-cooled thyristor valve, it adopts horizontal structure consisted by frames, frames is divided into upper and below two spaces by crossbeams, the bottom of frames is supported by insulators. There is a cross plate between two vertical said frames, the cross plate mounts resistors connect with a high potential plate and capacitor through two wires. There is a thyistor string in said frame upper space, which is constituted of thyistors and cooler series. The thyistor string is compressed tightly by press-fit mechanism, thyistor string crosses current transformers. There are high potential plates on both sides of the thyistor, the number of the potential plates is equal to that of thyistor. One side of the high potential plates links frames, said current transformers connects with high potential plates.

Abstract: A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.

Abstract: Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC) thermally coupled to the substrate, the TEC being mounted within the housing; an optical component structurally mounted on the substrate, wherein the optical component is thermally coupled to the TEC; and a TEC driver electrically coupled to the TEC, wherein the TEC driver is configured to electrically drive the TEC, the TEC driver being mounted within the housing.

Abstract: A plasma display assembly having increased structural rigidity without using a reinforcing member is disclosed. The plasma display assembly includes a PDP, a chassis base and at least one or more circuit boards so as to provide the electromechanical structures to produce an image. The chassis base supporting the PDP at a rear side thereof includes a base part and at least one extended bent part. The base part is formed substantially parallel to the PDP. The extended bent part is formed in at least one of upper, lower, left and right edges of the base part, and includes a first bent part bent with respect to the base part to extend rearwardly, a second bent part bent with respect to the first bent part to extend in a direction parallel to the chassis base, and a third bent part bent with respect to the second bent part to extend forwardly. The circuit boards are arranged to be connected to at the rear side of the chassis base and drive the PDP during operation.

Abstract: A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween.

Abstract: An optical disc drive may include a tray movable for the sake of mounting and dismounting a disc, a disc rotation mechanism arranged at the center to rotate the disc, and a pickup arranged on a backside of the center to write and read the disc within a housing. The optical disc drive may be arranged with a first opening for inhaling outside air in a height range between the bottom surface of the tray and the proximity to the bottom end of the pickup on a back surface or a side surface around a corner on a right side viewed from the backside of the housing, and a second opening for exhausting internal air, arranged higher than a top surface of the tray on the back surface or a side surface around a corner on a left side viewed from the backside.

Abstract: A mount module for an inverter includes a housing element with a recess being open to the front face, for holding a single inverter. The upper face and the lower face of the housing element are complementary to one another, and/or the right side and the left side of the housing element are complementary to one another, and/or the rear face of the housing element is complementary to itself. The respective side or sides and face or faces of the housing element each have at least one connection device. A relatively large number of the mount modules can be disposed one above the other, alongside one another, and/or with their rear faces against one another and can be connected to one another in order, for example, to form a central inverter unit for large photovoltaic installations.

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough.

Abstract: A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal transmission member, which transmits electrical signals between a chassis member supporting a panel displaying image and including at least one device and a circuit unit separated from the chassis member to drive the panel. The thermal conductive supporter includes: a base portion formed of a thermal conductive material, and having a side surface contacting the chassis member and another side surface contacting the signal transmission member; and a recess portion oriented on the base portion toward the chassis member so that the at least one device does not contact the base portion.

Abstract: A heat dissipating device for a data storage device includes a bracket configured for receiving the data storage device, a heat sink received in the bracket configured for dissipating heat from the data storage device, and a fastener. The bracket has two sidewalls. A slot is defined in each sidewall of the bracket. The fastener has two free ends fixed in the slots of the bracket respectively for pressing the heat sink to closely contact with the data storage device.

Abstract: Embodiments of methods and apparatus for cooling optics are disclosed.

Abstract: A plasma display apparatus for discharging heat from a lateral surface of a device. The plasma display apparatus includes a display panel, a chassis base supporting the display panel, and a circuit unit supported by the chassis base and for driving the display panel. A signal transmission unit couples the display panel and the circuit unit and includes at least one device mounted on itself. A lateral heat radiation member surrounds a lateral portion of the device to diffuse heat from the lateral portion of the device.

Abstract: A test apparatus for testing circuitized substrates such as PCB test coupons for thru-hole failure in which the substrate may be cooled to a temperature less than the ambient temperature surrounding the test apparatus housing in which the testing is accomplished. A method of testing substrates is also provided.

Abstract: An electronic device including: a circuit board with an electronic circuit; a heat conductor to conduct heat generated in the electronic circuit; an electronic element to be used under an ambient temperature lower than a temperature of the heat conductor heated by heat generated in the electronic circuit; and a support to support the circuit board, the heat conductor, and the electronic element, wherein the support is positioned between the heat conductor and the electronic element so that a first plane of projection of the heat conductor on the support and a second plane of projection of the heat conductor on the support do not overlap with each other.

Abstract: Noise exiting from a plasma display device is effectively reduced and a degree of freedom of design is increased according to a plasma display device that includes a base chassis, a PDP adhered to the base chassis, a PDP driving circuit board adhered to the base chassis opposite to the PDP, a front cover disposed in front of the PDP, a rear cover having a plurality of ventilation holes for heat radiation, the rear cover being disposed at the rear of the base chassis and covering the base chassis, and a noise-shielding member for covering the plurality of ventilation holes from front or rear thereof, such that noise generated inside of the device is reflected or diffracted.

Abstract: A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.

Abstract: A heat-dissipating casing of an electronic apparatus having an input device, an output device, and a printed circuit board connected with the input device and the output device is disclosed. The heat-dissipating casing includes a metal extruded casing having at least four surfaces to form a space, a first opening and a second opening, wherein the space is used for receiving the printed circuit board, a first side plate fixed to the metal extruded casing to cover the first opening and having a first hole for securing the input device, and a second side plate fixed to the metal extruded casing to cover the second opening and having a second hole for securing the output device, thereby dissipating the heat generated from the electronic apparatus and equalizing the surface temperature of the electronic apparatus.

Abstract: An outdoor telecommunications cabinet comprising an electronic compartment adapted to contain heat-generating electrical equipment, having a main electronic compartment including a rear wall panel and two clamshell doors, a floor panel and a cover panel, including access areas and an equipment storage area, the main compartment being adapted to contain heat-generating electrical equipment, at least one rack inside said main electronic compartment for electronic equipment, a base assembly supporting the said electronic compartment, having a width and depth similar to said main electronic compartment capable of being anchored to a base plate or pad, a ventilated sub-compartment in the base assembly containing an environmental cooling system, a pair of clamshell doors, movable between an open position permitting access to both front and back sides of said electrical equipment and a closed position in which the doors maintain a substantially closed environment in the electronic compartment, a cable entry port, ty

Abstract: A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.