Abstract: Optical alignment between an optical waveguide device and an optical connection part is realized easily and at low cost. An optical circuit in which optical waveguides to be connected to optical fibers are formed includes: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to the optical axis direction of the core of the alignment optical waveguide.

Abstract: Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: Building blocks are provided for on-chip chemical sensors and other highly-compact photonic integrated circuits combining interband or quantum cascade lasers and detectors with passive waveguides and other components integrated on a III-V or silicon. A MWIR or LWIR laser source is evanescently coupled into a passive extended or resonant-cavity waveguide that provides evanescent coupling to a sample gas (or liquid) for spectroscopic chemical sensing. In the case of an ICL, the uppermost layer of this passive waveguide has a relatively high index of refraction that enables it to form the core of the waveguide, while the ambient air, consisting of the sample gas, functions as the top cladding layer. A fraction of the propagating light beam is absorbed by the sample gas if it contains a chemical species having a fingerprint absorption feature within the spectral linewidth of the laser emission.

Abstract: Apparatus, systems, and methods for the inspection of holes in transparent materials, the apparatus including a processor, an illumination probe, and a detection probe. The illumination probe includes a laser light source and a reflective surface and is configured to be inserted into a first hole in the transparent material. The detection probe includes a second reflective surface and a photodetector and is configured to be inserted in a second hole in the transparent material. Laser light is directed onto the first reflective surface within the first hole and is reflected through a wall of the first hole, into the transparent material, and reflected by the second reflective surface to the photodetector. The photodetector transmits a measured light intensity value to the processor, which compares the light intensity value to a standard intensity value to determine whether or not a crazing condition exists in the second hole.

Abstract: The invention may be embodied in other forms than those specifically disclosed herein without departing from itMulti-kW-class blue (400-495 nm) fiber-delivered lasers and module configurations. In embodiments, the lasers propagate laser beams having beam parameter products of <5 mm*mrad, which are used in materials processing, welding and pumping a Raman laser. In an embodiment the laser system is an integration of fiber-coupled modules, which are in turn made up of submodules. An embodiment has sub-modules having a plurality of lensed blue semiconductor gain chips with low reflectivity front facets. These are locked in wavelength with a wavelength spread of <1 nm by using volume Bragg gratings in an external cavity configuration. An embodiment has modules having of a plurality of submodules, which are combined through wavelength multiplexing with a bandwidth of <10 nm, followed by polarization beam combining. The output of each module is fiber-coupled into a low NA fiber.

Abstract: An electronic device includes: a housing including a front plate oriented in a first direction and a rear plate oriented in a second direction; a display visible through at least a portion of the front plate; and a biometric sensor module located between the front plate and the rear plate. The biometric sensor module may include: a cover glass oriented in the second direction; at least one light source configured to emit light to the outside; a light detector disposed adjacent to the at least one light source, and configured to receive reflected light corresponding to light emitted from the light source; a light guide disposed between the light detector and the cover glass, and configured to provide a path of the reflected light received by the light detector; and a circuit board electrically connected to the at least one light source and the light detector.

Abstract: An optical fiber connector includes a coupler having a waveguide section integrally formed with a fiber attachment section. At least one waveguide is disposed in the waveguide section and has a core dimension that is greater at the end of the waveguide at the fiber attachment section. The fiber attachment section has a first surface and at least one recess formed on the first surface for aligning one or more optical fibers with the at least one waveguide. In an optical fiber component, an optical substrate has a first end and a second end, and at least one waveguide input at the first end and at least one waveguide output at the second end. An integral input portion of the substrate at the first end has one or more input optical fiber alignment elements and an integral output portion of the substrate at the second end has one or more output optical fiber alignment elements. One or more input optical fibers are positioned in the one or more input optical fiber alignment elements.

Abstract: Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.

Abstract: A joint layout is provided for the firm bonding of components by means of a light-activated joining agent. A light guide element is arranged at least in sections in a joint gap between the components. The light guide element is embedded into the joining agent in the joint gap, and light for activating the joining agent can be outcoupled from the light guide element in the joint gap. In this context, at least one spacer is arranged in the joint gap between the light guide element and at least one of the components.

Abstract: The present invention provides an optical connector which comprises a connector body, and a first adjusting element, wherein the connector body comprises a first end surface at a first side of the connector body utilized to insert into a receptacle, and a second end surface formed at another side of the connector body and opposite to the first end surface. The first adjusting element is operated to perform a position adjusting movement for taking the connector body away from the receptacle. Alternatively, in another embodiment, the present invention further provides an optical connector module comprising the receptacle and the optical connector for applying to various kinds of communication device.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: Porous polymeric materials having a very high content of thermally conductive and/or electrically conductive fillers. Process for the preparation of the porous composite material including at least one binder-forming polymeric phase and one or more fillers, this process including the stages of hot mixing, by the molten route, the polymeric phase, the fillers and a sacrificial polymeric phase, so as to obtain a mixture, of shaping the mixture and of removing the sacrificial polymeric phase.

Abstract: A system is provided for connecting a plurality of different enclosures within rack. Enclosures can be stacked and contain a plurality of articulating arm assemblies configured to mate with each other. Each articulating arm assembling may comprise a side plenum, arm plenum, plenum pivot, and at least one knuckle housing. One or more knuckle housings of each articulating arm assembly configured to connect with one or more knuckle housing of a different articulating arm assembly. Each articulating arm assembly configured to move to at least a open and an closed position. Each knuckle housing of each articulating arm assembly includes a plurality of optical connector arrays configured to mate with corresponding optical connector arrays of a different articulating arm assembly. Each knuckle housing may further include at least one retention feature configured to retain coupling of a knuckle housing with a corresponding knuckle housing.

Abstract: Quantum well designs for tunable VCSELs are disclosed that are tolerant of the wavelength shift. Specifically, the active region has even number of substantially uniformly spaced (¼ of the center wavelength in the semiconducting material) quantum wells.

Abstract: An optical fiber array includes: a multicore optical fiber in which the outer peripheral shape of cladding in a cross section has first and second convex surfaces symmetric with respect to a first axis, and first and second surfaces symmetric with respect to a second axis and closer than extensions of the first and second convex surfaces to the second axis; an arrangement component including a groove having a trapezoidal shape having first and second side surfaces mutually facing such that sectional shapes become closer toward a grove bottom, and a bottom surface; and a pressing member. With the first surface in surface contact with the pressing member, the first convex surface or a boundary portion between the first convex surface and the second surface, and the second convex surface or a boundary portion between the second surface and the second convex surface are in contact with the first and second side surfaces, respectively.

Abstract: An optical cable includes an optical component assembly, inner and outer optical fibers, a componentry cover, and a connector. The optical component assembly includes an optical unit. The inner and the outer optical fibers are on opposing sides of the optical unit such that the optical unit receives a first optical signal from the inner optical fiber and the outer optical fiber receives a second optical signal from the optical unit or such that the optical unit receives the second optical signal from the outer optical fiber and the inner optical fiber receives the first optical signal from the optical unit. The componentry cover encapsulates an entirety of the optical unit and portions of the inner and the outer optical fibers. The connector includes a portion of first outer optical fiber that is exposed to route the second optical signal.

Abstract: An optical subassembly may include a plurality of optical semiconductor devices arrayed such that a plurality of light beams respectively traveling in parallel in a first direction are emitted therefrom or incident thereon. The optical subassembly may also include a carrier on which the plurality of optical semiconductor devices are mounted. Adjacent ones of the plurality of optical semiconductor devices may be located at positions shifted in a second direction orthogonal to the first direction and may be shifted in the first direction so as not to face each other in the second direction.

Abstract: Optical apparatus comprises: a body comprising material; a plurality of optical elements formed of the material of the body; and a plurality of alignment holes formed in the material of the body, wherein: the alignment holes comprise fibre or other waveguide alignment holes aligned with one or more of the optical elements, and/or the alignment holes comprise alignment holes configured to receive mechanical elements for fixing and/or aligning the body to at least one further body.

Abstract: A fiber array unit (FAU) includes a substrate, a cover element, and a plurality of optical fibers each including a splice joint connecting fibers of different mode-field diameters with a recoating material arranged over at least a portion of the fibers overlapping the substrate, wherein stripped portions of the fibers are arranged in grooves between the substrate and the cover element. A method for fabricating a compact FAU includes splicing ends of stripped sections of first and second optical fiber segments of different mode-field diameters, applying a recoating material over at least portions of the stripped sections, positioning portions of stripped sections of the second optical fiber segments in grooves defined in a substrate, and arranging a cover over the grooves. Certain embodiments include stripping recoating material portions of the second optical fiber segments before they are placed in the grooves.

Abstract: Technologies for propagating optical information through an optical waveguide in a downhole environment are provided. An example method can include generating a light signal via a light-emitting device at a first location on a wellbore environment; propagating the light signal through an optical waveguide on an inner surface of a wellbore tool, the optical waveguide including a first layer of low refractive-index material, a second layer of high refractive-index material applied to a first surface of the first layer, and a third layer of low refractive-index material applied to a second surface of the second layer; and receiving, by a detector at a second location on the wellbore environment, the light signal via the optical waveguide on the inner surface of the wellbore tool.

Abstract: A fiber attachment structure may comprise a monolithic platform structure having a first trench and a second trench to segment the monolithic platform structure into a chip mount area, a first island, and a second island. A laser chip may be mounted directly on the chip mount area and an optical fiber may be mounted on the first island by a first adhesive joint and on the second island by a second adhesive joint. For example, in some implementations, the first adhesive joint may include a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip, and the second adhesive joint may include a second quantity of the adhesive material to mechanically secure the optical fiber to the second island.

Abstract: Generally disclosed herein is an optical cable assembly a casing that defines a storage space, the casing having a first through hole at a first end and a second through hole at the second end, a first arrayed waveguide grating (AWG) disposed in the storage space, a second AWG disposed in the storage space, a first optical cable comprising at least one transmission optical fiber connected to a first end of the first and second AWGs, a second optical cable comprising at least one transmission optical fiber connected to a second end of the first and second AWGs, wherein the first and second AWGs are disposed substantially parallel with each other and substantially parallel with a longitudinal axis of the casing such that each of the first and second AWGs have a first end proximate the first through hole and a second end proximate the second through hole.

Abstract: An optical coupling device including a plurality of optical fibers, each including first and second bared optical fiber portions, and first and second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface of the first component and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface of the first component and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.

Abstract: An optical module includes a circuit board and a receiver disposed on the circuit board. The circuit board includes a groove disposed in a surface of the circuit board. The groove is recessive along a height direction of the circuit board. The receiver includes an arrayed waveguide grating. The arrayed waveguide grating is configured to receive optical signal from an optical fiber. The arrayed waveguide grating is arranged above the groove and opposite to the groove.

Abstract: An optical module that includes a shell, an optical fiber, a coupling portion, and a ferrule is disclosed. The shell installs an optical device, for instance, a multi-mode interference (MMI) device therein. The optical fiber in a tip thereof is optically coupled with the optical device within the shell. The coupling portion has a cylindrical shape with a bore having an axis and secures the optical fiber, where the coupling portion is attached to the shell. The ferrule, which is secured in the coupling portion, has a pillared shape with a diameter that is slightly smaller than a diameter of the bore of the coupling portion. The ferrule has a groove that receives and secures the optical fiber therein. The filler fills the groove and fixes the optical fiber in the groove.

Abstract: A hermetic optical subassembly includes an optical bench having a mirror directing optical signals to/from an optical waveguide, a carrier supporting a photonic device, and an intermediate optical bench having a mirror directing optical signals between the photonic device and the optical bench. The optical bench and the intermediate optical bench optically aligns the photonic device to the waveguide along a desired optical path. In one embodiment, the photonic device is an edge emitting laser (EML). The mirror of the optical bench may be passively aligned with the mirror of the intermediate optical bench. The assembled components are hermetically sealed. The body of the optical benches are preferably formed by stamping a malleable metal material to form precise geometries and surface features. In a further aspect, the hermetic optical subassembly integrates a multiplexer/demultiplexer, for directing optical signals between a single optical fiber and a plurality of photonic devices.

Abstract: The various technologies presented herein relate to integrating an IC having at least one waveguide incorporated therein with a v-groove array IC such that an optical fiber located in a v-groove is aligned relative to a waveguide in the IC maximizing optical coupling between the fiber and the waveguide. The waveguide IC and the v-groove array IC are bonded in a stacked configuration. Alignment of the waveguide IC and the array IC in the stacked configuration enables advantage to be taken of lithographic accuracy of features formed with respect to the Z-direction. Further, kinematic pins and sockets are utilized to provision accuracy in the X- and Z-directions, wherein advantage is taken of the placement accuracy and fabrication tolerance(s) which can be utilized when forming the and sockets. Accordingly, automated alignment of the waveguide IC and the array IC is enabled, facilitating accurate alignment of the respective waveguides and fibers.

Abstract: An optical waveguide termination comprising a light-receiving inlet for receiving light to be terminated, a curved section extending from the inlet and having a continuously decreasing radius of curvature, and a light-terminating tip at an end of the curved section. The curved section may define a spiral waveguide, for example a logarithmic spiral, having a waveguide width that continuously decreases from the inlet to the tip.

Abstract: A system for monitoring a signal on an optical fiber includes a fiber optic connector having a housing couplable to a receptacle. An optical fiber that transmits a first optical signal has first fiber core at least partially surrounded by a cladding and has a first end terminating proximate the housing. The first optical signal is transmitted along the first fiber core. An optical tap has a first tap waveguide arranged and is configured to receive at least part of the first optical signal as a first tap signal. The first tap waveguide comprises an output port for the first tap signal for directing the tap signal to a detector unit. In other embodiments, a detector unit detects light from the optical signal that is propagating along the fiber cladding. The system is intended to permit a technician to easily and quickly, without having to remove a connector, determine whether an optical signal is propagating along a fiber cable.

Abstract: An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A multi-tiered optical assembly includes a ferrule body having a mating face, a rear face, and a pair of spaced apart sidewalls, with the mating face, the rear face, and the sidewalls defining an opening. The ferrule body further includes a first support level, and a second support level, with the second support level being vertically spaced from the first support level. First and second flexible optical waveguide members each include at least one waveguide. The first waveguide member is disposed at the first support level and extends between the mating face and the rear face, and the second waveguide member is disposed at the second support level and extends between the mating face and the rear face.

Abstract: The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.

Abstract: The present disclosure relates to an integrated light emitting device. The integrated light emitting device comprises a substrate of semiconductor material, a light emitting unit integrated into the semiconductor material, and at least one cavity formed into the semiconductor material between the substrate and the light emitting unit. At least portions of the at least one cavity may be formed by Silicon-On-Nothing (SON) process steps.

Abstract: A photonic integrated circuit (PIC) package includes a PIC die including electro-optical circuitry having an optical waveguide system therein and a V-groove fiber optic receptacle on a first surface thereof. The V-groove fiber optic receptacle positions an optical element, e.g., optical fiber(s), for optical coupling with the optical waveguide system. An optical element is operatively coupled to the optical waveguide system and positioned in the V-groove fiber optic receptacle. A magnetic force inducer (MFI) is positioned to forcibly direct the optical element into position in the V-groove fiber optic receptacle in response to application of a magnetic field from a direction opposite the V-groove fiber optic receptacle in the first surface. During assembly, a magnetic field may be applied to the MFI to generate the magnetic force. After adhering the optical element, the magnetic field may remain to allow the PIC package to be moved with more security.

Abstract: A method for assembling a semiconductor device includes: receiving a first chip including a plurality of first bonding pads, a first standoff and a second standoff, wherein a first solder is deposited on each of the first bonding pads; depositing a second solder on each of the first and second standoffs; arranging a second chip over the first chip, wherein the second chip includes a plurality of second bonding pads, and at least one of the second bonding pads has a corresponding first bonding pad; heating the second chip over a melting point of the second solder to melt the second solder, and placing the second chip on the first chip to touch and solidify the second solder on each of the first and second standoffs; performing a reflow process to melt the first solder on each of the first bonding pads so that at least one of the first solders touches a corresponding second bonding pad; and waiting a predetermined period of time to allow the second chip to move until a side edge of the second chip touches a wav

Abstract: Provided is a device and method for detecting an optical signal. The optical signal detecting device may include an optical de-multiplexer configured to de-multiplex an input optical signal to optical signals of different wavelengths; an optical coupling lens configured to allow the optical signals of different wavelengths to be incident; an optical signal reflector configured to reflect the optical signals of different wavelengths emitted from the optical couple lens; and an optical detector configured to detect the reflected optical signals of different wavelengths.

Abstract: Disclosed herein are methods and apparatuses for scoring a glass article, including positioning a plasma flame of a plasma torch and the glass article in close proximity to one another; and moving the plasma torch across a surface of the glass article to form at least one indentation in the surface, wherein the at least one indentation is formed from the plasma flame melting at least a portion of the glass surface to form a scoring line, without penetrating through a total thickness of the glass article.

Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Abstract: A system including a first component having a lensed facet; and a second component optically coupled to the first component, the second component having a tapered facet, the tapered facet and lensed facet spaced from each other so as to establish evanescent-wave coupling between the first component and the second component.

Abstract: An electrical connector includes: a contact module comprising an insulative housing having a base portion and a tongue portion, and a number of conductive terminals affixed to the insulative housing and each comprising a contacting portion exposed to a surface of the tongue portion, a soldering portion and a connecting portion connecting the contacting portion and the soldering portion; and a metal shell comprising a pair of locking grooves depressed forwardly from a rear surface thereof; wherein the insulative housing comprises a pair of mounting portions located at two lateral sides of a rear end thereof, the mounting portions are stuck in the locking grooves when the contact module is assembled to the metal shell along a rear-to-front direction, and a lower portion of each mounting portion is resisted against the rear surface of the metal shell.

Abstract: A micro-optics assembly and a method for assembling the micro-optics assembly are provided. The micro-optics assembly may include an optical bench having an opening, a cylindrical body disposed in the opening and having a solder well, a heating element thermally coupled to the solder well, and an optical element. The optical element may include a frame having a post and a micro-optic mounted in the frame. The post may be secured in a solid solder material disposed within the solder well in the cylindrical body. The solder may be reflowable such that the micro-optics assembly is reconfigurable without the need for optical realignment components permanently mounted to the optical bench.

Abstract: A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.

Abstract: The present invention makes it possible to prevent an optical loss in association with mode field diameter conversion and to prevent deformation in a mode field converter. The present invention includes: (a) temporarily fixing an end surface of an optical fiber (1) to an end surface of a core part (8) via a highly-viscous resin (3); and (b) after the step (a), while butting the end surface of the optical fiber (1) against the end surface of the core part (8) through the highly-viscous resin (3), fixing the optical fiber (1) to a semiconductor optical device (100) at a place away from the end surface of the optical fiber (1).

Abstract: An apparatus may include a photonic device with at least a first waveguide having a light-conducting core bounded by at least one cladding layer, at least a second waveguide having a light-conducting core bounded by at least one cladding layer, wherein the first waveguide is aligned to couple with the second waveguide, wherein alignment of the first waveguide with the second waveguide with respect to at least one axis C coincides with at least one stop area of the photonic device resting on a stop surface of a corresponding support structure on a substrate, wherein the stop area is a stop in a recess from a surface of the photonic device. A method to fabricate the apparatus may include the recess is formed by etching of the photonic device, and/or the support structure is formed by etching of the substrate.

Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.

Abstract: A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.

Abstract: An optical module for connecting a photoelectric conversion device on a substrate to a ferrule connected to an optical fiber includes a body configured to be mounted on the substrate, a first lens disposed on the body at a side thereof connectable to the ferrule, a second lens disposed on the body at a side thereof facing the substrate, and a core disposed in the body between the first lens and the second lens, wherein a refractive index of the core is higher than a refractive index of the body.

Abstract: An optical transceiver includes a substrate, a first transceiver module, a second transceiver module and an optical fiber module. The substrate defines an optical transceiver end. The first transceiver module and the second transceiver module are disposed on an outer surface of the substrate, and the first transceiver module is located between the optical transceiver end and the second transceiver module. The optical fiber module includes a first optical fiber and a second optical fiber. The first optical fiber is coupled to the first transceiver module, and the second optical fiber is coupled to the second transceiver module. A part of the second optical fiber is located above the first transceiver module.