Abstract: A reservoir unit which is included as an element along a circulation path of a cooling system includes a cartridge and a cartridge loading unit which are configured to be removable from each other. The cartridge includes a reservoir chamber that stores a circulating liquid, and a connection portion in fluid communication with the reservoir chamber. The cartridge loading unit includes a connection receiving portion, to which the connection portion is connected, and a connection port. When the cartridge and the cartridge loading unit are attached to each other, the connection portion, the connection receiving portion and the connection port form a feed path that allows feeding the circulating liquid to the circulation path outside, and a collection path that allows collecting the circulating liquid into the reservoir chamber.

Abstract: A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapor compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapor compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapor compression loop before the second electronic component is cooled and after the first electronic component is cooled.

Abstract: A mount for an optical element such as in a laser, optical amplifier, or other optical system, is disclosed. The mount is a mounting vane (100) for cooling the optical element (125) by a fluid stream. The optical element may be a gain medium generating heat. The mounting vane comprises: an input section with a leading edge (110) for meeting the fluid stream; a diffuser section (130) which tapers to a trailing edge (135); and a Direction of plane section (120) with an aperture for receiving the optical element (125) for cooling by the fluid stream, the plane section arranged between the input section and diffuser section, wherein the diffuser section (130) includes one or more flow guiding fins (140) protruding from the diffuser section. The mounting vane may be stacked with a plurality of other mounting vanes in a manifold. The shape of the vane plate results in a turbulent fluid flow improving the heat exchange between a laser disc heated by optical pumping and a cryogenic He gas used for cooling.

Abstract: A semiconductor laser bar 2 is mounted onto a liquid-cooled heat sink 1. A molybdenum reinforcement member 3 is fixed onto the surface opposite to the surface on which the semiconductor laser module 2 is mounted. The molybdenum has a linear expansion coefficient less than that of the heat sink 1. Sub-mounts are preferably made of a Cu—W alloy, more preferably of the reinforcement member 3 molybdenum. In this case, the stresses that are imposed on the heat sink 1 when being expanded or contracted can cancel each other out.

Abstract: A laser diode grid element comprising laser diodes arranged along a corresponding substantially flat surface; and a collimator for each laser diode for generating collimated light beams substantially perpendicular on the respective substantially flat surface. The laser diodes are comprised in standard packages including a base plate serving as cooling surface of the laser diode, a metal housing arranged on the base plate to protect the laser diode, and at least two driving pins which extend from the laser diode through the base plate and which are used for driving the laser diode within the package. The laser diode grid element includes a heat sink arranged in contact with the base plates, and the at least two driving pins of each laser diode extend at least partially through the heat sink. Also provided are light emitting systems comprising such grid elements, and an optical component for use in such system.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium.

Abstract: A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapour compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapour compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapour compression loop before the second electronic component is cooled and after the first electronic component is cooled.

Abstract: In one embodiment, the instant invention is an optical structure that includes: an optical active medium of a solid state laser, where the optical active medium has a first coefficient of thermal expansion; and a protective structure that is directly cladded a portion of the optical active medium, where the protective structure has a second coefficient of thermal expansion which matches the first coefficient of thermal expansion of the optical active medium, and where the protective structure is transparent to a wavelength that is within an absorption band of the optical active medium so that the optical structure has: the optical active medium that is protected from a physical damage, and the optical active medium that is capable of generating a laser beam having a first energy that is larger than a second energy generated by a control optical structure having the optical active medium without the protective structure.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: A gas laser includes discharge tubes connected to together by corner housings, each corner housing including a first cooling channel configured to allow flow of a first coolant. A heat exchanger circuit includes a plurality of second cooling channels configured to allow flow of a second coolant. Each second cooling channel is operable to cool laser gas prior to the laser gas entering into one of the corner housings. The gas laser further includes a temperature control device, in which the temperature control device is selected from the group consisting of a laser gas cooling device, a coolant temperature control assembly, and combinations thereof. The temperature control device is operable to maintain a temperature difference of less than approximately 5 K between the first coolant flowing through the first cooling channel of the corner housing and the laser gas entering into the corner housing.

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: The invention relates to a laser device (10) comprising at least one laser unit (20) for generating laser light, and cooling means (30) for cooling said laser unit, said cooling means including a channel arrangement (35) through which a cooling fluid is circulated for transferring heat away from the laser unit. The laser device is characterized in that a mounting member (46) for releasably holding a fluid container (50) is provided, the mounting member comprises a first connector element(42) for connecting to a second connector element (44) of the fluid container in a fluid tight manner, and the mounting member is connected with the channel arrangement. The invention further relates to a fluid container for cooling fluid for use in the laser device. The fluid container is designed as a cartridge (50) and comprises an information storage means (60) for storing information about the container and the cooling fluid filled in said fluid container.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: An OPS-chip is soldered mirror-structure-side down on an upper surface of diamond-heat spreader. A metal frame is also soldered to the upper surface of the heat-spreader. The lower surface of the diamond heat-spreader is either soldered to, or clamped against, a surface of a heat-sink. The dimensions of the frame and the heat spreader are selected such that at a solidification temperature of the solder at the center of the upper surface of the heat-spreader has an effective CTE comparable with that of the OPS-chip. The lower surface of the heat-spreader can be soldered to the heat sink surface or clamped against the heat-sink surface by the frame.

Abstract: A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.

Abstract: A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: Systems and methods for providing a low stress electrode connection capable of carrying a high electrical current to an edge-emitting device, such as a laser diode are described. Systems and methods for providing mechanisms to allow precise adjustment of the relative position of one heat-sink for an optical edge emitting device relative to an adjacent heat-sink in a stack of heat-sinks are also provided herein.

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.

Abstract: A laser device for emitting waves in a frequency range belonging to the terahertz range, includes the following, in combination: a wave guide extending longitudinally along an axis A-A?; a superconducting coil arranged coaxially to the wave guide and arranged at a first end of the wave guide; a p-Ge p-doped germanium crystal arranged inside the coil such that the turns of the superconducting coil at least partially surround the p-Ge crystal; a cooling device containing a coolant, the superconducting coil and the p-Ge crystal being arranged in the cooling device, and the wave guide partially extending outside the cooling device; and removing the coolant from the wave guide.

Abstract: There is provided a semiconductor laser device including a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated, a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed, and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.

Abstract: Cooling arrangement for laser-active solid-state materials, laser arrangement and method for cooling a laser-active solid-state material. The invention relates in particular to a cooling arrangement for the active liquid cooling of a laser-active solid-state material. In order to achieve an advantageous cooling effect, it is proposed to use a nozzle unit which is formed and adapted in order to subject the laser-active solid-state material to a directed coolant jet.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

Abstract: A laser including a semiconductor laser stack group, a beam compositor, a pump beam collimator, a thin-disk laser crystal, a first and a second parabolic reflectors with the same facial contour function, a corrective reflector, an output mirror, and a jet-flow impact cooling system. The thin-disk laser crystal and the output mirror form a laser resonant cavity. The first parabolic reflector, second parabolic reflector, thin-disk laser crystal, and corrective reflector form a multi-pumping focus cavity. The jet-flow impact cooling system is used for cooling the thin-disk laser crystal. The pump light produced by the semiconductor laser stack group is composited by the beam compositor, collimated by the pump light collimator, and enters the multi-pumping focus cavity. Within the multi-pumping focus cavity, the pump light is focused, collimated, and deflected to converge on the thin-disk laser crystal. The laser resonant cavity produces and outputs a laser beam.

Abstract: A window unit may include: a window configured to allow a laser beam to be transmitted therethrough; and a holder for holding the window at a periphery thereof, the holder being provided with a flow channel thereinside configured to allow a fluid to flow.

Abstract: This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A compact CO2 slab-laser is contained in a fluid cooled housing having three compartments. One compartment houses discharge electrodes and a laser resonator. Another compartment houses a radio-frequency power supply (RFPS) assembled on a fluid-cooled chill plate and an impedance-matching network. The remaining compartment houses beam-conditioning optics including a spatial filter. The housing and RFPS chill-plate are on a common coolant-fluid circuit having a single input and a single output. The spatial filter is optionally fluid-coolable on the common coolant fluid circuit.

Abstract: A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: A laser system having a cooling apparatus is disclosed. The laser system includes a resonator, a gain medium and multiple heat-absorbing discs. The resonator is formed by a first mirror and a second mirror. The gain medium, which is contained within the resonator, is collectively formed by a group of gain medium segments. Each of the gain medium segments is preferably in the shape of a cylindrical disc. The heat-absorbing discs are interleavely disposed among the gain medium segments to provide face cooling for the gain medium segments during the operation of the laser system.

Abstract: The different advantageous embodiments provide an apparatus and method comprising a substrate configured to increase an intensity of light at a desired wavelength. The substrate has a front side, a back side, and an outer edge. The substrate is configured to reflect the light received on the front side of the substrate. The substrate comprises ceramic. The substrate comprises a plurality of sections. The method and apparatus also comprise a material configured to attenuate the light passing between the plurality of sections. The material surrounds an edge of each section of the plurality of sections. The apparatus and method also comprise a cooling system configured to allow liquid nitrogen to be transmitted through the cooling system and receive heat generated in the substrate from the back side of the substrate.

Abstract: A spherical laser includes a transparent or semi-transparent outer spherical vessel having an internal cavity, an amplifying medium in the cavity, and means to excite the amplifying medium. The sphere is provided with a partially reflective coating to act as a spherical optical resonator. The spherical resonator includes a plurality of optically different regions containing alternative optical media from the cavity medium differing in bulk optical parameters utilized for mode tailoring. The optically different regions work collectively to exclude the whispering gallery modes from those supported by the spherical cavity. Excitation of the amplifying medium produces an optical gain. When the gain exceeds cavity losses and threshold conditions are met, lasing is supported. This creates a three-dimensional, spherically radiating emission, emulating a point source. The sphere is enclosed within a mirrored ellipse to image the output to a point, or within a mirrored parabola to columinate the emission.

Abstract: A diode pumped solid-state laser for high shock, high vibration environments such as those found in laser ignition systems for artillery systems which internally integrate into the breech of an artillery system such as a 155 mm howitzer. The diode pumped solid-state laser employs a unique gain medium mounting which permits its use in such high shock/high vibration environments. Contributing further to robustness is a monolithic design based on diode arrays mounted in a linear configuration along with an advanced polycrystalline gain medium laser rod. Advantageously, and in sharp contrast to laser ignition systems incorporating flash lamps, the diode pumped solid-state laser of the present invention permits a seamless integration into a howitzer artillery weapons system without other complex mounting provisions or shock isolation system(s).

Abstract: A wavelength conversion device may include a wavelength conversion element that converts an entering first laser beam into a second laser beam by wavelength conversion, and a cooling mechanism that cools the wavelength conversion element from at least one surface of the wavelength conversion element.

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: A semiconductor laser bar 2 is mounted onto a liquid-cooled heat sink 1. A molybdenum reinforcement member 3 is fixed onto the surface opposite to the surface on which the semiconductor laser module 2 is mounted. The molybdenum has a linear expansion coefficient less than that of the heat sink 1. Sub-mounts are preferably made of a Cu—W alloy, more preferably of the reinforcement member 3 molybdenum. In this case, the stresses that are imposed on the heat sink 1 when being expanded or contracted can cancel each other out.

Abstract: A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Abstract: A compact CO2 slab-laser is contained in a fluid cooled housing having three compartments. One compartment houses discharge electrodes and a laser resonator. Another compartment houses a radio-frequency power supply (RFPS) assembled on a fluid-cooled chill plate and an impedance-matching network. The remaining compartment houses beam-conditioning optics including a spatial filter. The housing and RFPS chill-plate are on a common coolant-fluid circuit having a single input and a single output. The spatial filter is optionally fluid-coolable on the common coolant fluid circuit.

Abstract: A laser element includes a laser rod and a thermally conductive jacket on an exterior surface of the laser rod. The thermally conductive jacket assists in dissipating heat generated in the laser rod during the application of pump energy to the laser rod.

Abstract: A laser system includes a laser element, a pump source configured to input light to the laser element, a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first pump configured to drive a first flow of cooling liquid through a first fluid pathway, a first primary heat exchanger configured to cool the first flow of cooling liquid, and a laser element heat exchanger configured to remove heat from the laser element using the first flow of cooling liquid. The second cooling circuit includes a second pump configured to drive a flow of cooling liquid through a second fluid pathway, a second primary heat exchanger configured to cool the second flow of cooling liquid, and a pump source heat exchanger configured to remove heat from the pump source using the first and second flows of cooling liquid.

Abstract: A laser diode arrangement having a multiplicity of laser diodes (11) arranged along side one another, comprises a heat sink (9) on which the laser diodes (11) are mounted and a cooling body (1) which is in intimate contact with the heat sink (9), wherein the cooling body (1) has two coolant channels (2; 3), which run parallel to the longitudinal axis of the heat sink (9) and are embodied as a feed channel (2) and as a discharge channel (3) for a coolant. According to the invention a multiplicity of cooling channels (5, 7; 6, 8) lying along side one another are provided, which branch off from the feed channel (2), lead past the heat sink (9), and open into the discharge channel (3), wherein cooling channels (5, 7; 6, 8) lying directly alongside one another branch off at different locations of the periphery of the feed channel (2) and of the discharge channel (3).

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

Abstract: A thermal management apparatus and method for a solid-state laser system enabling the laser system to have near isothermal temperatures across and throughout a solid-state gain material, by mechanically controlling an oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K; bonding a solid-state lasing crystal or ceramic to the mechanically controlled oscillating heat pipe; and providing a supporting structure including a surface bonded to the solid-state lasing crystal or ceramic that matches the coefficient of thermal expansion of both the solid-state lasing crystal or ceramic and the mechanically controlled oscillating heat pipe.

Abstract: The different advantageous embodiments provide an apparatus and method comprising a substrate configured to increase an intensity of light at a desired wavelength. The substrate has a front side, a back side, and an outer edge. The substrate is configured to reflect the light received on the front side of the substrate. The substrate comprises ceramic. The substrate comprises a plurality of sections. The method and apparatus also comprise a material configured to attenuate the light passing between the plurality of sections. The material surrounds an edge of each section of the plurality of sections. The apparatus and method also comprise a cooling system configured to allow liquid nitrogen to be transmitted through the cooling system and receive heat generated in the substrate from the back side of the substrate.

Abstract: Various embodiments are disclosed for a thermal management system and related method for selectively thermally isolating and thermally connecting a target component. One embodiment of a system includes a first component having a first surface proximate to a target component, and an electromagnet between the first surface and the target component. A second component is spaced apart from the first component to form a gap that serves as a thermal boundary between the first component and the second component. A carrier fluid disposed within the gap includes multiple thermally conductive, ferrous particles. The carrier fluid is configured to align at least a portion of the thermally conductive, ferrous particles when the electromagnet generates a magnetic field that attracts the particles, and to displace at least a portion of the particles when the electromagnet generates a magnetic field that repels the particles.

Abstract: A system for cooling a semiconductor light source bar during burn-in testing includes a fixture for holding the semiconductor light source bar, and the fixture including a housing having a water inlet channel and a water outlet channel communicated with the water inlet channel; a first water tank with coolant connected with the water inlet channel; a second water tank connected with the water outlet channel; and a pumping device at least connected with the water outlet channel for pumping the coolant from the first water tank to the second water tank, thereby rushing a bottom of the semiconductor light source bar to lower the temperature thereof. The system can disperse the local heat generated during burn-in testing and uniform the local temperature of the semiconductor light source bar, thereby maintaining a proper temperature during burn-in testing and improving the heat stability of the heat assist magnetic recording head.

Abstract: A temperature controller for a gas laser which controls temperatures of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion and each second temperature-controlled portion in parallel.

Abstract: A diode-laser bar package includes a diamond composite heat-sink on which is soft-solder bonded a copper-pad having an area much greater than that of the diode-laser bar. A constraining-block of a metal having a CTE matching that of the diode-laser bar is hard-solder bonded to the conductive pad. The constraining-block is configured such that the conductive pad in the region of the diode-laser bar has a CTE about equal to that of the constraining-block, and, accordingly, the diode-laser bar.