Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells each connected to word lines. The memory cells are disposed in strings and configured to retain a threshold voltage corresponding to data states. A control means is configured to apply verification pulses of program verify voltages each associated with one of the data states to selected ones of the word lines to determine whether the memory cells connected thereto have the threshold voltage above each of the program verify voltages targeted for each of the memory cells during a program-verify portion of a program operation. The control means is also configured to trim the program verify voltages for each of the data states for a grouping of the memory cells based on quantities of the memory cells having the threshold voltage crossing over between the data states in crossovers in a verify level trimming process.

Abstract: A non-volatile semiconductor memory device, described herein, comprises non-volatile storage elements and one or more control circuits in communication with the non-volatile storage elements. The one or more control circuits are configured to, during a program iteration of a program operation, determine whether a program voltage level of the program iteration exceeds a threshold program voltage level and in response to the determination, identify a set of voltage levels to apply to a source line connected to a set of the non-volatile storage elements. The one or more control circuits are further configured to perform the program iteration of the program operation on the set of non-volatile storage elements, where the program iteration includes applying the set of voltage levels to the source line.

Abstract: A method includes determining that a ratio of valid data portions of a block of memory cells is greater than or less than a valid data portion threshold and performing a first media management operation on the block of memory cells in response to determining that the ratio of valid data portions is greater than the valid data portion threshold. The method further includes performing a second media management operation on the block of memory cells in response to determining that the ratio of valid data portions is less than the valid data portion threshold.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines. The memory cells are disposed in strings and are configured to retain a threshold voltage corresponding to data states. A control means is configured to apply verification pulses of program verify voltages each associated with one of the data states to selected ones of the word lines to determine whether the memory cells connected thereto have the threshold voltage above each of the program verify voltages associated with the data states targeted for each of the memory cells being programmed during verify loops of a program-verify operation. The control means slows the memory cells targeted for a selected one of the data states identified as being faster to program than other ones of the memory cells during one of verify loops associated with an earlier one of data states.

Abstract: A plurality of memory programming the memory cells to at least one programmed data state in a plurality of program-verify iterations. In each iteration, after a programming pulse, a sensing operation is conducted to compare the threshold voltages of the memory cells to a low verify voltage associated with a first programmed data state and to a high very voltage associated with the first programmed data state. The sensing operation includes discharging a sense node through a bit line coupled to one of the memory cells and monitoring a discharge time of the sense node. At least one aspect of the sensing operation is temperature dependent so that a voltage gap between the high and low verify voltages is generally constant across a range of temperatures.

Abstract: Apparatuses and techniques are described for reducing the number of latches used in sense circuits for a memory device. The number of internal user data latches in a sense circuit is reduced by using an external data transfer latch to store a bit of user data, in place of an internal user data latch. The user data in the data transfer latches identifies a subset of the data states which are not prohibited from having a verify test. The subset is shifted as the program operation proceeds, at specified program loops, to encompass higher data states. The completion of programming by a memory cell is indicated by the user data latches and another internal latch of the sense circuit in place of the external data transfer latch.

Abstract: A memory sub-system to receive a request to execute a read operation associated with data of a memory unit of a memory sub-system. A time after program associated with the data is determined. A temperature level associated with the memory unit is determined. Based on the time after program and the temperature level, a set of read offset values to apply in executing the read operation is determined. The read operation is executed using the set of read offset values.

Abstract: A semiconductor memory device includes a memory cell array, a peripheral circuit, and a control logic. The memory cell array includes a plurality of memory cells. The peripheral circuit performs a program operation on selected memory cells among the plurality of memory cells. The control logic controls the program operation of the peripheral circuit. The program operation includes a plurality of program loops. The control logic is configured to control the peripheral circuit to apply a program voltage to a select word line that is connected to the selected memory cells, apply a first under drive voltage that is determined based on at least one verify voltage to the select word line, and apply the at least one verify voltage to the select word line in each of the plurality of program loops. The first under drive voltage is at a lower voltage level than the at least one verify voltage.

Abstract: Provided herein is a memory device and a method of operating the memory device. The memory device includes a memory cell array including a plurality of memory cells, a peripheral circuit configured to perform a program operation for storing data in selected memory cells among the plurality of memory cells, and a control logic circuit configured to control the peripheral circuit to form threshold voltage distributions corresponding to target program states corresponding to the data to be stored in the selected memory cells, respectively, wherein the control logic controls the peripheral circuit to perform a main verify operation for any one of the target program states of the selected memory cells when a pre-verify operation for the any one of the target program states has passed.

Abstract: In a method for reading a memory device including a first memory cell string, in a pre-verify stage, a first verify voltage is applied on a gate terminal of a selected memory cell of the first memory cell string, where the selected memory cell is programmed and arranged between a first adjacent memory cell and a second adjacent memory cell. A first bias voltage is applied on a gate terminal of at least one memory cell of the first memory cell string that is not programmed. In a verify stage, a second verify voltage is applied on the gate terminal of the selected memory cell of the first memory cell string. A second bias voltage is applied on the gate terminal of the at least one memory cell of the first memory cell string that is not programmed, where the second bias voltage is smaller than the first bias voltage.

Abstract: A memory is provided. The memory includes banks, each bank includes a U half bank and a V half bank; a first error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of output data of the U half banks and the V half banks; and a second error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of the output data of the U half banks and the V half banks.

Abstract: An operating method of a non-volatile memory device comprises: performing a foggy operation applying a first application voltage to a word line and applying a first verification voltage having a same level as or a higher level than a target threshold voltage to the word line, determining whether the foggy operation is completely performed according to whether a number of memory cells each having a threshold voltage higher than the first verification voltage is equal to or greater than a first number, performing a fine operation applying a second application voltage to the word line and applying a second verification voltage having the same level as the target threshold voltage, and determining whether the fine operation is completely performed, according to whether a number of memory cells each having a threshold voltage lower than the second verification voltage is less than or equal to a second number.

Abstract: A semiconductor memory device according to an embodiment includes memory cell transistors, a word line, and a controller. A memory cell transistor whose threshold voltage is included in first and second states store first and second data, respectively. In a verify operation of the first data, during application of a verify high voltage of the first data to the word line, the controller is configured to determine whether or not a threshold voltage of a memory cell transistor to which the first data is to be written exceeds the verify high voltage of the first data, and also determine whether or not a threshold voltage of a memory cell transistor to which the second data is to be written exceeds a verify low voltage of the second data.

Abstract: A semiconductor storage device in an embodiment includes a plurality of planes each including a memory cell array, a voltage generation circuit configured to apply a first intermediate voltage to an adjacent word line adjacent to a selected word line in a former half of a program period and apply a second intermediate voltage higher than the first intermediate voltage to the adjacent word line in a latter half of the program period, a discharge circuit configured to feed a discharge current from the selected word line in a period corresponding to a period in which the second intermediate voltage is applied to the adjacent word line, and a control circuit configured to set a discharge characteristic of the discharge circuit according to a number of the planes.

Abstract: A reading and writing method for a memory device and a memory device are provided. The memory device includes a memory chip. The reading and writing method of the memory device includes that: during operation of the memory chip, the temperature of the memory chip is measured, and a writing recovery time of the memory chip is adjusted according to the temperature.

Abstract: A programming pulse is caused to be applied to a wordline associated with a memory cell of the memory sub-system. A program verify operation is caused to be performed on the memory cell to determine that a measured threshold voltage associated with the memory cell. The measured threshold voltage associated with the memory cell is stored in a sensing node associated with the memory cell. A bitline voltage matching the measured threshold voltage is caused to be applied to a bitline associated with the memory cell to reduce a rate of programming associated with the memory cell.

Abstract: A processing device in a memory sub-system monitors a temperature associated with a block of a memory device, the block comprising a plurality of wordlines. The processing device further determines a first amount of time between when memory cells associated with a first wordline of the plurality of wordlines of the block were written and when memory cells associated with a last wordline of the plurality of wordlines of the block were written. That first amount of time is normalized according to the temperature associated with the block. The processing device further determines, based at last in part on the first amount of time and on an associated scaling factor, an estimate of when the block will reach a uniform charge loss state.

Abstract: A memory device may include a plurality of memory cells, a plurality of word lines, and a plurality of bit lines. The memory device may determine, when programming a first memory cell among the plurality of memory cells to a target program state, a precharge time based on a number of times that a program voltage is applied to a first word line connected to the first memory cell among the plurality of word lines, and may precharge the plurality of bit lines during the precharge time when executing a verify operation on the first memory cell.

Abstract: A memory device that dynamically adjusts the sense time to read an open block of a memory block is disclosed. The adjusted sense time is based upon various considerations, including the sense time of the closed block equivalent and the openness of the open block. This allows the memory device to maintain a fixed Vt as well as reduce failed bit count, i.e., read errors due to an insufficient sense time. Also, the dynamic adjustment of sense time can optimize system performance and increase efficiency.

Abstract: According to one embodiment, a memory device includes: a memory cell including a memory element and a switching element; and a circuit that applies a first write pulse having a first polarity to the memory cell at the time of writing first data in the memory cell and applies a second write pulse having a second polarity different from the first polarity to the memory cell at the time of writing second data in the memory cell. The switching element has polarity dependence according to the first and second polarities.

Abstract: When erasing multiple sub-blocks of a block, erase verify is performed for memory cells connected to even word lines to generate even results and for memory cells connected to odd word lines to generate odd results. The even results and the odd results are used to determine that the erase verify process successfully completed. For each NAND string of a first sub-block, a last even result for the NAND string is compared to a last odd result for the NAND string. Despite the determination that the first sub-block successfully completed erase verify, the erasing failed for the first sub-block because the number of NAND strings that have the last even result different than the last odd result is greater than a limit. The system determines that one or more additional sub-blocks also failed erasing based on and in response to determining that the first sub-block failed erasing.

Abstract: A memory system includes a semiconductor memory device having memory cells arranged in rows and columns, and a controller configured to issue a write command with or without a partial page program command to the semiconductor memory device. The semiconductor memory device, in response to the write command issued without the partial page command, executes a first program operation on a page of memory cells and then a first verify operation on the memory cells of the page using a first verify voltage for all of the memory cells of the page, and in response to the write command issued with the partial page command, executes a second program operation on a subset of the memory cells of the page and then a second verify operation on the memory cells of the subset using one of several different second verify voltages corresponding to the subset.

Abstract: A memory device includes a memory array of memory cells and control logic, operatively coupled with the memory array. The control logic is to perform operations, which include causing the memory cells to be programmed with an initial voltage distribution representing multiple logical states; causing the memory cells to be programmed with a subsequent voltage distribution representing a subset of the multiple logical states at a higher voltage than that of the initial voltage distribution, wherein the subset of the multiple logical states is compacted above a program verify voltage level for the subsequent voltage distribution; and causing a first program verify operation of the subsequent voltage distribution to be performed on the memory cells to verify one or more voltage levels of the subsequent voltage distribution.

Abstract: A sense amplifier is provided. A first terminal of a first invertor is connected to a power node and a second terminal of the first invertor is connected to a cell current source. A first terminal of a second invertor is connected to the power node and a second terminal of the second invertor is connected to a reference current source. The first invertor is cross coupled with the second invertor at a first node and a second node. A pre-charge circuit is connected to the first node and the second node. A first pull up transistor and a second pull up transistor are connected between a supply voltage node and the power node. A signal level detector circuit is connected to the second pull up transistor. The signal level detector circuit switches on the second pull up transistor when a remaining voltage on one of the first node and the second node is below a reference voltage.

Abstract: A method of programing a memory device having a plurality of memory cell groups where each of the memory cell group includes N non-volatile memory cells, where N is an integer greater than or equal to 2. For each memory cell group, the method includes programming each of the non-volatile memory cells in the memory cell group to a particular program state, performing multiple read operations on each of the non-volatile memory cells in the memory cell group, identifying one of the non-volatile memory cells in the memory cell group that exhibits a lowest read variance during the multiple read operations, deeply programming all of the non-volatile memory cells in the memory cell group except the identified non-volatile memory cell, and programming the identified non-volatile memory cell in the memory cell group with user data.

Abstract: Systems and methods for improving the reliability of non-volatile memory by reducing the number of memory cell transistors that experience excessive hole injection are described. The excessive hole injection may occur when the threshold voltage for a memory cell transistor is being set below a particular negative threshold voltage. To reduce the number of memory cell transistors with threshold voltages less than the particular negative threshold voltage, the programmed data states of the memory cell transistors may be reversed such that the erased state comprises the highest data state corresponding with the highest threshold voltage distribution. To facilitate programming of the memory cell transistors with reversed programmed data states, a non-volatile memory device structure may be used in which the bit line connections to NAND strings comprise direct poly-channel contact to P+ silicon and the source line connections to the NAND strings comprise direct poly-channel contact to N+ silicon.

Abstract: A method of detecting, by a nonvolatile memory system, a defective memory cell block from among memory cell blocks, includes performing, after performing an erase operation, a read operation on at least some memory cells included in a target memory cell block based on an off-cell detection voltage that is different from a read reference voltage that distinguishes an off-cell on which no data is written from an on-cell on which data is written; counting a number of hard off-cells having a higher threshold voltage than the off-cell detection voltage from among the memory cells based on a result of performing the read operation; and identifying whether the target memory cell block is a defective memory cell block based on the number of counted hard off-cells.

Abstract: According to one configuration, a monitor resource monitors conveyance of content streaming over a shared communication link between a server resource and a communication device, the communication device requesting segments of the content from a manifest file. Monitoring as described herein can include intercepting and inspecting data packets associated with conveyance of the content over the shared communication link. An analyzer resource analyzes bandwidth attributes of streaming the content over the shared communication link. Based on the attributes of streaming the content (such as bandwidth, adaptive bit rate, etc.) over the shared communication link, the monitor resource generates a report indicating a link quality provided to the communication device via the shared communication link conveying the stream of content.

Abstract: A memory device includes a page buffer circuit including a plurality of page buffer stages each including a plurality of page buffers. The memory device also includes a control circuit configured to generate page buffer control signals for controlling the plurality of page buffers. The control circuit is also configured to probe each of a plurality of page buffer control signal groups configured with the page buffer control signals through a probing path corresponding to each of the plurality of page buffer control signal groups.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell and a first boosting circuit. The first boosting circuit generates a first voltage, a second voltage, and a third voltage lower than the second voltage at a first output terminal. The first, second and third voltages is used for a write operation. The write operation includes a first program operation and a first verify operation executed after the first program operation. The first boosting circuit generates the first voltage at the first output terminal during the first program operation, generates the third voltage at the first output terminal at end of the first program operation, generates the second voltage at the first output terminal during the first verify operation, and then generates the first voltage to the first output terminal during the first verify operation.

Abstract: According to a certain embodiment, the nonvolatile semiconductor memory device includes: a memory cell array including a plurality of selected blocks and a plurality of non-selected blocks; and a row decoder including a block decoder configured to switch between the selected block and the non-selected block. The row decoder switches a block determined to be a defective block to a non-selected block and switches a block determined not to be a defective block to a selected block, on the basis of the multi-level data. The block decoder includes a defective block flag circuit including a plurality of latch circuits configured to store multi-level data.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. The peripheral circuit is configured to program a row of memory cells using a first program voltage and verify the programmed row of memory cells using a verify voltage and a sample voltage smaller than the verify voltage. The peripheral circuit is also configured to obtain a first number of memory cells of the programmed row of memory cells based on the sample voltage. The peripheral circuit is further configured to predict, based on the first number of memory cells and the sample voltage, a second number of memory cells of the programmed row of memory cells that fail to pass the verification.

Abstract: Systems and methods for adapting garbage collection (GC) operations in a memory device to an estimated device age are discussed. An exemplary memory device includes a memory controller to track an actual device age, determine a device wear metric using a physical write count and total writes over an expected lifetime of the memory device, estimate a wear-indicated device age, and adjust an amount of memory space to be freed by a GC operation according to the wear-indicated device age relative to the actual device age. The memory controller can also dynamically reallocate a portion of the memory cells between a single level cell (SLC) cache and a multi-level cell (MLC) storage according to the wear-indicated device age relative to the actual device age.

Abstract: A memory device, including a plurality of planes, includes a mode setting component to set an operation mode of the memory device as a verify pass mode to allow a verify operation, performed in the plurality of planes, to forcibly pass; and a verify signal generator for outputting a verify pass signal signaling that the verify operation has passed for each of the plurality of planes.

Abstract: A memory device includes a voltage generator that provides a read voltage to a selected word line and provides a pass voltage to a plurality of unselected word lines, and a deterioration level detection circuit. The selected word line and the unselected word lines are connected to a plurality of memory cells. The deterioration level detection circuit detects a deterioration level of memory cells connected to the selected word line based on data of memory cells that receive the read voltage. The memory cells connected to the selected word line and the memory cells that receive the read voltage are included in the plurality of memory cells. The voltage generator changes the pass voltage provided to the unselected word lines based on the deterioration level.

Abstract: A non-volatile memory device includes a memory cell array including memory cells, a page buffer circuit including page buffers respectively connected to bit lines, a buffer memory, and a control logic configured to control a read operation on the memory cells. In the read operation, the control logic obtains valley search detection information including read target block information and word line information by performing a valley search sensing operation on a distribution of threshold voltages of the memory cells, obtains a plurality of read levels using a read information model by inputting the valley search detection information into the read information model, and performs a main sensing operation for the read operation.

Abstract: A three-dimensional (3D) memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second sets of memory layers. The 3D memory device may further include a peripheral circuit that includes a word line (WL) driving circuit configured to when programming a first memory layer of the first set of memory layers, apply a first pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the first memory layer, and when programming a second memory layer of the first set of memory layers located above the first memory layer, apply a second pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the second memory layer. The first pre-charge voltage may be larger than the second pre-charge voltage.

Abstract: Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A method includes determining that a first programming pass of a programming operation has been performed on a memory cell of the memory component, and performing a dynamic program targeting (DPT) operation on the memory cell to calibrate a first program-verify (PV) target value that results in an adjustment to a placement of a first first-pass programming distribution and a second PV target value that results in an adjustment to a placement of a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Abstract: A semiconductor memory device includes a memory block, a peripheral circuit, and control logic. The memory block includes a plurality of string groups respectively connected to a corresponding source select line among a plurality of source select lines. The peripheral circuit is configured to perform a program operation of storing data within the memory block. The control logic controls the program operation of the peripheral circuit. The plurality of source select lines are grouped into a plurality of source select line groups. The control logic controls the peripheral circuit to increase a voltage of a first source select line group including a source select line connected to a selected string group to a first level among the plurality of source select line groups.

Abstract: In a method of counting the number of memory cells in a nonvolatile memory device, a measurement range and a plurality of measurement intervals of a measurement window for a cell counting operation are set to a first range and a plurality of first intervals, respectively. The plurality of measurement intervals are included in the measurement range. A first sensing operation is performed on first memory cells included in a first region of a memory cell array based on the measurement window. A first shifting operation for shifting the measurement window is performed while a width of the measurement range and a width of each of the plurality of measurement intervals are maintained. A second sensing operation is performed on the first memory cells based on the measurement window shifted by the first shifting operation. A final count value for the first memory cells is obtained based on a result of the first sensing operation and a result of the second sensing operation.

Abstract: An apparatus includes a plurality of solid-state storage elements, a plurality of control lines coupled to the plurality of solid-state storage elements, and control circuitry in communication with the plurality of control lines. The control circuitry is configured to during a first phase of a control line pre-charging stage, charge one or more unselected control lines of the plurality of control lines using a regulated charging current for a period of time based at least in part on a predicted parasitic capacitance associated with the programming state of the control lines, and during a second phase of the control line pre-charging stage, charge the one or more unselected bit lines to an inhibit voltage level using an unregulated charging current.

Abstract: A memory device includes a plurality of memory cell strings, a peripheral circuit, and control logic. The plurality of memory cell strings are connected between a bit line and a common source line. The peripheral circuit is configured to perform a channel precharge operation and a program operation for the plurality of memory cell strings. The control logic is configured to control the peripheral circuit to apply a pass voltage to a selected word line among a plurality of word lines connected to the plurality of memory cell strings and to apply a turn-on voltage to a source select line connected to the plurality of memory cell strings, during a portion of a period in which the pass voltage is applied to the selected word line, in the program operation.

Abstract: According to one embodiment, a non-volatile memory includes a plurality of groups and a memory controller configured to execute a first operation. Each of the plurality of groups includes a plurality of cell units. Each of the plurality of cell units includes a plurality of memory cells. The first operation includes: based on a first correction amount associated with a target group, reading data from the target group; and updating the first correction amount to a second correction amount based on the data. The memory controller is configured to: select a first group as the target group; and when a condition is satisfied, select a second group as the target group after performing the first operation related to the first group.

Abstract: A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Abstract: A semiconductor memory device includes a memory block and a peripheral circuit. The memory block includes normal pages and buffer pages. Each of the normal pages includes memory cells that store the N bits of data. Each of the buffer pages includes memory cells that store one bit of data. The peripheral circuit receives a first page data and performs a single level cell (SLC) program on the first page data in a first buffer page. In addition, the peripheral circuit receives a second page data and performs the SLC program on the second page data in a second buffer page. In addition, the peripheral circuit performs a multiple-level program operation on a normal page based on the first and second page data programmed in the first and second buffer page, respectively.

Abstract: The memory device may include a plurality of memory cells, a peripheral circuit, and a control logic. The peripheral circuit may perform a program operation on the plurality of memory cells and may perform program verify operations each including at least one verify loop corresponding to a plurality of program states programmed in the program operation. The control logic may control the peripheral circuit to perform a verify pulse apply operation and an additional verify pulse apply operation when a target verify loop count exceeds a reference count corresponding to the target program state, and may determine a failure of the program verify operation corresponding to the target program state based on results of the verify pulse apply operation and the additional verify pulse apply operation. A verify voltage of the additional verify pulse apply operation is higher than a verify voltage of the verify pulse apply operation.

Abstract: A method of verifying the programming of a plurality of memory cells in a data storage system includes performing a setup operation including settling of bit lines associated with the subset of memory cells; performing a sensing operation including subjecting the settled bit lines to a verify voltage signal; and performing first and second latching operations identifying memory cells of the subset of memory cells having threshold voltages that meet first and second verify reference voltages, where the first and second latching operations are part of the same program verify operation with no setup time between them.

Abstract: A nonvolatile memory device comprising: a cell string comprising a plurality of memory cells, a bit line coupled to the cell string, and a page buffer suitable for precharging the bit line, a first sensing node and a second sensing node to a preset level in a first period, and double-sensing the bit line through the first and second sensing nodes in a second period, wherein the page buffer comprises: a first coupling unit suitable for coupling the bit line and the first sensing node, a second coupling unit suitable for coupling the first and second sensing nodes, and controlling the first and second sensing nodes to have a voltage level interval according to a preset ratio in the second period, a first and second latch units suitable for latching a logic levels corresponding to a voltage levels of the first and second sensing nodes, respectively.

Abstract: A memory device and a method of operating the same are provided. The memory device may include a peripheral circuit configured to perform a plurality of program loops and program a page selected from among the plurality of pages, wherein the peripheral circuit may count a number of memory cells whose threshold voltages have increased up to a first target voltage, among a part of memory cells included in the selected page, and may perform a current sensing check operation of determining whether a verify operation performed in a previous program loop has passed or failed, and a control logic circuit configured to control the peripheral circuit so that the current sensing check operation is performed when the number of memory cells whose threshold voltages have increased up to the first target voltage, is equal to or greater than a reference number of memory cells.

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.