Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, having a base box (2), an outer cabinet body (3) with at least one door (4), a cabinet cover (5), and an inner installation frame (6), the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: The telecommunications equipment transportation apparatus of the present invention is comprised of components including a base section, a container section and a harness system. The base provides a suspension which forms the supporting foundation for the unit and the equipment stored therein, and houses a power circuit that includes electrical outlet(s) for providing battery or generator-supplied alternating current (AC) or direct current (DC) power to the transported telecommunications equipment. The container is comprised of compartments that can be totally sealed for transport and storage, along with panel(s) which open to allow access to the viewing monitor and controls of transported equipment such as computers and TV sets.

Abstract: The telecommunications equipment transportation apparatus of the present invention is comprised of components including a base section, a container section and a harness system. The base provides a suspension which forms the supporting foundation for the unit and the equipment stored therein, and houses a power circuit that includes electrical outlet(s) for providing battery or generator-supplied alternating current (AC) or direct current (DC) power to the transported telecommunications equipment. The container is comprised of compartments that can be totally sealed for transport and storage, along with panel(s) which open to allow access to the viewing monitor and controls of transported equipment such as computers and TV sets.

Abstract: The invention relates to an electronic plug-in unit which has two lateral edges and adapted to support at least one electronic card. The plug-in unit includes a central core made of metal lying parallel to the plane of the plug-in unit and a supported electronic card to drain away heat, by thermal conduction, to at least one lateral radiator which forms one of the lateral edges of the plug-in unit.

Abstract: A computer mainframe and stand arrangement includes a stand and a computer mainframe supported on the stand, wherein the stand has an oblique front panel and an oblique riser rose behind the front panel, the riser having a plurality of air vents and coupling holes; the computer mainframe is supported on the riser above the front panel of the stand, having a substantially U-shaped, fixed handle, a holding space defined between the handle and a front side wall thereof and adapted for holding case-packed computer readable disks on the front panel of the stand above a stop block at the front panel, and a plurality of coupling rods raised from a back side wall thereof and respectively coupled to the coupling holes of the stand.

Abstract: The invention comprises a main distribution arrangement for a telephone exchange, including a rack (1); several subscriber-related connectors whose positions are affixed to the rack, coordinated to one or more connection terminals (2a); and several external connectors that belong to telephone exchange-related line circuits, also affixed to the rack and coordinated to one or more connection terminals (3a). Said connection terminals are situated close to one another, and are arranged, with required main distribution conductors (23), to connect selected subscriber-related connectors with selected telephone exchange-related external connectors. A predetermined number of telephone exchange-related line circuits are coordinated to a block (10). Each block (10) can be inserted into and removed from the rack along parallel bars (11, 12).

Abstract: The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package.

Abstract: In cooling electrical devices (205) a Laval nozzle, is used for obtaining a cooling effect. The nozzle can be located close to the electrical device (205), which it is intended to cool, whereas the unit (209) supplying the nozzle with air, for example a fan or a compressor, can be located at another location. This is very advantageous when the electrical devices (205) to be cooled are located at locations hard to reach or access, such as in the top of antenna (201). The supplying unit (209) can then be located at the foot of the antenna where repair and service is easy to carry out.

Abstract: A double-sided electronic device includes a heat conductive substrate having working zones of structures and components disposed thereon in double planar arrangement, as a monolithic or hybrid electronic device. In order to connect the structures or components, disposed on different sides of a substrate, connecting conductors go through the substrate's edges. At the same time the connecting conductors are insulated from the structures and pass on main surfaces of double-sided electronic device. In a case of failure detection after burn-in and checking, the device having one good side is used as conventional, housed in a package or three-dimensional module. A device having two good surfaces has double information capacity. The invention provides a large economic benefit due to economy of materials and significantly increases a packing density of electronic equipment.

Abstract: A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem, with low RF leakage between the compartments is disclosed. The manufacturing module comprises a printed circuit board having one or more circuit trace layers, and ground planes covering a substantial portion of the top and bottom surfaces. The printed circuited board also has numerous plated-through holes electrically connecting the top and bottom ground planes. The circuit board is sandwiched between a heatsink having a flat upper surface and a machined enclosure having an outer wall and inner divider walls. The plated-through holes, space less than 1/10 wavelength of module's highest carrier frequency apart, serve to electrically connect the heatsink to the machined enclosure, thus creating separate compartments with low RF leakage.

Abstract: Heat sinks extending rearward from and connected to the risers of a switchgear assembly by the same fasteners which secure the stabs to the risers dissipate the joule heat generated by current flow through the risers and stabs and accommodate for the higher temperature rise permitted in the power circuit breakers engaged by the stabs. The heat sinks are formed by a pair of heat sink members straddling the risers, each of which has an elongated flat body with an extended flat mounting surface on a first face which provides extended surface engagement with a stab. The elongated body projects rearward beyond the stab and a first set of transverse fins project from the first face rearward of the stab toward the first set of fins on the other heat sink member of the pair.

Abstract: An electronic circuit board assembly and method that enable close stacking and cooling of closely positioned pluralities of similar electronic I/O or memory boards and requiring high speed communication between the boards, such as high speed switching amongst the I/O terminals of the boards or CPU processing, and having an upper and a lower set of similar spaced groups of closely spaced vertical boards; powering terminals aligned along the upper edges of the upper set of boards, and along the lower edges of the lower set of boards, and terminals for connection with a switching fabric disposed along the lower edges of the upper set of boards and the upper edges of the lower set of boards; power backing planes mounted to power and support the lateral edges of the respective sets of groups of boards and extending across the upper and lower sections of the frame; and a plurality of parallel closely spaced vertical switching fabric boards comprising switching fabric (or CPU processing boards) and centrally mounted

Abstract: A device is disclosed for connecting a plurality of capacitors between a first and a second terminal. The device includes a plurality of bus bars located in a parallel spaced apart relationship. A plurality of fasteners fasten the plurality of capacitors between adjacent bus bars. A plurality of shims are interposed between selected bus bars and the first and second terminal for electrically connecting the plurality of capacitors between the first and second terminals.

Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Abstract: The present invention is a mounting structure for a power supply. The mounting structure of the present invention allows power to be coupled from a power supply to a predetermined area on a motherboard adjacent one or more high power demand components, such as an IC microprocessor chip. The mounting structure includes a frame; a plurality of legs attached to the frame for supporting the frame on the motherboard; the ends of the legs opposite the frame being attached to the motherboard; a fastener coupled to the frame for releasably fastening the power supply to the mounting structure such that the power supply is positioned a predefined distance above the upper surface of the motherboard; and a plurality of power buses interconnecting the power supply and the motherboard at predetermined area on the motherboard adjacent a high power demand IC chip.

Abstract: The present invention encompasses a mounting structure on which both a power supply and a integrated circuit (IC) chip module are mounted.

Abstract: An enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material.

Abstract: An interface module for an electronic system that permits signals to pass between a high frequency main circuit board area such as used for central processing units, memories, or other relatively high clock rate components and a low frequency circuit area such as used for standard peripheral circuit modules used for disk drives, video interfaces and the like. The interconnect module is positioned near an opening in a sheet metal bulkhead used as an electromagnetic interference (EMI) barrier around the main circuit area. The interface module uses a connector that is surrounded by one or more conductive shields that contain metal fingers on inboard and outboard sides to provide a ground connection between the interface module and the EMI barrier.

Abstract: The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Abstract: An energy storage system including a housing adapted to rest on a supporting surface. The housing has a plurality of openings formed therein. Each of a predetermined number of the plurality of openings has a door mounted therein. The housing includes a sump, and located inside the housing are one or more racks. Each of the racks is adapted to hold a plurality of energy storing devices. The racks may include sliding shelves or energy storing device access mechanisms which permit each energy storing device to be moved from a first position to a second position. In addition, and optionally, the racks may be mounted on wheels so that they may be moved within the housing in order to provide access to the energy storing devices mounted thereon.

Abstract: The present invention contemplates a significant departure from known shielded enclosure designs by providing an enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material. The present invention further contemplates methods for making shielded enclosures and card guides for such enclosures that represent a significant improvement over known enclosure designs. This invention contemplates composite cold walls and composite fins. These composite fins and cold walls may be used alone or together in structures and enclosures which are useful in conducting heat.

Abstract: A frame stand for a device cabinet which has panels and serves in the installation of component carriers of industrial electronics. Four posts extend between a lower base plate and an identically-configured lid plate. To attach the panels, front brackets and rear brackets project from the base plate and the lid plate; these brackets are aligned with one another, and form recesses for cable harnesses.

Abstract: A telecommunications shelf module is provided having electronic circuit packs and conductors extending from the circuit packs to an interface station for connection to conductors exterior of the pack, the module detachably mountable in a frame. The module preferably has a cooling arrangement included in its structure.

Abstract: In an electronic equipment assembly having a plurality of electronic equipment housings tiered, a horizontal air passageway is formed on the lower surface of each bottom plate of each electronic equipment housing, air ventilation openings being formed on the top plate thereof, vertical ducts open to the horizontal air passageway being formed on the outside of the side plate, the cross section of each vertical duct being the same in shape and size. When two electronic equipment housings are tiered, common vertical ducts are formed, through which heated air can be expelled and cables can be routed.