Abstract: A non-volatile semiconductor memory device, comprising: a non-volatile memory array, storing multi-values by setting a plurality of different threshold voltages for each memory cell, and a control circuit, controlling a write-in operation to the memory cell array. When data have been written into the memory cell, the control circuit selects an adjacent word line, uses an erasing level to perform write-in which is weaker than the data write-in, and verifies soft programming of the amount of one page, such that a narrow-banded erasing level distribution is realized in an adjacent memory cell.

Abstract: A graphics memory device includes a memory array configured to store data for a display device comprising b*y rows by a*x columns of pixels, where b>a. The memory array is arranged in a*y rows by b*x columns of memory locations. Each memory location is adapted to store n-bit image data for one of the pixels of the display device. A memory location remapping circuit is adapted to map image data stored in the b*x columns of memory locations in the memory device to the a*x columns of the display device.

Abstract: Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide.

Abstract: A first bias charge is provided to first bias region at a first level of an electronic device, the first bias region directly underlying a first transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the first transistor is based upon the first bias charge. A second bias charge is provided to second bias region at the first level of an electronic device, the second bias region directly underlying a second transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the second transistor is based upon the second bias charge.

Abstract: A microcontroller system is determining to exit a power saving mode and, in response, enable a reference current source to begin providing a reference current for a memory module. The microcontroller system determines that the reference current has reached a substantial fraction of a target reference current, and, in response to determining that the reference current has reached a substantial fraction of the target reference current, enables the memory module to begin performing one or more memory operations.

Abstract: A semiconductor memory device, a memory system including the same, a method of manufacturing the same and a method of operating the same are provided. The semiconductor memory device includes a pipe channel layer, vertical channel layers coupled to a top surface of the pipe channel layer, a first pipe gate substantially surrounding a bottom surface and side surfaces of the pipe channel layer, a boosting gate formed over the pipe channel layer, and first insulating layers and conductive layers alternately stacked over the boosting gate and the pipe channel layer.

Abstract: A semiconductor memory device, a memory system having the same, and a method of fabricating the same are provided. The semiconductor memory device includes a vertical channel layer protruding from a surface of a substrate, a tunnel insulating layer and a charge storage layer, which are surrounding the vertical channel layer, a blocking layer surrounding the charge storage layer, interlayer insulating layers stacked along the blocking layer, and conductive layers interposed between the interlayer insulating layers. The blocking layer includes a metal oxide layer.

Abstract: The invention relates to a flash memory cell having a FET transistor with a floating gate on a semiconductor-on-insulator (SOI) substrate composed of a thin film of semiconductor material separated from a base substrate by an insulating buried oxide (BOX) layer, The transistor has in the thin film, a channel, with two control gates, a front control gate located above the floating gate and separated from it by an inter-gate dielectric, and a back control gate located within the base substrate directly under the insulating (BOX) layer and separated from the channel by only the insulating (BOX) layer. The two control gates are designed to be used in combination to perform a cell programming operation. The invention also relates to a memory array made up of a plurality of memory cells according to the first aspect of the invention, which can be in an array of rows and columns, and a method of fabricating such memory cells and memory arrays.

Abstract: A bit line is electrically connected to one end of a current path of a memory cell. A word line is commonly connected to the memory cells arranged in a direction intersecting the bit line. A control circuit executes a write operation for applying a write voltage to the word line so shift a threshold voltage of the memory cell to be data written that the threshold voltage of the memory cell to be data written reaches a certain threshold voltage. During the write operation, the control circuit, while applying a gradually rising write voltage to the word line, gradually changes a voltage applied to the bit line based on a relationship between the threshold voltage of the memory cell to be written and a number of times of the write voltage applications.

Abstract: A non-volatile memory device includes a plurality of memory cells stacked along a channel protruded from a substrate, a first select transistor connected to one end of the plurality of memory cells, a first interlayer dielectric layer for being coupled between a source line and the first select transistor, and a second interlayer dielectric layer disposed between the first select transistor and the one end of the plurality of memory cells, and configured to include a first recess region.

Abstract: The semiconductor device includes a memory cell including a first transistor including a first channel formation region, a first gate electrode, and first source and drain regions; a second transistor including a second channel formation region provided so as to overlap with at least part of either of the first source region or the first drain region, a second source electrode, a second drain electrode electrically connected to the first gate electrode, and a second gate electrode; and an insulating layer provided between the first transistor and the second transistor. In a period during which the second transistor needs in an off state, at least when a positive potential is supplied to the first source region or the first drain region, a negative potential is supplied to the second gate electrode.

Abstract: The present invention relates to a nonvolatile memory device and to a method for manufacturing same. According to the present invention, the blocking insulation layer of a nonvolatile memory device having a typical SONOS structure is replaced with a threshold voltage switching material, which changes to a low resistance state only while a voltage greater than a threshold voltage is applied while maintaining a high resistance state under normal conditions and returning to the high resistance state when the applied voltage is removed. The present invention performs a program operation by injecting charges from a gate electrode layer into a charge trap layer through an insulation layer formed of the threshold voltage switching material after applying a voltage pulse greater than the threshold voltage to the gate electrode layer.

Abstract: According to one embodiment, a semiconductor integrated circuit includes nonvolatile memory areas, each includes a first nonvolatile memory transistor, a second nonvolatile memory transistor and an output line, the first nonvolatile memory transistor includes a first source diffusion region, a first drain diffusion region and a first control gate electrode, the second nonvolatile memory transistor includes a second source diffusion region, a second drain diffusion region and a second control gate electrode, the output line connected the first drain diffusion region and the second drain diffusion region, and logic transistor areas, each includes a logic transistor, the logic transistor includes a third source diffusion region, a third drain diffusion region and a first gate electrode.

Abstract: In a read step or a program (write) verification step of a semiconductor memory device, read voltages different from one another are applied to a pair of word lines respectively disposed on both sides of a selected word line to suppress the enlargement of program distribution.

Abstract: According to one embodiment, a non-volatile programmable switch according to this embodiment includes first and second non-volatile memory transistors, and a common node that is connected to the output side terminals of the first and second non-volatile memory transistors, and a logic transistor unit that is connected to the common node. A length of a gate electrode of the first and second non-volatile memory transistors in a channel longitudinal direction is shorter than a length of the charge storage film in the channel longitudinal direction.

Abstract: Memory devices and methods of operating memory devices are shown. Configurations described include a memory cell string having an elongated n type body region and having select gates with p type bodies. Configurations and methods shown can provide a reliable bias to a body region for memory operations such as erasing.

Abstract: Nonvolatile memory devices include a two-dimensional array of nonvolatile memory cells having a plurality of memory cells of unequal size therein. These memory cells may include those that have unequal channel widths associated with respective word lines and those having unequal channel lengths associated with respective bit lines that are connected to corresponding strings of nonvolatile memory cells (e.g., NAND-type strings). Control circuitry is also provided that is electrically coupled to the two-dimensional array of nonvolatile memory cells. This control circuitry may operate to concurrently program first and second nonvolatile memory cells having unequal sizes from an erased state (e.g., logic 1) to an equivalent programmed state (e.g., logic 0).

Abstract: A method begins with a processing module determining a retrieval threshold for retrieving a set of encoded data slices from a dispersed storage network (DSN). The set of encoded data slices represents data encoded using a dispersed storage error encoding function having a number of encoded data slices in the set of encoded data slices equal to or greater than a decode threshold and the retrieval threshold is equal to or greater than the decode threshold. The method continues with the processing module issuing data retrieval requests to the DSN for the set of encoded data slices and receiving encoded data slices of the set of encoded data slices to produce received encoded data slices. The method continues with the processing module decoding the received encoded data slices to recapture the data when a number of received encoded data slices compares favorably to the retrieval threshold.

Abstract: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.

Abstract: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.

Abstract: A nonvolatile memory device includes a memory cell array including a plurality of bitlines, a plurality of wordlines, and a plurality of memory cells. The memory device further includes a plurality of page buffers coupled to the respective bitlines of the memory cell array, each page buffer including a latch configured to store data to be written into and read from a memory cell coupled to a respective bitline of the memory cell array. The memory device further includes a control circuit configured to execute an over-program verify operation which includes detecting an over-programmed memory cell among the plurality of memory cells with reference to pass/fail data stored in the respective latches of the plurality of page buffers, and decreasing a threshold voltage of a detected over-programmed memory cell while maintaining a threshold voltage of memory cells which have not been detected as being over-programmed.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: A data encoding scheme for transmission of data from one circuit to another circuit considers the Hamming Weight of combined multiple words to determine whether to invert or not invert an individual word to be transmitted. The multi-word data encoding scheme performs DBI encoding with data inversion conducted based on the total HW in the combined multiple words. The decision to invert or not invert each of the multiple words is made based on the sum of the individual Hamming Weights of each of the words. Such encoding has the advantage that SSO noise is dramatically reduced when the encoded data has a large number of words transmitted from one circuit to another circuit over a wide parallel bus.

Abstract: The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is formed on or in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.

Abstract: According to an aspect of the present invention, there is provided, a nonvolatile semiconductor storage device including: a substrate; a stacked portion that includes a plurality of conductor layers and a plurality of insulation layers alternately stacked on the substrate, at least one layer of the plurality of conductor layers and the plurality of insulation layers forming a marker layer; a charge accumulation film that is formed on an inner surface of a memory plug hole that is formed in the stacked portion from a top surface to a bottom surface thereof; and a semiconductor pillar that is formed inside the memory plug hole through the charge accumulation film.

Abstract: According to one embodiment, there is provided a fusion memory including a first memory cell array formed of a NAND cell unit and a second memory cell array formed of a DRAM cell on a semiconductor substrate. The NAND cell unit is formed of a non-volatile memory cell having a two-layer gate structure in which a first gate and a second gate are stacked, and a selective transistor connecting the first and second gates of the non-volatile memory cell. The DRAM cell is formed of a cell transistor having a structure same as the structure of the selective transistor, and a MOS capacitor having a structure same as the structure of the non-volatile memory cell or the selective transistor.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

Abstract: This invention provides a 3D stacked NAND flash memory array and operation method thereof enabling to operate by LSM (a layer selection by multi-level operation) and to get rid of the waste of unnecessary areas by minimizing the number of SSLs needed for a layer selection though the number of layers vertically stacked is increased.

Abstract: Memory devices and methods of operating memory devices are shown. Configurations described include a memory cell string having an elongated n type body region and having select gates with p type bodies. Configurations and methods shown can provide a reliable bias to a body region for memory operations such as erasing.

Abstract: A vertical memory device may include a substrate, a first selection line on the substrate, a plurality of word lines on the first selection line, a second selection line on the plurality of word lines, and a semiconductor channel. The first selection line may be between the plurality of word lines and the substrate, and the plurality of word lines may be between the first and second selection lines. Moreover, the first and second selection lines and the plurality of word lines may be spaced apart in a direction perpendicular with respect to a surface of the substrate. The semiconductor channel may extend away from the surface of the substrate adjacent sidewalls of the first and second selection lines and the plurality of word lines. In addition, portions of the semiconductor channel adjacent the second selection line may be doped with indium and/or gallium. Related methods are also discussed.

Abstract: Embodiments relate to a two-transistor (2T) floating-body cell (FBC) for embedded-DRAM applications. Further embodiments pertain to a floating-body/gate cell (FBGC), which yields reduction in power dissipation, in addition to better signal margin, longer data retention, and higher memory density.

Abstract: A circuit is configured to supply a first gate voltage (PG1) at a first voltage bias (VP1) to a source of a first transistor providing an output (WLS), providing the first voltage bias (VP1) to a second transistor and supplying a second voltage bias (VN1) and a second gate voltage (NG1) to a third transistor, the second transistor coupled in series to the third transistor and in parallel with the first transistor, to supply a third voltage bias (VP2) and a third gate voltage (PG2) to a fourth transistor, and a fourth voltage bias (VN2) and a fourth gate voltage (NG2) to a fifth transistor, the fourth transistor coupled in series to the fifth transistor, and the fourth and fifth transistors coupled to a gate of the second transistor, and to provide a fifth voltage bias (VN3) to a line connecting the third transistor to the fifth transistor.

Abstract: According to one embodiment, a nonvolatile memory device includes a substrate, a first electrode, a second electrode, a third electrode, a first memory portion and a second memory portion. The first electrode extends in a first direction and is provided on the substrate. The second electrode extends in a second direction crossing the first direction and is provided on the first electrode. The third electrode extends in a third direction crossing the second direction and is provided on the second electrode. The first memory portion is provided between the first and the second electrodes and has a first oxygen composition ratio and a first layer thickness. The second memory portion is provided between the second and the third electrodes and has at least one of a second oxygen composition ratio different from the first oxygen composition ratio and a second layer thickness different from the first layer thickness.

Abstract: In a semiconductor layer, information is written by applying a first potential to a first electrode, applying a second potential that is lower than the first potential to all of back gate electrodes, applying a third potential that is higher than the first potential to the first to (i?1)th front gate electrodes, and applying a fourth potential that is between the second and third potentials to the ith and subsequent front gate electrodes, where “i” is a positive integer and identifies a specific location to which information is to be written.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation.

Abstract: A localized trapping multi-level memory cell operating method includes the following steps. First, a localized trapping memory cell with the initial threshold voltage of approximately 2.5V is provided. Next, an erasing operation is performed to obtain a negative threshold level having uniform charge distribution along the channel region. Taking into account the over-erasure issue in the erasing operation, a programming operation is performed to precisely adjust the threshold voltage to a predetermined level of ?2V to ?1V. Then, with this negative voltage as a new initial state, a corresponding programming operation is performed and electrons are locally injected into the storage layer. By controlling the quantity of injected electrons, the MLC storage is achieved.

Abstract: A nonvolatile semiconductor memory device includes an MIS transistor having nodes, a control circuit configured to apply a first set of potentials to the nodes to cause an irreversible change in transistor characteristics, to apply a second set of potentials to the nodes to cause a first current to flow through the MIS transistor in a first direction, and to apply the second set of potentials to the nodes to cause a second current to flow through the MIS transistor in a second direction opposite the first direction, and a sense circuit configured to produce a signal responsive to a difference between the first current and the second current.

Abstract: A method begins by a processing module determining a retrieval threshold for retrieving a set of encoded data slices from a dispersed storage network (DSN), wherein the set of encoded data slices represents data encoded using a dispersed storage error encoding function having a pillar width of “n”, a decode threshold of “k”, and an encoding ratio of n?k>k and wherein the retrieval threshold is in accordance with the encoding ratio. The method continues with the processing module issuing data retrieval requests to the DSN for the set of encoded data slices and receiving encoded data slices of the set of encoded data slices to produce received encoded data slices. The method continues with the processing module decoding the received encoded data slices to recapture the data when a number of received encoded data slices compares favorably to the retrieval threshold.

Abstract: A three-dimensional semiconductor device includes stacked structures arranged two-dimensionally on a substrate, a first interconnection layer including first interconnections and disposed on the stacked structures, and a second interconnection layer including second interconnections and disposed on the first interconnection layer. Each of the stacked structures has a lower region including a plurality of stacked lower word lines, and an upper region including a plurality of stacked upper word lines disposed on the stack of lower word lines. Each of the first interconnections is connected to one of the lower word lines and each of the second interconnections is connected to one of the upper word lines.

Abstract: A semiconductor device according to an embodiment includes: a first transistor including a gate connected to a first interconnection, a first source, and a first drain, one of the first source and the first drain being connected to a second interconnection; and a second transistor including a gate structure, a second source, and a second drain, one of the second source and second drain being connected to a third interconnection and the other of the second source and second drain being connected to a fourth interconnection. The gate structure includes a gate insulation film, a gate electrode, and a threshold-modulating film provided between the gate insulation film and the gate electrode to modulate a threshold voltage, the other of the first source and first drain of the first transistor is connected to the gate electrode.

Abstract: A nonvolatile semiconductor memory device of the charge trap type is initialized by reading the memory cells in the device to determine which charge traps hold less than a predetermined minimum charge and injecting charge into these charge traps until all of the charge traps in the device hold at least the predetermined minimum charge. The charge traps are then programmed selectively with data. The initialization procedure shortens the programming procedure by narrowing the initial distribution of charge in the charge traps, and leads to more reliable reading of the programmed data.

Abstract: Memory devices and methods of operating memory devices are shown. Configurations described include a memory cell string having an elongated n type body region and having select gates with p type bodies. Configurations and methods shown can provide a reliable bias to a body region for memory operations such as erasing.

Abstract: The non-volatile storage system predicts which blocks (or other units of storage) will become bad based on performance data. User data in those blocks predicted to become bad can be re-programmed to other blocks, and the blocks predicted to become bad can be removed from further use.

Abstract: According to one embodiment, a semiconductor memory device includes a stacked body, a semiconductor pillar, a charge storage layer, a tunneling layer, a dividing trench and a first heating unit. The stacked body includes a plurality of first insulating films stacked alternately with a plurality of electrode films. The semiconductor pillar pierces the stacked body. The charge storage layer is provided between the electrode films and the semiconductor pillar. The tunneling layer is provided between the charge storage layer and the semiconductor pillar. The dividing trench is provided between the semiconductor pillars in one direction orthogonal to a stacking direction of the stacked body to divide the electrode films. The first heating unit is provided in an interior of the dividing trench.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a charge storage film and a memory cell transistor. The transistor is provided for each of storage regions configured to store charge in the film.

Abstract: A system embodiment comprises a nonvolatile memory device, a memory, and a controller. The nonvolatile memory device includes a plurality of nonvolatile memory cells. Each nonvolatile memory cell is adapted to store at least two bits. The memory is adapted to store a program when the system powers up. The controller is adapted to implement the program to provide instructions used to program and erase nonvolatile memory cells. A method embodiment comprises loading a program into memory upon powering up a memory system, and implementing the program using a controller, including programming and erasing multi-bit nonvolatile memory cells.

Abstract: Some embodiments include memory cells which have channel-supporting material, dielectric material over the channel-supporting material, carrier-trapping material over the dielectric material and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. Some embodiments include methods of storing information. A memory cell to is provided which has a channel-supporting material, a dielectric material over the channel-supporting material, a carrier-trapping material over the dielectric material, and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. It is determined if carriers are trapped in the carrier-trapping material to thereby ascertain a memory state of the memory cell.

Abstract: According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.

Abstract: According to an aspect of the present invention, it is provided: a nonvolatile semiconductor memory device comprising: a plurality of bit lines arranged in a first direction; a plurality of source lines arranged in the first direction, the plurality of source lines being parallel to the plurality of bit lines, the plurality of source lines being distinct from the plurality of bit lines; a plurality of memory gate lines arranged in a second direction perpendicular to the first direction; a plurality of memory cells arranged in a matrix, each of the plurality of memory cells including a p type MIS nonvolatile transistor having a first terminal, a second terminal, a channel between the first terminal and the second terminal, a gate insulation film formed on the channel, a gate electrode connected to one corresponding memory gate line of the plurality of memory gate lines, and a carrier storage layer formed between the gate insulation film and the gate electrode, the first terminal being connected to one correspo

Abstract: An embodiment of the invention relates to a memory comprising a strained double-heterostructure having an inner semiconductor layer which is sandwiched between two outer semiconductor layers, wherein the lattice constant of the inner semiconductor layer differs from the lattice constants of the outer semiconductor layers, the resulting lattice strain in the double-heterostructure inducing the formation of at least one quantum dot inside the inner semiconductor layer, said at least one quantum dot being capable of storing charge carriers therein, and wherein, due to the lattice strain, the at least one quantum dot has an emission barrier of 1.15 eV or higher, and provides an energy state density of at least three energy states per 1000 nm3, all said at least three energy states being located in an energy band of 50 meV or less.