Abstract: An optical waveguide device includes: a substrate; an optical element arranged on the substrate; and an optical circuit part having an optical waveguide formed on the substrate. The optical circuit part includes: a core whose optical axis is matched with the optical element; and a dummy core arranged on a same layer to the core and exposed on a side being not opposed to the optical element when the optical element is arranged on the substrate. The relative position between the optical waveguide and the optical element can be recognized by observing the dummy core. The planar shape of the optical circuit has a convex portion. The width of the convex portion and the width of the optical element are same in the opposing edge face where the optical element and the core is opposed to one another.

Abstract: A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

Abstract: A laser guide optical fiber (100) used for transmitting a laser beam includes an optical fiber body (110) including a core (111) and a clad (112), and a quartz chip (120) integrally provided at an end surface on the light entering side of the optical fiber body (110) and including an optical waveguide portion, where at least the optical waveguide portion of the quartz chip (120) is made of pure quartz. The quartz chip (120) includes a light entering surface subjected to surface fusion treatment.

Abstract: A laser light source device which can inexpensively achieve a visually recognizable level of speckle reduction is disclosed. The laser light source device includes: a laser module including a light source and a first optical waveguide, wherein light emitted from the light source is outputted from an output end of the first optical waveguide; a second optical waveguide connected to the first optical waveguide, wherein the light outputted from the output end of the first optical waveguide is inputted to an input end of the second optical waveguide and guided through the second optical waveguide; and an intensity modulation unit disposed in the vicinity of the second optical waveguide, the intensity modulation unit applying intensity modulation to the second optical waveguide, wherein a core diameter at the input end of the second optical waveguide is larger than a core diameter at the output end of the first optical waveguide.

Abstract: A mirror embedded optical waveguide according to the present invention comprises: a core; an angled cut face in the core; an adhesive layer on the angled cut face, the adhesive layer having approximately the same refractive index as that of the core; and a metal film on the adhesive layer, the metal film being formed by transfer.

Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

Abstract: The present invention is directed to an assembly of an optical fiber and an optical fiber holder for holding the optical fiber, the optical fiber having an end surface formed at an end portion thereof, the end surface being configured to perform light coupling with a light emitting element or with a light receiving element. The optical fiber holder comprises; a throughhole which extends through the optical fiber holder and a recess that is positioned on a surface of the optical fiber holder and that is provided with an opening of the throughhole. The optical fiber is inserted through the throughhole and an adhesive is filled in a gap between an inner wall of the throughhole and an outer periphery of the optical fiber, the adhesive being used for adhering the optical fiber to the optical fiber holder. The end portion, on which is formed the end surface of the optical fiber, protrudes from the opening and terminates within the recess.

Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.

Abstract: A main path in an optical waveguide with a light-emitting element has two sides faced to each other: one side has a plurality of branched points and the other side does not have any branched points. A width W of the main path becomes narrower as the main path moves away from a light-emitting element. An angle ? formed by the main path and a light guiding direction in each branched point of each branched path is 0.1° to 2.0°. An angle ? formed by the other side without branched points and the light guiding direction of the main path is 0.3° to 1.7°.

Abstract: Systems and methods according to these exemplary embodiments provide for on-chip optical waveguides, methods of making on-chip optical waveguides, and devices including such on-chip optical waveguides. A dielectric layer formed from, e.g., transparent spacer dielectric material, forms a waveguide core and can be surrounded or substantially surrounded by a metal cladding layer. The metal cladding layer can be formed in the chip using backend metallization techniques, e.g., Damascene processing.

Abstract: Provided is a silicon photonics chip that is thermally separated from a light emitting device. The silicon photonics chip includes photoelectric devices integrated on a silicon substrate. The photoelectric devices include an optical connection device optically guiding at least one signal light incident from a signal light generation device to transmit the signal light into the silicon substrate. The signal light generation device is thermally separated from the photoelectric devices, and is optically connected to the photoelectric devices.

Abstract: An all-fiber optical pulse compression arrangement comprises a concatenated arrangement of a section of input fiber (e.g., a single mode fiber), a graded-index (GRIN) fiber lens and a section of pulse-compressing fiber (e.g., LMA fiber). The GRIN fiber lens is used to provide mode matching between the input fiber (supporting the propagation of chirped optical pulses) and the pulse-compressing fiber, with efficient pulse compression occurring along the length of the LMA fiber. The dispersion and length of the LMA fiber section are selected to provide the desired degree of pulse compression; for example, capable of reconstituting a femtosecond pulse as is used in supercontinuum generation systems.

Abstract: The invention provides a method of manufacturing an optical printed circuit board and an optical printed circuit board. The method comprises providing a support layer; on the support layer, providing an optical core layer; forming optical channels from the optical core layer and surrounding the optical channels with cladding thereby forming optical waveguides; and during said step of forming the optical channels, forming one or more alignment features, e.g. projections, on the optical printed circuit board.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a sh ape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: An optical coupling device for coupling a light beam into a waveguide and a method of manufacturing the device. The device includes a grating portion having a plurality of essentially straight and essentially parallel scattering elements, wherein two or more of the scattering elements have different lengths. The method includes providing a grating layer on a substrate and forming a plurality of essentially straight and essentially parallel scattering elements from the grating layer, wherein two or more of the scattering elements have different lengths.

Abstract: In a semiconductor apparatus, a plurality of light-triggered type semiconductor devices, each having a groove for burying of an optical fiber for supplying an optical gate signal to a housing of the light-triggered type semiconductor device, are connected in series. Device cooling heat sinks, each having a flow path for circulating a coolant medium and a coolant inlet and a coolant outlet communicating with the flow path, are disposed on both sides of the housing of each light-triggered type semiconductor device. The light-triggered type semiconductor devices and the device cooling heat sinks are coupled into a single structure. An optical fiber insertion groove, which corresponds in position to the groove of the housing, is provided on a side surface of the device cooling heat sink, which contacts a groove (4)-side surface of the housing of the light-triggered type semiconductor device.

Abstract: An optical connector fitted upon a tip end portion of an optical fiber ribbon and disposed to face an optical input and output terminators which are installed upon a substrate, and which optically connects between optical fibers of the optical fiber ribbon and each of the optical input and output terminators. The optical connector includes a block shaped connector main body which is disposed to face the optical input and output terminators.

Abstract: A manufacturing method of an optical waveguide device which is capable of easily and precisely aligning the optical axis of a light receiving and emitting element and the optical axis of an optical waveguide and capable of shortening manufacturing time, and to provide an optical waveguide device obtained thereby. An under cladding layer 11 is formed on an upper surface of a substrate 10. A core layer 16 is formed on an upper surface of the under cladding layer 11. Horizontal alignment guides 17 made of the same material as the above-mentioned core layer 16 are formed on the above-mentioned substrate 10. A light emitting element 19 is installed on the substrate 10 along the horizontal alignment guides 17.

Abstract: A self-written branched optical waveguide is formed. A laser beam 2 from a laser source (not shown) is focused with a lens 3 onto the face of incidence 10 of an optical fiber 1. The laser beam of an LP11 mode was emitted from the face of emergence 11, and “bimodal” light intensity peaks were arranged in the horizontal direction (1.A). A slide glass 4 coated with a photocurable resin gel 5 was placed horizontally (1.B). A single linear cured material 61 was formed as the LP11-mode laser beam was emitted from the face of emergence 11 of the optical fiber 1 (1.C). A branch portion 62 was then formed at a distance L from the face of emergence 11 of the optical fiber 1, which was followed by the growth of two cylindrical cured materials 63a and 63b. The two cylindrical cured materials 63a and 63b were linear branches, and formed an angle of about four degrees. An optical waveguide 60 thus formed was composed of cured materials 61, 62, 63a, and 63b (1.D).

Abstract: A cable assembly (100) includes an insulative housing (2) having a base portion (21) and a tongue portion (22) extending forwardly therefrom, at least a mounting cavity (2212) and a curved slot (2213) defined in a low section of the insulated housing, said curved slot located behind and communicated to the mounting cavity; a plurality of contacts (4) supported by the base portion, each contact having a mating portion arranged proximate to the top side of the tongue portion, and a tail portion extending beyond a back surface of the base portion; an optical module (6) accommodated in the mounting cavity and a spring member (63) arranged between the optical module and a back side of the mounting cavity; an optical fiber (53) extending through the curved slot and connected to the optical module; and a metal shell (8) having a mating frame enclosing the tongue portion and the optical module therein.

Abstract: A leaky plasmon mode directional coupler and a polarization detection module for a magneto-optical pickup head, which uses the leaky plasmon mode directional coupler, are provided. The leaky plasmon mode directional coupler is manufactured by integrating a planar waveguide and a leaky plasmon mode waveguide, which share a cladding layer with each other, into one body. The polarization detection module includes the leaky plasmon mode directional coupler, a first photo diode, which is formed on the leaky plasmon mode directional coupler, and a second photo diode, which is located at an output port of the planar waveguide.

Abstract: Various embodiments of the present invention are directed to photonic-based interconnects for transmitting data encoded in electromagnetic signals between electronic mosaics. In one embodiment of the present invention, a photonic-based interconnect comprises a first photonic node coupled to a second photonic node via a waveguide. The first photonic node is coupled to a first electronic mosaic and is configured to transmit electromagnetic signals encoding data generated by the first electronic mosaic to a second electronic mosaic and receive electromagnetic signals encoding data generated by the second electronic mosaic. The second photonic node is coupled to the second electronic mosaic and is configured to transmit electromagnetic signals encoding data generated by the second electronic mosaic to the first electronic mosaic and receive electromagnetic signals encoding data generated by the first electronic mosaic.

Abstract: An optical waveguide device that is smaller in size and has higher impact resistance. The optical waveguide device (1) has a V-groove (14) formed in a groove forming surface (SF) at an end of a base board (10) where an optical waveguide section (11) is formed. An optical fiber element (22) is embedded by an adhesive layer (13) and connected to the base board (10) with an end of the optical fiber element (22) fitted in the V-groove (14).

Abstract: A sample slide, launch system, and method for microscopy having two optical fibers positioned proximate a sample slide with optical fiber mounting elements to deliver EMR to a surface of the sample slide at a critical angle for total internal reflection microscopy. In one exemplary embodiment, the EMR from the first optical fiber and the EMR from the second optical fiber may have different polarization states and/or wavelengths.

Abstract: In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

Abstract: The invention relates to a coupling device comprising a support substrate; a first layer arranged on the support substrate and comprising first patterns produced within the thickness of said first layer, said first patterns being arranged in parallel and periodic rows; a second layer arranged on the first layer and comprising second patterns passing through the thickness of said second layer, said second patterns being arranged in parallel and periodic rows. The direction of periodicity of the rows of the first patterns is perpendicular to the direction of periodicity of the rows of the second patterns. The rows of the first patterns extend over a distance greater than or equal to the wavelength in the void of the optical wave intended to be coupled. The first patterns have a width less than or equal to a tenth of the wavelength of the optical wave intended to be coupled, and the period of these patterns is between 50 nm and 1 ?m. The second patterns are arranged so as to form a periodic diffraction grating.

Abstract: The invention relates to a circuit arrangement with an electronic circuit on a printed circuit board and an electrically screening housing surrounding the circuit board, wherein there are on said circuit board a HF plug-and-socket connector connected to the electronic circuit with an outer conductor part and an inner conductor part, wherein the HF plug-and-socket connector penetrates through an opening in the housing. The outer conductor part of the HF plug-and-socket connector is electrically isolated from the housing, and wherein a tunnel-like screening sleeve surrounds the outer conductor part both axially and circumferentially at least partially, the sleeve being connected electrically to the housing and capacitively to the outer conductor part of the HF plug-and-socket connector.

Abstract: An optical fiber mounting waveguide device and a method for fabricating the same, which provide a low optical connection loss and a high productivity. An under cladding layer (3u), a core (4), and an over cladding layer (3o) are sequentially formed on a substrate (8) to constitute an optical fiber mounting waveguide device (1). An optical fiber mounting groove (2) for mounting an optical fiber (6) is formed on the optical fiber mounting waveguide device (1). An end surface (3a) of the over cladding layer (3o) faces to the optical fiber mounting groove (2). The core (4) and the under cladding layer (3u) are projected toward the optical fiber mounting groove (2) with respect to the end surface (3a) of the over cladding layer (3o).

Abstract: An optical connector according to the present invention comprises a ferrule and a V-groove board connected to the ferrule, wherein a first optical fiber and a second optical fiber being butt jointed in a V-groove formed in the V-groove board so as to be interconnected; the second optical fiber is connected to the first optical fiber through a refractive index matching material of cross-link curing type applied to an end surface on the V-groove board side of the first optical fiber; and spaces are provided in the V-groove so as to relax stress loaded on the refractive index matching material of cross-link curing type.

Abstract: A method comprises: forming an optical device on a device substrate; forming a first optical waveguide on the device or device substrate; forming a second, structurally discrete optical waveguide on a structurally discrete waveguide substrate; and assembling the optical device, first waveguide, or device substrate with the second waveguide or waveguide substrate. The device and first waveguide are arranged for transferring an optical signal between the device and the first waveguide. Upon assembly the first and second waveguides are positioned between the device and waveguide substrates and are relatively positioned for transferring the optical signal therebetween via optical transverse coupling. The first or second optical waveguide is arranged for transferring the optical signal therebetween via substantially adiabatic optical transverse coupling with the first and second waveguides so positioned.

Abstract: An optical device includes an optically emitting material producing spontaneous emission and an optical waveguide coupled to the optically emitting material. The spontaneous emission from the optically emitting material is emitted into at least one optical mode of the optical waveguide. The optical waveguide coupled to the optically emitting material does not provide optical gain, and the presence of the optical waveguide causes the spontaneous emission rate to be substantially more rapid than in the absence of the optical waveguide. The optical waveguide causes the more rapid spontaneous emission rate over a broad range of frequencies.

Abstract: An optical transmission assembly consists of an upper cladding; a lower cladding; a specified width core formed between the upper cladding and the lower cladding; a surface light emitting device mounted on an upper surface of the upper cladding, a light emitting surface of the surface light emitting device facing the core; a reflective surface formed at a position in the core facing the light emitting surface of the surface light emitting device, and inclined in a longitudinal direction of the core; a shift area formed by which a beam from the light emitting surface of the surface light emitting device and the reflective surface are shifted in a width direction of the core relative to each other; and a light receiving device mounted on a lower surface of the lower cladding, a light receiving surface of the light receiving device facing the light emitting surface of the surface light emitting device through the shift area.

Abstract: Provided is an optical transmitter including, a substrate (silicon optical bench), a light emitting element, and a temperature sensing element; wherein, two recesses are formed in a surficial portion of the silicon optical bench; the light emitting element is provided inside one recess; and the temperature sensing element is provided inside the other recess.

Abstract: An optical waveguide structure comprises a substrate (12) having first and second groove arrays (8, 10), including grooves (8a-8g, 10a-10h), and an optical waveguide (14), having cladding and core (14b) layered on the substrate between the groove arrays to vertically align the core with cores (2a, 4a) of optical fibers (2, 4) positioned on the grooves. The waveguide has at least one first port (20) aligned with a groove (8d) of the first groove array and at least one second port (22) aligned with a groove (10e) of the second groove array. The number of second ports is equal to or greater than that of the first ports. A ratio of the number of grooves of the second groove array relative to the number of grooves of the first groove array is less than a ratio of the number of the second ports relative to the number of first ports.

Abstract: An optical waveguide with photoelectric conversion element includes an under-cladding layer and an over-cladding layer including a thick portion having a large thickness and a thin portion having a small thickness. The optical waveguide with photoelectric conversion element is bendable in a region including the thin portion in such a direction that the under-cladding layer faces inward. This makes it possible to arrange a photoelectric conversion element of each of the optical waveguides with photoelectric conversion element and its associated circuit on the back side of a display panel of an optical touch panel, thereby reducing the size of a frame surrounding a coordinate input region of the optical touch panel and the difference in level on the surface of the frame and its vicinity.

Abstract: A luminometer is provided comprising a waveguide sample holder and one or more detectors. The waveguide sample holder may include a hollow region to hold the sample. The waveguide sample holder can be made of material that guides emission light to a bottom end of the waveguide sample holder. One or more detectors may be provided which detect the emission light coming out of the bottom of the waveguide sample holder. A fluorometer/photometer is also provided that comprises a waveguide sample holder, one or more excitation light sources, and one or more optical detectors. The waveguide sample holder has a hollow region to hold the sample. The excitation light is introduced at an angle or perpendicular to one surface of the waveguide sample holder. The waveguide sample holder is made of material that can guide emission light to the bottom end of the waveguide sample holder. There are one or more detectors that detect the emission light coming out of the bottom of the waveguide sample holder.

Abstract: An optical fiber holder 7 which directs an angulated groove 6 in which an optical fiber 4 is disposed to a substrate 2 and overlays the angulated groove 6 on the substrate 2 may be formed first. Next, a guide 8 which guides the optical fiber holder 7 to the position where the optical fiber 4 and the optical device 3 are to be optically coupled to each other is formed on the substrate 2. Next, a 45-degree mirror is formed by dicing the optical fiber holder 7 and the optical fiber 4 together in a state in which the optical fiber 4 is disposed in the angulated groove 6. Finally, the optical fiber holder 7 is overlaid on the substrate 2, and the optical fiber holder 7 is guided by the guide 8.

Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.

Abstract: In various embodiments, an illumination structure includes a discrete light source disposed proximate a bottom surface of a waveguide and below a depression in a top surface thereof. A top mirror may be disposed above the discrete light source to convert modes of light emitted from the discrete light source into trapped modes, thereby increasing the coupling efficiency of the illumination structure.

Abstract: A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.

Abstract: A sample slide, launch system, and method for microscopy having two optical fibers positioned proximate a sample slide with optical fiber mounting elements to deliver EMR to a surface of the sample slide at a critical angle for total internal reflection microscopy. In one exemplary embodiment, the EMR from the first optical fiber and the EMR from the second optical fiber may have different polarization states and/or wavelengths.

Abstract: The invention relates to a coupling device comprising a support substrate; a first layer arranged on the support substrate and comprising first patterns produced within the thickness of said first layer, said first patterns being arranged in parallel and periodic rows; a second layer arranged on the first layer and comprising second patterns passing through the thickness of said second layer, said second patterns being arranged in parallel and periodic rows. The direction of periodicity of the rows of the first patterns is perpendicular to the direction of periodicity of the rows of the second patterns. The rows of the first patterns extend over a distance greater than or equal to the wavelength in the void of the optical wave intended to be coupled. The first patterns have a width less than or equal to a tenth of the wavelength of the optical wave intended to be coupled, and the period of these patterns is between 50 nm and 1 ?m. The second patterns are arranged so as to form a periodic diffraction grating.

Abstract: An optical system comprising a substrate and an optical waveguide which is formed on the substrate and to which optical fibers are optically coupled. The optical waveguide has a plurality of straight core portions which obliquely intersect each other. The substrate has positioning sections for positioning a plurality of optical fibers optically coupled to two or more of the plurality of the core portions, the positioning sections having grooves on which the respective optical fibers are supported. When the plurality of optical fibers are supported on the respective grooves, offsets between centers of the plurality of the core portions and respective centers of the plurality of the optical fibers coupled to the core portions are equal to or less than 5 ?m.

Abstract: A door handle apparatus for a vehicle, opening and closing a vehicle door, the door handle apparatus includes an informing portion for visually informing a state of the vehicle door, including a locking/unlocking state thereof, to a user by a decorative light, which is a visible light, an operation detecting portion for optically detecting an active-direct operation to the door handle apparatus by the user based on changes in an detection light, and an optical waveguide for transmitting the decorative light and the detection light, which is inputted from a first end portion of the optical waveguide, to a second end portion of the optical waveguide, the optical waveguide functioning as the informing portion by leaking the decorative light on a transmission path so as to be outwardly emitted and as the operation detecting portion by outputting the detection light from the second end portion of the optical waveguide.

Abstract: A flexible optoelectric interconnect including an optoelectric film, a driving IC, an optical semiconductor device, a heat dissipation plate and a thermally conductive material. The optoelectric film has an electrical interconnect layer made of a single layer and an optical interconnect layer including an optical waveguide core and an optical waveguide clad. The optoelectric film has a through hole extending from a major surface thereof to a rear surface opposite to the major surface. The driving IC is provided on the major surface of the optoelectric film and electrically connected to the electrical interconnect layer, and provided above the through hole in the optoelectric film. The optical semiconductor device is provided on the major surface of the optoelectric film and driven by the driving IC.

Abstract: An optical connector has a body, a mirror provided within the body, an optical waveguide path, and a linking section. The optical waveguide path extends from a first end face exposed on a part of the surface of the body, bending via the mirror up to a second end face exposed on a part of the surface of the body not parallel to the first end face. The linking section is formed so as to include the first end, face and has a mechanism linking the fixing member first end face to the second end face of the optical waveguide path of the fixing member.

Abstract: A scanning fiber device of one aspect may include an actuator tube. An optical fiber may be inserted through the actuator tube. The optical fiber may have a free end portion outside of the actuator tube. A first bead may be around the optical fiber. At least part of the first bead may be within a distal portion of the actuator tube. An adhesive may be adhering the first bead to the distal portion of the actuator tube. A second bead may be around the optical fiber. At least part of the second bead may be within a proximal portion of the actuator tube. An adhesive may be adhering the second bead to the proximal portion of the actuator tube.

Abstract: An optoelectronic circuit fabrication method and integrated circuit apparatus fabricated therewith. Integrated circuits are fabricated with an integral optical coupling transition to efficiently couple optical energy from an optical fiber to an integrated optical waveguide on the integrated circuit. Layers of specific materials are deposited onto a semiconductor circuit to support etching of a trench to receive an optical coupler that performs proper impedance matching between an optical fiber and an on-circuit optical waveguide that extends part way into the transition channel. A silicon based dielectric that includes at least a portion with a refractive index substantially equal to a section of the optical fiber is deposited into the etched trench to create the optical coupler. Silicon based dielectrics with graded indices are also able to be used. Chemical mechanical polishing is used finalize preparation of the optical transition and integrated circuit.