Abstract: Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.

Abstract: A method, circuit arrangement, and design structure utilize a lock prediction data structure to control ownership of a cache line in a shared memory computing system. In a first node among the plurality of nodes, lock prediction data in a hardware-based lock prediction data structure for a cache line associated with a first memory request is updated in response to that first memory request, wherein at least a portion of the lock prediction data is predictive of whether the cache line is associated with a release operation. The lock prediction data is then accessed in response to a second memory request associated with the cache line and issued by a second node and a determination is made as to whether to transfer ownership of the cache line from the first node to the second node based at least in part on the accessed lock prediction data.

Abstract: An integrated circuit can include an input/output (I/O) bank. The I/O bank can include a plurality of byte clock groups. Each byte clock group can include at least one phaser configured to clock circuit elements of the byte clock group at a frequency at which a source synchronous device coupled to the byte clock group communicates data.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded bit to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: A capacity and density enhancement circuit for a sub-threshold memory unit array which can decrease the drain current in the bit lines and enhance the pull-up capability of memory cells. The capacity and density enhancement circuit is composed of a first enhancement transistor, a second enhancement transistor, a first mask transmission gate, a second mask transmission gate, a first logic memory capacitor and a second logic memory capacitor.

Abstract: A system including a controller and a memory chip. The controller includes first and second selection signal terminals supplying first and second selection signals, respectively, multiple first data terminals and multiple second data terminals. The memory chip includes a semiconductor substrate, third and fourth selection signal terminals provided on the semiconductor substrate and electrically coupled to the first and second selection signal terminals of the controller, respectively. Multiple third data terminals are provided on the semiconductor substrate and electrically coupled to the first data terminals of the controller, respectively. Multiple fourth data terminals are provided on the semiconductor substrate and electrically coupled to the second data terminals of the controller, respectively. The first and third data terminals communicate first data in response to the first selection signal. The second and fourth data terminals communicate second data in response to the second selection signal.

Abstract: Approaches to organizing/constructing a register file base cell in a way that reduces the number of signals which need to be routed to and through the bit base cell are disclosed. Base cells so constructed allow industry standard static timing approaches and tools to verify the timing of a register file comprised of such base cells as a whole and allow industry standard place-and-route (APR) tools to be used to implement the connections between the base cells and the other register file logic not directly included in the base cell.

Abstract: A semiconductor memory device includes a plurality of memory regions formed on one chip, each of the memory regions having a plurality of volatile memory cells that are formed with a density or capacity of 2?K bits, where K is an integer greater than or equal to 0, and a plurality of input/output (I/O) terminals for inputting and outputting data of the volatile memory cells, and at least one peripheral region that controls a write operation for writing data into the memory regions and a read operation for reading data from the memory regions based on a command and an address input from outside. Thus, a total or entire density of the memory regions corresponds to a non-standard (or ‘interim’) density so that the semiconductor memory device may have an interim density.

Abstract: A system and method to read and write data at a memory cell that includes multiple non-volatile memories is disclosed. In a particular embodiment, a memory device is disclosed that includes a plurality of memory cells, where at least one of the memory cells comprises a first non-volatile memory including a first resistive memory element and a second multi-port non-volatile memory including a second resistive memory element.

Abstract: Disclosed are a semiconductor device capable of testing memory cells and a test method. The semiconductor device includes a plurality of terminals, each terminal being configured to receive similar data during a test mode, a plurality of buffers, each buffer being configured to receive data from a corresponding terminal and output either the data or changed data to a corresponding memory cells in response to a control signal, and a control unit configured to generate a plurality of control signals, each control signal being respectively applied to a corresponding buffer.

Abstract: A semiconductor device comprises a plurality of terminals, a plurality of drive units corresponding to the plurality of terminals, and a data control unit. The data control unit outputs parallel data applied to the plurality of terminals to the plurality of drive unit in a normal operation mode, and converts serial data applied to a particular terminal, which is one of the plurality of terminals, to parallel data, and outputs the parallel data to which the serial data applied to the particular terminal is converted to the plurality of drive units in a test mode.

Abstract: A common standard may be used for both dynamic random access memories and non-volatile memories, despite the fact that the non-volatile memory generally needs bidirectional communications to coordinate writing with a memory controller. In one embodiment, a package connector on the non-volatile memory may be used for one function that does not involve communications with the memory controller during reading and may be used for communications with the memory controller during writing. Particularly, those communications during writing may be to indicate to the memory controller when the memory is ready for writing and when the memory is busy so that a write must be deferred until the memory is ready to be written to.

Abstract: An apparatus is provided that includes a memory controller to provide a first on-die termination (ODT) signal and a second ODT signal, a memory channel, a first memory module to couple to the memory channel, and a second memory module to couple to the memory channel. The first memory module may include a first memory having a first ODT circuit to receive the first ODT signal, and a second memory having a second ODT circuit to receive the first ODT signal. The first ODT signal may disable the ODT circuit of the first memory when the first memory is to be ACTIVE.

Abstract: A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.

Abstract: A configurable processor architecture uses a common simulation database for multiple processor configurations to reduce the cost of producing customized processor configurations. An unchanging core portion is used in each processor configuration. To support different memory modules, identification signals are provided from the memory modules or an identification module to configure the core portion.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: A semiconductor storage device, in which successive reading and successive writing of data having a predetermined length from and to a memory cell specified by a certain address are performed, includes a plurality of memory cells, address input terminals through which the address is input, data output terminals through which read data having the predetermined length is output, and data input terminals through which write data having the predetermine length is input. Part of the address input terminals are also used as the data output terminals. In this way, the operation of successive reading and successive writing performed in succession at the same address can be made faster without increasing the number of terminals.

Abstract: A resistive memory device operates to sequentially activate bit lines, which are divided into plural groups, after precharging all of word and bit lines in a writing operation. The device is able to write a large amount of data therein at a high frequency, with a reduced the chip size.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded bit to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: Dual I/O data read is performed in an integrated circuit which includes a serial peripheral interface memory device. In one example, a second page read address is transmitted to the memory device using a first input pin and a second input pin concurrently, while transferring data from the memory device associated with a first page read address using a first output pin and a second output pin concurrently. The first page read address is associated with a first location in the memory device and the second page read address is associated with a second location in the memory device.

Abstract: A device includes a one-time-programmable memory including multiple random accessible input/output pins. Each random accessible I/O pin corresponds to a unique memory address in the one-time-programmable memory. The device also includes a multiplexing circuit with multiple inputs. Each of the multiple inputs is coupled to one of the multiple random accessible I/O pins. An output of the multiplexing circuit has a bit width that is less than the number of the multiple random accessible I/O pins.

Abstract: A semiconductor memory device includes a row control circuit block and a column control circuit block each performing an access control over a memory cell array, a data I/O circuit block transmitting and receiving data to and from the memory cell array, and a control circuit changing at least a part of the row control circuit block, the column control circuit block, and the data I/O circuit block from a standby state into an active state in response to a setting of a predetermined mode signal to a mode register. According to the present invention, even if it is necessary to turn predetermined circuit blocks into the active state by an operation other than a read or write operation, there is no need to always set these circuit blocks into the active state.

Abstract: A semiconductor memory has main bit lines paralleled by fixed potential lines in an alternating arrangement. Each main bit line is switchably connected to two sub-bit lines. The memory cells connected to one of the two sub-bit lines are placed below the main bit line. The memory cells connected to the other one of the two sub-bit lines are placed below an adjacent fixed potential line. The fixed potential lines prevent parasitic capacitive coupling between the main bit lines and thereby speed up read access to the memory cells without taking up extra layout space.

Abstract: A method for dual I/O data read in an integrated circuit which includes a serial peripheral interface memory device. In an embodiment, the memory device includes a clock signal, a plurality of pins, and a configuration register. In an embodiment, the configuration register includes a wait cycle count. The method includes transmitting a read address to the memory device using a first input/output pin and a second input/output pin concurrently. In an embodiment, the read address includes at least a first address bit and a second address bit, the first address bit being transmitted using the first input/output pin, and the second address bit being transmitted using the second input/output pin. The method includes accessing the memory device for data associated with the address and waiting a predetermined number clock cycles associated with the wait cycle count. The method includes transferring the data from the memory device using the first input/output pin and the second input/output pin concurrently.

Abstract: A memory system includes a controller having first and second input/output terminals, and first and second memory devices each having first and second input/output terminals. The system includes a path selection mechanism for selectively employing one of the first and second terminals of either the controller or the first memory device for communicating a first input/output signal between the controller and the first memory device, and employing the other one of the first and second terminals for communicating a second input/output signal between the controller and the first memory device. The path selection mechanism selectively employs the first and second terminals in accordance with data indicating which of the first and second terminals of the first memory device is connected to the first terminal of the controller and which of the first and second terminals of the first memory device is connected to the second terminal of the controller.

Abstract: In one aspect, a multiplexer array is described. The multiplexer array includes (1) a first multiplexer coupled to a first address line, where the first multiplexer includes a first plurality of memory devices and (2) a first plurality of input logic devices coupled to the first multiplexer, a first plurality of data lines, and a plurality of bitlines. Each input logic device of the first plurality of input logic devices is coupled to a respective memory device of the first plurality of memory devices and includes a first input terminal and a second input terminal, where, for each input logic device, the first input terminal is coupled to a respective data line of the first plurality of data lines and the second input terminal is coupled to a respective bitline of the plurality of bitlines. Embodiments of methods of programming a multiplexer array are also described.

Abstract: A system is provided for multi-rank, partial-width memory modules. A memory controller is provided. Additionally, a memory bus is provided. Further, a memory module with a plurality of ranks of memory circuits is provided, the memory module including a first number of data pins that is less than a second number of data pins of the memory bus.

Abstract: A method is disclosed for programming an ID register of a microchip. The method comprises the step, prior to packaging, of attaching at least one additional ID pin to the die of the microchip. The at least one pin being so attached that, when the microchip is packaged, the at least one pin is sealed within the package. At least a portion of the microchip identity data is programmed by providing a plurality of unique combinations of binary data to the at least one additional pin. Each unique combination of binary data corresponds to a unique identity of the microchip. The at least one pin is coupled to a respective module of the microchip layout for providing, via the at least one pin, information associated with the particular identity of the microchip. The at least one pin is also coupled to the identification register, so as to, upon testing, include the respective combination of binary data in the ID register data of the microchip.

Abstract: A memory module includes a memory device having a plurality of data pins and conductive lines electrically connected to the plurality of data pins. The memory device is configurable, using at least one input to the memory device, to a data pin configuration selected from among a plurality of different data pin configurations. The plurality of different data pin configurations include a first data pin configuration that uses a first number of data pins of the memory device, and a second data pin configuration that uses a second, different number of data pins.

Abstract: A memory system includes a plurality of memory devices having data terminals that are commonly connected to a memory controller. Each of the memory devices includes a data output circuit that outputs read data that is read from a memory cell array in response to a read command to the data terminal, and an output-timing adjustment circuit that adjusts an output timing of read data that is output from the data output circuit. The memory controller sets an adjustment amount of adjustment performed by an output-timing adjustment circuit such that delay times from when the read command is issued until when the read data is received match in the memory devices, by issuing a setting command to each of the memory devices.

Abstract: A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region.

Abstract: Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.

Abstract: A memory controller operates in two modes to support different types of memory devices. In a first mode, the memory controller distributes a dedicated reference voltage with each of a plurality of signal bundles to a corresponding plurality of memory devices. The reference voltages are conveyed using pads that are alternatively used for e.g. timing-reference signals in a second mode, so the provision for bundle-specific reference voltages need not increase the number of pads on the memory controller.

Abstract: A common standard may be used for both dynamic random access memories and non-volatile memories, despite the fact that the non-volatile memory generally needs bidirectional communications to coordinate writing with a memory controller. In one embodiment, a package connector on the non-volatile memory may be used for one function that does not involve communications with the memory controller during reading and may be used for communications with the memory controller during writing. Particularly, those communications during writing may be to indicate to the memory controller when the memory is ready for writing and when the memory is busy so that a write must be deferred until the memory is ready to be written to.

Abstract: An integrated circuit device includes a serial peripheral interface adapted for receiving a first command supporting an address of a first configuration, wherein the serial peripheral interface supports an address of a second configuration upon receipt of a second command, the second configuration being different from the first configuration. In a specific embodiment, the first and the second configurations are different in address length. In another embodiment, a second address cooperated with the second command has a first part and a second part, the second part comprising a plurality of byte addresses, each of the byte addresses being associated with a corresponding byte of data. In another embodiment, integrated circuit device also includes a mode logic circuit for controlling operations of the first command and the second command. Various other embodiments are also described.

Abstract: A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.

Abstract: In the storage device of the invention, latch control is performed on a series of signals in response to latch control signals. Latch control terminals are provided to which the latch control signals are input respectively and a plurality of signal terminals to which a series of signals are input. Herein, a plurality of latch circuits is provided so as to correspond to the plurality of signal terminals, respectively. The plurality of latch circuits are located within a specified distance from their associated signal terminals respectively and within a specified distance from the latch control terminals. The delays of signal transmission from the signal terminals to their associated latch circuits can be equalized and the delays of signal transmission from the latch control terminals to which the latch control signals for executing latch control are input to the latch circuits can be equalized. This contributes to a reduction in the skew of the latch characteristics of the signals.

Abstract: Disclosed is a memory circuit that includes a plurality of columns of bit line pairs, each bit line pair including True and Bar bit lines, between which at least a memory cell is connected; a sense amplifier that has True and Bar terminals and that performs differential amplification; and a switching circuit that selects one of: a straight connection in which the True and Bar bit lines of a selected column bit line pair are connected to the True and Bar terminals of the sense amplifier, respectively; and a cross connection in which the True and Bar bit lines of a selected column bit line pair are connected to the Bar and True terminals of the sense amplifier, respectively.

Abstract: A semiconductor device comprises a board, a first semiconductor storage device placed on the board, and a second semiconductor storage device placed on the board. Each of the first and second semiconductor storage devices has a first pad for inputting a chip enable signal, a second pad for inputting a write enable signal, a third pad for inputting an output enable signal, a fourth pad for inputting an address signal, and a fifth pad for inputting data. The first semiconductor storage device has a sixth pad which is electrically connected to the first pad of the second semiconductor device, and the second semiconductor storage device has a seventh pad which is electrically connected to the first pad of the first semiconductor device.

Abstract: A semiconductor device according to the present invention performs, when a first word structure is designated, control such that input and output of data is performed from a first data input/output terminal and from a second data input/output terminal in response to a first strobe signal and a second strobe signal. The semiconductor device performs, when a second word structure is designated and when a first control signal is supplied, control such that input and output of data is performed from the first data input/output terminal in response to the first strobe signal. The semiconductor device performs, when the second word structure is designated and when a second control signal is supplied, control such that input and output of data is performed from the second data input/output terminal in response to the second strobe signal.

Abstract: A trigger producing circuit provides a trigger signal. A delay circuit receives the trigger signal, and provides a delay signal produced by delaying the trigger signal. A clock counter receives clocks, counts the received clocks for a period from reception of the trigger signal to reception of the delay signal, and provides a result of the counting. A determining circuit stores a relationship between the number of clocks and a latency, and determines the latency corresponding to the result of counting provided from the clock counter. A latency register holds the determined latency. A WAIT control circuit externally provides a WAIT signal based on the latency held in the latency register.

Abstract: A non-volatile storage apparatus includes Y lines, a common X line, multiple storage elements, a dummy element and control circuitry in communication with the common X line and the Y lines. Each element is connected to the common X line and the dummy element is also connected to a particular Y line. The control circuitry provides control signals to the common X line and the Y lines to change a first storage element from a first to a second state by passing a current into the first storage element from the particular Y line through the dummy element. The control circuitry controls the common X line and Y lines to sequentially change additional storage elements from the first to the second state by passing currents into the additional storage elements previously changed to the second state and their associated different Y lines.

Abstract: A semiconductor device comprises a board, a first semiconductor storage device placed on the board, and a second semiconductor storage device placed on the board. Each of the first and second semiconductor storage devices has a first pad for inputting a chip enable signal, a second pad for inputting a write enable signal, a third pad for inputting an output enable signal, a fourth pad for inputting an address signal, and a fifth pad for inputting data. The first semiconductor storage device has a sixth pad which is electrically connected to the first pad of the second semiconductor device, and the second semiconductor storage device has a seventh pad which is electrically connected to the first pad of the first semiconductor device.

Abstract: Control information needed for executing data transmission/reception through a data terminal is received via its own control terminal in a first operation mode, and the control information is received by using the own control terminal and also a control terminal of at least one of the other ports in a second operation mode.

Abstract: An apparatus is provided that includes a memory controller to provide a first on-die termination (ODT) signal and a second ODT signal, a memory channel, a first memory module to couple to the memory channel, and a second memory module to couple to the memory channel. The first memory module may include a first memory having a first ODT circuit to receive the first ODT signal, and a second memory having a second ODT circuit to receive the first ODT signal. The first ODT signal may disable the ODT circuit of the first memory when the first memory is to be ACTIVE.

Abstract: Semiconductor memory device and parallel test method of the same. The test includes writing data into multiple memory banks simultaneously, reading the data from a portion of the memory banks, compressing the read data and outputting the compressed data to the outside of a chip.

Abstract: A semiconductor apparatus of the present invention includes a first to a fourth external terminals and a decoding circuit. The semiconductor apparatus in a first mode inputs a first encoded data from the first external terminal, decodes the first encoded data by the decoding circuit to generate a first decoded data, outputs the first decoded data from the fourth external terminal, and the semiconductor apparatus in a second mode, inputs a second encoded data from the first external terminal, outputs the second encoded data input from the first external terminal from the second external terminal, inputs the second encoded data output from the second external terminal from the third external terminal, decodes the second encoded data input from the third external terminal by the decoding circuit to generate a second decoded data and outputs the second decoded data from the fourth external terminal.

Abstract: A semiconductor memory device includes a data input driver and a data output driver for receiving an external power supply voltage, and for inputting and outputting data, respectively; and a voltage detector for detecting the external power supply voltage to generate a detection signal, wherein a drive current of each of the data input driver and the data output driver is controlled by the detection signal.

Abstract: A hybrid solid-state memory system is provided for storing data. The solid-state memory system comprises a volatile solid-state memory, a non-volatile solid-state memory, and a memory controller. Further, a method is provided for storing data in the solid-state memory system. The method comprises the following steps. A write command is received by the memory controller. Write data is stored in the volatile memory in response to the write command. Data is transferred from the volatile memory to the non-volatile memory in response to a data transfer request.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.