Abstract: A modular split-axis stage is used to inspect and/or repair large flat glass media suitable for LCD/TFT applications. Low-precision air table sections are detachably mounted to a centrally located, high-precision granite inspection/repair section. Glass media held by a vacuum contact is transported on air cushions from the up-web air table to the central inspection/repair section. Vacuum nozzles integrated with porous medium pads precisely control the height of the flexible media above the central section during inspection or repair. Embodiments includes structures in which the media is either stationary or moving during inspection/repair. A first media can be loaded/unloaded while a second media is undergoing inspection or repair in a pipelined operational mode.

Abstract: A modular split-axis stage is used to inspect and/or repair large flat glass media suitable for LCD/TFT applications. Low-precision air table sections are detachably mounted to a centrally located, high-precision granite inspection/repair section. Glass media held by a vacuum contact is transported on air cushions from the up-web air table to the central inspection/repair section. Vacuum nozzles integrated with porous medium pads precisely control the height of the flexible media above the central section during inspection or repair. Embodiments includes structures in which the media is either stationary or moving during inspection/repair. A first media can be loaded/unloaded while a second media is undergoing inspection or repair in a pipelined operational mode.

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract: Novel methods and apparatus are disclosed for handling carriers for soft contact lenses in a lens manufacturing system. In accordance with a first aspect of the invention, article handling devices are located beneath a pre-cure station and a curing station of the system to move lens carriers within those stations. As a result of locating these devices beneath these stations, the desired movement of the carriers can be achieved without increasing the footprint of the station. Pursuant to a second aspect of the invention, a complete set of assemblies is provided for moving a multitude of lens carriers into, through, and out from the pre-cure station and the curing station. This set of assemblies accomplishes this movement in a completely automated, high speed, mass production basis. In accordance with a third aspect of the invention, the curing station is provided with an intelligent buffer.

Abstract: A Vacuum transport chamber for disk-shaped substrates, has a base plate structure has an interior surface which borders an interior of the chamber on one side thereof. A covering structure is situated parallel and opposite an interior surface of the base plate structure. The structure has at least two substrate passage openings which are adapted to a substrate disk surface. A transport device which is rotationally drivingly movable about a rotation axis perpendicular to the base plate structure. At least one substrate receiving device is brought into alignment with a respective one of the openings. A controlled sealing arrangement establishes an edge of at least one of the openings with the substrate holding device brought into alignment therewith and a substrate provided thereon.

Abstract: A conveyor system is disclosed for sequentially moving a plurality of flat battery components. The conveyor has a plurality of separators for receiving a flat battery component between each of the adjacent separators. The conveyor supports an end of each flat battery component with each of the flat battery components being maintained on end by the plurality of separators. A motor drive is provided for moving the conveyor for moving the plurality of flat battery components.

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract: A load port which can selectively receive plural types of cassette having substrate which are to be processed accommodated therein is disclosed. The load port has the following constituents. That is, the load port includes a main body, an opening portion (which has a configuration that opens in the three surfaces) formed in one side surface of the main body, a placement table formed in the opening portion and used to place the cassette thereon, a first sensor mechanism (which identifies the type of the cassette) provided on the placement table, plural types of clamp mechanism (each type of the clamp mechanism clamping the corresponding type of cassette) provided on the placement table, and an up-down-type cover mechanism (which is vertically moved) which covers the opening portion of the main body.

Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.

Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.

Abstract: In a soft contact lens manufacturing process, an injection molding machine (IMM) produces many thermoplastic injection molded front curve (FC) and back curve (BC) mold parts, each of which mold parts is subsequently used only once to mold a single soft contact lens. An inlay station with alignment assemblies and transfer tubes provide for the precise transfer to and alignment of the FC and BC molds in pallets during their transfer from the IMM to pallets on an assembly line in a high speed automated commercial production operation. A rotatable FC transfer arm and a rotatable BC transfer arm transfer the FC and BC molds from the IMM machine to the pallets in an inlay station. The precisely aligned transfer is provided by two alignment rods of an alignment assembly which pass through two alignment apertures in the pallet and then pass through two alignment apertures in one of the FC or BC alignment arms.

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Abstract: A mobile, self-evacuating, micro-environment system for transit and storage of substrates between two or more processing chambers in the manufacture of semiconductor devices is provided where the system includes a mobile cart, a vacuum sealable container to hold the substrates, a vacuum source having a portable power source, located on the cart and capable of generating a vacuum in the container, and a docking valve to mate with a corresponding valve on each of the processing chambers, where the docking valve and the corresponding valve are securable to one another to form a substantially vacuum-tight seal and openable, while mated, to permit unloading and loading of substrates between the container and the processing chamber. A method of using the system is also provided.

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

Abstract: An apparatus for flow-line treatment of articles has two chambers. The first chamber is a vacuum working chamber to treat articles in an artificial atmosphere. First transport means transport articles through the first chamber and at least one lock at the end of the chamber. Second transport means transport articles though the second chamber. The lock has a movable body with at least two cavities, installed inside an airtight shell. The movable body moves between a first position, in which one cavity connects with the first chamber and the first transport means extend into the cavity, and a second position, in which the cavity connects with the second chamber and the second transport means extend into the cavity. The at least two cavities are adjacent and similar and are provided with openings. Each cavity holds one carrier with articles. The first and second transport means provide simultaneous and antiparallel movement.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: Method and apparatus are provided for accurately placing first and second semiconductor wafers onto a first and a second platforms, respectively, in a single processing chamber despite changes in the exact positions of the platforms caused by variations in temperature within the chamber. A computer controls a mechanism having a pair of wafer-supporting blades to insert the wafers into the chamber. The computer determines from position sensors when the first wafer is centered over the first platform, then actuates lift pins associated with the first platform to lift the first wafer off of its respective blade. Then the computer in the same way in response to other position sensors moves the second wafer into alignment with the second platform, and raises by lift pins the second wafer off of its respective blade. Thereafter the computer removes the blades from the chamber, and lowers the wafers in precise positions onto their respective platforms.

Abstract: A load port module is mounted adjacent a process tool for loading semiconductor wafers to the process tool and unloading them from the process tool. The module includes a mounting frame having a charging opening therein for entry into the process tool, a platform having an upper surface for supportively receiving a cassette containing the semiconductor wafers to be passed though the charging opening into the process tool, a selectively operable closure movable between a first position withdrawn from the charging opening allowing the passage therethrough of the semiconductor wafers and a second position overlying the charging opening preventing the passage therethrough of the semiconductor wafers, and a shroud movable between a retracted position fully exposing the platform and its associated cassette and an advanced position fully encompassing the platform and the cassette adjacent the process tool. The shroud serves as a barrier against the passage of particulate matter into the process tool.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: Disclosed in an original chuck effective to prevent deformation of an original as the same is attracted and held by the chuck, thereby to reduce distortion of a pattern of the original or distortion of a pattern transferred to a substrate, such as a wafer, due to the deformation of the original. The original chuck includes four attracting and holding portions disposed to attract four corners of the original, and each attracting and holding portion has a steel ball to be engaged with the original and an attracting pad surrounding the steel ball and being made of an elastic material. A negative pressure is produced inside the attraction pad, in response to an operation of a vacuum source and through an attracting bore, such that the attracting pads attract the original while the steel balls support the original through point contact. In one preferred from, at least one of the attracting and holding portions is made adjustable upwardly/downwardly.

Abstract: A transfer mechanism is provided for placing a wafer at a prescribed position on an arm without any additional step. The transfer mechanism for transferring a workpiece into and from a storage section comprises an arm member for holding a workpiece having a projection which can be contacted with an edge of the workpiece at the tip end portion thereof, a movement mechanism for reciprocating the arm member between a retracted and an extended positions while holding the workpiece thereon to transfer the workpiece to and from the storage section, and a positioning member which is positioned in the vicinity of the arm member and can be contacted with the edge of the workpiece for positioning the held workpiece in a prescribed position on the arm member.