Abstract: The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

Abstract: The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a variable gain signal processing circuit (203) that processes an electrical signal from the transducer and a gain control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

Abstract: A hybrid diaphragm structure is provided. The hybrid diaphragm structure includes a substrate, a first diaphragm disposed in a central region of the substrate, a first coil structure disposed over the first diaphragm, a first groove separating the first diaphragm and the first coil structure from the substrate, and a first bridge structure coupling the first diaphragm to the substrate. The first diaphragm and the substrate include a same material.

Abstract: A controller in a wireless system may, in a first mode, communicate directly with a wireless microphone, via a first wireless protocol, in order to control the wireless microphone, and may, in a second mode, communicate using the first wireless protocol with a wireless access point, in order to control or configure the wireless microphone.

Abstract: A unidirectional microphone includes: a case having a shape of a bottomed cylinder and including a sound hole in a bottom thereof; a ring-shaped diaphragm fixed to the bottom in the case; a vibrating membrane stretched on the diaphragm; a backplate which has a shape of a bottomed cylinder and is housed in the case in a nested manner such that an air gap to serve as a sound propagation path is formed between the backplate and an inner surface of the case, the backplate including an aperture serving as a sound propagation path in a side face thereof; a spacer positioned between the diaphragm and the backplate to fix the diaphragm and the backplate, and including a notch serving as a sound propagation path in a portion thereof; and a base plate covering a top opening of the case and including a hole serving as a sound propagation path.

Abstract: A sound transducer unit for an in-ear headphone, for generating and/or detecting sound waves in the audible wavelength spectrum and/or in the ultrasonic range, includes at least one MEMS sound transducer arranged on a circuit board. At least one connector element of the circuit board is electrically conductively connected to at least one contact element of the MEMS sound transducer. The MEMS sound transducer is designed as a surface-mount device, which is connected to the circuit board with the aid of surface-mount technology. The sound transducer unit can form a component of a sound-generating unit.

Abstract: The present disclosure provides a method, apparatus for implementing a far-field speech function, system and a storage medium, wherein the method comprises: a speech detecting unit located on a smart device performing speech signal detection in real time; upon detecting an awakening word, the speech detecting unit awakening an algorithm unit located on the smart device and being in a standby state; the speech detecting unit transmitting the obtained speech signal to the algorithm unit so that the algorithm unit performs arithmetic processing for the speech signal in a predetermined manner, and sends a processed speech signal to a control system of the smart device, to complete a corresponding control operation. The solution of the present disclosure can be applied to save energy consumption and improve the acoustic effect, break away from the constraints of the remote controller and facilitate the user's operation.

Abstract: A microphone assembly includes a circuit board and a microphone array disposed on the circuit board. The circuit board includes: a first FPC extending along a first direction, and a second FPC extending along a second direction different from the first direction and separated from the first FPC, the second FPC and the first FPC are fixed to each other and form an electrical connection, and the microphone array is disposed on the first FPC.

Abstract: A system and method for the manufacture of flipchip microelectromechanical system devices. A method comprises forming a cavity from a first surface of a rigid back through to a second surface of the rigid back, depositing an anisotropic conductive film over the first surface of the multilayer rigid back to conform to a contour of a microelectromechanical system device, positioning the a microelectromechanical system device over the cavity formed in the multilayered rigid back, and causing contact of the microelectromechanical system device with the anisotropic conductive film deposited over the first surface of the multilayer rigid back.

Abstract: A sound receiving structure is applied to a sound receiving electronic device to receive a sound, wherein the sound receiving electronic device includes a housing defines a housing hole. The sound receiving structure includes a circuit board and an accommodating structure. The circuit board includes a plate, a sound guiding tube and a microphone. The plate defines a circuit board hole. The sound guiding tube is provided above the plate and located in the housing hole and includes a sound guiding hole aligned with the circuit board hole, wherein a diameter of the circuit board hole is smaller than a diameter of the sound guiding hole. The microphone is provided below the plate and corresponds in position to the circuit board hole. A sound passes through the sound guiding hole and the circuit board hole and then enters the microphone.

Abstract: Introduced here are recording devices optimized for recording speech between multiple parties (e.g., a speaker and a counterparty, or a first speaker and a second speaker). These recording devices can facilitate the discovery of personalized characteristics of an interaction by detecting location. For example, these recording devices can discover the intent behind certain terms and phrases in the context of a conversation. A recording device can include a communication module configured to stream recorded media content to another electronic device, as well as a marker identification module configured to identify nearby beacons. For example, a recording device may include a Bluetooth® Low Energy chipset configured to identify nearby Bluetooth® beacons and a Wi-Fi® chipset configured to stream recorded media content to another electronic device.

Abstract: A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.

Abstract: A microphone can include a cover having a series of slits and a nest. The nest can be configured to receive a first diaphragm, a second diaphragm, and a PCB in a stacked arrangement, such that the PCB is positioned between the first diaphragm and the second diaphragm. Also the first diaphragm can define a first plane, the second diaphragm can define a second plane, and the PCB can define a third plane and the first plane, the second plane, and the third plane can extend parallel to one another. The cover can also include slits having a first length and a second length, and the first length can be greater than the second length. The slits can extend both radially and axially.

Abstract: In an example embodiment, method, apparatus and computer program product are provided. The method includes capturing an acoustic signal by a microphone of an apparatus to generate an electrical output signal. The acoustic signal is rendered in response to a source audio signal by a speaker through at least one speaker interface element of the apparatus. The electrical output signal is compared to the source audio signal in order to determine whether the electrical output signal is being affected by mechanical vibrations caused at least partially by the speaker interface element being at least partially interfered by a user. A predetermined action is further performed in the apparatus whenever it is determined that the electrical output signal is affected by the mechanical vibrations caused at least partially by the speaker interface element being at least partially interfered by the user.

Abstract: A phantom powered preamp for use with a microphone cartridge having a unique mechanical interface. The unique mechanical interface allows the phantom powered preamp to function with both ¼ and ½ inch microphone cartridges. The phantom powered preamp including a housing base having a PC board assembly and a connector, the PC board assembly being electrically coupled to the connector; a preamp tip having an adapter and a guard tube, the PC board assembly extending from the housing base to the preamp tip and being electrically coupled to the adapter and the guard tube, the adapter being configured to be electrically coupled to the microphone cartridge, the guard tube being configured to surround a portion of the PC board assembly within the preamp tip; and a first converter being configured to releasably engage the preamp tip or the housing base to reduce edge diffraction.

Abstract: A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.

Abstract: A microphone assembly and a method for manufacturing a microphone assembly are disclosed. In an embodiment, the microphone assembly includes a MEMS dual backplate microphone configured to provide a differential output signal, an ASIC including a differential amplifier configured to receive the differential output signal and a control element configured to adjust at least one of a setting of the MEMS dual backplate microphone and a setting of the ASIC.

Abstract: A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

Abstract: A microphone includes a plurality of vibration membrane electrodes, and a plurality of fixing membrane electrodes that respectively faces the plurality of vibration membrane electrodes and forms a plurality of unit capacitors along with the facing vibration membrane electrodes, wherein the plurality of unit capacitors generates a plurality of unit output signals according to inputs of a power source and a sound source, and outputs a signal combining the plurality of unit output signals as an output signal corresponding to the sound source.

Abstract: In a unidirectional microphone unit, stable frequency characteristics can be obtained, and manufacturing cost is reduced while preventing increasing of an external size. A microphone cap that covers a microphone element is included, and the microphone cap includes a porous ring member arranged in the front of the microphone element to form a first communication space communicating with a front acoustic hole in a center side, and a cylindrical member supporting a peripheral edge portion of the ring member and surrounding a periphery side of the microphone element, and forming a second communication space communicating with a rear acoustic hole in the periphery side of the microphone element, and the first communication space and the second communication space are communicated through the ring member.

Abstract: A microphone and method for manufacturing the microphone are provided. The microphone includes a substrate with a penetration aperture, a vibration unit disposed on the substrate to cover the penetration aperture, and a fixed electrode disposed over, and spaced from, the vibration unit. Further, the vibration unit includes a first portion and a second portion disposed on the penetration aperture, and a third portion disposed on the substrate. In addition, the first portion and the third portion are spaced from each other, and the second portion is connected between the first portion and the third portion, and includes a first piezoelectric portion and a second piezoelectric portion.

Abstract: A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path.

Abstract: This document discusses, among other things, an advanced slave circuit and method configured to transfer power from a master device to a battery through an advanced slave circuit in a first mode using a load switch in a first state, to isolate the battery from the master device using the load switch in a second state, and to selectively couple a microphone to the master device using the advanced slave circuit in a second mode using a microphone switch.

Abstract: An acoustic impedance on a rear acoustic terminal side is set such that satisfactory directionality is obtained even in a high tone range. A rear portion of a sealing member 30A fitted to a unit case 10 is formed in a convex spherical shape, ranging from an apex part 301 to a hem part 302. The sealing member 30A forms an acoustic distributed constant circuit including: a first portion 310 in which a cross-sectional area of a sound path continuously increases, the sound path running from acoustic resistance parts AR as sound holes 28a of an electroacoustic transducer 20 to reach a rear acoustic terminal 12 through an air chamber A; and a second portion 320 on the rear acoustic terminal 12 side in which a cross-sectional area continuously decreases toward a direction farther from a sound pickup source.

Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Abstract: A microphone has a MEMS acoustic transducer having a frame-shaped support, and a membrane including a diaphragm as a movable electrode, covering an opening in the support, an integrated circuit that amplifies the output from the MEMS acoustic transducer, and a housing that houses the MEMS acoustic transducer and the integrated circuit. The housing includes a sound port bearing partition with a sound port formed therein. The MEMS acoustic transducer is secured in the housing with the membrane thereof facing the inner surface of the sound port bearing partition to form a closed space inward of the sound port bearing partition of the housing between the membrane and the sound port bearing partition. The closed space communicates with the outside via the sound port.

Abstract: A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed in each of the divided regions. The plurality of sensing units output a plurality of signals having different sensitivities. At least some sensing units of the sensing units have vibration electrode plates having areas different from the areas of the vibration electrode plates in the other sensing units.

Abstract: A stereo microphone includes two unidirective mid units and a bidirective side unit, the side unit is a ribbon microphone unit including a ribbon diaphragm, the two mid units are disposed at two respective surfaces of the ribbon diaphragm of the side unit, and the mid units each have a sound collecting axis along a longitudinal direction of the ribbon diaphragm in the side unit.

Abstract: A microphone unit includes first and second diaphragms; a substrate on a top surface of which are installed the first and second diaphragms; and a cover disposed covering the first and second diaphragms, the cover joined to an outside edge of the substrate and forming an internal space. There are formed in the substrate first and second openings that are formed respectively in the top and bottom surfaces of the substrate, and an internal sound path communicating from the first opening to the second opening. The first diaphragm is disposed on the substrate so as to cover and hide the first opening. The second diaphragm is disposed so as to seal off a partial region away from the first opening of the top surface of the substrate. A third opening is formed in the cover, and the internal space communicates to an outside space via the third opening.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.

Abstract: Integrated light and microphone systems are provided that include a microphone with directionality and a lighting device that emits a light beam. The light beam may be emitted in a direction substantially the same as the directionality of the microphone. The lighting device and the microphone can share a common interference tube to assist in aligning the directionalities of the microphone and the lighting device. The systems may be adjusted to enable visual calibration of the microphone to optimally detect sound from an audio source. The audio source can be simultaneously illuminated. The systems may be unobtrusive and more easily used to meet the aesthetic needs of an environment. Multiple integrated light and microphone systems can be in communication with an audio mixer to optimally detect sounds from multiple audio sources and create a desired audio mix that emphasizes a target audio source and suppresses other audio sources.

Abstract: A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

Abstract: A host device for use with a removable peripheral apparatus having a microphone, and to the biasing circuitry for said microphone. The host device may have a device connector for forming a mating connection with a respective peripheral connector. A source of bias is arranged to supply an electrical bias to a device microphone contact of the device connector via a biasing path. A capacitor is connected between a reference voltage node and a capacitor node of the biasing path. A first switch is located between the capacitor node and the device microphone contact. Detection circuitry detects disconnection of the peripheral connector and device connector; and control circuitry controls the switch to disable the biasing path.

Abstract: Provided is a microphone. The microphone includes a substrate including an acoustic chamber, a lower backplate disposed on the substrate, a diaphragm spaced apart from the lower backplate on the lower backplate, the diaphragm having a diaphragm hole passing therethrough, a connection unit disposed on the lower backplate to extend through the diaphragm hole, and an upper backplate disposed on the connection unit, the upper backplate being spaced apart from the diaphragm. Thus, the microphone may be improved in sensitivity and reliability.

Abstract: A method for producing a MEMS device having improved charge elimination characteristics includes providing a substrate having one or more layers, and applying a first charge elimination layer onto at least one portion of one given layer of the substrate. The method may then (1) apply a sacrificial layer onto the first charge elimination layer, (2) apply a second charge elimination layer onto at least a portion of the sacrificial layer, and (3) deposit a movable layer onto at least a portion of the second charge elimination layer. To form a structure within the movable layer the method may etch the movable layer. The method may then etch the sacrificial layer to release the structure.

Abstract: The electret condenser microphone according to the present invention includes an electret condenser microphone unit including a diaphragm and a fixed pole disposed opposite to the diaphragm; and a three-pin plug including a hot terminal and a cold terminal and being capable of producing a balanced output, wherein each of the hot terminal and the cold terminal is coupled to an FET that functions as an impedance converter a gate terminal of one of the FETs is coupled to the diaphragm, a gate terminal of the other of the FETs is coupled to the fixed pole, and the gate terminal of the FET coupled to the cold terminal is AC-grounded.

Abstract: A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.

Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.

Abstract: An electroacoustic transducer includes a diaphragm, an electroacoustic transducer unit having the diaphragm, and an air chamber having the diaphragm of the electroacoustic transducer unit and having a variable volume in response to vibration of the diaphragm. The air chamber has a sound pressure detector detecting a sound pressure in the air chamber and a volume adjuster driven by the output signals from the sound pressure detector, changing the volume of the air chamber in response to the output signals, and controlling the acoustic impedance of the air chamber. A control system from the sound pressure detector to the volume adjuster configures a feedback control system increasing the volume of the air chamber with an increase in the sound pressure in the air chamber.

Abstract: A microphone having a microphone capsule (10) is provided. The microphone capsule (10) has a diaphragm carrier (40), a diaphragm (20) and an adhesive tape ring (30) which is used to fasten the diaphragm (20) to or in the diaphragm carrier (40). The microphone capsule (10) is in the form of a dynamic sound transducer. A dynamic sound transducer for headphones, earphones or headsets is also provided. The sound transducer has a diaphragm carrier (40), a diaphragm (20) and a moving coil (22) which is coupled to the diaphragm. In a similar manner to the microphone capsule, the sound transducer has an adhesive tape ring (30) between the diaphragm (20) and the diaphragm carrier, which ring is used to fasten the diaphragm (20) to the diaphragm carrier (40).

Abstract: A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.

Abstract: A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a housing (20) for accommodating the first vibrating part (14) and the second vibrating part (15), the housing being provided with a first sound hole (132), a second sound hole (101), and a third sound hole (133). The housing (20) is provided with a first sound path (41) for transmitting sound pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound path (42) for transmitting sound pressure inputted from the second sound hole (101) to the other surface (142b) of the first diaphragm (142), and a third sound path (43) for transmitting sound pressure inputted from the third sound hole (133) to the other surface (152b) of the second diaphragm (152).

Abstract: A microphone is disclosed in which a housing is formed by a cap (13) sealed to a substrate (11). A MEMS die (10) is mounted on the substrate (11), the MEMS die (10) incorporating a membrane (12). The membrane (12) has a first surface facing the substrate and in fluid communication with an acoustic inlet port (14) in the cap (13) via an acoustic path (17) and a second surface facing the inner surface of the cap, which second surface along with part of the inner surface of the cap (13) defines at least part of a sealed chamber (19) within which a volume of air is trapped.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A microphone rubber apparatus mounted on an SMD microphone prepared on a printed circuit board to protect the SMD microphone from an external physical impact and the like in a portable communication device such as a portable terminal and a Personal Digital Assistant (PDA). The microphone rubber apparatus includes a microphone holder portion formed to engage with and wrap up a microphone, a connection portion protruding to one side of the microphone holder portion and delivering a transmission sound to the microphone through an inside thereof, and at least one shock absorbing portion deformably formed around the connection portion to ease an impact caused by an external force. Thus, the shock absorbing portion having a wrinkled shape can be deformed no matter in which direction an impact is applied to the portable communication device, thereby easing the impact and preventing the microphone rubber from being detached from the microphone due to the external impact or during a distribution test.

Abstract: An acoustic conversion device includes: a driving unit including a pair of magnets disposed so as to face each other, a yoke to which the pair of magnets are attached, a coil to which driving current is supplied, a vibrating portion which vibrates when driving current is supplied to the coil, and an armature disposed between the pair of magnets with the vibrating portion being passed through the coil; and a diaphragm unit including a diaphragm, and a beam portion for propagating the vibration of the vibrating portion to the diaphragm; with a coil attachment portion to which the coil is attached, located in a state in parallel with the vibrating portion, being provided to the armature.

Abstract: A novel ribbon microphone incorporates rounded-edge magnet motor assembly, a backwave chamber, and a phantom-powered JFET circuit. In one embodiment of the invention, one or more novel rounded-edge magnets may be placed close to a ribbon of the ribbon microphone, wherein the one or more novel rounded-edge magnets reduce or minimize reflected sound wave interferences with the vibration of the ribbon during an operation of the ribbon microphone. Furthermore, in one embodiment of the invention, a novel backwave chamber operatively connected to a backside of the ribbon can minimize acoustic pressure, anomalies in frequency responses, and undesirable phase cancellation and doubling effects. Moreover, in one embodiment of the invention, a novel phantom-powered JFET preamplifier gain circuit can minimize undesirable sound distortions and reduce the cost of producing a conventional preamplifier gain circuit.

Abstract: Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer 52 is mounted on a top surface of a circuit board 43, and an acoustic sensor 51 is mounted on the top surface thereof. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52, and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51, the interposer 52 and the like are covered by a cover 42 put on the top surface of the circuit board 43. In the cover 42, a sound introduction hole 48 is opened in a position opposed to the front chamber of the acoustic sensor 51. The interposer 52 is formed with a ventilation notch 71 for acoustically communicating a space below a diaphragm 56 of the acoustic sensor 51 with a space inside the cover 42 and outside the interposer 52.

Abstract: Disclosed herein is a speaker apparatus, including: a housing having a speaker disposition section in which a speaker unit is disposed, and an apparatus receiving section which receives a portable terminal apparatus mounted thereon. The speaker apparatus further includes a connector provided on the apparatus receiving section such that a connector section of the portable terminal apparatus is to be connected to the connector; a holder provided on the apparatus receiving section and supported for pivotal motion on the housing in such a manner as to be pivoted, in a state in which the portable terminal apparatus is connected to the connector, in a first direction to press down the portable terminal apparatus from the opposite side to the connector to hold the portable terminal apparatus; and a biasing spring provided on the apparatus receiving section and configured to bias the holder in the first direction.