Abstract: A slot coater device is provided for applying a processing solution, such as developer, to film during film development. The slot coater includes a housing having an opening for dispensing the processing solution, a reservoir within the housing adapted to receive a predetermined amount of the processing solution, and a channel for delivering the processing solution from the reservoir to the opening.

Abstract: An automatic processing apparatus for processing an exposed photographic light-sensitive material by coating a processing solution on the photographic material, comprising: a conveying device having a conveying path for conveying the photographic material in a conveying direction while inclining the photographic material downward in the conveying direction; and a coating device for coating the processing solution on an inclined portion of the photographic material in a line form in a direction perpendicular to the conveying direction.

Abstract: An application device in which uneven application due to a clogged nozzle can be suppressed. Rows of plural spray holes are formed in the nozzle plate with the holes being disposed in a staggered, lattice-like configuration with an odd number of spray hole rows being aligned along a conveying direction of an image recording material. Each time a conveyed distance of the image recording material is a distance corresponding to a distance between two adjacent rows times one-half of the odd number of the spray hole rows, the image forming solvent is sprayed. By setting an arrangement of the spray holes and a spray interval of the spray holes, the solvent can be sprayed and applied between rows of solvent which were previously sprayed and applied.

Abstract: When a developing process is performed, a mixture of developing solution and pure water is supplied while the ratio of developing solution and pure water is gradually increased from pure water to developing solution. Thus, a developing solution component and a resist component gradually react. Even if a resist component dissolves in the mixture of pure water and developing solution, the equality of the concentration of the developing solution can be maintained. Thus, the developing process can be suppressed from being unequally performed. When a rinsing process is performed, a mixture of developing solution and pure water is supplied while the ratio of developing solution against pure water is gradually decreased from developing solution to pure water. Consequently, the substitution from developing solution to pure water can be gradually performed. As a result, particles due to the solidification of unsolved resist can be prevented.

Abstract: A developing method comprising, a step of holding a substrate in substantially a horizontal position, the substrate coated with a photoresist film which has a pattern-exposed region where a predetermined circuit pattern is formed by light exposure, and a step of developing the photoresist film by starting to apply, at a time, a developing solution to the entire pattern-exposed region of the photoresist film.

Abstract: The present invention is a method for developing a substrate by supplying a developing solution from a developing solution supply nozzle onto a surface of the substrate mounted on a predetermined position, and comprises the steps of moving the developing solution supply nozzle from a standby position of the developing solution supply nozzle outside one end of the substrate to at least the other end of the substrate without supplying the developing solution, and thereafter, moving the developing solution supply nozzle from the other end to at least the one end while supplying the developing solution. Therefore, the developing solution supply nozzle which is used once and has a possibility of a drip of the developing solution does not pass above the substrate, so that the developing solution never drips from the developing solution supply nozzle onto the substrate before and after supplying the developing solution for some reason or other.

Abstract: In a developing processing to apply the developing solution onto the substrate after the light exposure, a developing solution supply nozzle scans a substrate more than once while discharging the developing solution on the substrate in a band shape to coat the substrate with the developing solution. Thus, it is possible to perform a developing processing with a small variation and high uniformity of the line width.

Abstract: A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.

Abstract: Discharge ports of a supply nozzle are structured to be able to discharge a processing solution in a horizontal direction, and a guide plate for reducing the discharge pressure of the processing solution and guiding the processing solution to an under substrate is provided at a position facing the discharge ports. Thus, the appearance of micro bubbles at the time of the supply of the processing solution to the surface of the substrate can be inhibited, thereby reducing poor developing.

Abstract: A coating and developing process system is described. The system includes a chuck for mounting a substrate, at least one process solution spray nozzle for sending out coating solution and developing solution onto the substrate mounted by the chuck, a cleaning solution spray nozzle for sending out cleaning solution onto the mounted substrate, an actuator for selecting one of the process solution spray nozzle and the cleaning solution spray nozzle and then moving the selected one to a top of the substrate, and a controller for controlling the actuator. One actuator can drive the different spray nozzles, thereby saving a space and production cost of the system.

Abstract: An image forming device which, after exposing a silver halide photographic photosensitive material, subjects the silver halide photographic photosensitive material to at least developing and bleaching-fixing processings so as to form an image on the silver halide photographic photosensitive material. The silver halide photographic photosensitive material has, on a support, one or more photographic structural layers. At least one of the photographic structural layers contains at least one color developing agent and at least one dye forming coupler. The image forming device includes a processing solution applying device which applies a processing solution for developing onto only a surface of the silver halide photographic photosensitive material at which surface the one or more photographic structural layers are provided.

Abstract: An image forming processing in which a minimum necessary amount of a processing solution, including hydrogen peroxide, which is substantially devoid of developing agents, an alkaline processing solution, and/or a post-processing solution is applied by a processing solution applying mechanism and the like serving as a non-contacting applying mechanism. The solutions are applied only on a surface of a silver halide photographic photosensitive material, which surface is provided with a photographic structuring layer having a single layer containing a reducing agent. Accordingly, neither the processing solution nor the post-processing solution is wasted and the photosensitive material can be speedily dried.

Abstract: In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time in a state where the temperature controlled liquid is discharged to the rim area on the rear face of the wafer from the flow channels, whereby developing is performed. The wafer is heated by the wafer holding section with a large heat capacity in an area close to a center of the wafer, and a liquid film of the temperature controlled liquid is formed in the rim area of the wafer, whereby the wafer is heated. At this time, the wafer is rotated, so that the developing solution is stirred.

Abstract: An apparatus for processing a photographic light sensitive material with a processing solution, comprises a jetting head provided so as to face the photographic light sensitive material with air space and having a plurality of orifices through which the processing solution is jetted toward the photographic light sensitive material; a supplying device to apply a pressure to the processing solution and to supply the pressed processing solution to the jetting head; a conduit provided between the supplying device and the jetting head so as to transmit the pressed processing solution from the supplying device to the jetting head; a valve provided on the conduit so as to open or close the conduit; and a controller to control a supplying amount of the processing solution by controlling a duty ratio of an opening time period to a closing time period of the valve per a unit time.

Abstract: An apparatus is provided for processing an imaged element comprising a support, an image-receiving layer and a silver halide emulsion layer. The apparatus comprises a tank for holding a processing liquid, driving means for propelling the imaged element through the tank, guide means for directing the path of the imaged element through the tank and developer circulation means for promoting circulation of the processing liquid in the tank. The circulation means includes flow control means to provide substantially fresh processing liquid to the surface of the imaged element and to disperse exhausted processing liquid present at the surface of the element, thereby eliminating the difficulties associated with local developer exhaustion and ensuring that consistently high image quality is maintained across the whole area of the imaged element.

Abstract: A method of replenishing a processing solution by adding the replenisher directly to the surface of the emulsion side of the material to be processed. This accelerates the processing of the material and maintains the sensitometry of the processing solution.

Abstract: A method of developing a photosensitive resin plate comprising, in order to greatly prolonging the service life of a developing solution and increase the number of plates that can be developed using a specified amount of the developing solution, supplying under circulation a developing solution (2) stored in a developer tank (1) and containing a surfactant to the surface of the tank (1), characterized in that a porous sheet (6) impregnated with a defoamer is disposed on or in the vicinity of the liquid surface of the developer tank (1) so that the developing solution (2) dropped from the surface of the photosensitive resin plate (5) passes through the porous sheet (6).

Abstract: A wafer is held by a wafer holding section, and while a developing solution is supplied onto a top surface of the wafer, the wafer is rotated 180 degrees, whereby performing the heaping of the developing solution on the top surface of the wafer. Thereafter, the rotation of the wafer is stopped, then holding pins are raised to receive the wafer from the wafer holding section, whereby holding the wafer with the wafer being raised above the wafer holding section by the holding pins, and the wafer is left standing for a predetermined time to thereby perform development. In doing as above, the temperature influence exerted on the wafer from the wafer holding section with large heat capacity is prevented, and the temperature distribution of the developing solution within the wafer plane can be prevented from occurring, thus preventing the occurrence of unevenness in the development caused by the temperature difference from occurring and making it possible to perform development processing with uniformity.

Abstract: A developing method comprising, a step of holding a substrate in substantially a horizontal position, the substrate coated with a photoresist film which has a pattern-exposed region where a predetermined circuit pattern is formed by light exposure, and a step of developing the photoresist film by starting to apply, at a time, a developing solution to the entire pattern-exposed region of the photoresist film.

Abstract: Photosensitive material which is a silver halide photosensitive material optimally used for copies of a color film original and the like is coated with developing solution from the nozzle holes of a spray tank. A chamber provided with an internal cavity is disposed on the opposite side of the transporting path to the spray tank with the transporting path sandwiched therebetween. The upper portion of the chamber is covered with a heating plate. The heating plate is pierced with a plurality of suction holes which penetrate from the inside of the chamber to the outside thereof. The unexposed surface of the photosensitive material is suctioned through the suction holes and the heating plate heats the photosensitive material as well as guides the photosensitive material. Downstream of the heating plate on the photosensitive material transporting path D, transporting rollers are disposed for transporting the photosensitive material and for squeezing out developing solution from the photosensitive material.

Abstract: A pure developing solution is discharged from a discharge port of a developing solution supply nozzle. A developing solution with reaction in progress flows from the center of a wafer by centrifugal force. The amount of the developing solution with reaction in progress mixing with the pure developing solution increases as it gets farther away from the wafer center, causing unequal development. To prevent such a problem, the developing solution supply nozzle is divided into a plurality of areas. The nozzle is composed so that the amount of the developing solution discharged from the discharge ports of each area gradually decreases as the areas approach the rotating center of the wafer. Thus, uniform development is achieved.

Abstract: An apparatus for fabricating semiconductor devices includes a spin chuck configured for mounting a wafer thereon and operative to rotate the wafer. A nozzle is arranged above the spin chuck, through which a solution is supplied to a surface of the wafer mounted on the spin chuck. A bowl surrounds the spin chuck to prevent the solution from reaching an inner wall of a process chamber. A cover is spaced apart from and confronts the spin chuck having the wafer mounted thereon. The cover has an opening through which a distal end of the nozzle passes so as to spray the solution onto the wafer surface while the cover is disposed over the wafer surface. The cover prevents any solution reflected back from the bowl from reaching the wafer surface.

Abstract: An apparatus is provided for processing a lithographic printing plate precursor comprising an aluminium support, an image-receiving layer and a silver halide emulsion layer. The apparatus comprises a tank for holding a processing liquid, at least one set of driving rollers, at least one guide roller or guide plate and means for providing direct electrical contact between the lithographic printing plate precursor and other electrically conducting surfaces in the apparatus which are in contact with the processing liquid. A method of processing a lithographic printing plate precursor using the apparatus is also disclosed. Undesirable electrochemical cell formation during processing, and the consequent deleterious effects on silver image formation, are prevented and subsequent problems with poor plate run length can therefore be avoided.

Abstract: A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.

Abstract: An image forming apparatus including an injector disposed opposite the transfer path of an image recording material and injecting an image forming solvent toward the image recording material, and a guide member having suction holes for suction, disposed opposite the injector with respect to the transfer path for the image recording material and guiding the image recording material by sucking through the sucking holes. Accordingly, since the guide member guides the image recording material by sucking through suction holes, a clearance between the injector and the image recording material is kept constant during injection of the image forming solvent, so that the image forming solvent can be applied to the image recording material uniformly.

Abstract: Apparatus for forming durable polymer protection film over a photographic image on a receiver includes an ink jet print head for ejecting a polymer protection fluid which when dried forms a film and the apparatus positions the receiver relative to the ink jet print head and causing the ink jet print head to apply the polymer fluid over the photographic image to form a polymer protection film when the fluid dries for protecting the photographic image.

Abstract: When an edge processing head is scanned in one direction, the discharge of a rinse solution from a rinse solution discharge nozzle at the front in a carrying direction is stopped, a developing solution is discharged from a developing solution discharge nozzle, and a rinse solution is discharged from a rinse solution discharge nozzle at the rear in the carrying direction. Specifically, with a developing solution being discharged to a glass substrate, the discharge of a rinse solution immediately follows the discharge of the developing solution. Thus, the edge processing of the substrate can be performed with minimal increases in the number of processes and in installation.

Abstract: The present invention provides a spin-processing apparatus less likely to produce a mist when an object to be processed is rotated. The apparatus is characterized in that it comprises a cup body having a lower cup and an upper cup mounted relative to the lower cup to be up/down movable, a rotation body retaining the object mounted within the cup body, a step motor rotationally driving the rotation body, an exhaust tube connected to a bottom of the lower cup to allow a gas in the cup body to be exhausted, and a scatter-proof cover provided within the upper cup and mounted above the rotation body.

Abstract: After a developer is applied to a semiconductor wafer, a head member having a plurality of fluid discharge holes is positioned so as to face the wafer, and during development of the wafer, a fluid is discharged from the discharge holes of the head member toward the developer on the wafer. By supplying the fluid to a region of the wafer where the line widths of the resulting circuit pattern are liable to become uneven, the temperature, thickness, liquid surface state, etc. of the developer in this region are controlled.

Abstract: A process solution supply system, comprising a process solution supply source from which a process solution is supplied, an intermediate storage mechanism for temporarily storing the process solution supplied from the process solution supply source and for supplying the process solution with predetermined pressure applied thereto, and a fluid supply mechanism for supplying the intermediate storage mechanism with a fluid which applies pressure to the process solution stored in the intermediate storage mechanism, the intermediate storage mechanism including a vessel which has an introduction port and a discharge port for the process solution, stores the process solution supplied through the introduction port and can discharge the process solution, and a compressing member, arranged inside the vessel to be located between the process solution and the fluid supplied from the fluid supply mechanism, for permitting pressure of the fluid to act on the process solution.

Abstract: A method and apparatus for developing a strip of photosensitive media having image exposure area having an undeveloped exposed portion thereon. The apparatus includes a transport mechanism for moving the photosensitive media along a processing path; and a mechanism positioned along the processing path for selectively applying a coating of the processing solution only on the undeveloped exposed portion of the strip of photosensitive media. The apparatus further includes sensors for determining the location of the undeveloped exposed portion of the image exposure area. A scanner may be provided for scanning the strip of photosensitive media so as to obtain a digital record of the images developed thereon.

Abstract: A spin coating apparatus requires less cleanroom air flow than prior spin coating apparatus to minimize cleanroom contamination. A shaped exhaust duct from the spin coater maintains process quality while requiring reduced cleanroom air flow. The exhaust duct can decrease in cross section as it extends from the wafer, minimizing eddy formation. The exhaust duct can conform to entrainment streamlines to minimize eddy formation and reduce interprocess contamination at minimal cleanroom air flow rates.

Abstract: A resist coating-developing system includes two transporting devices each for transporting a substrate, a relay section arranged between the two transporting devices for temporarily retaining a substrate thereon, a coating unit to and from which a substrate is transferred by one of the two transporting devices, the coating unit subjecting the substrate transferred thereto to a resist coating process, and a developing unit to and from which a substrate is transferred by the other of the two transporting devices, the developing unit subjecting an exposed resist of the substrate transferred thereto to a developing process, wherein the coating unit and the developing unit are arranged opposite to each other with the two transporting devices and the relay section interposed therebetween.

Abstract: In an apparatus for automatically processing a silver halide photographic light sensitive material by plural processes, provided with a conveyor for relatively conveying the material to the plural processes; and a processing solution supplying device for supplying a processing solution onto the material in at least one of the plural processes, the processing solution supplying device having plural jetting channels, each jetting channel comprising a jetting chamber in which the processing solution is accommodated, a jetting head provided with plural orifices each communicating with the jetting chamber, and a converting element to change the volume of the jetting chamber so that the processing solution is jetted through the plural orifices from the jetting chamber to an outside; each orifice has a length L and a diameter R and a ratio (L/R) is made within a range of 5 to 200.

Abstract: Photographic processing apparatus feeds photographic material downwards between successive pairs of drive rollers. Processing solution is directed into the nips of the rollers. A nozzle at each end of the roller pairs directs compressed air into the nips so as to prevent the solution overflowing at the ends of the rollers.

Abstract: The inventive dispenser mechanism uniformly develops a photosensitive layer on a substrate. The mechanism uses a developer head that moves in a substantially linear relative motion with respect to the substrate and dispenses a developer at a controlled rate. Contact of the developer material with the photosensitive layer commences a chemical reaction of developing. The mechanism also uses a rinse head that has the same motion as the developer head and travels at the same velocity. The rinse head dispenses a rinse material at a controlled rate. Contact of the rinse material with the developer material on the photosensitive layer retards the chemical reaction of developing. The rinse head waits for a predetermined dwell period after the developer head has dispensed the developer material before dispensing the rinse material. The mechanism may also use a suction head that has the same motion and velocity and removes loose material on a surface of the substrate.

Abstract: The present invention provides a developing apparatus and a developing method which make it possible to uniformly develop a photosensitive film which is formed on a substrate at a high throughput. A substrate processing apparatus which comprises such a developing apparatus and a developing method is also realized. During developing processing, a substrate is held still by a substrate holding portion. A developing solution dispensing nozzle moves over the substrate, linearly from a position off and on one side of the substrate to a position off and on the other side of the substrate in a scanning direction (A), and supplies a developing solution onto the substrate. After the developing solution dispensing nozzle moves in the scanning direction (A), a substrate transport apparatus replaces the substrate which is held by the substrate holding portion with another substrate.

Abstract: A semiconductor wafer processing system having a multi-layered arrangement of wafer processing units included in a spinner to carry out photoresist coating and developing processes for the formation of micro patterns on semiconductor wafers, thereby enabling an easy increase in those processing units coping with an introduction of new processes without increasing the occupying space of the processing units, while being capable of achieving accurate wafer feeding and loading operations, and minimizing the consumption of a chemical solvent coated over wafers. The system includes groups of modules each being selected from first and second modules. The first module includes a plurality of bake units each having bake boxes arranged in a multi-layered fashion, the bake units being arranged adjacent to one another in the wafer feeding direction, and a spin unit, such as a spine coater or a spine developer, fixedly mounted on the bake units.

Abstract: A method and an apparatus apply a substance, especially a developer, to a surface through jets. Each jet carries the substance to be applied to a predetermined portion of the surface, and each jet essentially applies a predetermined quantity of substance per unit of surface area, wherein at least one jet applies a maximum quantity of substance per unit of surface area to the surface. The quantity of substance per unit of surface area applied by each jet is selected in such a way that it is greater than 1% of the maximum quantity of substance per unit of surface area.

Abstract: An image forming solvent stored in a bottle is sent to a sub tank by a pump. The image forming solvent with the bubbles eliminated at a sub tank with the upper end open is filled into a jetting device having nozzle holes. The water level of the sub tank is kept constant by a discharge pipe communicating with the sub tank at a position lower than the jetting device. As a result, the inside of the jetting device is in a constant negative pressure state so that the atomized image forming solvent is jetted from the jetting device. At this time, the atomized image forming solvent can be jetted stably. The jetting state of the jetting device is not effected by the pulsation of the sub tank pump.

Abstract: A developing solution dispensing nozzle starts scanning at a scanning start position P1. After the developing solution dispensing nozzle reaches an edge of a substrate, the developing solution dispensing nozzle scans over the substrate while uniformly dispensing a developing solution to a surface of the substrate. The developing solution dispensing nozzle thereafter moves off the substrate from the other edge of the substrate. To uniformly supply the developing solution to a substrate, where a flow rate of the developing solution is set constant, a scanning speed is set large during an initial scanning section over a substrate, and the scanning speed is set slow during the remaining section. Meanwhile, where the scanning speed of the developing solution dispensing nozzle is set constant, the flow rate of the developing solution is gradually increased during the initial scanning section, and the flow rate is set constant during the remaining section.

Abstract: A fluid injecting apparatus includes an injecting tank disposed in opposition to the transfer path of an image recording material and storing an image forming solvent, a filler filled within the injecting tank and forming a smoothly curved inner wall surface of the injecting tank, a nozzle plate disposed in the injecting tank as part of the wall surface of the injecting tank in opposition to the transfer path of the image recording material, having a plurality of nozzle holes for injecting the image forming solvent and injecting the image forming solvent from the plurality of nozzle holes by an oscillation, and a spacer member disposed at the back surface end of the filler and constituting part of the injecting tank opposing the plurality of nozzle holes. Accordingly, since the wall surface of the injecting tank is made a smoothly curved surface by the filler, the bubbles do not tend to attach to it, so the image forming solvent can be evenly applied on the image recording material.

Abstract: A development system for manufacturing semiconductor devices uses a container to easily remove by-products of development from a wafer by: soaking the wafer in the developer with the pattern face downward; spraying rinse onto the pattern face from below; rotating the wafer at high speed to remove the rinse and by-products; and then cleaning and ventilating the container so that the developer, rinse, cleaning solution and development by-products are removed from the container. No by-products are left in the comers of the pattern of the pattern face, because the development and rinse are performed with the pattern facing downward. No by-products, developer, rinse or cleaning solution contaminate the wafer, because steps of the process are performed in an enclosed container which is cleaned and ventilated between development of each wafer.

Abstract: In the production of semiconductor devices, a pattern-wise exposed resist coating is developed with a developer to form a resist pattern corresponding to the pattern of exposure radiation on an article to be fabricated. The development being carried out with a developer consisting of one or more organic solvents, in at least two stages and in each stage of the development, the development is interrupted when a substantial permeation of the developer of a surface portion of the pattern-forming area of the resist pattern in which the resist pattern remains is completed, and the developed resist coating is dried between this stage and the following development stages. The development of the exposed resist coating is carried out by using a developing apparatus which comprises at least one set of developer-supplying system and rinsing solution-supplying system, and a conveyor means for guiding the article carrying the resist coating.

Abstract: A processing apparatus and method for processing photosensitive material includes processing paths which comprise downwardly inclined and upwardly inclined portions with respect to a conveying direction of photosensitive material. The processing paths are thin channel paths and are oriented so as to provide for a compact processor. Also, the processing apparatus includes several processing sections which are structured to permit an easy assembly and disassembly of the apparatus and thereby facilitate maintenance. The processing apparatus combines the concept of cascading solution flow and nozzle delivery of processing solution for recirculation and replenishment.

Abstract: A processing apparatus for processing photosensitive material combines thin channel technology with nozzles, and an inclined processing path. Processing solution can be introduced into the inclined processing path so as to cause the solution to flow along the inclined processing path in a direction which is opposite to a direction of travel of the photosensitive material in the inclined processing path. With the arrangement of the present invention, photosensitive material can be processed in the first processing path by way of the nozzle spray arrangement and can be subjected to further processing along the inclined processing path.

Abstract: A substrate developing method and apparatus for improving uniformity of a developing process by adjusting a temperature gradient of a developer spread over the surface of a substrate. The developer is delivered to a central region of the substrate surface and spread over the surface. The developer in this state has activity diminishing, and thereby lowering the developing rate, gradually from center to edge of the substrate. With a gas flowing down around the edge of the substrate during the developing process, the developer vaporizes from peripheral regions of the substrate at an increased rate, thereby lowering the developer temperature in the peripheral regions. This increases the developing rate gradually from edge to center of the substrate. The uniformity of the developing process is improved by balancing the gradient of developing rate due to the temperature variation of the developer against the gradient of developing rate due to the lowering of developer activity.

Abstract: An improved developer application method and apparatus for use in electronic film development, wherein the developer is applied to a photographic film using controlled, aerial deposition of one or more stream(s) of droplets of one or more developer agents or developer components such that the droplets adhere to a targeted region of the film, rather than run off, and chemically react to allow scanning of a latent image in the film as it moves through an electronic film development scan mechanism.

Abstract: A developing apparatus in which a substrate holding part holds a substrate in a stationary state, and a developer discharge nozzle starts scanning from a scanning start position. After scanning starts, the developer discharge nozzle discharges a developer at a discharge start position before a slit discharge port thereof reaches the substrate. The developer discharge nozzle moves linearly on the substrate in a scanning direction while discharging the developer, passes over the substrate, and thereafter stops discharging the developer at a discharge stop position separated from the substrate. The developer discharge nozzle stops scanning when reaching a scanning stop position.

Abstract: An image forming apparatus including an inject or disposed opposite the transfer path of an image recording material and injecting an image forming solvent toward the image recording material, and a guide member having suction holes for suction, disposed opposite the injector with respect to the transfer path for the image recording material and guiding the image recording material by sucking through the sucking holes. Accordingly, since the guide member guides the image recording material by sucking through suction holes, a clearance between the injector and the image recording material is kept constant during injection of the image forming solvent, so that the image forming solvent can be applied to the image recording material uniformly.