Abstract: Illuminator module comprising VCSEL arrays with planar electrical contacts, readily adaptable for surface mounting, is provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate. Different shapes of illuminator modules may be configured by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc.

Abstract: The different advantageous embodiments provide an apparatus and method comprising a substrate configured to increase an intensity of light at a desired wavelength. The substrate has a front side, a back side, and an outer edge. The substrate is configured to reflect the light received on the front side of the substrate. The substrate comprises ceramic. The substrate comprises a plurality of sections. The method and apparatus also comprise a material configured to attenuate the light passing between the plurality of sections. The material surrounds an edge of each section of the plurality of sections. The apparatus and method also comprise a cooling system configured to allow liquid nitrogen to be transmitted through the cooling system and receive heat generated in the substrate from the back side of the substrate.

Abstract: A system and method for cooling an optical fiber includes a flexible heat sink member, a heat pipe evaporator, and a thermal storage medium. The flexible heat sink member is in thermal contact with the optical fiber. The heat pipe evaporator is configured to dissipate heat from the optical fiber. The thermal storage medium is in thermal contact with the flexible heat sink member and the heat pipe evaporator. The flexible heat sink member is configured to compensate for any mismatch in coefficient of thermal expansion between material of the optical fiber and material of the flexible heat sink member so as to provide radial compliance and to maintain direct thermal contact between the optical fiber and the flexible heat sink member.

Abstract: The present invention relates to a method and system for repairing and refurbishing a microplate reader of the Flipr type which has a water cooled argon laser light source. The old laser is removed and replaced with a high power (300 to 500 mW) air cooled solid state laser as a replacement place on its own support and focused and wired to replace the old laser. The new product operates at lower power consumption yet provides accurate measurements.

Abstract: A compact, light weight laser beam combiner includes a pair of concentric annular shells defining an annular cavity of an annular ring resonator having an annular solid laser gain medium disposed therein. The output ends of a plurality of low power and brightness fiber lasers are coupled into the cavity of the resonator such that fiber laser beams cause the gain medium in the resonator cavity to lase and produce an annular beam of laser light. Optical elements of the resonator are operable to feed a first portion of the laser light back through the resonator cavity to support regenerative lasing of the laser medium and to couple off a second portion of the laser light in the form of a circular beam of high power and high brightness laser light. A fluid may be circulated through the resonator cavity to cool the laser medium.

Abstract: A gas laser includes discharge tubes connected to together by corner housings, each corner housing including a first cooling channel configured to allow flow of a first coolant. A heat exchanger circuit includes a plurality of second cooling channels configured to allow flow of a second coolant. Each second cooling channel is operable to cool laser gas prior to the laser gas entering into one of the corner housings. The gas laser further includes a temperature control device, in which the temperature control device is selected from the group consisting of a laser gas cooling device, a coolant temperature control assembly, and combinations thereof. The temperature control device is operable to maintain a temperature difference of less than approximately 5 K between the first coolant flowing through the first cooling channel of the corner housing and the laser gas entering into the corner housing.

Abstract: A laser diode grid element comprising laser diodes arranged along a corresponding substantially flat surface; and a collimator for each laser diode for generating collimated light beams substantially perpendicular on the respective substantially flat surface. The laser diodes are comprised in standard packages including a base plate serving as cooling surface of the laser diode, a metal housing arranged on the base plate to protect the laser diode, and at least two driving pins which extend from the laser diode through the base plate and which are used for driving the laser diode within the package. The laser diode grid element includes a heat sink arranged in contact with the base plates, and the at least two driving pins of each laser diode extend at least partially through the heat sink. Also provided are light emitting systems comprising such grid elements, and an optical component for use in such system.

Abstract: A wavelength conversion laser light source includes an element temperature switching section that switches a temperature of the wavelength conversion element according to a harmonic wave output value as set in an output setting device, and the element temperature switching section for switching a temperature of a wavelength conversion element according to a harmonic wave output level as set in the output setting device. The element temperature switch section includes an element temperature holding section that holds the wavelength conversion element at the temperature as switched by the element temperature switching section.

Abstract: A device for emitting a laser beam comprises a cylindrical solid amplifier medium, having a fluorescence wavelength ?, delimited by a surface ? connecting two faces and intended to be pumped through both the faces, or one of them, in order to become a gain medium. It comprises a cooling fluid of thermal conductivity Cr in contact with the amplifier medium over one of the faces, and an index matching liquid that absorbs or scatters the fluorescence wavelength, of thermal conductivity Ci<0.3 Cr, in contact with the amplifier medium over its surface ?.

Abstract: The semiconductor laser device of the present invention has a structure that allows a cooling medium to be directly fed into heatsink disposed inside package. Besides, the structure ensures that the inside of package is kept at hermetically sealed condition. The structure suppresses temperature rise in semiconductor laser element and package, enhancing the reliability and quality of the semiconductor laser device. At the same time, a high-power semiconductor laser element can be employed.

Abstract: The invention is a method and apparatus for creating marks on an anodized aluminum specimen with selectable color and optical density. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters. The laser marking system is directed to produce laser pulses having laser pulse parameters associated with the desired color and optical density in the presence of a fluid directed to the surface of the anodized aluminum specimen while marking.

Abstract: The present embodiment provides a thin disk laser disk element having improved direct cooling through the use of a barrier material directly attached to the high reflectivity layer of the thin disk element. This barrier is needed due to noticeable degradation of the reflectivity of the thin disk element without the barrier material. A barrier material of sapphire (crystalline Al2O3) is preferable, given a desire to have adequate thermal conductivity through the barrier material, proper matching of the coefficient of thermal expansion with the other components of the thin disk, and to save monetary costs. In another preferred embodiment, an intermediate layer is interposed between the thin disk element and the barrier material to provide improved adhesion between the barrier material and the thin disk element. Preferred crystallographic orientations for sapphire barrier material are provided as well.

Abstract: A wavelength conversion device may include a wavelength conversion element that converts an entering first laser beam into a second laser beam by wavelength conversion, and a cooling mechanism that cools the wavelength conversion element from at least one surface of the wavelength conversion element.

Abstract: A laser diode arrangement having a multiplicity of laser diodes (11) arranged along side one another, comprises a heat sink (9) on which the laser diodes (11) are mounted and a cooling body (1) which is in intimate contact with the heat sink (9), wherein the cooling body (1) has two coolant channels (2; 3), which run parallel to the longitudinal axis of the heat sink (9) and are embodied as a feed channel (2) and as a discharge channel (3) for a coolant. According to the invention a multiplicity of cooling channels (5, 7; 6, 8) lying along side one another are provided, which branch off from the feed channel (2), lead past the heat sink (9), and open into the discharge channel (3), wherein cooling channels (5, 7; 6, 8) lying directly alongside one another branch off at different locations of the periphery of the feed channel (2) and of the discharge channel (3).

Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

Abstract: A device for emitting a laser beam comprises a cylindrical solid amplifier medium, having a fluorescence wavelength ?, delimited by a surface ? connecting two faces and intended to be pumped through both the faces, or one of them, in order to become a gain medium. It comprises a cooling fluid of thermal conductivity Cr in contact with the amplifier medium over one of the faces, and an index matching liquid that absorbs or scatters the fluorescence wavelength, of thermal conductivity Ci<0.3 Cr, in contact with the amplifier medium over its surface ?.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: A carbon-dioxide (CO2) gas-discharge slab laser includes elongated discharge-electrodes in a sealed enclosure. Radio Frequency (RF) power is supplied to the electrodes via an impedance matching network and a co-axial electrical low inductance transmission line feed-through sealed to the enclosure. The feed-trough includes two spring contacts which are configured to be spring compression push-fit in grooves in edges of the discharge-electrodes. A central conductor of the feed-through is fluid cooled. A capacitor of the impedance matching network is assembled on the central conductor as an integral part of the feed-trough.

Abstract: The present invention relates to an amplification device comprising an amplifying medium (2) of parallelepiped shape and pumping means comprising lamps (5) emitting first radiation in a frequency range useful for the amplification and second radiation capable of degrading the amplifying medium. It is characterized in that lamps (5) are integrated into a jacket (3) that absorbs at least some of the second radiation.

Abstract: A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.

Abstract: A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.

Abstract: This invention provides a p-type group III nitride semiconductor, with good p-type properties, having a composition expressed by AlXGaYInZN in which each of X, Y and Z indicates a rational number satisfying a relationship of X+Y+Z=1.0, even if Al content is as high as 1.0>X?0.5. It is achieved that a proportion of a hole concentration at 30° C. to an acceptor impurity atom concentration is 0.001 or more in the p-type group III nitride semiconductor of the invention, by doping acceptor impurity atoms such as Mg in concentration of 5×1018 to 1×1020 cm?3 using the method, for example, MOCVD with attention not to incorporate an impurity atom other than the acceptor impurity atom or not to form dislocation in the crystal when producing the group III nitride semiconductor expressed by the above composition.

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source such as a pump and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. A plurality of laser diode emitters are disposed on the mounting surface of the pump layer circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit of the pump layer. The intermediate layer is in contact with the bottom surface of the pump layer. A middle layer has a plurality of micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer in contact with the intermediate layer.

Abstract: A thermal management apparatus and method for a thin disk laser system enabling the laser system to have near isothermal temperatures across and throughout a thin disk comprising a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K that promotes near isothermal conditions in lasing of the thin disk, a thin disk lasing crystal or ceramic bonded to the mechanically controlled oscillating heat pipe, and a supporting structure including a surface bonded to the thin disk that matches the CTE (coefficient of thermal expansion) of both materials.

Abstract: A semiconductor laser device has a heat sink of which multiple laminated plates are constituted and a semiconductor laser element mounted on upper surface of the heat sink. The heat sink has a channel in which a coolant flows inside thereof. The heat sink includes a channel-forming plate portion that forms the channel and a mounting plate portion that forms an upper surface of the heat sink that comes into contact with the channel. The mounting plate portion is made of material having a thermal expansion coefficient, which is closer to that of the semiconductor laser element than that of the channel-forming plate portion.

Abstract: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Abstract: An exemplary water jet guided laser device includes a water-ejecting device and a hollow light guide pipe. The water-ejecting device has a water chamber, a light incident through hole and a water-ejecting through hole defined at opposite sides thereof. The light incident through hole and the water-ejecting through hole are in communication with the water chamber. The water-ejecting device is configured for ejecting water from the water chamber through the water-ejecting through hole. The light incident through hole is configured for introducing a laser beam in the water chamber. The hollow light guide pipe is mounted in the water chamber and aligned with the light incident through hole and the water-ejecting through hole. The light guide pipe is watertight and is configured for receiving and guiding the laser beam from the light incident through hole to the water-ejecting through hole.

Abstract: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Abstract: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Abstract: A device for cooling optical components based on optical fibers for transmitting high optical power. The device includes one or more cavities with a flowing coolant to take care of optical power loss. The device includes a transmitting construction material having a low heat expansion coefficient arranged in direct connection with the optical components and arranged to transmit power loss radiation into the cavity which is flushed with the flowing coolant. The transmitting construction material is made as a transparent tube and surrounded by a tubular casing of a non-transparent material having a good absorption capacity so that the cavity is formed between the two materials.

Abstract: This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A beam alignment chamber extending in a length direction comprising a base having a front edge, and two side edges, first and second opposed side walls connected to the base, and extending along the length of the base, a front wall located at the front edge of the base having an output opening. The beam alignment chamber further comprises a plurality of arrays of light sources disposed to direct light beams through the first or second side walls, and a plurality of reflectors mounted on the base, each having independent yaw and pitch adjustments, each reflector being paired with a corresponding array of light sources, the base-mounted reflectors being disposed to direct the light beams along the length of the beam alignment chamber through the output opening forming an aligned two-dimensional array of parallel light beams.

Abstract: A light projection optical system is presented. The system comprises a cooling chamber containing: a light source operative at a cool temperature being lower than 240K; a cooler unit capable of cooling said light source to said cool temperature during the light source operation,- an optical window permitting light emergence outside from the cooling chamber; and an optical unit accommodated in the optical path of light emitted by said light source and enabling emergence of this light through said optical window outside from the cooling chamber.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: The field of the invention is that of high-energy laser beam amplifiers and associated optical pumping devices. The object of the invention is to use an amplifier configuration and a cooling means which do not have the drawbacks of cryogenic systems that have been used up until now and which however make it possible both to obtain an amplified laser beam of high quality and to minimize transverse lasing effects. A laser beam amplifying device according to the invention combines four main principles, which are use of a crystal exhibiting circular symmetry so as to distribute the mechanical stresses radially; cooling of the entire external surface by a cooling liquid, so as to avoid the use of cryogenic techniques; use of a matching liquid so as to avoid transverse lasing effects; and use of pump laser beams with uniform energy distribution.

Abstract: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Abstract: A wavelength conversion laser light source includes: an element temperature switching section that switches a temperature of the wavelength conversion element according to a harmonic wave output value as set in an output setting device, and the element temperature switching section for switching a temperature of a wavelength conversion element according to a harmonic wave output level as set in the output setting device, wherein the element temperature switch section includes an element temperature holding section that holds the wavelength conversion element at the temperature as switched by the element temperature switching section.

Abstract: Methods and systems are disclosed for cooling a laser, such as a high average power (HAP) solid state laser (SSL). A coolant that has been heated from previous use can be conditioned by transferring heat from the coolant to a phase change medium. The conditioned coolant can then be re-used to cool the laser. In this manner, a low cost, lightweight, compact cooling system that generates comparatively quiescent flow at comparatively high flow rates can be provided.

Abstract: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

Abstract: The present invention relates to a surface-emitting semiconductor laser having a vertical resonator, comprising a substrate base section (1) and a mesa (M) arranged on and/or at the substrate base section, the mesa substantially comprising, viewed perpendicular to the substrate base section: at least one part of a first doting region (2) facing the substrate base section, at least one part of a second doping region (4) facing away from the substrate base section, and an active region (3) arranged between the first and the second doping regions, said active region having at least one active layer (A) with a laser-emitting zone, emitting substantially perpendicular to the active layer, characterized in that the mesa (M) comprises in at least one partial section of the side flank thereof at least one constriction (E).

Abstract: A thermal management apparatus and method for a thin disk laser system enabling the laser system to have near isothermal temperatures across and throughout a thin disk comprising a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K that promotes near isothermal conditions in lasing of the thin disk, a thin disk lasing crystal or ceramic bonded to the mechanically controlled oscillating heat pipe, and a supporting structure including a surface bonded to the thin disk that matches the CTE (coefficient of thermal expansion) of both materials.

Abstract: A compact, light weight laser beam combiner includes a pair of concentric annular shells defining an annular cavity of an annular ring resonator having an annular solid laser gain medium disposed therein. The output ends of a plurality of low power and brightness fiber lasers are coupled into the cavity of the resonator such that fiber laser beams cause the gain medium in the resonator cavity to lase and produce an annular beam of laser light. Optical elements of the resonator are operable to feed a first portion of the laser light back through the resonator cavity to support regenerative lasing of the laser medium and to couple off a second portion of the laser light in the form of a circular beam of high power and high brightness laser light. A fluid may be circulated through the resonator cavity to cool the laser medium.

Abstract: Systems and methods for controlling a thermoelectric cooler (TEC) in an optical transceiver. A TEC system includes a processor that interacts with a power supply and a TEC controller to prevent inrush current. The power supply is switched by the processor and turned on only at a particular time. The power supply has a relatively large time constant such that it ramps slowly to its full value. In the meantime, the processor and TEC controller cause the temperature to ramp to a target value by repeatedly incrementing or decrementing a target value over time and by controlling when the maximum available voltage can be applied to the TEC.

Abstract: A laser light source apparatus includes a laser light source; a heat exchanger that includes a plurality of cooling fins and that cools the laser light source; a driving circuit that drives the laser light source; a housing including an intake port and an exhaust port; and an air-cooling fan that is attached to the housing and that discharges air taken in from the intake port to the exhaust port. The cooling fins are arranged at a position opposed to the intake port to be stacked up on each other at predetermined intervals and a pitch between the cooling fins is equal to or less than a minimum width of the intake port.

Abstract: A digital image projector includes a light assembly configured to project light along a light path from at least one laser array light source, the projected light having an overlapping far field illumination in a far field illumination portion of the light path; a temporally varying optical phase shifting device configured to be in the light path; an optical integrator configured to be in the light path; a spatial light modulator located downstream of the temporally varying optical phase shifting device and the optical integrator in the light path, the spatial light modulator configured to be located in the far field illumination portion of the light path; and projection optics located downstream of the spatial light modulator in the light path, the projection optics configured to direct substantially speckle free light from the spatial light modulator toward a display surface.

Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: An integrated, low profile, high power laser light emission device is disclosed. The integrated laser light emission device provides uniform heat dissipation, as well as uniform pumping of the laser gain medium without the need for a pumping cavity. The laser system includes a pump diode array that can be mounted directly to a laser gain medium without intervening correcting optics hardware. Heat generated by the laser light emission device is cooled by a single cooling system. In the laser device, a pump diode array is preferably a Vertical-Cavity Surface-Emitting Laser (VCSEL) array. VCSEL arrays are mounted on the laser gain crystal by a metal cavity frame or metal stilts. The slightly elevated mounting of the VCSEL's enables increased cooling and maximizing the quantity of VCSEL's on the laser gain medium in order to achieve highly efficient and high power laser light output.

Abstract: A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.

Abstract: A laser oscillator for improving efficiency of conversion from solar rays to laser beams is provided. The laser oscillator includes: a laser medium 31 excited by solar rays S to output laser beams; an output mirror 35 having a concave surface 35a opposed to an output end of the laser medium 31; and a light guide 20 having a reflector 22 extending from the output end of the laser medium 31 towards the outside of the laser medium 31 and reflecting the solar rays Sf to guide them to the laser medium 31.