Abstract: A data storage device includes a memory and a controller. Mapping circuitry is configured to apply a mapping to received data to generate mapped data to be stored into the memory. The mapping is configured to reduce an average number of state changes of storage elements per write operation.

Abstract: A memory device includes a plurality of memory blocks, and a row decoder including a plurality of decoders including a first decoder and a second decoder, the first decoder being configured to output a first block selection signal for selecting one of the memory blocks and a control signal for causing the second decoder to output a second block selection signal for selecting another one of the memory blocks.

Abstract: Embodiments of a method for operating a computer system are disclosed. In one embodiment, the memory unit has a non-volatile memory array and processing logic and the non-volatile memory array stores initialization data that is used by the processing logic to perform input/output operations of the memory unit. The method involves storing the initialization data in retention registers within the memory unit, wherein the retention registers are separate from the non-volatile memory array and retain data while the memory unit is power gated, using the stored initialization data in the retention registers to initialize the memory unit upon exiting the power gating.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.” In one embodiment, the “near memory” is configured to operate in a plurality of different modes of operation including (but not limited to) a first mode in which the near memory operates as a memory cache for the far memory and a second mode in which the near memory is allocated a first address range of a system address space with the far memory being allocated a second address range of the system address space, wherein the first range and second range represent the entire system address space.

Abstract: Example embodiments are related to a high power spin torque oscillator that is integrated by combining a transistor. The high power spin torque oscillator according to example embodiments may include a spin torque oscillator and a transistor. The spin torque oscillator may perform an oscillation function and a transistor may perform an amplification function by integrating the spin torque oscillator and a transistor in one chip. The transistor may amplify an amplification signal of the spin torque oscillator. The high power spin torque oscillator may be integrated on FET or BJT.

Abstract: A solid-state electronic device according to the present invention includes: an oxide layer (possibly containing inevitable impurities) that is formed by heating, in an atmosphere containing oxygen, a precursor layer obtained from a precursor solution as a start material including both a precursor containing bismuth (Bi) and a precursor containing niobium (Nb) as solutes, the oxide layer consisting of the bismuth (Bi) and the niobium (Nb); wherein the oxide layer is formed by heating at a heating temperature from 520° C. to 650° C.

Abstract: A processor-based system includes a processor coupled to a system controller through a processor bus. The system controller is used to couple at least one input device, at least one output device, and at least one data storage device to the processor. Also coupled to the processor bus is a memory hub controller coupled to a memory hub of at least one memory module having a plurality of memory devices coupled to the memory hub. The memory hub is coupled to the memory hub controller through a downstream bus and an upstream bus. The downstream bus has a width of M bits, and the upstream bus has a width of N bits. Although the sum of M and N is fixed, the individual values of M and N can be adjusted during the operation of the processor-based system to adjust the bandwidths of the downstream bus and the upstream bus.

Abstract: Improved PMOS and NMOS transistor designs for sensing circuitry use in advanced nanometer flash memory devices are disclosed.

Abstract: A semiconductor device includes a one-time programmable (OTP) memory cell includes a first MOS transistor having a gate coupled to a bit line, a first switching device, coupled to one side of a source/drain of the first MOS transistor, configured to provide a current path for a current supplied to the gate of the first MOS transistor, and a second switching device configured to provide a bias voltage at the other side of the source/drain of the first MOS transistor.

Abstract: A system to recover a multimaster serial single-ended bus and a faulted connected device includes a director device connected to the faulted connected device via the multimaster serial single-ended bus. The director device includes a central processing unit, a field programmable gate array, and a management module in communication with the faulted connected device, the management module configured to recover the faulted connected device and the multimaster serial single-ended bus. The management module may transmit a clock pulse to the faulted connected device if the faulted connected device is holding a data line (SDA) low, transmit a stop command to the faulted connected device if the faulted connected device is holding SDA low and/or read and compare a register value in the faulted device against an expected value to determine if the faulted device and the multimaster serial single-ended bus have been recovered.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes: first semiconductor regions extending in a first direction and arranged in a direction crossing the first direction; control gate electrodes provided on an upper side of the first semiconductor regions, extending in a second direction different from the first direction, and arranged in a direction crossing the second direction; a charge storage layer provided in a position each of the first semiconductor regions and each of the control gate electrodes cross; a first insulating film provided between the charge storage layer and each of the first semiconductor regions; a second insulating film provided between the charge storage layer and each of the control gate electrodes; and a silicon-containing layer in contact with part of a side wall of each of the control gate electrodes and having a gradient in a silicon concentration in a direction crossing the second direction.

Abstract: A nonvolatile memory device includes a single-layer gate, a first area, and a second area. The first area includes a first well region, a first contact region arranged in the first well region, and source and drain regions arranged at both sides of the single-layer gate in the first well region. The second area includes a second well region, a second contact region arranged to overlap a part of the single-layer gate in the second well region, and a third contact region arranged in the second well region.

Abstract: A data storage device includes a memory and a controller. Mapping circuitry is configured to apply a mapping to received data to generate mapped data to be stored in storage elements. The mapping is configured to reduce average write time by mapping at least one incoming data value into a mapped value such that no transitions of storage elements from a second state to a first state are used for storing the mapped value into the storage elements. The mapping of the received data to the mapped data does not depend on the states of the storage elements prior to the writing of the mapped data.

Abstract: A sense amplifier circuit comprising a pair of cross-coupled inverters and a data line charging circuit is disclosed. The cross-coupled inverters comprise a first inverter and a second inverter. The first inverter has a first pull-up transistor with a first pull-up terminal. The second inverter has a second pull-up transistor with a second pull-up terminal. The output of the first inverter is coupled to the input of the second inverter at a first sense amp node. The output of the second inverter is coupled to the input of the first inverter at a second sense amp node. The data line charging circuit has a first node connected to a data line and the first pull-up terminal. The data line charging circuit also has a second node connected to a complementary data line and the second pull-up terminal. The first and second pull-up transistors are coupled to different voltage levels when a sense amplifier enable signal is activated.

Abstract: Apparatuses, sense circuits, and methods for compensating for a voltage increase on a wordline in a memory is described. An example apparatus includes a bitline, a memory cell coupled to the bitline, a bipolar selector device coupled to the memory cell, a wordline coupled to the bipolar selector device, and a wordline driver coupled to the wordline. The apparatus further includes a model wordline circuit configured to model an impedance of the wordline and an impedance of the wordline driver, and a sense circuit coupled to the bitline and to the model wordline circuit. The sense circuit is configured to sense a state of the memory cell based on a cell current and provide a sense signal indicating a state of the memory cell. The sense circuit is further configured to adjust a bitline voltage responsive to an increase in wordline voltage as modeled by the model wordline circuit.

Abstract: A semiconductor memory device includes a bit line sense amplification unit configured to sense/amplify data loaded on a bit line, and a driving control unit configured to supply a power line of the bit line sense amplification unit with an overdriving voltage in an overdriving period and supply an internal voltage line with a voltage of the power line of the bit line sense amplification unit in a discharge driving period.

Abstract: Semiconductor devices are provided. The semiconductor device includes a first pre-charge element and a second pre-charge element. The first pre-charge element receives a first pre-charge signal to pre-charge a first bit line to have a first pre-charge voltage signal. The second pre-charge element receives a second pre-charge signal to pre-charge a second bit line to have a second pre-charge voltage signal. The second pre-charge signal is enabled earlier than the first pre-charge signal in the event that a data stored in a memory cell of a first cell block is loaded on the first bit line.

Abstract: Schematic circuit designs for a dual-port SRAM cell are disclosed, together with various layout schemes for the dual-port SRAM cell. The dual-port SRAM cell comprises a storage unit and a plurality of partial dummy transistors connected to the outputs of the storage unit. Various layout schemes for the dual-port SRAM cell are further disclosed. A gate electrode serves as the gate for a pull-down transistor and a pull-up transistor, a gate of a first partial dummy transistor, and a gate of a second partial dummy transistor. A butt contact connects a long contact to the gate electrode. The long contact further connects to a drain of a pull-down transistor, a drain of a pull-up transistor, a drain of a first pass gate, and a drain of a second pass gate, wherein the first pass gate and the second pass gate share an active region.

Abstract: A semiconductor device comprises transmission lines, inverting circuits, first, second and third switches, global sense amplifiers, and a control circuit. The first switch switches between the transmission line and the input of the inverting circuit, the second switch switches between the transmission line and the output of the transmission line, and the third switch switches between the adjacent transmission lines. The control circuit turns off the first and second switches so that the transmission lines are brought into a floating state in a state where signals of the transmission lines are held in the inverting circuits by the global sense amplifiers. After charge sharing of the transmission lines occurs by turning on the third switches within a predetermined period, the control circuit turns off the second switches so that the transmission lines are inverted and driven via the inverting circuits and the second switches.

Abstract: A circuit includes a Static Random Access Memory (SRAM) array. An SRAM cell is in the SRAM array and includes a p-well region, a first and a second n-well region on opposite sides of the p-well region, and a first and a second pass-gate FinFET. The first pass-gate FinFET and the second pass-gate FinFET are p-type FinFETs. A CVss line is over the p-well region, wherein the CVss line is parallel to an interface between the p-well region and the first n-well region. A bit-line and a bit-line bar are on opposite sides of the CVss line. A CVdd line crosses over the SRAM cell. A CVss control circuit is connected to the CVss line. The CVss control circuit is configured to provide a first CVss voltage and a second CVss voltage to the CVss line, with the first and the second CVss voltage being different from each other.

Abstract: A memory array includes a plurality of columns of memory cells and each column of memory cells of the memory array is coupled to a local voltage source, a bit line, and a bit line bar. Provide a working voltage to pre-charge the bit line and the bit line bar of the column of memory cells when a memory cell of the column of memory cells is selected to be read, and meanwhile use local voltage sources coupled to remaining columns of memory cells of the memory array to provide high voltages lower than the working voltage to pre-charge bit lines and bit line bars of the remaining columns of memory cells.

Abstract: Subject matter disclosed herein relates to accessing memory, and more particularly to operation of a partitioned bitline.

Abstract: Embodiments of an apparatus and method to improve power delivery including a pre-charge circuit that may include a first voltage supply rail configured to provide a first voltage amount to perform a first phase of a pre-charge of a bit line and a second voltage supply rail configured to provide a second voltage amount to perform a second phase of the pre-charge of the bit line are described herein. In embodiments, the pre-charge circuit may be a pre charge circuit for a static random-access memory (SRAM) memory cell.

Abstract: A fault masking method is applied to a non-volatile memory array which includes a faulty cell and electrically connected to an address register providing a first address. The faulty cell can only output a fixed value. The content of the first address is not equal to the fixed value. The method includes: providing a complementer electrically connected between the address register and the faulty cell; providing a control word; writing the first address and the control word into the complementer; performing a complement operation on the first address and the control word by the complementer to obtain a second address, and storing the content of the second address into the faulty cell, wherein the content of the second address is equal to the fixed value. The method can reduce or eliminate the usage of redundancy in non-volatile memories, so as to reduce the manufacturing costs and improve the fabrication yield.

Abstract: File management systems and methods are presented. In one embodiment, implementation of a method for determining the accurate ownership of a file within a data system includes: identifying a first plurality of access events for a file, wherein the file is associated with a directory of related files; identifying a second plurality of access events for the related files within the directory, wherein access events in the first and second plurality of access events occur within a period; determining a pool of users accessing files within the directory within the period; and selecting a user from the pool of users as an inferred owner of the file based on access metrics related to the plurality of access events.

Abstract: SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.

Abstract: Transistors formed in one identical diffusion layer and performing complementary operations are generally arranged symmetrically with respect to the diffusion layer. A semiconductor integrated device using a layout capable of partially avoiding restriction on the design of the semiconductor integrated circuit device and reducing the size and economizing the manufacturing cost is provided by breaking the stereotype idea. The size of the semiconductor integrated circuit device can be decreased further by arranging two transistors formed in one identical diffusion layer and conducting complementary operations by intentionally arranging them in an asymmetric pattern.

Abstract: In general, the present disclosure is directed toward a novel hybrid spintronic device for converting chemical absorption into a change in magnetoresistance. This device uses a novel magnetic material which depends on the attachment of an organic structure to a metallic film for its magnetism. Changes in the chemical environment lead to absorption on the surface of this organometallic bilayer and thus modify its magnetic properties. The change in magnetic properties, in turn, leads to a change in the resistance of a magnetoresistive structure or a spin transistor structure, allowing a standard electrical detection of the chemical change in the sensor surface.

Abstract: A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.

Abstract: A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal. The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal.

Abstract: A voltage source controller for a memory array includes an input coupled to a voltage source, an output coupled to one or more memory cells of a memory array, where the output is configured to provide a cell source voltage to the memory cells. The controller also includes a switch circuit configured to: receive a retention enable signal, a write assist enable signal, and a standard mode enable signal; and based on the retention enable signal, write assist enable signal, and standard mode enable signal, selectively set the cell source voltage for one or more of the memory cells to one of: a retention voltage, a write assist voltage, or a standard mode voltage, where the retention voltage and the write assist voltage are less than the standard mode voltage.

Abstract: A method of equilibrating digit lines, a memory array, device, system and wafer for digit lines configured in an open digit line architecture. The digit lines are equilibrated by coupling a terminated end of a first digit line to an equilibration reference and coupling an unterminated end of a second digit line to the terminated end of the first digit line. The memory array is configured with the first and second digit lines arranged directly adjacent to each other.

Abstract: A Static Random Access Memory (SRAM) cell includes a first long boundary and a second long boundary parallel to a first direction, and a first short boundary and a second short boundary parallel to a second direction perpendicular to the first direction. The first and the second long boundaries are longer than, and form a rectangle with, the first and the second short boundaries. A CVss line carrying a VSS power supply voltage crosses the first long boundary and the second long boundary. The CVss line is parallel to the second direction. A bit-line and a bit-line bar are on opposite sides of the CVss line. The bit-line and the bit-line bar are configured to carry complementary bit-line signals.

Abstract: A sense amplifier (100) includes first and second inverters (112 and 113). The first inverter has an input terminal (116) and an OUT_B output node and a first transistor (124). The second inverter (113) has an input terminal (115) and an OUT output node and a second transistor (125). The OUT_B output node of the first inverter is coupled to an input terminal of the second inverter, and the OUT node of the second inverter is coupled to an input terminal of the first inverter. The sense amplifier does not use a reference current; therefore, the sense amplifier does not need a reference current generator. The sense amplifier needs only one enable signal to reset a latch (110) of the sense amplifier. When coupled to a non-volatile memory element, voltages at the output nodes are indicative of a logic level of a bit stored in the non-volatile memory element.

Abstract: A static RAM includes: a plurality of word lines; a plurality of pairs of local bit lines; a plurality of memory cells arranged in correspondence with intersections of the plurality of pairs of local bit lines and the plurality of word lines; a capacitance shared circuit arranged for each of the plurality of pairs of local bit lines; a common connection line connecting the plurality of capacitance shared circuits; and a pair of global bit lines connected to the plurality of pairs of local bit lines, wherein the capacitance shared circuit includes two N-channel transistors connected between the pair of local bit lines and the common connection line corresponding to each other.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: At least one example embodiment discloses a semiconductor device. The semiconductor device includes a first sense amplifier selectively connected between a first bit line and a second bit line, a second sense amplifier selectively connected between the first bit line and the second bit line, a first power supply circuit configured to provide a power supply voltage to the first sense amplifier in response to a first control signal, a second power supply circuit configured to provide a ground voltage to the second sense amplifier in response to a second control signal, and a switching circuit configured to selectively connect the first power supply circuit with the second power supply circuit in response to a third control signal.

Abstract: A method of equilibrating digit lines, a memory array, device, system and wafer for digit lines configured in an open digit line architecture. The digit lines are equilibrated by coupling a terminated end of a first digit line to an equilibration reference and coupling an unterminated end of a second digit line to the terminated end of the first digit line. The memory array is configured with the first and second digit lines arranged directly adjacent to each other.

Abstract: Systems, methods, and other embodiments associated with bit line equalization are described. Systems and methods described herein provide secondary bit line equalization for embedded memory systems to reduce equalization time and improve memory performance. The reduction in equalization time is accomplished by adding a secondary equalizer in addition to a standard primary equalizer for a column of memory cells.

Abstract: Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.

Abstract: Examples described include precharge operations and circuitry for performing precharge operations. Digit lines may be driven to ground during a portion of example precharge operations. By driving the digit lines to ground, charge accumulating in bodies of vertical access devices may be discharged to the digit lines in some examples. To drive the digit lines to ground, a dynamic reference may be used where the reference is ground during one portion of the precharge operation and another value, which may be between two supply voltages (e.g. VCC/2), during another portion of the precharge operation.

Abstract: Multi-period structures exhibiting giant magnetoresistance (GMR) are described in which the exchange coupling across the active interfaces of the structure is ferromagnetic.

Abstract: A method, apparatus, and system in which an interconnect for an integrated circuit communicates transactions between one or more initiator Intellectual Property (IP) cores and one or more target IP cores coupled to the interconnect, including a power manager having a hierarchy of two or more layers including a hardware logic portion to control a power consumption of two or more domains in the integrated circuit, where each layer of the power manager performs its own function; wherein the power manager has its own dedicated CPU or dedicated state machine to execute power management instructions; and wherein the power manager controls the power consumption of two or more domains without using a CPU IP core utilized by other IP cores on the integrated circuit to execute power management instructions.

Abstract: A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.

Abstract: A semiconductor memory device includes memory cells, a sensing amplifier, a precharge circuit, and a control signal generator. The precharge circuit has a NMOS transistor and two PMOS transistors, and is used to precharge bit lines of a bit line pair, wherein the NMOS transistor is controlled by a first control signal, and the two PMOS transistors are controlled by a second control signal. The control signal generator is used to generate the first and second control signals, wherein the first control signal is at a logic high level only when the second control signal is at a first logic low level, the first control signal is at a logic low level when the second control signal is at a second logic low or a first logic high level, and the second logic low level is higher than the first logic low level.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array configured by plural memory cells each including a variable resistor and each provided between first and second lines. A control circuit applies to a memory cell through the first and second lines a writing voltage for writing data or a reading voltage for reading data. A sense amplifier circuit senses data retained in a memory cell based on a current flowing through the first line. In a data writing operation, the control circuit applies a writing voltage to each of n number of memory cells configuring one unit such that the memory cells may be supplied with different resistance values. In a data reading operation, the sense amplifier circuit compares level relationship of the resistance values of n number of memory cells configuring one unit and reads out n! patterns of data from the one unit.

Abstract: A memory cell includes a storage element, a write circuit coupled to the storage element and a read circuit coupled to the storage element. At least a portion of the storage element and at least a portion of the write circuit are fabricated using a thicker functional gate oxide and at least a portion of the read circuit is fabricated using a thinner functional gate oxide.

Abstract: A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage.

Abstract: An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.

Abstract: A vertical semiconductor device is provided. The semiconductor device includes a cell array including a control bit line connected to cells and electrically isolated from a bit line, and a floating body control circuit for applying a floating control voltage to the control bit line in a predetermined period.