Added Bonding Material, E.g., Solder, Braze, Etc. Patents (Class 403/272)
  • Patent number: 11732330
    Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 22, 2023
    Assignee: Alpha Assembly Solutions, Inc.
    Inventors: Md Hasnine, Lik Wai Kho
  • Patent number: 11686365
    Abstract: In a cylinder device, a rod of which one end portion is joined to a piston in a cylinder and the other end portion protrudes from an opening portion of the cylinder includes a first member that is a hollow cylindrical member in sliding contact with a sliding contact member, and a second member that does not come into sliding contact with the sliding contact member. An outer diameter of at least a first member side end portion of the second member is smaller than an outer diameter of the first member. An inner peripheral portion of the first member is joined to an outer peripheral portion of the second member by friction weld joining.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 27, 2023
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Yasuhisa Omata, Naoya Kubo, Toshifumi Komatsu, Ikuo Akai
  • Patent number: 11479835
    Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: October 25, 2022
    Assignee: BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
    Inventors: Shaoming Zhang, Huijun He, Xixue Liu, Yanbin Sun, Zhigang Wang, Qiang Hu, Ning An, Fuwen Zhang, Jie Zhu, Jiangsong Zhang, Lirong Wang, Huankun Zhang, Lei Xu, Zhihua Zhu, Pin Zhang
  • Patent number: 11400539
    Abstract: A flux-cored wire according to an aspect of the present invention includes: a steel sheath; and a flux filling the inside of the steel sheath, in which the flux contains 0.11% or more in total of a fluoride in terms of F-equivalent value, 4.30% to 7.50% of a Ti oxide in terms of TiO2 equivalent, 0.30% to 2.40% in total of an oxide in terms of mass %, and 0% to 0.60% in total of a carbonate in terms of mass %, the amount of a Ca oxide in terms of CaO is less than 0.20% in terms of mass %, the amount of CaF2 is less than 0.50%, a chemical composition of the flux-cored wire is within a predetermined range, a Z value is 2.00% or less, a V value is 5.0 to 27.0, and Ceq is 0.30% to 1.00% or less.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: August 2, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroki Fujimoto, Kotaro Watanabe, Yasuhito Totsuka
  • Patent number: 11359293
    Abstract: Systems and methods for monitoring anodic protection are disclosed. The system can include a sacrificial anode having an anode body, at least one cavity within the anode body, a conductor disposed within the at least one cavity, and electronic circuitry in communication with the conductor. The sacrificial anode can be electrically connected to a component or structure that is subject to galvanic corrosion. The cavity can be positioned such that as the anode degrades to a certain point, the conductor will contact water. In response, an alert can be provided to inform a user that the sacrificial anode needs replacement. The alert can be provided by activating a light, siren, or other device. The alert can also be sent to a mobile device or website.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: June 14, 2022
    Assignee: Rheem Manufacturing Company
    Inventors: Satya Kiran Gullapalli, Jorge Miguel Gamboa Revilla, Sergio Montalgo Salazar
  • Patent number: 11220732
    Abstract: Provided is a ferritic stainless steel sheet excellent in shape of weld zone and corrosion resistance of a weld zone with a material of a different kind formed by performing welding with austenitic stainless steel. A ferritic stainless steel sheet having a chemical composition containing, by mass %, C: 0.003% to 0.020%, Si: 0.01% to 1.00%, Mn: 0.01% to 0.50%, P: 0.040% or less, S: 0.010% or less, Cr: 20.0% to 24.0%, Cu: 0.20% to 0.80%, Ni: 0.01% to 0.60%, Al: 0.01% to 0.08%, N: 0.003% to 0.020%, Nb: 0.40% to 0.80%, Ti: 0.01% to 0.10%, Zr: 0.01% to 0.10%, and the balance being Fe and inevitable impurities, in which relational expression (1) below is satisfied: 3.0?Nb/(2Ti+Zr+0.5Si+5Al)?1.5??(1), here, in relational expression (1), each of the atomic symbols denotes the content (mass %) of the corresponding chemical element.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: January 11, 2022
    Assignee: JFE STEEL CORPORATION
    Inventors: Hidetaka Kawabe, Shuji Nishida, Mitsuyuki Fujisawa, Chikara Kami
  • Patent number: 11198199
    Abstract: The invention relates to a method to produce a metal blank with a predetermined contour, with the following steps: continuously moving the metal strip in a transport direction x; concurrently removing material from the surface of a top of a metal strip in at least one predetermined surface section by ablation by means of a first laser that is a component of a first removal device, and then concurrently cutting the metal strip along a cutting path corresponding to the contour of the metal blank by means of at least one second laser that is a component of a cutting device provided downstream of the first removal device; the surface section of an upstream metal blank being produced simultaneously with the cutting of a downstream metal blank.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: December 14, 2021
    Assignee: SCHULER PRESSEN GMBH
    Inventors: Martin Liebel, Manuel Hunger, Michael Robert Kronthaler
  • Patent number: 11142255
    Abstract: There is provided a pillar structure for a vehicle, that has: a pillar frame member having a superposed portion, at which a second wall portion, which faces a vehicle cabin side, of a second member that extends in a length direction of a pillar is superposed with a first wall portion, which faces the vehicle cabin side, of a first member that extends in the length direction of the pillar, and linearly welded portions that are formed due to an edge end portion of the second wall portion being linearly welded to the first wall portion; and a pillar garnish that is mounted at least to the second wall portion, and covers the first wall portion and the second wall portion from the vehicle cabin side.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: October 12, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Koki Ikeda, Shinya Kamimura, Yoshiki Miyamoto
  • Patent number: 11123817
    Abstract: A method of welding laminated metal foils (LMF) by projecting a laser beam onto LMF sandwiched between an upper metal plate and a lower metal plate from a side of the upper metal plate and laser-welding the LMF to the upper metal plate and the lower metal plate. The method includes: forming a hole in an upper surface of the upper metal plate and forming a chamfered part so that a diameter of the hole expands toward the upper surface before the laser welding; and in the laser welding, projecting the laser beam for heat conduction welding onto the chamfered part of the upper metal plate to form a molten pool; and projecting the laser beam in a circle to agitate the molten pool and grow the molten pool in a laminating direction of the LMF so that the molten pool reaches the lower metal plate.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: September 21, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keisuke Uchida, Hiroomi Kobayashi, Nozomi Tateyama
  • Patent number: 11118251
    Abstract: A rolled wire rod for spring steel contains, as a chemical composition, by mass %: C: 0.42% to 0.60%; Si: 0.90% to 3.00%; Mn: 0.10% to 1.50%; Cr: 0.10% to 1.50%; B: 0.0010% to 0.0060%; N: 0.0010% to 0.0070%; Mo: 0% to 1.00%; V: 0% to 1.00%; Ni: 0% to 1.00%; Cu: 0% to 0.50%; Al: 0% to 0.100%; Ti: 0% to 0.100%; Nb: 0% to 0.100%; P: limited to less than 0.020%; S: limited to less than 0.020%; and a remainder including Fe and impurities, the carbon equivalent (Ceq) is 0.75% to 1.00%, the area fraction of tempered martensite and bainite included in a microstructure is 90% or greater, the tensile strength is 1,350 MPa or less, and the reduction of area is 40% or greater.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: September 14, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Takahisa Suzuki, Yutaka Neishi, Shuji Kozawa
  • Patent number: 11073176
    Abstract: A fastening element consisting of a cage element with a nut arranged therein that is held by a fastening flange in the cage element. The cage element has a wall element which can be moved in an axial direction and shields the seat area of the cage element against the penetration of adhesive while mounting the fastening element on a component surface.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: July 27, 2021
    Assignee: Böllhoff Verbindungstechnik GmbH
    Inventors: Michael Stumpf, Franz Drüke, Jörg Matthes
  • Patent number: 10974340
    Abstract: Provided is an oil, gas and/or petrochemical ferrous or non-ferrous material component including two or more segments of ferrous or non-ferrous components for joining, wherein the two or more segments are of the same or different materials, and laser metal deposition weldments bonding adjacent segments of said components together. Also provided are methods of making laser metal deposition weldments and their uses in the oil, gas and petrochemical industry.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 13, 2021
    Assignee: ExxonMobil Research and Engineering Company
    Inventor: Ning Ma
  • Patent number: 10876565
    Abstract: A self-piercing rivet for producing a joining connection between at least two components, which comprises the following features: a rivet head and a rivet shank having a central shank bore, wherein the rivet shank comprises a cylindrical shank outer surface and a shank inner surface limiting the central shank bore, and wherein the shank outer surface and the shank inner surface are connected at the axial end of the rivet shank facing away from the rivet head by a flat shank end face and a shank end radius. The shank end radius transitions tangentially into the shank inner surface and the flat shank end face is connected to the shank outer surface by a cutting edge.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 29, 2020
    Assignee: Böhoff Verbindungstechnik GmbH
    Inventors: Dennis Henke, Mathias Heger
  • Patent number: 10845092
    Abstract: A system includes a first torque tube with a weld seam. A mounting rail includes a cutout portion with a weld seam alignment slot. The first torque tube is configured for placement in the cutout portion. The weld seam of the first torque tube is configured for placement within the weld seam alignment slot.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: November 24, 2020
    Inventor: Robert B. Dally
  • Patent number: 10689057
    Abstract: The present disclosure is directed to a bicycle frame having a lug that is connected with a tube. The lug may be produced by shaping and bonding at least two plates.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 23, 2020
    Assignees: KIA MOTORS CORPORATION, HYUNDAI MOTOR COMPANY
    Inventors: Jungnam Choi, Sung Dae Lim
  • Patent number: 10688580
    Abstract: This welded structure member includes a base metal member including a first surface and a second surface; a joined metal member including an abutting surface of which an end surface abuts onto the first surface; a weld bead which is formed on the first surface; and a weld overlay section which is formed on the second surface of the base metal member, in which the weld bead includes a weld bead end section in a position which is separated to the front of the abutting end section.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: June 23, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Masahiro Ogawa, Shoko Oami, Shinji Kodama
  • Patent number: 10626903
    Abstract: A formed steel part includes a first steel plate having a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer, the first steel part having a first area without the first metal alloy layer and having at least part of the first intermetallic alloy layer; and a second steel plate having a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer, the second steel part having a second area without the second metal alloy layer and having at least part of the second intermetallic alloy layer in the second area. The first and second steel plates are joined together. The formed steel part may also include a butt-weld joining the first and second steel plates.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: April 21, 2020
    Assignee: ARCELOEMITTAL FRANCE
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Patent number: 10626902
    Abstract: A formed steel part includes a first steel plate having a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer, the first steel part having a first area without the first metal alloy layer and having at least part of the first intermetallic alloy layer; and a second steel plate having a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer, the second steel part having a second area without the second metal alloy layer and having at least part of the second intermetallic alloy layer in the second area. The first and second steel plates are joined together. The formed steel part may also include a butt-weld joining the first and second steel plates.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: April 21, 2020
    Assignee: ARCELORMITTAL FRANCE
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Patent number: 10480554
    Abstract: A formed steel part includes a first steel plate having a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer, the first steel part having a first area without the first metal alloy layer and having at least part of the first intermetallic alloy layer; and a second steel plate having a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer, the second steel part having a second area without the second metal alloy layer and having at least part of the second intermetallic alloy layer in the second area. The first and second steel plates are joined together. The formed steel part may also include a butt-weld joining the first and second steel plates.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: November 19, 2019
    Assignee: ArcelorMittal France
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Patent number: 10473130
    Abstract: A formed steel part includes a first steel plate having a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer, the first steel part having a first area without the first metal alloy layer and having at least part of the first intermetallic alloy layer; and a second steel plate having a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer, the second steel part having a second area without the second metal alloy layer and having at least part of the second intermetallic alloy layer in the second area. The first and second steel plates are joined together. The formed steel part may also include a butt-weld joining the first and second steel plates.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: November 12, 2019
    Assignee: ArcelorMittal France
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Patent number: 10343238
    Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: July 9, 2019
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Masayuki Suzuki, Naoko Izumita, Shunsaku Yoshikawa, Ken Tachibana, Rei Fujimaki, Hikaru Nomura
  • Patent number: 10293172
    Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 21, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Senthil Kumar Balasubramanian, Leoni Wilhelm, Thomas Schmitt, Thorsten Kaiser, Tim Asmus
  • Patent number: 10163579
    Abstract: Disclosed is a glass composition for sealing a large-area dye-sensitized solar cell, and more particularly, to a glass composition which may be uniformly bonded to a large-area without reacting with an electrolyte.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: December 25, 2018
    Assignees: Kongju National University Industry-University Cooperation Foundation, Orion Co., Ltd.
    Inventors: Woon Jin Chung, Han Sol Lee, Jae Kwun Hwang, Jae Hyoung Park
  • Patent number: 9994489
    Abstract: Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: June 12, 2018
    Assignee: The Boeing Company
    Inventors: Tab Hunter Crooks, MaryAnn S. Muench
  • Patent number: 9796054
    Abstract: Disclosed herein is a high-temperature lead-free Au—Sn—Ag-based solder alloy that is excellent in sealability, joint reliability, and wet-spreadability, that can be kept at a high quality level for a long period of time, and that is provided at a relatively low cost. The lead-free Au—Sn—Ag-based solder alloy contains 27.5 mass % or more but less than 33.0 mass % of Sn, 8.0 mass % or more but 14.5 mass % or less of Ag, and a balance being Au except for elements inevitably contained therein during production. When having a plate- or sheet-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less, ?1.48 or more but 0.52 or less, and ?4.8 or more but 9.2 or less, respectively. When having a ball-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* are 63.9 or more but 75.9 or less, 0.05 or more but 0.65 or less, and 1.3 or more but 11.3 or less, respectively.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 24, 2017
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventor: Takashi Iseki
  • Patent number: 9345895
    Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: May 24, 2016
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Michael G. Marinkov, Lea A. Nygren, Brad C. Tischendorf
  • Patent number: 9248863
    Abstract: A vehicle body superstructure includes a roof side rail having a rail flange upon which a roof panel is mounted, a vertical rail wall that hangs down from the outer end of the rail flange in the vehicle width direction, a bottom rail wall that extends from the lower end of the vertical rail wall to the outside in the vehicle width direction, and a bulging section formed by allowing the bottom rail wall and the vertical rail wall to bulge toward the center in the vehicle width direction, in order to accommodate a slide rail for a sliding door. The outer end of a roof arch in the vehicle width direction is joined to the bulging section. First arch flanges are joined on the lower surface side of the rail flange. Second arch flanges are joined to the lower surface side of the of the bottom rail wall.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: February 2, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hirokazu Matsuura, Masami Yaguchi
  • Publication number: 20150140738
    Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.
    Type: Application
    Filed: March 6, 2013
    Publication date: May 21, 2015
    Inventor: Hironobu Moriyama
  • Publication number: 20150135844
    Abstract: An assembly, comprising two ceramic bodies, which are connected by means of a joint, which contains an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced from the ceramic bodies, in each case, by at least 1 ?m, especially at least 2 ?m, and wherein the joint has bounding layers, which border on the ceramic body. The the core volume, which includes at least 50% of the volume of the joint, is free of crystalline phases of size greater than 6 ?m, especially greater than 4 ?m, preferably greater than 2 ?m.
    Type: Application
    Filed: June 7, 2013
    Publication date: May 21, 2015
    Inventors: Nils Ponath, Andreas Rossberg, Elke Schmidt
  • Publication number: 20150132143
    Abstract: A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38) formed at an angle (A1) of 35-60° relative to the component surface (36), and a second side (40) formed at an angle (A2) of 10-35° relative to the surface. The sides may be extended to intersect (44) without the necessity for a flat bottom surface (20) as is typical for prior art weld joints (10). The inventive weld joint may be formed by moving an end mill tool (60) into and along the surface with its axis of rotation (64) being transverse to the surface.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Inventors: Gerald J. Bruck, Ahmed Kamel
  • Publication number: 20150125281
    Abstract: A multi-component braze filler alloy comprising at least 70% by weight MarM509A superalloy with the remainder MarM509B superalloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. It is shown that generally higher braze temperatures lead to improved results including the possibility of re-welding such a brazed component, resulting in a re-repaired brazed component capable of continued commercial service.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventors: Petya M. Georgieva, James A. Yarbrough
  • Publication number: 20150125282
    Abstract: A multi-component braze filler alloy comprising 60-70% by weight CM247 superalloy and BRB braze alloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. The substrate/braze interface may be subsequently weld-repaired without de-melting and migrating the braze alloy from the interface. The weld zone and surrounding area are solidification crack resistant. After the alloy composition is brazed to the base substrate the component may be returned to service. Thereafter the component remains repairable by welding or re-brazing, if needed to correct future in-service defects.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventors: Petya M. Georgieva, James A. Yarbrough
  • Publication number: 20150117937
    Abstract: In a flux-cored wire for welding an ultrahigh tensile strength steel, one or more of CaF2, BaF2, SrF2, and MgF2 are included in the wire and, when a total amount thereof is defined as ?, the ? is more than 2.0% and equal to or less than 8.0% in terms of mass % with respect to a total mass of the wire, one or more of Ti oxide, Si oxide, Mg oxide, and Al oxide are included in the wire and, when a total amount thereof is defined as ?, the ? is 0.01% to 1.20% in terms of mass % with respect to the total mass of the wire, a ratio of an amount of the CaF2 with respect to the ? is 0.50 or more, a ratio of the ? with respect to the ? is 2.0 to 800.0, and Ceq defined in following Expression a is 0.60% to 1.20%, Ceq=[C]+[Si]/24+[Mn]/6+[Ni]/40+[Cr]/5+[Mo]/4+[V]/14??(a).
    Type: Application
    Filed: May 2, 2013
    Publication date: April 30, 2015
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shuichi Nakamura, Kazuhiro Kojima, Yasuhito Totsuka, Ryuichi Shimura
  • Publication number: 20150110548
    Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventor: Aarne H. Reid
  • Patent number: 8997606
    Abstract: An assembly that includes a tube mount, a tube, a first fillet weld, and a second fillet weld. The tube mount has a tubular side wall, a plurality of circumferentially spaced apart notches formed on a first end of the tubular side wall, and a securing aperture formed through the tubular side wall. The notches form a plurality of teeth. The tube is received into the tube mount. The first fillet weld couples the tube to the tube mount. The first fillet weld is formed about a perimeter the first end such that each of the first welds is formed substantially completely over the entirety of the teeth. The second fillet weld couples the tube to the tube mount. The second fillet weld is formed about a perimeter of the securing aperture such that the second fillet weld is formed substantially completely over an inside perimeter of the securing aperture.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: April 7, 2015
    Assignee: American Axle & Manufacturing, Inc.
    Inventors: Zugang Huang, James P. Downs, Gregory A. Marsh
  • Publication number: 20150093188
    Abstract: The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.
    Type: Application
    Filed: March 27, 2013
    Publication date: April 2, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20150086263
    Abstract: A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.
    Type: Application
    Filed: April 17, 2013
    Publication date: March 26, 2015
    Inventors: Hikaru Nomura, Shunsaku Yoshikawa
  • Publication number: 20150078810
    Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 19, 2015
    Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
  • Patent number: 8979416
    Abstract: In a panel joint structure, a first joint portion and first load transfer portions are formed on an end portion of a first panel, and a second joint portion and second load transfer portions are formed on an end portion of a second panel. A first joint surface of the first joint portion and a second joint surface of the second joint portion are welded and adhered to each other, and first load transfer surfaces of the first load transfer portions and second load transfer surfaces of the second load transfer portions are adhered to each other. The first load transfer surfaces are contained in the range of the plate thickness of a first panel body portion, and the second load transfer surfaces are contained in the range of the plate thickness of a second panel body portion.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: March 17, 2015
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Daisuke Itoh
  • Publication number: 20150056006
    Abstract: A welding wire formed of a trace boron titanium base alloy is provided, along with welds formed from the wire and articles comprising one or more of such welds. A method may include forming such a weld or welds from such a welding wire, and may also include non-destructively inspecting titanium alloy articles comprising one or more of such welds using ultrasonic waves to detect internal flaws.
    Type: Application
    Filed: November 5, 2014
    Publication date: February 26, 2015
    Inventors: Jeffrey J. Bernath, Sesh A. Tamirisakandala
  • Publication number: 20150056005
    Abstract: Provided is a process for producing a welded joint which includes a weld metal having high strength and high toughness, and containing fewer blowholes. The process for producing a welded joint according to the present embodiment includes the steps of: preparing a base material containing, by mass %, not less than 10.5% of Cr; and subjecting the base material to GMA welding using a shielding gas containing 1 to 2 volume % or 35 to 50 volume % of CO2 gas, and the balance being inert gas, thereby forming a weld metal includes, by mass %, C: not more than 0.080%, Si: 0.20 to 1.00%, Mn: not more than 8.00%, P: not more than 0.040%, S: not more than 0.0100%, Cu: not more than 2.0%, Cr: 20.0 to 30.0%, Ni: 7.00 to 12.00%, N: 0.100 to 0.350%, O: 0.02 to 0.11%, sol. Al: not more, than 0.040%, at least one of Mo: 1.00 to 4.00% and W: 1.00 to 4.00%, and the balance being Fe and impurities.
    Type: Application
    Filed: March 27, 2013
    Publication date: February 26, 2015
    Applicant: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Kenta Yamada, Masahiko Hamada, Daisuke Motoya, Shinjiro Nakatsuka, Hisashi Amaya, Hideki Takabe
  • Publication number: 20150037087
    Abstract: A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Ken Tachibana, Hikaru Nomura, Kyu-oh Lee
  • Publication number: 20150037088
    Abstract: A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura, Kyu-oh Lee
  • Publication number: 20150030382
    Abstract: The invention relates principally to a welded steel part with a very high mechanical strength characteristics obtained by heating followed by hot forming, then cooling of at least one welded blank obtained by butt welding of at least one first and one second sheet consisting at least in part of a steel substrate and a pre-coating which is constituted by an intermetallic alloy layer in contact with the steel substrate, topped by a metal alloy layer of aluminum or aluminum-based alloy.
    Type: Application
    Filed: July 23, 2012
    Publication date: January 29, 2015
    Applicant: ARCELORMITTAL INVESTIGACION Y DESARROLLO, S.L.
    Inventors: Laurent Cretteur, Qingdong Yin, Francis Schmit, Wolfram Ehling
  • Patent number: 8932519
    Abstract: A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: January 13, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Seiko Ishibashi, Shunsaku Yoshikawa, Tsukasa Ohnishi
  • Publication number: 20140363221
    Abstract: A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Inventors: Kosuke Nakano, Hidekiyo Takaoka
  • Publication number: 20140356056
    Abstract: A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 4, 2014
    Inventors: Liangde XIE, Ronald Lee SOUTHER, Mark Lawrence HUNT, Steven Charles WOODS
  • Publication number: 20140356681
    Abstract: A brazing structure for an electrochemical cell is described. It includes a nickel or nickel alloy component; a ceramic component; a braze alloy layer, containing an active metal element, between the nickel and the ceramic component, and a barrier layer disposed between the nickel layer and the braze alloy layer. The barrier layer is capable of preventing or minimizing the diffusion of the active metal element into the nickel or nickel alloy component. Electrochemical cells that include such a brazing structure are also described, as are related methods for joining nickel components to ceramic components in the manufacture of thermal batteries.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Applicant: General Electric Company
    Inventors: Sundeep Kumar, Mohamed Rahmane, Vipin Raju Suddala
  • Publication number: 20140348571
    Abstract: Provided in one embodiment is a method of joining one or more articles together using pressurized fluid to deform a bulk-solidifying amorphous alloy material and form a mechanical interlock between the respective surfaces joined together.
    Type: Application
    Filed: October 21, 2011
    Publication date: November 27, 2014
    Inventors: Christopher D. Prest, Joseph C. Poole, Matthew S. Scott, Dermot J. Stratton, Stephen P. Zadesky, Richard W. Heley
  • Publication number: 20140348576
    Abstract: In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
    Type: Application
    Filed: July 10, 2012
    Publication date: November 27, 2014
    Inventors: Shigeyuki Nakagawa, Yoshitaka Uehara, Chika Yamamoto, Kenji Miyamoto, Toshikazu Nanbu