Abstract: A condenser microphone element is disclosed with an electrically conducting transducer membrane having an acoustically active area arranged to receive sound waves and to vibrate in response to the sound waves. The membrane is arranged in parallel with and at a distance from a back plate, which is formed from a non-conductive base. The base is provided with a conductive layer. The conductive layer has an active area that is arranged opposite the acoustically active area of the membrane and has a shape that faces the acoustically active area, and is delimited by an area where no conductive layer is provided. A microphone including the condenser element and a method of producing the microphone element are also provided.

Abstract: An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.

Abstract: A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.

Abstract: A microphone system has a package with an interior chamber and an inlet aperture for receiving an acoustic signal, and a microphone die having a backplate and a diaphragm. The microphone is positioned within the package interior to form a front volume between the diaphragm and the inlet aperture. Accordingly, the microphone is positioned to form a back volume defined in part by the diaphragm within the interior chamber. The system also has a stop member positioned in the back volume so that the diaphragm is between the stop member and the backplate.

Abstract: A host device for use with a removable peripheral apparatus having a microphone, and to the biasing circuitry for said microphone. The host device may have a device connector for forming a mating connection with a respective peripheral connector. A source of bias is arranged to supply an electrical bias to a device microphone contact of the device connector via a biasing path. A capacitor is connected between a reference voltage node and a capacitor node of the biasing path. A first switch is located between the capacitor node and the device microphone contact. Detection circuitry detects disconnection of the peripheral connector and device connector; and control circuitry controls the switch to disable the biasing path.

Abstract: A MEMS microphone comprising: a) a case with an open front side; b) a MEMS membrane mounted on one face of a base, the base being mounted inside the case on a substantially closed side; and c) a mesh covering the front side, substantially transparent acoustically to at least some of a range of operating frequencies at which the microphone is sensitive.

Abstract: A system and method are described for reducing the current consumption of a microphone component without adversely affecting performance. The system includes a micromechanical microphone capacitor, an acoustically inactive compensation capacitor, an arrangement for applying a high-frequency sampling signal to the microphone capacitor and for applying the inverted sampling signal to the compensation capacitor, an integrating operational amplifier which integrates the sum of the current flow through the microphone capacitor and the current flow through the compensation capacitor as a charge amplifier, a demodulator, which is synchronized with the sampling signal, for the output signal of the integrating operational amplifier, and a low-pass filter which uses the output signal of the demodulator to obtain a microphone signal that corresponds to the changes in capacitance of the microphone capacitor. The sampling signal is composed of a periodic sequence of sampling pulses and pause times.

Abstract: A condenser microphone includes a plurality of condenser microphone units, each unit including a diaphragm and a fixed electrode one of which has an electret layer thereon. The condenser microphone units include respective sensitivity controllers changing sensitivities of the units. The sensitivity controllers include respective variable resistors connected between a power source and a ground. Each of the variable resistors has a slidable terminal connected to one, opposed to the electret layer, of the diaphragm and the fixed electrode, of the corresponding condenser microphone unit.

Abstract: The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure.

Abstract: A condenser microphone which prevents a directional axis from varying depending on a sound source frequency is provided. The condenser microphone includes a first reflector member 2 provided below the microphone unit 17 and covering an electronic circuit substrate 19 and a second reflector member 3 formed in the same shape as the first reflector member and provided above the microphone unit, the first reflector member and the second reflector member being disposed symmetrically with respect to the microphone unit.

Abstract: A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil.

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract: A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a case (10) for accommodating the first vibrating part (14) and the second vibrating part (15), the case being provided with a first sound hole (132) and a second sound hole (133). The case (10) is provided with a first sound channel (41) for transmitting acoustic pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound channel (42) for transmitting acoustic pressure inputted from the second sound hole (133) to the other surface (152b) of the second diaphragm (152), and a sealed space (S) that faces the other surface (142b) of the first diaphragm (142).

Abstract: There is provided a capacitor microphone comprising a microphone capsule (100), which has an at least partially electrically conductive diaphragm (110) and a counterelectrode (120) associated therewith. The counterelectrode (120) has a printed circuit board (21) having a carrier of an insulating material (121a) and at least one electrically conductive surface (121b).

Abstract: Disclosed is a microphone unit comprising a film substrate (1), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (11), including the electrically conductive layers (15, 16), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.

Abstract: In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

Abstract: A back air room of a microphone unit can be enlarged and a model with a sound signal output switch can easily be diverted to a switchless model. A reed switch 16 is used as the sound signal output switch which turns on or off the sound signal from a microphone unit 1. This reed switch is disposed at an output connector 11 portion at an rear end of a microphone case 6. It is arranged that a magnet 22 is disposed at a connector cover 21 which surrounds an output connector and relative movement of the connector cover with respect to the output connector allows on/off operation. Thus, by removing the connector cover 21, it is possible to provide the microphone as a switchless model which always outputs the sound signal from the microphone unit 1.

Abstract: Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.

Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.

Abstract: A hearing aid (8) comprises an inlet port (6), a sound tube (12) for conveying sound to the ear piece (13). The invention further provides a component for a hearing aid comprising a slab (26) having an exterior surface, which is super-hydrophobic. The component may be any one of a housing, a casing, a shell, a faceplate, a grid, a hook, a lid, a battery drawer, a button, or a manipulator. The invention also provides a method of manufacturing a component for a hearing aid.

Abstract: A dynamic microphone unit includes: a diaphragm vibrating in response to received sound waves; a voice coil fixed to the diaphragm and vibrating in cooperation with the diaphragm; a magnetic circuit generating magnetism in a magnetic gap, the voice coil being disposed in the magnetic gap; a first air chamber defined adjacent to the reverse of the diaphragm; and a second air chamber defined behind the voice coil, the second air chamber being in communication with the first air chamber, an elastic thin-plate acoustic resistor being disposed in the second air chamber while having tensile force applied, at a position where the acoustic resistor limits the volume of the second air chamber and comes into contact with the voice coil within a maximum displacement of the voice coil.

Abstract: The present invention relates to a microphone actuator for fitting a microphone through the upper surface of a table such as that used in a boardroom. The microphone actuator comprises a stepper motor (2), coupled to a gear (4, 6, 8, 14) which is arranged to cause extension and/or retraction of a microphone (11) from or into a housing (20) respectively. The invention also relates to a method of initialising a microphone actuator comprising the steps of initially moving the actuator to a retracted position until a retracted limit stop is reached, receiving user input indicating that a setup mode has been entered, receiving user input indicating that the actuator should be extended or retracted, receiving user input indicating that a desired actuator position has been reached, and storing the desired actuator position in memory.

Abstract: Illustrative acoustic transducers are provided. A monolithic semiconductor layer defines a plate, two or more flexible extensions and at least a portion of a support structure. Acoustic pressure transferred to the plate results in tensile strain of the flexible extensions. The flexible extensions exhibit varying electrical characteristics responsive to the tensile strain. An electric signal corresponding to the acoustic pressure can be derived from the varying electrical characteristics and processed for further use.

Abstract: A composite microphone comprises a flexible and stretchable substrate (22, 122, 250, 350, 450) with a grid of flexible and stretchable first and second conductors (31a, . . . , 31e, 131a, 131g; 33a, . . . , 33h, 133a, 133g). The first conductors (31a, . . . , 31e, 131a, 131g) are arranged transverse to the second conductors (33a, . . . , 33h, 133a, 133g). A plurality of acoustic sensors (40, 140) is each in connection with a respective pair of conductors in the grid.

Abstract: An implantable microphone for use in hearing systems includes a housing having a sidewall, a first membrane coupled to a top portion of the housing and configured to move in response to movement from an auditory ossicle, and a second membrane coupled to the sidewall such that an interior volume of the housing is divided into a first volume and a second volume. The second membrane has an opening that permits fluid to flow from the first volume to the second volume. The implantable microphone also includes a vibration sensor adjacent to the second membrane and configured to measure the movement of the second membrane and to convert the measurement into an electrical signal. The vibration sensor may include a piezoelectric sensor and/or a MEMS sensor.

Abstract: A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

Abstract: The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components.

Abstract: A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

Abstract: A unidirectional microphone is provided that has an excellent directional frequency response and a high sensitivity. Sound waves are guided to a rear acoustic terminal 10b of an acoustic resistance tube 30 through an acoustic resistance member 31. A rear end opening 30b of the acoustic resistance tube 30 is blocked so as to prevent the sound waves from entering the rear acoustic terminal 10b from the rear end opening 30b of the acoustic resistance tube 30 on the side of the rear acoustic terminal 10b. A gap G which allows low-frequency sound waves to pass and through which a front acoustic chamber A1 and a rear acoustic chamber A2 in the acoustic resistance tube 30 communicate with each other is provided between the inner peripheral surface of the acoustic resistance tube 30 and the outer peripheral surface of the microphone unit 10.

Abstract: The present invention relates to a spacer for a capacitive microphone and a capacitive microphone with such spacer, in which the spacer is mounted between polar plates and vibrating diaphragm of the microphone and the spacer comprises at least one insulating layer and at least one conductive layer bonded with the insulating layer. With the above-mentioned structure, static electricity is effectively prevented from occurring or storing during manufacturing process of the spacer and meanwhile, disadvantages such as difficult processing, high cost and tendency to increase parasitic capacitance while making spacer with metal sheet are overcome.

Abstract: To provide a downsized microphone unit in which a differential microphone is densely mounted thereon. The microphone unit has a cover portion 30 and a microphone substrate 10, in which a first substrate internal space 15 is communicated with a cover portion internal space 32 via a first substrate opening 11 and a cover portion opening 31, and is communicated with the outside via a second substrate opening 12, a second substrate internal space 16 is communicated with the cover portion internal space 32 via a third substrate opening 13 and a cover portion opening 31, and is communicated with the outside via a fourth substrate opening 14, a partition portion 20 covers a communication aperture between the first substrate opening 11 and the cover portion opening 31, and a diaphragm 22 covers at least a part of the communication aperture between the first substrate opening 11 and the cover portion opening 31.

Abstract: A microphone includes two backplates. A membrane is located between the two backplates. A voltage source applies a first bias voltage to the membrane and the first backplate and applies a second bias voltage to the membrane and the second backplate. A control unit adjusts the first and the second bias voltage. A method to center the membrane in a final electro-mechanic equilibrium position between the two backplates in a microphone is also disclosed.

Abstract: Embodiments of a directional acoustic sensor or acoustic velocity microphone are disclosed that include a sensor frame structure, a support means, and a buoyant object. The buoyant object is suspended in the sensor frame structure using the support means. The buoyant object has a feature size smaller than a wavelength of the highest frequency of an acoustic wave in air. The buoyant object receives three-dimensional movement of the air excited by the acoustic wave. The three-dimensional movement that the buoyant object receives is detected using a detection means. A particle velocity of the acoustic wave is derived from the three-dimensional movement of the buoyant object using the detection means. The detection means can be an optical detection means, an electromagnetic detection means, or an electrostatic detection means. An acoustic image of the acoustic wave can be determined by distributing two or more directional acoustic sensors a multi-dimensional array.

Abstract: A microphone system including an audio sensor with a first electrode and a second electrode. A voltage source is coupled to the first electrode and the second electrode. A high-impedance bias network is coupled between the voltage source and the first electrode of the audio sensor. Additional electronics operate based on a state of the first electrode of the electromechanical device. A feedback system is configured to maintain an electrical potential across the high-impedance bias network at approximately zero volts. Maintaining the electrical potential across the high-impedance bias network at approximately zero volts reduces the tendency of electrostatic pull-in occurring.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.

Abstract: A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element.

Abstract: A micro-sensor package is provided that includes a micro-sensor and printed circuit board (PCB), or that includes an array of micro-sensors and PCB. The micro-sensor includes a first substrate having opposing front and back surfaces, a sensing element on the front surface of the first substrate, and a through-chip via disposed within the first substrate and electrically connected to the sensing element. The PCB includes a second substrate to which the back surface of the first substrate is bonded. The second substrate defines a recess within which a bond pad is disposed, and the through-chip via of the micro-sensor is electrically connected to the bond pad of the PCB. The micro-sensor package may further include a shim bonded to the PCB, and that may surround an outer boundary of the micro-sensor and have approximately the same thickness as the micro-sensor.

Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).

Abstract: A capacitor microphone includes: a capacitor microphone unit; a microphone casing that incorporates the microphone unit and is provided with an opening communicating with a rear acoustic terminal of the microphone unit; and a shield plate that covers the opening in the microphone casing from inside of the microphone casing. The shield plate has a projection extending towards axial direction of the microphone casing at least on microphone unit side in the axial direction of the microphone casing. The projection is folded to be pressed firmly against the outer surface of a casing of the capacitor microphone unit. The shield plate is rolled into a cylindrical shape and is in contact with the inner surface of the microphone casing with pressure.

Abstract: An electret condenser microphone includes a microphone capsule having a diaphragm, a fixed electrode and an extraction electrode. The extraction electrode includes a closed-bottomed cylinder composed of a conductive material. The fixed electrode has holes extending from an air chamber between the diaphragm and the fixed electrode to an air chamber within the extraction electrode, and is fixed to a shoulder of the extraction electrode to form the air chamber that serves as acoustic capacitor within the extraction electrode.

Abstract: A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.

Abstract: A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.

Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.

Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.

Abstract: A MEMS acoustic transducer, for example, a microphone, includes a substrate provided with a cavity, a supporting structure, fixed to the substrate, a membrane having a perimetral edge and a centroid, suspended above the cavity and fixed to the substrate the membrane configured to oscillate via the supporting structure. The supporting structure includes a plurality of anchorage elements fixed to the membrane, and each anchorage element is coupled to a respective portion of the membrane between the centroid and the perimetral edge of the membrane.

Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.

Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.

Abstract: A micromechanical microphone structure configured as a layered structure includes: a semiconductor substrate; a diaphragm structure having an acoustically active diaphragm which at least partially spans a sound opening in the back side of the substrate and is provided with a movable electrode of a microphone capacitor, which diaphragm structure has openings via which pressure compensation occurs between the back side and the front side of the diaphragm; a stationary acoustically permeable counterelement having vents, which counterelement is situated in the layered structure above the diaphragm and which functions as a carrier for a nonmovable electrode of the microphone capacitor; and at least one ridge-like structural element which is situated at the outer edge area of the diaphragm, and which protrudes from the diaphragm plane into corresponding recesses in an adjoining layer.

Abstract: An electro-acoustic transducer (1) is disclosed, comprising a substrate (2) that comprises conducting paths (3), a cover (4) attached to said substrate (2) thus forming an inner chamber (A) and a space (B) outside said chamber (A), wherein said cover (4) comprises one or more ports (5). A MEMS sensor (6) of said transducer (1) has at least one hole (7) extending from a first side (C) to a second side (D). A membrane (8) is arranged in said hole (7) transverse to the hole axis (E) thus forming a first hole space (a) and a second hole space (b). The sensor (6) furthermore has electrical connectors (9) designed to carry electrical signals representing sound acting on said membrane (8), which connectors (9) are connected to said conducting paths (3). According to the invention, said MEMS sensor (6) is arranged inside said chamber (A) in such a way that said second hole space (b) is connected to said outside space (B) via said port or ports (5) and said first hole space (a) is connected to said inner chamber (A).