Abstract: According to one embodiment, a method of manufacturing a nonvolatile semiconductor storage device includes a memory-cell forming step, a first wire forming step, and a second wire forming step. The memory-cell forming step is forming dummy memory cells arranged at a predetermined space apart from an end memory cell located at an end of a group of memory cells set in contact with the same first or second wire among the memory cells, the dummy memory cells having a laminated structure same as that of the memory cells and being set in contact with no second wire.

Abstract: A semiconductor memory device includes a control circuit. The control circuit applies a first voltage to a selected one of a upper interconnections, applies a second voltage to an unselected one of the upper interconnections, applies a third voltage to a first dummy upper interconnection and independently controls the first to third voltages to be set to different values.

Abstract: A memory includes a memory array, a sense amplifier, and a reference circuit. The memory array includes a memory cell. The sense amplifier includes a first terminal coupled to the memory cell and a second terminal. The reference circuit includes a first reference cell, a second reference cell, and a switch. The first reference cell has a first reference threshold voltage for providing a first reference current, based on a first reference word line voltage. The second reference cell has a second reference threshold voltage for providing a second reference current, based on a second reference word line voltage. The switch selectively provides one of the first and the second reference currents to the second terminal in response to a control signal. The first and the second reference word line voltages correspond to different voltage levels.

Abstract: Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods to compensate for defective memory in third dimension memory technology. In a specific embodiment, an integrated circuit is configured to compensate for defective memory cells. For example, the integrated circuit can include a memory having memory cells that are disposed in multiple layers of memory. It can also include a memory reclamation circuit configured to substitute a subset of the memory cells for one or more defective memory cells. At least one memory cell in the subset of the memory cells resides in a different plane in the memory than at least one of the one or more defective memory cells.

Abstract: A semiconductor memory device (e.g. DRAM) is constituted of a memory cell array including a plurality of memory cells, a plurality of word line drivers, a plurality of sense amplifiers, and a plurality of dummy capacitors. The memory cells, each of which includes a transistor and a capacitor, are positioned at intersections between the word lines and the bit lines. The first electrodes of the capacitors are connected to the transistors in the memory cells. The first electrodes of the dummy capacitors are connected together and are supplied with a second potential (e.g. VDD or VSS). The second electrodes of the dummy capacitors are connected together with the second electrodes of the capacitors of the memory cells and are supplied with a first potential (e.g. VPL). The dummy capacitors serve as smoothing capacitances for the plate voltage VPL so as to reduce plate noise.

Abstract: A memory system includes a content addressable memory (CAM) including a plurality of match lines, each match line having a plurality of memory cells coupled thereto. The system also includes a match detector coupled to the CAM and a reference match line having a plurality of reference memory cells coupled thereto, the reference memory cells being of the same type and the memory cells. The system also includes a match line sensor coupled to the reference match line and the match detector that determines a characteristic of the reference match line and provides a timing signal to the match detector based on the characteristic.

Abstract: A semiconductor memory device includes a sense amplifier, first and second bit lines connected to the sense amplifier, a first reference cell connected to the first bit line, and a second reference cell connected to the second bit line. A reference potential is simultaneously written to the first and second reference cells. Further, a dummy cell may be provided to be simultaneously, with the reference cell, with the reference potential.

Abstract: A memory includes first selective transistors connected between one end of cell strings and bit lines; second selective transistors connected between the other end of the cell strings and a cell source line; a dummy cell string; a first dummy selective transistor connected between one end of the dummy cell string and a dummy bit line and whose gate is connected to a first selective gate line; a second dummy selective transistor connected between the other end of the dummy cell string and the cell source line and whose gate is connected to a second selective gate line, wherein at a time of writing in a selected memory cell, a voltage of a first dummy bit line selected is driven to a different voltage from a voltage of an unselected bit line, and any of the dummy cell transistors connected to the first dummy bit line is written.

Abstract: An oscillating device including: an oscillator generating an oscillation signal according to an enable signal; a counter counting an oscillation number of the oscillation signal and being able to reset at the oscillation number indicated by a first signal; and a comparator comparing the counted oscillation number and a reference number, is provided.

Abstract: The present invention relates to a semiconductor memory device, and more precisely to a semiconductor memory device which controls the voltage supplied to a dummy bit line and a biasing method. The semiconductor memory device includes a dummy bit line disposed in a cell array and a switching unit which switches the supply of a bias voltage to the dummy bit line by a control signal related to an operation of the cell array.

Abstract: A semiconductor storage device precharging a bit line pair to a ground potential includes a sense amplifier connected between the bit line pair, a storage cell connected to one of the bit line pair and storing data, a first transistor controlling a conduction state between the other of the bit line pair and a reference cell node, a second transistor connected between a reference voltage source generating a reference voltage and the reference cell node, the second transistor exclusively controlled from the first transistor, and a capacitor setting a potential of the reference cell node.

Abstract: A F-RAM memory device containing a current mirror sense amp. A F-RAM memory device containing a current mirror sense amp coupled to a negative voltage generator. A method of reading data from and restoring data back into F-RAM cells in a 2T2C F-RAM device containing a current mirror sense amp. A method of reading data from and restoring data back into F-RAM cells in a 1T1C F-RAM device.

Abstract: A circuit for reading and programming a fuse. The electronic circuit includes a data fuse coupled to a data node and a reference fuse coupled to a reference node. A programming circuit is coupled to the data node, wherein the programming circuit is configured to, when activated, cause the data fuse to be programmed. A sensing circuit is configured to draw current from the data node and the reference node in order to develop a voltage differential between the data node and the reference node during a read operation. A read circuit is configured to, when activated, enable the sensing circuit to develop the voltage differential during the read operation. A protection circuit is configured to form a voltage divider within the sensing circuit during programming of the fuse.

Abstract: A semiconductor memory device of the present invention determines a logic level of a signal based on a predetermined reference voltage. And the memory device has an input terminal to which a reference signal having the reference voltage is input, a low-pass filter connected to the input terminal for passing a component of the reference voltage of the reference signal and eliminating undesired high frequency components, and one or more input first-stage circuits to each of which an output of the low-pass filter and a signal having the logic level to be determined are connected. In the memory device, the low-pass filter has predetermined attenuation at least at a frequency of an operating clock.

Abstract: A semiconductor memory device of the present invention comprises a memory array and a read circuit that reads data of a selected cell. The memory array includes a plurality of memory cells and a reference cell each having a memory element that stores data based on change in resistance value. The read circuit includes: a voltage comparison unit that compares a value corresponding to a sense current from the selected cell with a value corresponding to a reference current from the reference cell; a first switch; and a second switch. Both of the first and second switches are provided at a subsequent stage of a decoder and at a preceding stage of the voltage comparison unit. The second switch circuit controls input of the value corresponding to the sense current to the voltage comparison unit, while the first switch circuit controls input of the value corresponding to the reference current to the voltage comparison unit.

Abstract: A sense amplifier for nonvolatile memory cells includes a reference cell, a first load, connected to the reference cell, and a second load, connectable to a nonvolatile memory cell, both the first load and the second load having controllable resistance; a control circuit of the first load and of the second load supplies the first load and the second load with a control voltage irrespective of an operating voltage between a first conduction terminal and a second conduction terminal of the first load.

Abstract: A semiconductor device includes a global bit line, a dummy global bit line that is shorter than the global bit line, a sense amplifier that amplifies a potential difference between the global bit line and the dummy global bit line, a plurality of memory blocks each including a hierarchy switch and a local bit line that is connected to the global bit line via the hierarchy switch, a dummy memory block that includes a dummy hierarchy switch and a dummy local bit line that is connected to the dummy global bit line via the dummy hierarchy switch, and a control circuit that activates any one of hierarchy switches and the dummy hierarchy switch. With this configuration, it is possible to obtain the same memory capacity between a memory mat located at an edge and the other memory mat.

Abstract: Various embodiments of the present invention are generally directed to an apparatus and associated method for generating a reference voltage for a resistive sense memory (RSM) cell, such as an STRAM cell. A dummy reference cell used to generate a reference voltage to sense a resistive state of an adjacent RSM cell. The dummy reference cell comprises a switching device, a resistive sense element (RSE) programmed to a selected resistive state, and a dummy resistor coupled to the RSE. A magnitude of the reference voltage is set in relation to the selected resistive state of the RSE and the resistance of the dummy resistor.

Abstract: Techniques for generating clock and control signals to achieve good performance for read and write operations in memory devices are described. In one design, a clock and control signal generator within a memory device includes first and second clock generators, first and second control signal generators, and a reset circuit. The first clock generator generates a first clock signal used for read and write operations. The second clock generator generates a second clock signal used for write operations. The reset circuit generates at least one reset signal for the first and second clock generators. The reset signal(s) may have timing determined based on loading due to dummy cells. The first control signal generator generates control signals used for read and write operations based on the first clock signal. The second control signal generator generates control signals used for write operations based on the second clock signal.

Abstract: A semiconductor memory device includes a delay locked loop to generate a delay control signal corresponding to a detected phase difference between reference and feedback clock signals, a delay locked loop (DLL) clock signal, and the feedback clock signal. The memory device further includes a delay time measurement device to measure a first degree of delay between the reference and feedback clock signals and output a delay measurement value, and an output enable signal generation device to delay read command information synchronized with an external clock signal by a second degree of delay between the reference and DLL clock signals. The output enable signal generation device generates the read command information as final output enable signal by synchronizing the read command information with the DLL clock signal according to the delay measurement value and column address strobe (CAS) latency information.

Abstract: The present disclosure relates to methods of selectively placing a reference column or reference row in a memory array. The method includes measuring a resistance state resistance value for a plurality of variable resistive memory cells within a memory array and mapping a location of each measured variable resistive memory cell to form a map of the resistance state resistance values for a plurality of variable resistive memory cells within a memory array. Then a column or row is selected to be a reference column or reference row based on the map of the resistance state resistance value for a plurality of variable resistive memory cells within a memory array, to minimize read operation errors, and forming a variable resistive memory cell memory array.

Abstract: A method and apparatus for reading data from a non-volatile memory cell. In some embodiments, a cross-point array of non-volatile memory cells is arranged into rows and columns that are each controlled by a line driver. A read circuit is provided that is capable of reading a logical state of a predetermined memory cell by differentiating a non-integrated first reference value from a non-integrated second reference value. Further, each reference value is measured immediately after configuring the column corresponding to the predetermined memory cell to produce a first and second amount of current.

Abstract: A semiconductor memory apparatus includes a sense amplifier that receives a driving voltage through a sense amplifier power supply input terminal and detects and amplifies a difference between signals that are supplied to two input lines, a sense amplifier voltage supply unit that supplies a driving voltage and an overdriving voltage higher than the driving voltage to the sense amplifier through the sense amplifier power supply input terminal using a power supply voltage, and a driving voltage control unit that maintains a driving voltage level of the sense amplifier power supply input terminal in response to the level of the power supply voltage, after a voltage of the sense amplifier power supply input terminal is elevated to a power supply level responding to the overdriving voltage in order to perform the overdriving operation.

Abstract: A dynamic type semiconductor memory device includes a sense amplifier connected with a bit line pair to amplify and sense a voltage difference on the bit line pair; a precharge circuit configured to precharge the bit line pair to a power supply voltage on a lower side in response to a first control signal; a memory cell capacitance having one end which is connected with the bit line pair through a first switch circuit which is controlled in response to a signal on a word line; and a reference cell capacitance having one end which is connected with the bit line pair through a second switch circuit which is controlled in response to a signal on a reference word line. The other end of the memory cell capacitance and the other end of the reference cell capacitance are electrically separated.

Abstract: A semiconductor memory device includes a plurality of banks, each of which is constituted of a plurality of memory cell arrays that are aligned in series in the longitudinal direction, wherein each memory cell array includes a plurality of memory cells, and wherein memory cell arrays of banks are collectively aggregated into a plurality of blocks, each of which includes memory cell arrays aligned in the perpendicular direction, in connection with a plurality of DQ pads. DQ pads are arranged in proximity to blocks. Substantially the same distance is set between memory cells and DQ pads so as to reduce dispersions in access times with respect to all DQ pads, thus achieving high-speed access in the semiconductor memory device. The wiring region of IO lines is reduced in the center area of the chip.

Abstract: A method for reading a bit of a memory cell in a non-volatile memory (NVM) cell array, the method comprising providing a memory cell comprising a bit to be read and at least one other bit not to be read, and reading the bit to be read with respect to a multi-bit reference cell, the reference cell comprising a first bit at a first non-ground programmed state and a second bit at a second non-ground programmed state. Compared with the prior art, the present invention may enable achieving an improved sensing accuracy together with improved read disturb immunity.

Abstract: In one embodiment, a semiconductor memory device includes a plurality of pairs of bit lines, each of said pairs including a first bit line, a second bit line, a memory cell coupled to said first bit line, a sense amplifier determining the logical value stored in the memory cell according to a potential difference between the first and the second bit line, a reference voltage generation circuit, and a reference voltage supply switch coupling an output of the reference voltage generation circuit to the second bit line.

Abstract: A method of reducing read disturb in NVM cells by using a first drain voltage to read the array cells and using a second, lower drain voltage, to read the reference cells. Drain voltages on global bitlines (GBLs) for both the array and the reference cells may be substantially the same as one another to maintain main path capacitance matching, while drain voltages on local bitlines (LBLs) for the reference cells may be lower than the drain voltage on local bitlines (LBLs) for the array cells to reduce second bit effect. Reducing the drain voltage of the reference cell at its drain port may be performed using a clamping device or a voltage drop device.

Abstract: A magnetic random access memory according to an example of the invention comprises a first reference bit line shared by first reference cells, a second reference bit line shared by second reference cells, a first driver-sinker to feed a first writing current, a second driver-sinker to feed a second writing current, and a control circuit which checks data stored in the first and second reference cells line by line, and executes writing simultaneously to all of the first and second reference cells by a uniaxial writing when the data is broken.

Abstract: A memory that employs separate Dref areas that are independently accessed to provide a threshold voltage reference signal. The memory includes the separate Dref areas, a data area positioned between the Dref areas, one or more sense amplifiers, and a switch component. The switch component is arranged to receive addressing data and to independently couple one of the separate Dref areas to the sense amplifiers based, at least in part, on a physical proximity of individual memory cells along a word line.

Abstract: A memory that employs separate Dynamic reference (Dref) areas to provide a threshold voltage reference signal. The memory includes the separate Dref areas, a data area positioned between the Dref areas, a reference array, and one or more sense amplifiers. The data area is arranged to provide an output signal, the reference cell and the separate Dref areas are arranged to provide the threshold voltage reference signal, and the sense amplifiers are arranged to receive the output signal and the threshold voltage reference signal.

Abstract: A differential sensing circuit and method for enhancing read margin of a memory device are disclosed. The differential sensing circuit includes a first current-to-voltage converter. The circuit includes a first current subtraction circuit having an erase reference cell. A first input terminal of the first current-to-voltage converter is coupled to the first current subtraction circuit. The circuit includes a second current-to-voltage converter. The circuit also includes a second current subtraction circuit having a program reference cell. A first input terminal of the second current-to-voltage converter is coupled to the second current subtraction circuit. Both the first and second current subtraction circuits are coupled to a memory access bias signal. Outputs of the first and second current-to-voltage converters are compared to generate an enhanced read margin output.

Abstract: A method accurately tracks a bit line maturing time for compiler memory. The method includes enabling a dummy word line in response to an internal clock signal. The dummy word line is enabled prior to enabling a real word line. A dummy bit line is matured in response to enabling of the dummy word line. The dummy bit line matures at a same rate that a real bit line matures. The method also includes disabling the dummy word line in response to determining a threshold voltage differential based on monitoring maturation of the dummy bit line. The real word line is enabled a predefined delay after enabling of the dummy word line. Similarly, the word line is disabled the predefined delay after disabling of the dummy word line. In response to disabling the dummy word line, a sense enable signal is generated.

Abstract: A dummy cell includes a plurality of first memory cells MC for storing “1” or “0”, arranged at points of intersection between a plurality of word lines WR0 to WR7 and a plurality of first data lines D0 to D7, a plurality of first dummy cells MCH for storing “1” or “0”, arranged at points of intersection between the word lines WR0 to WR7 and a first dummy data line, and a plurality of second dummy cells MCL for storing “0”, arranged at points of intersection between the word lines WR0 to WR7 and a second dummy data line DD1.

Abstract: In one embodiment, a memory includes: an array of memory cells arranged according to word lines and columns, each column corresponding to bit lines; a sense amplifier adapted to couple to the bit lines to sense a binary content of selected cells from the array of memory cells, the sense amplifier sensing the binary content responsive to a sense command; an x-decoder configured to assert a selected one of the word lines in response to decoding an address as triggered by a clock edge, wherein the assertion of the selected word line switches on corresponding access transistors to develop voltages on the bit lines; and a bit line replica circuit adapted to replicate the development of the bit lines, the bit line replica circuit including a replica access transistor coupled between a replica bit line and a replica memory cell wherein the replica access transistor is switched on responsive to the clock edge such that the replica memory cell pulls the replica bit line to ground, the bit line replica circuit also inc

Abstract: An MRAM has: a memory cell including a first magnetoresistance element; and a reference cell including a second magnetoresistance element. The first magnetoresistance element has a first magnetization free layer, a first magnetization fixed layer, a second magnetization free layer and a first nonmagnetic layer sandwiched between the first magnetization fixed layer and the second magnetization free layer. The first magnetization free layer has perpendicular magnetic anisotropy, and the first magnetization fixed layer and the second magnetization free layer has in-plane magnetic anisotropy. The first magnetization free layer has: first and second magnetization fixed regions whose magnetization directions are fixed; and a magnetization free region whose magnetization direction is reversible and connected to the first and second magnetization fixed regions. The magnetization free region and the second magnetization free layer are magnetically coupled to each other.

Abstract: A word-line tracking system for a memory array having a plurality of memory cells, the word-line tracking system comprises a dummy row having substantially identical structure as one or more regular rows of the memory cells, the dummy row including a dummy word-line having a first and a second end at the opposite longitudinal ends of the dummy word-line, the first end being connected to a word-line driver, a self timing generator configured to receive a clock signal and generate a pulse signal in sync with the clock signal for the dummy word-line driver, the self timing generator having a first terminal for receiving a feedback signal to determine the falling edge of the pulse signal, a voltage-to-current converter connected to the second end of the dummy word-line, a current-to-voltage converter connected to the feedback terminal, and a wire connecting the voltage-to-current converter to the current-to-voltage converter.

Abstract: A voltage regulator is provided. The voltage regulator provides an output voltage that is proportional to a digital multi-bit select signal. The voltage regulator includes a coarse voltage regulator and a fine voltage regulator. The coarse voltage regulator provides a coarse output voltage based on an output of a voltage divider selected based on the most significant bits of the select signal. The fine voltage regulator provides the output voltage from the coarse output voltage. The output of the fine voltage regulator is adjusted by adjusting the output of an adjustable current source that is provided to a resistor that is coupled between the output and one of the inputs of the fine voltage regulator.

Abstract: We describe a reference cell structure for determining data storing cell resistances in an SMT (spin moment transfer) MTJ (magnetic tunneling junction) MRAM array by comparing data cell currents with those of the reference cell. Since the reference cell also utilizes spin moment transfer (SMT) magnetic tunneling junction (MTJ) cells, there would ordinarily be the danger that the act of reading the reference cell could change its magnetization orientations and be a source of error for subsequent comparisons. Therefore the present invention describes a new circuit arrangement for the reference cell that directs read currents through two SMT MTJ cells in opposite directions so that the transfer of spin moments cannot affect the relative magnetization directions of the cells.

Abstract: A nonvolatile semiconductor memory that includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section. The data reading and programming cortrol section includes: an adjacent memory cell data reading section; an adjacent memory cell data memory section; a reading voltage level control section; a data reading section for reading the data from a first memory cell at a plurality of reading voltages corresponding to a plurality of predetermined reading voltage verify levels controlled using the reading voltage level control section; and a data determining section for deterraining which data of 4-value data is programmed in the first memory cell based on the data which is read by the data reading section.

Abstract: The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (Rt) ranges which correspond to a number of data states, and a number of reference cells interleaved with the data cells and programmable within the number of target Rt ranges. The aforementioned device embodiment also includes control circuitry coupled to the array and configured to sense a level associated with at least one data cell and at least one reference cell, and compare the sensed level associated with the at least one data cell with the sensed level associated with the at least one reference cell to determine a data state of the at least one data cell.

Abstract: A F-RAM memory device containing a current mirror sense amp. A F-RAM memory device containing a current mirror sense amp coupled to a negative voltage generator. A method of reading data from and restoring data back into F-RAM cells in a 2T2C F-RAM device containing a current mirror sense amp. A method of reading data from and restoring data back into F-RAM cells in a 1T1C F-RAM device.

Abstract: A dual mode accessing signal control apparatus for being used in a dummy cells set of a memory, and a dual mode timing signal generating apparatus comprising a dual mode accessing signal control apparatus are provided. The dual mode accessing signal control apparatus respectively generates a write delay signal and a read signal during the write and the read process. The memory is thereby capable of self-timing its write and the read process, and is able to generate a wordline signal with a shorter width in the write process to ensure an early start to precharging. As a result, the whole duty period of the memory can be shortened.

Abstract: A first memory cell array includes a first bit line and a second bit line arranged to read data out of a memory cell containing a ferroelectric capacitor. A second memory cell array includes a third bit line and a fourth bit line arranged to read data out of a memory cell containing a ferroelectric capacitor. A sense amp circuit detects and amplifies a potential difference caused between any two of the first through fourth bit lines. A decoupling circuit selectively connects any two of the first through fourth bit lines to the sense amp circuit and decouples the remainder from the sense amp circuit. A bit-line potential control circuit is arranged between the decoupling circuit and the first and second memory cell arrays to fix the bit lines decoupled from the sense amp circuit by the decoupling circuit to a first potential.

Abstract: A semiconductor memory cell includes a plurality of memory cells configured to store data having polarity corresponding to a direction of current flowing in first and second driving lines, a current generator configured to generate a predetermined read current, apply the predetermined read current to the plurality of memory cells, and generate a data current corresponding variation of the read current according to the data and a current controller connected to a current path of the read current and configured to control a current amount of the read current.

Abstract: A configuration for biasing conductive array lines in a two-terminal cross-point memory array is disclosed. The configuration includes applying a read voltage to a selected X-conductive array line while applying an un-select voltage thru a biasing element to a remaining plurality of un-selected X-conductive array lines. A plurality of Y-conductive array lines are initially biased to some voltage (e.g., 0V) and then allowed to float unbiased after a predetermined amount of time has passed, some event has occurred, or both. As one example the event that triggers the floating of the plurality of Y-conductive array lines can be the read voltage reaching a predetermined magnitude. The array can be formed BEOL and include a plurality of two-terminal memory cells with each memory cell including a memory element and optionally a non-ohmic device (NOD) that are electrically in series with each other and with the two terminals of the memory cell.

Abstract: A magnetic random access memory includes a memory element having a first fixed layer, a first recording layer, and a first nonmagnetic layer, a first reference element having a second fixed layer, a second recording layer, and a second nonmagnetic layer, antiparallel data being written in the first reference element, a second reference element making a pair with the first reference element, and having a third fixed layer, a third recording layer, and a third nonmagnetic layer, parallel data being written in the second reference element, and a current source which, when a read operation is performed, supplies a current from the second fixed layer to the second recording layer in the first reference element, and supplies the current from the third recording layer to the third fixed layer in the second reference element.

Abstract: A method and apparatus for controlling a reading level of a memory cell are provided. The method of controlling a reading level of a memory cell may include: receiving metric values calculated based on given voltage levels and reference levels; generating summed values for each of the reference levels by summing metric values corresponding to levels of a received signal from among the received metric values; selecting the reference level having the greatest value of the generated summed values from the reference levels; and controlling the reading level of the memory cell based on the selected reference level.

Abstract: A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result.

Abstract: A semiconductor memory device includes a plurality of memory cell arrays each including a plurality of memory cells arranged in a matrix pattern, and a plurality of cell plate lines each being shared by the memory cell arrays, each of the cell plate lines corresponding to each of rows of the memory cells and each of the cell plate lines being connected to the memory cells of a corresponding one of the rows. Each of the memory cell arrays includes a plurality of word lines each of which corresponds to each of the rows of the memory cells in the memory cell array. The number of the memory cells connected to each of the cell plate lines is larger than the number of the memory cells connected to one of the word lines corresponding to the each of the cell plate lines.