Abstract: A device includes a measuring assembly, a fluid pressure assembly, and a manometer. The measuring assembly includes a heating member defining a first contact surface, a cooling member defining a second contact surface facing the first contact surface, a platform, and a sleeve. The sleeve is configured far hermetically adjoining the heating and cooling members and allowing movement of the heating and cooling members relative to each other. The sleeve and the first and second contact surfaces form a cavity for receiving fluid material to be measured. The platform is configured for controlling the relative movement of the heating and cooling members to adjust the length of the cavity. The fluid pressure assembly is configured for compressing the fluid material into the cavity. The manometer is disposed on the sleeve or the fluid pressure assembly and is configured for detecting a fluid pressure of the fluid material in the cavity.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein.

Abstract: A sensor apparatus and sensor apparatus system for use in conjunction with a cassette, including a disposable or replaceable cassette. In some embodiments, the cassette includes a thermal well for permitting the sensing of various properties of a subject media. The thermal well includes a hollow housing of a thermally conductive material. In other embodiments, the cassette includes sensor leads for sensing of various properties of a subject media. The thermal well has an inner surface shaped so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe. In some embodiments, the thermal well is located on a disposable portion and the sensing probe on a reusable portion.

Abstract: A process is described for preparing 3-pentenenitrile by hydrocyanating 1,3-butadiene in the presence of at least one catalyst, wherein unhydrocyanated 1,3-butadiene is removed from the effluent of the hydrocyanation and recycled into the process, and the recycled 1,3-butadiene is monitored for the content of hydrogen cyanide.

Abstract: A urea sensor includes a detecting portion which, in use, is immersed in a liquid accommodated in a urea solution tank for detecting the thermal conductivity of the liquid to detect whether the liquid accommodated in the urea solution tank is an aqueous urea solution; and an enclosing member enclosing a periphery of the detecting portion and including one or more vents penetrating the enclosing member. At least one of the vents is a lower vent being of a configuration and size such that a first hypothetical circle having a diameter of not less than 3.5 mm can be wholly contained within the lower vent. At least a portion of the lower vent is positioned below the detecting portion when the urea sensor is positioned for installation in the urea solution tank.

Abstract: An apparatus is provided for determining thickness and thermal conductivity for an insulative coating disposed on a substrate in an object. The apparatus includes a source for rapidly applying a multiple optical pulses on a surface of the object, where the surface comprises the insulative coating. The system further includes a recording system configured to collect data representative of the propagation of the optical pulses in the object. The apparatus further includes a processor coupled to the recording system and configured to receive the data from the recording system and configured to determine a thickness value and a thermal conductivity value for the insulative coating.

Abstract: According to the present disclosure, a system for sensing attributes of tissue in at least one direction is provided. The system includes a thermal conductivity probe having a sensor configured to measure thermal conductivity in the target tissue in at least one direction, and an electrical conductivity probe having a sensor configured to measure electrical conductivity in the target tissue in at least one direction, a power supply operatively coupled to the thermal conductivity probe and being configured to supply power to the thermal conductivity probe, an impedance analyzer operatively coupled to the electrical conductivity probe, and a computer operatively coupled to at least one of the power supply, the multimeter and the impedance analyzer.

Abstract: The present invention has an object for setting thermal resistance corresponding to a contact condition of a contact face between two elements automatically and generating analysis data including a thermal conductivity of the contact face accurately in a short time when analysis data is generated based on three-dimensional design data of an object formed by a plurality of elements. An apparatus according to the present invention includes a retaining unit for retaining thermal resistance information for obtaining thermal resistance of the contact face in accordance with contact condition of the contact face; a thermal conductivity calculating unit for calculating a thermal conductivity of the contact face based on the thermal resistance information which is retained in the retaining unit and corresponds to the contact condition of the contact face set by a contact condition setting unit; and a generating unit for generating the analysis data including the thermal conductivity.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: An integrated microstructure sensor element is proposed for detecting thermodynamic measured variables of a fluid. To that end, a supporting body, particularly a board or a wafer having at least one microstructured heating element in contact with the fluid during operation, is provided, on which or in whose vicinity are arranged first arrangement for at least intermittently acting on the heating element with an electric alternating current of defined frequency or a defined frequency band, as well a second arrangement for detecting the amplitude of the third harmonic wave of the electric voltage applied to the heating element. The proposed microstructure sensor element in the form of a compact, integrated component is suitable in particular for determining or monitoring the thermal conductivity and/or the thermal capacity of a fluid, particularly an oil in a motor vehicle.

Abstract: The invention relates to a method and a device for the continuous measurement (30) of the thermal conductivity of a multifunctional fluid.

Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.

Abstract: A probe (10) includes a base element (12), formed from an inflexible material and having one or more unitary rigid elongate prong members (18), heating and sensing elements (20) and (22) supported on the base element (12), and elements for electrically energizing at least the heating element (20). The heating element (20) is formed on the or one prong member (18) so that, when energized, the thermal energy output by the heating element (20) can be sensed by the sensing element (22) to determine at least the thermal conductivity of a substance in which the probe (10) is inserted.

Abstract: The novel method and device provide for process control—closed-loop control or open-loop control—for a thermal system with an obstruction-curved and/or thick-walled component through which a medium flows. The wall temperatures of the component are detected, the heat flux density of the heat flux from the medium into the wall of the component is determined, the respective heat transmission coefficient is determined, using the wall temperatures. The heat flux density, and the heat transmission coefficient thus determined are used to influence the medium properties, with the heat stresses in the component being taken into account.

Abstract: The present invention has an object for setting thermal resistance corresponding to a contact condition of a contact face between two elements automatically and generating analysis data including a thermal conductivity of the contact face accurately in a short time when analysis data is generated based on three-dimensional design data of an object formed by a plurality of elements. An apparatus according to the present invention includes a retaining unit for retaining thermal resistance information for obtaining thermal resistance of the contact face in accordance with contact condition of the contact face; a thermal conductivity calculating unit for calculating a thermal conductivity of the contact face based on the thermal resistance information which is retained in the retaining unit and corresponds to the contact condition of the contact face set by a contact condition setting unit; and a generating unit for generating the analysis data including the thermal conductivity.

Abstract: An electronic clinical thermometer has a probe including a temperature sensor and a heat flux sensor which are controlled to make measurements at specified time intervals. The measured values are used in solving the equation of heat conduction to estimate the temperature of an internal body position. A heater may be included to preheat a body part in order to reduce the time required for measurement. The probe may use two temperature sensors to measure temperatures at two body surface positions through insulating members which are different in thermal conductivity.

Abstract: A sensor for determining the thermal conductivity of a fluid comprising a sensing module located within a housing having inlet and outlet ports for a fluid under test, the sensing module comprising a reference base surface and a sensing element spaced therefrom and having measure and reference sections, and there being provided electrical power monitoring means for monitoring the power through the measure and reference sections in order to generate a signal indicative of the power difference due to thermal conductivity through the fluid. The sensing element is a thick film printed disc with measure and reference resistors printed on it. All changes in the fluid are common to both the measure and reference sections except for the thermal conductivity of the fluid itself.

Abstract: A thermoelastic device comprising an expansive element is disclosed. The expansive element is formed from a material, which is preselected by calculating a dimensionless constant for the material. The dimensionless constant is indicative of the potential effectiveness of the material in a particular application, such as a micro-electromechanical system.

Abstract: A method and apparatus for performing characterization of devices is presented. The characteristic of the device are determined by obtaining a first temperature measurement in a first location of a device, obtaining a second temperature measurement, computing the difference between the temperature measurements and, using the temperatures and/or the temperature difference, a characteristic of the device is determined.

Abstract: This invention utilizes the nuclear magnetic resonance imaging and spectroscopy to experimentally measure thermal diffusivity, thermal conductivity, specific heat, specific absorption rate, thermal power, heat transfer coefficient, heat of reaction and the membrane permeability in substances and systems.

Abstract: The invention provides a system for determining the heat flow rate between a first and a second medium, the system including at least two sensor units having signal outputs disposed in a spaced-apart relationship, each of the units including a transducer having apertures allowing fluid to pass therethrough; the transducer of a first sensor unit is affixable to a first surface on the first medium, the heat flow of which is to be determined and a second surface of the first transducer is exposed to the second medium; a first surface of the transducer of a second sensor unit is affixable to a calibration plate, the calibration plate is affixable to the first medium, the heat flow of which is to be determined and the second surface of the transducer is exposed to the second medium; the signal outputs of the transducers are connectable to a processing unit for determining changes in the heat flow between the first and the second sensor units.

Abstract: The present invention broadly comprises a method and apparatus for testing electrochemical cells which is faster and more cost-effective than current testing methods. Accordingly, the invention provides a method for testing electrochemical cells, particularly batteries for medical applications, such as for implantable devices for pacemakers, defibrillators, etc., comprising the steps of: surrounding at least one electrochemical cell with a vacuum with a pressure range of 0 to 0.001 Torr and measuring energy emitted from the electrochemical cell.

Abstract: Visual thermal functional textile clothing designs are created using a programmed computer and advanced computing techniques. The computer is supplied with information from a number of databases relating to human body properties and relating to textile material characteristics. The method is used to generate functional designs that are visually displayed for use by a textile designer or engineer.

Abstract: An apparatus and method for measuring and mapping thermal conductivity and thermal diffusivity at micrometer scale resolution. The apparatus and method utilize a mode-locked femtosecond pulsed laser in a pump-probe configuration to analyze time-domain thermoreflectance of a specimen to evaluate its thermal conductivity in micro-scale, so that, if desired, an image of thermal conductivity distribution of micro-scale regions may be obtained therefrom. A multi-layer, complete three-dimensional model that takes into account the entire three-dimensional heat flow in cylindrical coordinates enables micro-scale measurements to be made at an accuracy of about 90% of well-accepted values.

Abstract: An apparatus for measuring heat dissipation of a target heating element includes a reference heating element for emitting heat; a control unit; and a pair of temperature measuring devices for measuring representative temperatures of the target and the reference heating element and transmitting to the control unit signals indicating the representative temperatures. The reference heating element has an outer configuration and sizes substantially identical to those of the target heating element. The control unit controls the reference heating element such that the representative temperature of the reference heating element becomes substantially identical to that of the target heating element.

Abstract: A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.

Abstract: The present invention relates to a device for detecting the thermal conductivity by application of optical pulse techniques. A sample preheated in a furnace is exposed to energy by means of an optical pulse. The temperature profile in the sample is recorded by means of an infrared sensor. The thermal conductivity of the sample can then be detected by mathematical derivation. To reduce tho influence of the time history of the optical pulse on measurement, a measuring means is provided for determining this history, An analyzer unit then derives therefrom the corrected temperature profile.

Abstract: A chuck having a high specific stiffness and high thermal conductivity compared to conventional chucks, with an apparatus for measuring thermal expansion in the chuck. High specific stiffness allows for a higher control bandwidth and improved scanning performance. High thermal conductivity enables excellent positioning accuracy because thermal expansion and strain may be accurately measured or predicted, and thus compensated.

Abstract: A sensor includes at least two microsensor chips in a housing.

Abstract: A heat generator includes a heat generating member including a heat flow output face, a heat flow insulative member attachably surrounding the heat generating member except the heat flow output face for insulating the heat generating member except the heat flow output face, a heat flow compensating member attachably surrounding the heat flow insulative member but exposing the heat flow output face to allow it contacting with a specimen, and a heat flow compensating circuit connected between the heat flow insulative member and the heat flow compensating member. The circuit is capable of controlling heat generated by the heat flow compensating member to cause no heat flow flowing between the heat flow compensating member and the heat flow insulative member whereby the heat energy of the heat flow outputing from the heat flow output face of the heat generating member is equal to the heat energy of heat generated by the heat generating member.

Abstract: A method of measuring the heat conductivity of an object to be measured, comprising generating heat between the object to be measured and a heat resistant material, causing heat to flow through the interior of the object to be measured and the interior of the heat resistant material and obtaining the heat conductivity of the object to be measured from a temperature difference between at least two points of the heat resistant material, a heat conductivity measuring instrument using the same and a method of producing a heat insulating material.

Abstract: A heat generator includes a cubic heat generating member for outputting heat flow. The heat generating member includes a heat flow output face and five heat flow insulation faces. Five thermoelectric coolers are attached on the five heat flow insulation faces respectively. A heat flow compensating circuit is electrically connected between each heat flaw insulation face and a corresponding thermoelectric cooler. The circuit is capable of controlling heat generated by the thermoelectric cooler to cause the temperature of the heating face of the thermoelectric cooler to be equal to the temperature of the heat flow insulation face. Controlling the heating in this manner results in the output of heat energy from the heat flow output face of the heat generating member being substantially equal to the heat energy generated by the heat generating member.

Abstract: A heat generator includes a heat generating member and a temperature compensating member made from different material. The heat generating member includes a heat flow output face for outputing heat flow and five heat flow insulation faces. The temperature compensating member encloses and contacts the heat generating member except the heat flow output face. A heat flow compensating circuit is electrically connected between the temperature compensating member and the heat generating member for maintaining a state of no heat flow flowing between the heat generating member and the temperature compensating member, whereby the heat energy of the heat flow outputing from the heat flow output face is equal to the heat energy of heat generated by the heat generating member.

Abstract: A heat generator includes a heat generating member for generating heat flow, a temperature compensating member, and a heat flow compensating circuit connected between the heat generating member and the temperature compensating member. The heat generating member includes a heat export face and a heat insulation face. The temperature compensating member includes a temperature compensating face facing the heat insulation face. The circuit is capable of controlling heat generated by a thermoelectric resistor of the temperature compensating member to cause the temperature of the temperature compensating face to be equal to the temperature of the heat insulation face, which results in the heat energy of the heat flow exporting out from the heat export face of the heat generating member to be substantially equal to the heat energy of the heat generated by the heat generating member.

Abstract: An automated test method characterizes the performance of commercially available thermal interface materials (TIM) for electronic cooling. Such automated internal test vehicle provides an independent study of various TIM's. A spectrum of materials are preferably tested using automated methods so the results are reported in a consistent way. Such reports simplify the comparison and selection of appropriate TIM material for various end-user applications. Such automated test method is observed to be faster and easier to use. It requires minimal operator intervention during the test.

Abstract: A method and apparatus for sensing a flammable vapor are described herein. Initially, a first thermal conductivity of a vapor at a first temperature and a second thermal conductivity of the vapor at a second temperature can be determined. Thereafter, a ratio of the first thermal conductivity signal to that of the second thermal conductivity can be calculated to obtain a primary “vapor” signal. The “vapor” ratio can then be compared to an “air” ratio of air without the vapor at the first temperature and the second temperature to obtain a secondary signal thereof. Such a secondary signal can then be compared to an alarm set-point value to thereby determine whether the vapor comprises a flammable vapor and a risk-reducing action thereof be taken.

Abstract: A method of measuring a thermal resistance of laminated resin sandwiched by a first member and a second member according to the present invention includes measuring, as thermal resistance of resin, a sum of thermal resistance of an interface between the resin and the first member, thermal restistance of an interface between the resin and the second member, and thermal resistance caused by conduction of heat through the resin.

Abstract: A thermal conductivity detector with an electrically heatable heating filament (6) that is mounted in the middle of a channel (5) in such a way that a fluid can flow around it. The heating filament is carried on its two ends on two electrically conductive carriers (7, 8) that intersect this channel. In particular to prevent the heating filament from relaxing at operational temperatures, at least one of the two carriers (7, 8) is embodied in such a way that its distance from the other carrier is greater in the region of the middle of the channel than in the region of the wall of the channel (9). As a result, as the temperature rises, the middle areas of the two carriers (7, 8) on which the heating filament (6) is held move away from each other, so that the heating filament (6) is tightened.

Abstract: Disclosed is a DC thermal energy generator for heating localized regions of an integrated circuit. The integrated circuit includes a pair of static circuits whose outputs are shorted, and are in contention. Contention causes current to flow through the circuits, generating heat. Integrated-circuit temperatures can be varied by turning on more or fewer thermals energy generators. The thermal resistance of a, packaged integrated circuit is computed using a well-known relationship integrated circuit's measured temperature, power consumption, and the ambient temperature.

Abstract: A heat-flux gage, a manufacturing method and a manufacturing device thereof which are improved from circular foil heat-flux gage disposed in ASTM E511 comprise: a cylindrical body having a receiving space therein, and a foil mounting hole on one end thereof; a foil including a heat absorption surface, an inner surface facing the heat absorption surface, and a radiant side surface connecting the heat absorption surface and the inner surface, wherein the inner surface faces toward the receiving space and the radiant side surface is contacted to a side surface of the foil mounting hole; a foil lead wire connected on a center of the inner surface of the foil; a body lead wire connected to an opposite end of the foil mounting hole on the cylindrical body; and a filler filled in the inner receiving space, to prevent the foil lead wire from being damaged by fixing the foil lead wire.

Abstract: A thermal conductivity detector includes separate sample gas and reference gas chambers. Each chamber has a gas inlet and a gas outlet and a sensor. The chambers are connected by at least one passageway. For example, a passageway can extend from the sample gas chamber to the reference gas chamber adjacent the gas inlets. As a further example, a passageway can be provided adjacent the gas outlets. More specifically, an exhaust passageway extends from the first passageway to the additional passageway and there is an exhaust outlet connected to the additional passageway.

Abstract: A single pass analyzer includes multiple infrared sensors, a catalytic converter, a scrubber and a thermal conductivity cell all coupled in series to provide a single pass (i.e., one sample) analyzer which allows for fast analysis, allows for the speciation of hydrogen samples, requires no purging between different sample types, utilizes a single carrier gas, and eliminates molecular sieves and Shutze converters. The resultant analyzer provides improved quicker results with less plumbing (i.e., gas conduits and valving) in a single instrument.

Abstract: A chuck having a high specific stiffness and high thermal conductivity compared to conventional chucks, with an apparatus for measuring thermal expansion in the chuck. High specific stiffness allows for a higher control bandwidth and improved scanning performance. High thermal conductivity enables excellent positioning accuracy because thermal expansion and strain may be accurately measured or predicted, and thus compensated.

Abstract: According to one embodiment of the invention, a method includes providing a conduit having a fluid flowing therethrough, disposing a plurality of temperature measurement devices inside a wall of the conduit, positioning at least some of the temperature measurement devices proximate an inside surface of the wall of the conduit, positioning at least some of the temperature measurement devices at different radial positions at the same circumferential location within the wall, measuring a plurality of temperatures of the wall with respective ones of the temperature measurement devices to obtain a three-dimensional temperature topology of the wall, determining the temperature dependent thermal conductivity of the conduit, and determining a multi-dimensional thermal characteristic of the inside surface of the wall of the conduit based on extrapolation of the three-dimensional temperature topology and the temperature dependent thermal conductivities.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A non-invasive apparatus and method for measuring a temperature of a portion of a living body, includes a signal receiving unit receiving electromagnetic wave signals emitted from the portion of a living body to be measured, a signal processing unit processing the electromagnetic signals input from the signal receiving unit and outputting a radiation power signal, a medium characteristic measurement unit measuring a value of a conductivity or a permittivity of the portion of the living body to be measured and outputting the measured value, and a temperature conversion unit including a computer database storing a plurality of temperature conversion tables with respect to radiation power according to the conductivity or the permittivity of the portion of the living body and determining a corresponding temperature using the measured value of the conductivity or the permittivity of the portion of the living body and the radiation power signal of the signal processing unit.

Abstract: A thermal conductivity detector with an electrically heatable heating filament (6) that is mounted in the middle of a channel (5) in such a way that a fluid can flow around it. The heating filament is carried on its two ends on two electrically conductive carriers (7, 8) that intersect this channel. In particular to prevent the heating filament from relaxing at operational temperatures, at least one of the two carriers (7, 8) is embodied in such a way that its distance from the other carrier is greater in the region of the middle of the channel than in the region of the wall of the channel (9). As a result, as the temperature rises, the middle areas of the two carriers (7, 8) on which the heating filament (6) is held move away from each other, so that the heating filament (6) is tightened.

Abstract: A II-VI semiconductor device includes a stack of II-VI semiconductor layers electrically connected to a top electrical contact. A GaAs substrate is provided which supports the stack of II-VI semiconductor layers and is positioned opposite to the top electrical contacts. A BeTe buffer layer is provided between the GaAs substrate and the stack of II-VI semiconductor layers. The BeTe buffer layer reduces stacking fault defects at the interface between the GaAs substrate and the stack of II-VI semiconductor layers.

Abstract: A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

Abstract: The thermal conductivity of a sample of interest is measured by applying backing material to a sensor to substantially surround the sensor with the backing material and the tested material. The instrument response of the sensor corresponds to the thermal conductivity of the combination of the tested sample and the backing material. The instrument is calibrated to cancel effects of the backing material out of the instrument response.