Abstract: The present invention relates to an apparatus and method for measuring the convective heat transfer coefficients of nanofluids, which can realize a small-sized structure and can accurately control the movement velocity of a hot wire sensor within a fluid. The apparatus for measuring the convective heat transfer coefficients of nanofluids according to the present invention includes a sensor unit, a transfer unit and a liquid container. The transfer unit is formed on the sensor unit and is configured to allow the sensor unit to longitudinally reciprocate in a direction parallel to a ground surface with the sensor unit spaced apart from the ground surface. The liquid container is arranged below and spaced apart from the sensor unit, and is configured to allow a nanofluid or a base fluid, a convective heat transfer coefficient of which needs to be measured, to be put therein.

Abstract: The present invention relates to a material screening apparatus, and more particularly, to a material screening apparatus that senses temperature change according to the thermal characteristics of the material to be screened so as to extract a thermal characteristic value for the material and determine the type of the material. The material screening apparatus according to an embodiment of the present invention comprises: a plurality of heat generators for variably generating heat; a plurality of temperature sensors attached to the heat generators, respectively, for measuring the changing temperatures of the heat generators; and a controller for controlling the heat generation by the heat generators, performing the calculations of the temperature values measured by the plurality of temperature sensors, and outputting the thermal characteristic value of the material.

Abstract: A computer-implemented method, apparatus, and computer program product implement enhanced thermal tomography three-dimensional (3D) thermal effusivity imaging. Experimental thermal imaging data is acquired. A response function is derived and a convolution formulation is constructed from the experimental thermal imaging data. A deconvolution solution procedure is implemented that includes constructing a matrix solution equation with a damping parameter, and solving the matrix solution equation with a selected number of iterations to construct a plurality of effusivity images. Using the novel depth deconvolution algorithm with experimental data acquired from a one-sided pulsed thermal-imaging system provides greater sensitivity for internal sample features substantially eliminating degradation in depth resolution.

Abstract: A method for measuring a thermal conductivity of a one-dimensional material is provided.

Abstract: A highly adaptive thermal properties measurement system and measuring method thereof, for measuring various thermal property values of a device under test without actually lighting up the device under test, are disclosed. The measurement system includes a light source unit, a light modulation module, a holding unit, a thermal reflection unit, a thermal signal capture unit, and a control and computation unit. A light field provided from the light source unit is first modulated by the light modulation module for its distribution of intensity, and then illuminates on the device under test such that the device under test is heated in a specific mode so as to simulate a temperature distribution of the device under test in a state of continuous operation. Further, the control and computation unit computes various thermal property values of the device under test based on a top-surface thermal signal and a bottom-surface thermal signal captured by the thermal signal capture unit.

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: A device and method for measuring dynamic thermal conductivity of micro-structure fluid. The device includes an upper fixing plate (110a) and a lower fixing plate (110b) which are vertically spaced apart from each other, a lower body (150b) which defines a side surface of a separation space formed between the upper fixing plate and the lower fixing plate, a rotating plate (120) which is disposed in the separation space in such a way that gaps are respectively formed among the rotating plate and the upper and lower fixing plates, a shaft (140) which passes through the upper fixing plate and is coupled to the rotating plate, a heater which installed on an upper portion of the upper fixing plate, and thermocouples (118a) and (118b) which are respectively installed in the upper and lower fixing plates.

Abstract: The invention is related to methods for determining thermophysical properties of solid bodies, particularly, to methods for determining thermal conductivity and volumetric heat capacity. In accordance with the method, a reference sample and sequentially located samples of solid bodies are heated by a thermal energy source moving at a constant speed relative to the reference sample and the samples being studied. Excessive temperatures of the surfaces of the reference sample and the studied samples at points on a line of heating are measured and the thermophysical properties of the reference sample and the samples being studied are determined. Arbitrary shape samples are used and thermal conductivity and volumetric heat capacity of the samples are determined by solving an inverse coefficient problem of thermal conductivity.

Abstract: A temperature uniformity device controls the temperature and temperature uniformity of an object such as a photovoltaic module undergoing testing. The temperature uniformity device includes a thermal conductivity device and a pliable thermally conductive interface material inserted between the object and the thermal conductivity device.

Abstract: An apparatus for monitoring a temperature and/or a temperature-dependent parameter of an optical element arranged in a path of a laser beam includes a measuring light source to produce measuring radiation and direct the measuring radiation to the optical element, a detector arranged to detect a portion of the measuring radiation that has passed through a passage region of the optical element, an evaluating device connected to the detector to monitor the temperature and/or the temperature-dependent parameter. The evaluating device is configured to determine the temperature and/or the temperature-dependent parameter based on an intensity of the measuring radiation detected by the detector in the passage region.

Abstract: A sensor apparatus and sensor apparatus system for use in conjunction with a cassette, including a disposable or replaceable cassette. In some embodiments, the cassette includes a thermal well for permitting the sensing of various properties of a subject media. The thermal well includes a hollow housing of a thermally conductive material. In other embodiments, the cassette includes sensor leads for sensing of various properties of a subject media. The thermal well has an inner surface shaped so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe. In some embodiments, the thermal well is located on a disposable portion and the sensing probe on a reusable portion.

Abstract: The invention concerns a device for determining the temperature inside an item to be cooked (12). The invention comprises at least one temperature sensor (20) for detecting at least one surface temperature of the item to be cooked (12) and/or an ambient temperature around the item to be cooked, particularly at a measuring location inside the cooking chamber surrounding the item to be cooked, preferably with an ambient temperature sensor which is arranged at said measuring location. Furthermore, the device comprises at least one distance sensor (22) for detecting one or multiple distances between the distance sensor (22) and one or multiple distance measuring points (36) on the surface of the item to be cooked (12).

Abstract: A surrogate temperature sensor (52) for a convection cooled radiant heater system is described. The surrogate temperature sensor has an internal controllable heater (62) and a sensing device such as a thermocouple (64). The surrogate temperature sensor is paired with a furnace/dryer radiant heat source (38). The surrogate's internal heater provides sufficient power to heat the surrogate to the same temperature as the radiant heater. At least one surrogate temperature sensor (52) is positioned to be exposed to the cooling media in a manner similar to the radiant heat source. The surrogate sensor reports its temperature which is indicative of the radiant heater temperature to the cooling controller. The controller responds to this signal and adjusts cooling to maintain the radiant heater at its desired temperature.

Abstract: A sensor apparatus and sensor apparatus system for use in conjunction with a cassette, including a disposable or replaceable cassette. In some embodiments, the cassette includes a thermal well for permitting the sensing of various properties of a subject media. The thermal well includes a hollow housing of a thermally conductive material. In other embodiments, the cassette includes sensor leads for sensing of various properties of a subject media. The thermal well has an inner surface shaped so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe. In some embodiments, the thermal well is located on a disposable portion and the sensing probe on a reusable portion.

Abstract: A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.

Abstract: The invention relates to a temperature calibrating system (1) comprising a thermo siphon, a heat pipe or an equivalent (2) connected between a cooling unit (4) and a temperature calibration unit (3), where the system (1) further comprises an external chamber (8) connected to the heat pipe/thermo siphon or equivalent (2) for controlling the thermal conductivity between the two units and where the temperature of the external chamber (8) is held at a certain temperature, for example ambient temperature or a temperature controlled by external means. The external chamber (8) can be connected to the heat pipe/thermo siphon (2) via a conduit (9) which connection point is placed above liquid level at a evaporating end of the heat pipe/thermo siphon (2) and in that the external chamber (8) is arranged below the connection between the conduit (9) and the heat pipe/thermo siphon (2).

Abstract: The disclosure is directed to a photoelastic method for measuring the absolute zero crossover temperature Tzc of a sample of materials (transparent glass, glass-ceramic or ceramic) directly, without requiring calibration against a primary technique. The method involves subjecting the sample to a temperature gradient that generates a stress distribution pattern within the sample. When some portion of the sample is at a temperature equal to the Tzc of the material, the pattern adopts an easily identifiable shape whose measurement allows the calculation of Tzc. Silica-titania glass, which has a low thermal expansion, is used as an exemplary material.

Abstract: A temperature sensing probe including a temperature sensor in an elongate housing wherein the elongate housing of the probe is elongate in a first direction and the elongate housing is comprised of a material which has a thermal conductivity of at least 500 W/mK at 20° C. in at least one direction.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.

Abstract: A method and apparatus for the measurement of thermal conductivity combines the following capabilities: 1) measurements of very small specimens; 2) measurements of specimens with thermal conductivity on the same order of that as air; and, 3) the ability to use air as a reference material. Care is taken to ensure that the heat flow through the test specimen is essentially one-dimensional. No attempt is made to use heated guards to minimize the flow of heat from the hot plate to the surroundings. Results indicate that since large correction factors must be applied to account for guard imperfections when specimen dimensions are small, simply measuring and correcting for heat from the heater disc that does not flow into the specimen is preferable.

Abstract: A thermal conductivity detector includes a structure defining a cavity, the structure principally comprising a material having a first coefficient of thermal expansion; a sensing element for sensing a thermal conductivity of a gas flowing within the cavity, the sensing element having a second coefficient of thermal expansion different from the third first coefficient of thermal expansion, the sensing element being disposed at least in part within the cavity; and a compensation structure having a third coefficient of thermal expansion different from the first and second thermal coefficients of expansion. Over a selected temperature range, a stress within the sensing element is less than a yield stress of any component of the sensing element, and a stress within the compensation structure is less than a yield stress of any component of the compensation structure.

Abstract: An indication apparatus for indicating temperature status of a motherboard includes a detection module, a comparison module, a switch module, and an indication module. The detection module detects temperatures of the motherboard, and converts the detected temperatures to voltage signals. The comparison module receives the voltage signals, compares the voltage signals with a first reference voltage, and outputs control signals according to a comparison result. The switch module receives the control signals, and turns on or off according to the control signals. The indication module indicates temperature states of the motherboard when the switch module turns on or off.

Abstract: A heat sink tester for pressing a heat sink against a simulation heat source includes a base, a pressing assembly and a supporting device. The base is for supporting the heat sink thereon. The pressing assembly presses the heat sink against the base along a first direction. The supporting device is for supporting the simulation heat source thereon. The supporting device pushes the simulation heat source through the base to engage against the heat sink along a second direction opposite to the first direction.

Abstract: A thermal detector includes a substrate, a support member, a spacer member, a thermal detection element, a detection circuit and a wiring part. The spacer member supports the support member over the substrate with a cavity part being formed therebetween. The thermal detection element is supported on the support member. The wiring part connects between the detection circuit and the thermal detection element, and has first through third conductive layer parts and a plurality of plugs. The first conductive layer part includes at least one layer disposed in the substrate. The second conductive layer part includes at least one layer disposed in the spacer member. The third conductive layer part includes at least one layer supported by the support member. The plugs respectively connect adjacent layers of the first conductive layer part, the second conductive layer part and the third conductive layer part, in a thickness direction of the substrate.

Abstract: A method for thermal characterization of a portion of first material of elongate shape on which there is arranged a portion of a second, electrically conductive material of elongate shape, the method including: a) determining characteristic of the portion of second material, b) applying an electric current of angular frequency between ends of the portion of the second material, and measuring the angular frequency harmonic of the electric voltage between these ends for different values of angular frequency, c) calculating coefficient of thermal conductivity of the portion of first material from the values of the harmonic and of the determined characteristic, a width of the portion of the first material being between about 0.9 and 1.1 times the width of the portion of second material, the portion of first material being surrounded by thermal insulation.

Abstract: A hot plate method and apparatus for the measurement of thermal conductivity combines the following capabilities: 1) measurements of very small specimens; 2) measurements of specimens with thermal conductivity on the same order of that as air; and, 3) the ability to use air as a reference material. Care is taken to ensure that the heat flow through the test specimen is essentially one-dimensional. No attempt is made to use heated guards to minimize the flow of heat from the hot plate to the surroundings. Results indicate that since large correction factors must be applied to account for guard imperfections when specimen dimensions are small, simply measuring and correcting for heat from the heater disc that does not flow into the specimen is preferable. The invention is a hot plate method capable of using air as a standard reference material for the steady-state measurement of the thermal conductivity of very small test samples having thermal conductivity on the order of air.

Abstract: A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.

Abstract: A method of analyzing metal oxides. In this method, metal oxide is provided, heated with microwaves, and a conductivity parameter of the metal oxide is determined. From the conductivity parameter, a determination is made regarding a pyroelectric effect of the metal oxide.

Abstract: Various techniques are provided for determining thermal resistance values of building materials through the use of infrared cameras. In one example, an infrared camera may be used to capture one or more infrared images of a wall. Using temperatures obtained from the images, a thermal resistance value such as an R-Value associated with the wall may be determined. Potential cost savings associated with adjusting the thermal resistance value may also be determined.

Abstract: The present invention provides a thermal history sensor having a plurality of substrates positioned adjacent to an item. The substrates include different compositions, such that the substrates respond to thermal exposures with different changes in electrical conductivity or magnetic permeability. By measuring the electrical or magnetic properties of the substrates following thermal exposure, information about the thermal history may be obtained.

Abstract: According to the present disclosure, a system for sensing attributes of tissue in at least one direction is provided. The system includes a thermal conductivity probe having a sensor configured to measure thermal conductivity in the target tissue in at least one direction, and an electrical conductivity probe having a sensor configured to measure electrical conductivity in the target tissue in at least one direction, a power supply operatively coupled to the thermal conductivity probe and being configured to supply power to the thermal conductivity probe, an impedance analyzer operatively coupled to the electrical conductivity probe, and a computer operatively coupled to at least one of the power supply, the multimeter and the impedance analyzer.

Abstract: Systems and methods for determining heat transfer characteristics are provided. In this regard, a representative system for determining heat transfer characteristics includes: a stereolithographic model of a component, the model having a surface; and a test article mounted to the surface such that an extension of the test article protrudes from and is thermally insulated from the surface of the model.

Abstract: A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system.

Abstract: The invention relates to an arrangement with a mounting rack and at least one assembly provided with a housing encapsulation and mounted on the mounting rack, wherein the mounting rack and the assembly have contacting means which are thermally connected to each other. Suitable measures are provided with which the quality of the heat dissipation is identified at the correct time.

Abstract: The application relates to a device based on the electrothermal method for determining thermal conductivity, which allows the examiniation of various phenomena, with a high level of reliability, through the study of the thermal behaviour of materials. The device is constitated by a sample-carrying cylinder surrounded by a resistance element that creates a radial heat flow in the sample, a cooling system based on a spiral-form heat exchanger incorporated into the thermal device, means for the storage of a fluid and a data-storage device. Furthermore, the present application describes the use of the device in processes for determining the productive potential of the soil (“PPS”) and the examination of the nutritional quality of agro-ecological produce and foods.

Abstract: The invention relates to a temperature sensor comprising: a temperature-sensitive element (3); and a peripheral casing (7) accommodating the temperature-sensitive element (3) and having a closed end (9), the peripheral casing (7) being able to be inserted into a corresponding cavity (11), characterized in that the closed end (9) of the peripheral casing (7) has a peripheral portion (21) revealing, butted against the closed end, a flexible assembly stop (23) after said peripheral portion (21), said stop (23) being able to deform towards the peripheral portion (21) by shape cooperation with the bottom (15) of the corresponding cavity (11). The subject of the invention is also a process for manufacturing a temperature sensor as described above and a method of assembling said sensor.

Abstract: Ultrasound data are collected from a thermal source and a mass of tissue before initiating therapy to measure two parameters of the bio-heat transfer equation (BHTE). The parameters are the thermal diffusivity (K) of the tissue and the magnitude of the thermal source (Q). Once the parameters have been obtained, the BHTE can be calibrated to the specific mass of tissue and the specific thermal source. The calibrated BHTE can be used to generate a temperature dependence curve calibrated to the thermal source and tissue, and spatio-temporal temperature maps, to facilitate pre-therapy planning. During therapy, ultrasound data are collected to determine if Q changes during therapy, and if so, the BHTE is recalibrated using the new Q value, increasing an accuracy of the temperature estimations.

Abstract: Modeling a plurality of fabric layers on a subject to predict thermal strain. The computerized model combines subject data, fabric data, and environmental conditions to simulate the thermal comfort of the subject over time. In an embodiment, a user interface enables a user to modify or define the input data to compare the predicted thermal comfort of different garments under the same working conditions.

Abstract: A device for non-invasive measurement of the internal temperature of a physical body or thermal resistivity, the body comprising a thermally conductive medium between an internal region with a substantially constant internal temperature and an external surface with a surface temperature. The device comprises: a patch comprising one or more contact components for attachment to the external surface and an insulating cover for substantially thermally insulating the contact component from ambient thermal conditions; a reader for acquiring one or more thermal magnitudes on the patch; a processing unit for processing the thermal magnitudes to derive the internal temperature of the internal region or the thermal resistivity of the conductive medium.

Abstract: According to the present disclosure, a system for sensing attributes of tissue in at least one direction is provided. The system includes a thermal conductivity probe having a sensor configured to measure thermal conductivity in the target tissue in at least one direction, and an electrical conductivity probe having a sensor configured to measure electrical conductivity in the target tissue in at least one direction, a power supply operatively coupled to the thermal conductivity probe and being configured to supply power to the thermal conductivity probe, an impedance analyzer operatively coupled to the electrical conductivity probe, and a computer operatively coupled to at least one of the power supply, the multimeter and the impedance analyzer.

Abstract: A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.

Abstract: A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.

Abstract: In a local softening point measuring apparatus and thermal conductivity measuring apparatus using a probe microscope as a base, environment of the prob˜ and a sample surface is set to 1/100 atmospheric pressure (103 Pa) or lower. Otherwise, a side surface of the probe is coated with a thermal insulation material having a thickness that enables thermal dissipation to be reduced to 1/100 or lower, to thereby reduce the thermal dissipation from the side surface of the probe, and exchange heat substantially only at the contacting portion between the probe and the sample surface.

Abstract: A thermoelastic device comprising an expansive element is disclosed. The expansive element is formed from a material, which is preselected on the basis that it has one or more of the following properties: a resistivity between 0.1 ??m and 10.0 ??m; chemically inert in air; chemically inert in the chosen ink; and depositable by CVD, sputtering or other thin film deposition technique.

Abstract: Method of determining the melt mass flow rate of an ethylene polymer in the polymerization of ethylene or of ethylene with further comonomers, which is carried out at temperatures of from 140° C. to 350° C. and pressures of from 40 MPa to 350 MPa in a reactor to form the ethylene polymer and the ethylene polymer is subsequently cooled in a heat exchanger, which comprises: a) establishment of a correlation between the thermal conductivity of the ethylene polymer in the heat exchanger and the melt mass flow rate of the ethylene polymer, with the individual measurements each being carried out at an essentially constant melt mass flow rate, b) measurement of the thermal conductivity of an ethylene polymer in the heat exchanger c) calculation of the melt mass flow rate from the thermal conductivity measured in b) and the correlation established in a).

Abstract: A method and apparatus for monitoring during dynamic processes that determines when effective measurements of thermal effusivity and/or thermal conductivity can be made during a portion of a cycle during a calibration phase, then measures thermal effusivity and/or thermal conductivity during a subsequent dynamic process in dependence upon the time delay value and the measurement duration value until a desired value is obtained. A sensor having a measurement period of between one of two seconds allows monitoring of materials during dynamic processes such as tumbling, blending, mixing, and rocking. For example, measurements can be made until a value indicative of a desired mixture condition is obtained.

Abstract: A total air temperature sensor includes a probe secured to a first side of a vehicle surface. The probe includes an air inlet and a temperature sensing element. Air flows into the air inlet and passes by the temperature sensing element. The temperature sensing element produces a temperature sensing element electrical signal as a function of a temperature of the air. The total air temperature sensor also includes an electronics package secured to a second side of the vehicle surface. Electronics in the electronics package receive the temperature sensing element electrical signal from the temperature sensing element and determine a total air temperature as a function of the temperature sensing element electrical signal.

Abstract: A multi-purpose, cylindrical thermal insulation test apparatus is used for testing insulation materials and systems of materials using a liquid boil-off calorimeter system for absolute measurement of the effective thermal conductivity (k-value) and heat flux of a specimen material at a fixed environmental condition (cold-side temperature, warm-side temperature, vacuum pressure level, and residual gas composition). The apparatus includes an inner vessel for receiving a liquid with a normal boiling point below ambient temperature, such as liquid nitrogen, enclosed within a vacuum chamber. A cold mass assembly, including the upper and lower guard chambers and a middle test vessel, is suspended from a lid of the vacuum canister. Each of the three chambers is filled and vented through a single feedthrough. All fluid and instrumentation feedthroughs are mounted and suspended from a top domed lid to allow easy removal of the cold mass.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: A thermal conductivity measurement apparatus for measuring a thermal conductivity of a one-dimensional material includes a substrate, a vacuum chamber receiving the substrate and four spaced electrodes. The one-dimensional material spans across the four spaced electrodes. A middle part of the one-dimensional material, located between the second and third electrodes, is suspended. The present disclosure further provides a method for measuring the thermal conductivity of the one-dimensional material.