Abstract: Provided is a pipe latch circuit of a multi-bit pre-fetch type semiconductor memory device with an advanced structure.

Abstract: A data input device of a semiconductor memory apparatus includes: a differential amplifier configured to compare an input to a reference voltage and output a differential signal based on the comparison; and a control circuit configured to adjust a current driving capacity of the differential amplifier by turning on a first current path connected to the differential amplifier in response to a first enable signal and turning off a second current path connected to the differential amplifier in response to a second enable signal in a standby mode, wherein, during a time that a plurality of external command signals toggle back and forth between a status of all being high signals and a status of all being low signals repeatedly, the second enable signal is controlled to be maintained at a low state signal.

Abstract: A nonvolatile memory device includes a memory cell array configured to comprise memory cells coupled by bit lines and word lines, a page buffer unit configured to comprise page buffers and flag latches, wherein the page buffers, coupled to one or more of the bit lines, each are configured to comprise a plurality of latches for storing logic operation results for error correction and configured to store data read using a read voltage, and the flag latches each are configured to classify the page buffers into some page buffer groups each having a predetermined number and to store flag information indicating whether an error has occurred in each group, and an error detection code (EDC) checker configured to determine whether an error has occurred in each of the page buffer groups.

Abstract: During a command/address calibration mode, a memory controller may transmit multiple cycles of test patterns as signals to a memory device. Each cycle of test pattern signals may be transmitted at an adjusted relative phase with respect to a clock also transmitted to the memory device. The memory device may input the test pattern signals at a timing determined by the clock, such as rising and/or falling edges of the clock. The test pattern as input by the memory device may be sent to the memory controller to determine if the test pattern was successfully transmitted to the memory device during the cycle. Multiple cycles of test pattern transmissions are evaluated to determine a relative phase of command/address signals with respect to the clock for transmission during operation of the system.

Abstract: A sub-word line driver includes a substrate, a plurality of gate lines and at least one gate tab. The substrate includes a plurality of isolation areas and a plurality of active areas, where the two active areas are separated by each isolation area, and the isolation areas and the active areas are extended in a first direction and are arranged in a second direction perpendicular to the first direction. The plurality of gate lines are formed on the substrate, where the gate lines are extended in a second direction and are arranged in the first direction. The at least one gate tab is formed on the substrate, where the at least one gate tab is extended in the first direction to cover the isolation area. Incorrect operation of the sub-word line driver may be prevented, and a power consumption of the sub-word line driver may be reduced.

Abstract: Circuits and methods are described for decoding exemplary memory arrays of programmable and, in some embodiments, re-writable passive element memory cells, which are particularly useful for extremely dense three-dimensional memory arrays having more than one memory plane. In addition, circuits and methods are described for selecting one or more array blocks of such a memory array, for selecting one or more word lines and bit lines within selected array blocks, for conveying data information to and from selected memory cells within selected array blocks, and for conveying unselected bias conditions to unselected array blocks.

Abstract: A semiconductor storage device and control method are provided. The semiconductor storage device includes a storage unit including a plurality of storage elements specified by addresses and divided into a plurality of blocks each corresponding to a plurality of the addresses, a write address decoding circuit that decodes a write address specifying a block to write data, a write buffer provided in a write signal path to input write data including write address to the block specified by the write address and a write buffer control unit that disables a write buffer provided in the write signal path for inputting the write data to blocks other than a block including a write address decoded by the write address decoding circuit.

Abstract: An integrated circuit is provided with built-in-self test circuitry. The integrated circuit may have multiple blocks of memory. The memory may be tested using the built-in-self test circuitry. Each memory block may include a satellite address generator that is used in generating test addresses for the memory blocks. Each memory block may also include failure analysis logic and output response analyzer logic. Stalling logic may be used to individually stall memory block testing on a block-by-block basis during memory tests. Address buffer circuitry such as first-in-first-out buffers may be used to provide randomized memory addresses during testing.

Abstract: A circuit for shifting an address includes a shift cell block configured to sequentially shift address signals in response to shift control signals and a control cell block configured to generate the shift control signals for activating the shift cell block in a column unit using sequentially shifted read commands or write commands.

Abstract: The present invention provides a novel wiring method for LR-DIMM of VLP type that conforms to LR-DIMM technology. The LR-DIMM comprises a plurality of DRAMs mounted on a board, two connectors mounted on the board for receiving data, and a buffer device mounted on the board for redriving data applied to the two connectors to supply the data to the plurality of DRAMs. The buffer device is located near the center of the board on which the two connectors are arranged at both ends thereof, and supplies data from each connector to DRAMs arranged on the opposite side to the connector.

Abstract: Embodiments of systems and methods for improved first-in-first-out (FIFO), last-in-last out (LIFO) and full-cycle decoders are described herein. In the various embodiments of the system, a clock generator is operable to generate a clock signal having an active phase and an inactive phase. A set of monotonic flip-flops are operable to capture a set of incoming data addresses during the active cycle of the clock and to generate therefrom data corresponding to single bits in the addresses that have changed compared to the data addresses received by the set of monotonic flip-flops during an immediately preceding data capture cycle. A set of static flip-flops are operable to capture a set of incoming data addresses during the inactive phase of the clock cycle and to generate set output data therefrom. A decoder operable to process the set output data from the set of static flip-flops and to generate a set of old wordlines corresponding to a set of data addresses in the immediately preceding data capture cycle.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, and first to third latch circuits. The first latch circuits hold information as to whether an associated column is defective. A pointer is set in the second latch circuits. The third latch circuits hold write data or read data. One of the third latch circuits is activated at a time the pointer is set to an associated second latch circuit when an associated first latch circuit holds the information indicating that the associated column is not defective. The pointer is sequentially shifted among the second latch circuits in synchronization with a clock. In shifting the pointer, the pointer skips one of the second latch circuits associated with one of the first latch circuit which holds the information indicating that the associated column is defective.

Abstract: A semiconductor device according to the present invention includes plural controlled chips CC0 to CC7 that hold mutually different layer information, and a control chip IF that supplies in common layer address signals A13 to A15 and a command signal ICMD to the controlled chips. Each bit that constitutes the layer address signals A13 to A15 is transmitted via at least two through silicon vias that are connected in parallel for each controlled chip out of plural first through silicon vias. Each bit that constitutes the command signal ICMD is transmitted via one corresponding through silicon via that is selected by an output switching circuit and an input switching circuit. With this configuration, the layer address signals A13 to A15 reach the controlled chips earlier than the command signal ICMD.

Abstract: The bank active signal generation circuit comprises a decoded signal generator and an active signal generator. The decoded signal generator generates decoded signals from a first bank access signal, a second bank access signal and a row address signal in response to when a prefetch signal at a first mode. The decoded signal generator also generates decoded signals from the first bank access signal, the second bank access signal, and a third bank access signal in response when the prefetch signal at a second mode. The active signal generator generates bank active signals in response to receiving the decoded signals, an active pulse and a precharge pulse.

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: an address pad; an address pad buffer section configured to selectively receive a signal of the address pad; a data input buffer section configured to selectively receive the signal of the address pad; and a signal control section configured to selectively provide a path of the signal of the address pad to the address buffer section and the data input buffer section.

Abstract: A word line driving circuit includes an address decoding signal generating unit and a word line voltage supply unit. The address decoding signal generating unit includes inverter chain receiving and delaying a first address decoding signal and outputting the delayed first address decoding signal. The word line voltage supply unit includes a pull-up driver that supplies the delayed first address signal to a selected word line in response to a second address decoding signal. The inverter chain includes an NMOS transistor outputting the delayed first address signal and a source terminal of the NMOS transistor receives a set voltage that is higher than a ground voltage and lower than a high voltage.

Abstract: The embodiments of the present invention disclose a memory device having a fast and shared redundancy decision scheme and a memory control method. The memory device includes an address receiver, a command receiver, a command controller, a row address generator, a column address generator and a shared redundancy decision circuit.

Abstract: Embodiments are provided that include a row decoder, including a row activation path, having a row address converter with an output coupled to an input of a section replacement detector. Further embodiments provide a method including mapping an external row address to an internal row address, wherein the internal row address comprises a section address, determining whether a section corresponding to the section address includes an error, and if the section includes an error, converting the internal row address to a redundant row address, wherein mapping the external row address to the internal row address is initiated prior to determining whether the section replacement should be performed. Further embodiments include a method for receiving a row address for a row in a memory section including a non-2^n number of normal rows and mapping the row address to a redundant row address by subtracting a value from the row address.

Abstract: A programmable logic device may include first and second ports in data communication with a memory block including a pair of address areas. A system using the programmable logic device may include the programmable logic device in data communication with a central processing unit and a controller. A method of using the programmable logic device may include generating a command from the central processing unit based on data read from one of the address areas and written to the second address area wherein the address areas are associated with a common memory address.

Abstract: An SRAM includes a memory cell and a precharge circuit. The precharge circuit precharges a bit line pair with a power supply voltage before writing a data in the memory cell or before reading a data therefrom at a time of a normal mode, and which feeds a power supply voltage to at least a low level data-holding node of a node pair of the memory cell at a time of a read test mode, between time for writing a data in the memory cell and time for reading a data therefrom.

Abstract: Methods of increasing the speed of random read and write operations of a memory device are provided for improving the performance of volatile and non-volatile memory devices. In contrast to the conventional approach that latches the current memory address right before the currently accessed memory data are outputted, the methods latch the next memory address before the currently accessed memory data are read out. The flow, timing waveforms and control sequences of applying the methods to parallel NOR flash, parallel pSRAM, serial SQI NOR flash and NAND flash are described in detail. The NOR flash device designed with the method can be integrated with a NAND flash device on a same die in a combo flash device packaged in either an ONFI compatible NAND flash package or other standard NAND flash package.

Abstract: A semiconductor memory device and a layout structure of sub-word line control signal generators. The sub-word line control signal generators are configured to supply a sub-word line control signal of a predefined voltage level to a sub-word line driver to enable a sub-word line of a memory cell array. At least two sub-word line control signal generators are disposed, respectively, at edge areas of the memory cell array, to directly supply the sub-word line control signal to one selected sub-word line driver, thereby reducing the power consumption, including for example, VPP voltage. Embodiments of the present invention also reduce the number of VPP power lines, thereby lessening a noise disturbance.

Abstract: A memory accessing device includes a generator which generates K (K: an integer equal to or more than two) of address coefficients corresponding to a first mode whereas generates L (L: an integer more than K) of address coefficients corresponding to a second mode. A first converter converts each value of the address coefficients generated by the generator into a value of 1/M (M: an integer equal to or more than two). A creator creates address information based on the address coefficients generated by the generator corresponding to the first mode whereas creates address information based on address coefficients converted by the first converter corresponding to the second mode. An outputter outputs the address information created by the creator in order to access a memory provided with a plurality of addresses each of which has a bit width equivalent to any one of N bits and N/M bits.

Abstract: A semiconductor storage device includes an external terminal to which a first signal is supplied, a core circuit, and an access operation control circuit that generates a signal indicating an access operation mode to the core circuit for subsequent cycles based on a pulse width of the first signal.

Abstract: A semiconductor memory integrated circuit having an X-row controller which includes a high-speed-operation control circuit by which when receiving a bank active signal, a period for stopping a latch circuit from receiving the X address is produced after a predetermined time has elapsed, and in the other periods, the latch circuit receives and holds the X address; a low-current-operation control circuit by which when receiving no bank active signal, the latch circuit stops receiving the X address, and when receiving the bank active signal, the latch circuit holds the X address after a predetermined time has elapsed; a circuit for selecting whether the bank active signal is output to the high-speed-operation control circuit or the low-current-operation control circuit; and a circuit for selecting whether the latch-circuit control signal from the high-speed-operation control circuit or the latch-circuit control signal from the low-current-operation control circuit is output to the latch circuit.

Abstract: A semiconductor memory apparatus includes: an address buffer configured to buffer an input address and generate a buffered address; a command buffer configured to buffer a chip selection command and generate a buffered command; a latch control unit configured to receive an internal clock and the buffered command and generate a latch control signal; and an address latch unit configured to latch the buffered address based on the latch control signal.

Abstract: A non-volatile semiconductor memory circuit includes a memory cell array, and a verification sense amplifier controller configured to control switching devices, which receive external input data, depending on a level of the input data such that distribution voltage is changed when controlling a write operation by comparing the input data with cell data written in the memory cell array so as to provide cell data.

Abstract: Memory circuit includes; an array, row decoder, column decoder, addressing circuit to receive an address of the data bit, control logic receiving commands and transmitting control signals to memory system blocks, and sensing and write driver circuits coupled to a selected column. A hidden read compare circuit couples between the sensing circuit and write driver, which couples an error flag to the control logic circuit responsive to a comparison between a data bit in the input latch and a data-out read from the memory array. A write error address tag memory is responsive to the error flag and is coupled to the addressing circuit via a bidirectional bus. A data input output circuit having first and second bidirectional buses to transmit and receive said data bit is provided. Write error address tag memory stores the address if the error flag is set and provides the address during a re-write operation.

Abstract: For example, a semiconductor device includes latch circuits, whose input nodes are connected to an input selection circuit and whose output nodes are connected to an output selection circuit; and a control circuit, which controls the input selection circuit and the output selection circuit. The control circuit includes a shift register to generate an input pointer signal and a binary counter to generate an output pointer signal. The input selection circuit selects one of the latch circuits on the basis of a value of the input pointer signal. The output selection circuit selects one of the latch circuits on the basis of a value of the output pointer signal. Therefore, it is possible to prevent a hazard from occurring in the input selection circuit, as well as to reduce the number of signal lines that transmit the output pointer signal.

Abstract: A technique capable of manufacturing a semiconductor device without posing contamination in a manufacturing apparatus regarding a phase change memory including a memory cell array formed of memory cells using a storage element (RE) by a variable resistor and a select transistor (CT). A buffer cell is arranged between a sense amplifier (SA) and a memory cell array (MCA) and between a word driver (WDB) and the memory cell array. The buffer cell is formed of the resistive storage element (RE) and the select transistor (CT) same as those of the memory cell. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.

Abstract: A semiconductor device includes a first input circuit to which a first supply voltage is supplied, a second input circuit to which a second supply voltage that is lower than the first supply voltage is supplied, and a control circuit which activates the first input circuit in a first mode and activates the second input circuit in a second mode. The control circuit controls the first input circuit and the second input circuit such that the first input circuit and the second input circuit are activated during a certain time period when switching between the first mode and the second mode.

Abstract: An apparatus is provided that includes a plurality of array dies and at least two die interconnects. The first die interconnect is in electrical communication with a data port of a first array die and a data port of a second array die and not in electrical communication with data ports of a third array die. The second die interconnect is in electrical communication with a data port of the third array die and not in electrical communication with data ports of the first array die and the second array die. The apparatus includes a control die that includes a first data conduit configured to transmit a data signal to the first die interconnect and not to the second die interconnect, and at least a second data conduit configured to transmit the data signal to the second die interconnect and not to the first die interconnect.

Abstract: An address latch circuit of a semiconductor memory apparatus includes a control signal generating section configured to generate a control signal in response to an external command signal and a RAS idle signal, a clock control section configured to output a clock signal as a control clock signal when the control signal is enabled and to fix the control clock signal to a predetermined level when the control signal is disabled, and an address latch section configured to latch an address signal in response to the control clock signal.

Abstract: An address decoder that includes a plurality of predecoders configured to (i) receive and logically combine a clock signal and address signals and (ii) generate addresses and complementary addresses. At least one of the plurality of precoders includes a first logic gate configured to receive the clock signal and one of the address signals, and a second logic gate configured to receive the clock signal and an output of the first logic gate. The address decoder further includes a decoder configured to generate a decoder output based on the addresses and complementary addresses.

Abstract: A semiconductor memory storage device is disclosed, the memory comprises: a plurality of storage cells for storing data; at least two access control lines each for controlling access to a respective at least one of the plurality of storage cells; at least two access control circuits each for controlling a voltage level supplied to a corresponding one of the at least two access control lines in response to an access request, the at least two access control circuits each comprising a capacitor and switching circuitry; routing circuitry for routing the access request and a boost signal to a selected one of the at least two access control circuits in dependence upon an address associated with the access request; wherein the at least two access control circuits are each responsive to: receipt of the access request from the routing circuitry to connect the selected access control line to a supply voltage; and receipt of the boost signal from the routing circuitry to disconnect the supply voltage from the access con

Abstract: A system includes a memory controller and a plurality of memory devices connected in-series that communicate with the memory controller. Each of the memory devices has multiple independent serial ports for receiving and transmitting data. The memory controller a device address (DA) or ID number for designating a device that executes a command. Data contained in the command sent by the memory controller is captured by an individual link control circuit, in response to internally generated clock with appropriate latencies. The captured data is written into a corresponding memory bank. The data stored in one of a plurality of memory banks of one memory device is read in accordance with the addresses issued by the memory controller. The read data is propagated from the memory device through the series-connected memory devices to the memory controller.

Abstract: A method of operating a nonvolatile memory device includes supplying a variable voltage of a first voltage level to a selected page buffer and supplying the variable voltage to a first bit line, coupled to a selected memory cell selected for data reading, for a first time period, cutting off the supply of the variable voltage to the first bit line, after the first time period, and precharging the first bit line to a second voltage level through a sense node of the selected page buffer, which is in a precharge state, evaluating a voltage of the first bit line, after the precharging of the first bit line, so that the voltage of the first bit line is shifted according to a program state of the selected memory cell, and sensing the voltage of the evaluated first bit line and latching data in the selected memory cell.

Abstract: Wordline driving circuit of semiconductor memory device includes a bias generator configured to generate a threshold bias voltage for accessing data, an over-driver configured to increase the threshold bias voltage at an initial stage of a data accessing operation and a wordline driver configured to activate a wordline in response to the threshold bias voltage and a signal output from the over-driver.

Abstract: A semiconductor storage device includes an external terminal to which a first signal is supplied, a core circuit, and an access operation control circuit that generates a signal indicating an access operation mode to the core circuit for subsequent cycles based on a pulse width of the first signal.

Abstract: A system includes a memory controller adapted to output address signals, command signals and select signals; a plurality of memory modules; and a plurality of buses each corresponding to one of the memory modules. Each bus is adapted to transmit corresponding ones of the address signals, the command signals, and the select signals to the corresponding memory module. Each of the memory modules includes: a plurality of memory devices; and a register adapted to receive and buffer the corresponding command and address signals transmitted to the memory module, and adapted to transmit the buffered command signal to the memory devices which are to be accessed, in response to the corresponding select signal for accessing the memory devices.

Abstract: Memory design techniques are disclosed that provide a high compression ratio at no loss in speed. The techniques can be embodied, for instance, in heterojunction bipolar transistor (HBT) based ROMs. By embedding compression logic (e.g., XOR) functionality directly into the address decoders and sense amplifiers of the memory device, a high compression ratio is achieved at no loss in speed. For example, the logic-based compression functionality can be directly implemented into the buffers that form the address decoder as well as the sense amplifiers.

Abstract: A semiconductor memory device is provided that is capable of reading out mode register information stored in a register adapted for LPDDR2 (Low Power DDR2), through DQ pads. The semiconductor memory device includes a mode register control unit configured to receive address signals, a mode register write signal and a mode register read signal and generate a flag signal and at least one output information signal, and a global I/O line latch unit for transferring the output information signal to a global I/O line in response to the flag signal.

Abstract: An object is to provide a semiconductor device which includes a memory cell capable of holding accurate data even when the data is multilevel data. The semiconductor device includes a memory cell holding data in a node to which one of a source and a drain of a transistor whose channel region is formed from an oxide semiconductor. Note that the value of off-state current (leakage current) of the transistor is extremely small. Thus, after being set to have a predetermined value, the potential of the node can be kept constant or substantially constant by turning the transistor off. In this manner, accurate data can be stored in the memory cell.

Abstract: Disclosed is a memory device including self-ID information. The memory device has a storage unit for storing information related to the memory device, such as a manufacturing factory, a manufacturing date, a wafer number, coordinates on a wafer and the like. Each bank of the memory device stores self-ID information related to the memory device and outputs the self-ID information out of a chip when an address is applied thereto during a test mode.

Abstract: Disclosed is an input circuit of a semiconductor memory apparatus. The input circuit includes a first buffer and a second buffer. The first buffer has an input terminal connected with a first input pin for receiving a control signal used in a multi-control mode for controlling an entire memory area by dividing the entire memory area, and an output terminal having a first level according to a control mode signal. The second buffer has an input terminal connected with a second input pin for receiving one of plural signals used in a single control mode for controlling the entire memory area without dividing the entire memory area, and an output terminal having a second level according to the control mode signal.

Abstract: A plurality of cell arrays are assigned different addresses. An access information unit holds access enable information indicating the number of the cell arrays to be simultaneously activated. An array control unit activates at least one of the cell arrays corresponding to the access enable information, in response to an access request, and forcibly activates at least one of the cell arrays not corresponding to the access enable information, in response to a forced access request. Consequently, it is possible to activate the inactivated cell array not corresponding to the access enable information before the supply of the access request. Therefore, even when the number of the cell arrays to be simultaneously activated is small, it is possible to execute access operations without interruption. As a result, it is possible to access the cell arrays with minimum power consumption without lowering access efficiency.

Abstract: A semiconductor memory device includes a controller, a plurality of substrates, and a plurality of stacked memories that are spaced apart and sequence on each of the substrates. Each of the stacked memories includes an interface chip that is connected to the respective substrate and a plurality of memory chips that are stacked on the interface chip. The controller is configured to control the stacked memories. The interface chips are configured to forward a command signal from the controller through each interface chip in the sequence of stacked memories that is intervening between the controller and a selected stacked memory to which the command signal is directed.

Abstract: A semiconductor memory device comprises a memory cell array including a plurality of mutually intersecting word lines and bit lines, and a plurality of memory cells connected at intersections thereof and each having a read port and a write port provided independently; and a plurality of word line drivers operative to drive the word lines. The elements contained in the memory cell have respective sizes in common with the elements contained in the word line driver.

Abstract: A semiconductor device includes a system clock input unit configured to receive a system clock for synchronizing input times of an address signal and a command signal from a memory controller, a data clock input unit configured to receive first and second data clocks for synchronizing an input/output time of a data signal from the memory controller, wherein a phase of the second data clock is shifted according to a training information signal, and the second data clock having the shifted phase is inputted to the data clock input unit, and a phase detection unit configured to detect a logic level of the second data clock based on an edge of the first data clock, and generate the training information signal to transmit the generated signal to the memory controller according to the detected logic level.

Abstract: In a semiconductor memory device which uses a same pad for an address input and data input/output, and has an input circuit and data output circuit connected to the pad, an output of the data output circuit is turned to a high impedance state in accordance with a chip enable signal, output enable signal, and address capture signal, at a stand-by time, output disable time, and address capture period, and thereby, it becomes possible to start an internal read operation even before the address capture period is finished, and a high-speed operation becomes possible.