Abstract: Disclosed is a six-bar linkage positioning mechanism mounted inside a clean container formed of a locating member and a four-bar linkage and a driving module which, when moved, has the slide of the driving module stopped at the base of the cleaning container and be forced to move upwards relative to a sliding way inside the locating member and to cause the driving link of the driving module to drive the four-bar linkage upwards and to further force the second link of the four-bar linkage to push workpieces in respective insertion slots in a cassette on the clean container. The six-bar linkage positioning mechanism has only one degree of freedom so that it moves workpieces horizontally in the cassette into position by means of contact at a point, preventing contamination due to friction and also improving moving stability.

Abstract: An improved apparatus and method is provided for storing semiconductor wafer carriers, and for loading wafers or wafer carriers to a fabrication tool. The apparatus preferably provides an elevated port for receipt of wafer carriers from an overhead factory transport, allows for local interconnection among a plurality of the inventive apparatuses, and enables independent loading of the factory load port and the tool load port. An inventive wafer handling method which divides a lot of wafers into sublots and distributes the sublots among tools configured to perform the same process is also provided.

Abstract: Mail reorientation apparatus which transfers horizontally oriented mail stack in an input tray to a vertical orientation in an output tray. The input tray is brought to a rotating station where a plate is brought down on top of the mail stack and a plurality of pusher rods are extended through apertures in the bottom of the input tray to contact the bottom of the mail stack. The rotation process orients the mail stack to the desired vertical orientation and the rods and plate are simultaneously moved to eject the mail from the input tray to the output tray.

Abstract: A transfer device for a substrate is capable of preventing deformation or breakage of the substrate due to bending stress by reducing the amount of dead weight deflection of the substrate, e.g. a large mother glass board. Supporting members extend in opposite directions from two sides of a storage device such that the substrate can be introduced or removed by raising and lowering the hand of a transfer machine inserted into the storage device between the supporting members. The supporting members are comprised of a plurality of supporting members in parallel, formed with a gap between the supporting members facing each other.

Abstract: A cassette exchange system is provided. The cassette exchange system includes a wafer temporary storage apparatus, a first cassette base, a second cassette base and a moving apparatus. The wafer temporary storage apparatus includes a number of wafer carrier units. The first cassette base is suitable for carrying a first cassette, and the second cassette base is suitable for carrying a second cassette. The moving apparatus connects the first cassette base with the second cassette base. Also, the moving apparatus sequentially moves the first cassette base and the second cassette base to the wafer temporary storage apparatus to simultaneously transfer the wafers stored in the first cassette to the second cassette.

Abstract: A storage lift has two shelving columns that support storage goods carriers (5). A vertical conveyor is located between the two shelving columns and at least one of the shelving columns has a loading and removal opening. A light grille (9, 10) and faceplates (11) are provided to determine or verify the position of the storage goods carriers (5) in the vicinity of the loading and removal opening (8). At least one faceplate is allocated to each storage goods carrier (5).

Abstract: A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.

Abstract: A carrier tape for a tape and reel machine includes at least one edge having a plurality of sprocket openings therein. The carrier tape also includes a first row of aperture cavities and a second row of aperture cavities. Electrical components are contained in the first and second row of aperture cavities. In some embodiments, the electrical components carried are the same, and in other embodiments, the electrical components carried in the first row differ from the electrical components carried in the second row.

Abstract: An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers or articles. Process chambers are located in the process bay. A transfer robot moves wafers from a pod unsealed at a docking station into a carrier at a transfer station. The carrier has tapered or stepped outside surfaces engaging corresponding inside surfaces on a rotor within a process chamber. A process robot moves between the indexer bay and process bay to carry wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: An apparatus for treating wafer-shaped articles includes at least one linear arranged array of a plurality of at least two process units wherein in each such process unit one single wafer-shaped article can be treated, a cassette-holding unit for holding at least one cassette storing at least one wafer-shaped article therein and a transport system for picking a wafer-shaped article from a cassette and placing it into one of a process unit. The apparatus has a transport unit movably mounted on a linear track. The transport unit includes at least one holding member for holding a single wafer-shaped article in a substantially vertical plane parallel to the linear track.

Abstract: The invention pertains to a device for removing the contents of a valve bag using suction. The invention further pertains to a method of removing the contents of a valve bag using the device.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing to the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed larger than the width of the vacuum processing block, and the plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: A semiconductor device producing apparatus is disclosed. The apparatus includes a carrier-holding stage for placing a carrier; first, second and third stages each for holding first and second boats one at a time, each boat holding one or more substrates; a boat transfer mechanism for transferring the boats among the first, second and third stages; and a substrate transfer mechanism for transferring the substrate(s) from the carrier to the boat held by the first stage. A controller controls the first stage, the boat transfer mechanism and the substrate transfer mechanism so that the boat transfer mechanism transfers one of the boats from the second stage to the first stage, the substrate transfer mechanism then transfers the substrate(s) from the carrier to the boat held by the first stage, and the first stage then moves the boat into the processing chamber for processing.

Abstract: A substrate handling robot includes an arm drive mechanism. A first arm is connected to the arm drive mechanism. A multiple substrate batch loader is connected to the first arm. A second arm is also connected to the arm drive mechanism. A single plane end effector is connected to the second arm. The multiple substrate batch loader produces a vacuum signal indicative of how many substrates are held by the multiple substrate batch loader. A vacuum signal interpreter alters the movement of the first arm in response to the substrate load number. An object sensor is connected to the second arm. The object sensor assesses the number of substrates in a cassette adjacent to the multiple substrate batch loader. A substrate loading sequence controller controls the first arm and the second arm in response to the number of substrates in the cassette, such that the second arm removes substrates from the cassette in such a manner as to facilitate complete loading of the multiple substrate batch loader.

Abstract: A loading assembly is provided that is configured to load transport containers with bulk material quickly and efficiently. The assembly includes a load bin having a cross section conforming to an open end of a container and a drive mechanism configured to urge the load bin into and out of the container. When fully inserted, the contents of the load bin are completely disposed within the container. The loading assembly further includes a barrier configured to keep the load confined within the container, while the load bin opens to allow the load to remain within the container upon retraction of the load bin. In this manner, the container can be filled to capacity in a single operation.

Abstract: An apparatus for supplying a component carrier in the form of a tape is provided. The component carrier has a number of cavities formed on one surface thereof for containing components. A pair of spaced first and second guide plates that function to guide one surface of the component carrier. A movable guide plate is disposed between the first and second guide plates so that it can move back and forth between a first position adjacent to the first guide plate for defining a component pickup station and a second position adjacent to the second guide plate. The movable guide plate has an extension which extends along at least one longitudinal edge of the component carrier and opposes the one surface of the component carrier for preventing movement thereof when the movable guide plate takes the first position.

Abstract: A wafer mapping device that recognizes the existence of wafers along with the descending and opening of a front door (2a) of a closed type clean container (2) in a state where the front door of the closed type clean container for mounting and housing wafers (4) on any one of or a plurality of shelves among a plurality of internal shelves is made tightly contact to a port door (13) of a load port (12), comprising a swinging member (22) coupled to the port door so as to swing around predetermined horizontal axes parallel to the port door, a pair of sensor portions (20) fixed to the swinging member and mutually separated as well as protruding towards the clean container from the swinging member above the port door, a light emitting device (20a) and light receiving device (20b) fixed one each to the pair of sensor portions and facing each other, and swinging drive means (25) for rotating the swinging member around the horizontal axis to an angle where the wafers enter between the light emitting device and the lig

Abstract: For a device for the detection of substrates stacked at an opening of a wall element, there existed the problem of constructing the detection device in such a way that the detection of the position of the substrates can be performed more flexibly with respect to the course of measurement and the measuring method employed and a defined approach of a sensor system to the semiconductor substrate to be detected is ensured in a definite position of measurement with a lowered risk of particle generation. A transmitting and receiving device (11) consists of a vertical drive mechanism (10) mounted on the wall element (1) and a sensor head (13) that can be adjusted between a lower and an upper position by means of the vertical drive mechanism (10), said sensor head being arranged so as to pivot on the vertical drive mechanism (10) in order to pivot into the opening (4).

Abstract: Improvement of the workability in an automatic guided vehicle which carries and transfers a semiconductor wafer between stations in a semiconductor manufacturing plant etc. An automatic guided vehicle 1 is moved to an objective station after storing a wafer 10 in a buffer cassette with a transfer equipment 3, the wafer 10 in a cassette 5 is transferred to a positioning device 4 by taking it up with the transfer equipment 3, an ID information of the wafer 10 is read by a OCR 43 after truing up the position and direction of the wafer 10 by the positioning device 4, the wafer 10 whose ID information is read is retained with a transfer hand 31, another wafer 10 placed on the station then is removed by the other transfer hand 31, the wafer 10 whose ID information is read is transferred to the station in the predetermined position and direction and the ID information is controlled to transmit to the station.

Abstract: A receiver frame loads and unloads a batch of semiconductor wafers onto wafer holders in a wafer boat. The wafer holders extends continuously about the perimeter of an overlying wafer. The receiver frame is provided with a plurality of supporting arms which are immovably mounted to a vertically extending structure. The supporting arms are coaxially aligned and vertically spaced in a manner corresponding with the spacing of the wafer holders in the wafer boat. Each supporting arm is configured to be accommodated below a support ring, with its distal end extending to align with the center region of the wafer holder. The distal end of each supporting arm is provided with at least three support pins to support a wafer vertically spaced above a wafer holder. To load wafers onto the wafer holders, after placing the wafers upon the support pins, the wafer holders are moved above the support pins so that the wafer holders contact and lift the wafers off the support pins.

Abstract: An apparatus for transporting a flat object from one position to another position. The apparatus includes an end effector having a base portion and at least one finger extending from the base portion. The finger having a top surface and a bottom surface, and the finger including a free end. The top surface includes a substantially flat portion extending from the base portion, and wherein the finger includes a tapered portion extending from the substantially flat portion towards the free end.

Abstract: Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.

Abstract: A wafer processing apparatus on which a pod having an opening is detachably mounted is provided with a door unit and a mapping unit provided with a transmitting type sensor having an emitter and a detector forming a slot therebetween. The emitter and the detector are moved toward the opening in the pod and are plunged into the interior of the pod after a door is opened by the door unit, and the slot between the emitter and the detector crosses an end portion of a wafer to thereby detect the presence or absence of the wafer. Thereby, a mechanism portion liable to produce dust which may adhere to the wafer and cause the contamination thereof can be disposed separately from the pod.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: Methods and apparatus for ensuring the proper handling of reticles in the manufacturing of microdevices are disclosed. The methods and apparatus employ one or more reticle stop blocks fixed to a reticle handling arm. The one or more reticle stop blocks are designed and arranged to engage an edge of the reticle in order to place the reticle in a desired position on the reticle handling arm should the reticle be improperly arranged in a cassette in which the reticle is stored. By ensuring proper placement of the reticle on the reticle handling arm when the reticle is removed from the cassette, the likelihood of a subsequent fault in handling the reticle is greatly reduced.

Abstract: The invention includes a method and a device for transferring storage containers, especially cassettes for printing plates, in order to reliably and accurately receive both manually inserted cassettes and cassettes from upstream transport systems and upstream storage devices, such as MCLs. The invention enables these cassettes to be supplied to other devices constructed, for example, for separating printing plates. The storage containers are aligned in a holder provided for them, and are positioned and secured against inadvertent withdrawal. In this case, the transport of the storage containers within the device is carried out in a damped manner and can be assisted automatically. A pneumatic drive system is preferably used for this purpose.

Abstract: A stage used, e.g., in semiconductor fabrication, includes a two substrate buffer station and a movable chuck. The buffer station, in one embodiment is fixed, i.e., non-movable relative to the stage. In another embodiment, the support elements of the buffer station may move in unison vertically or horizontally. In another embodiment, a pair of the support elements horizontally moves toward another pair of support elements to reduce the necessary horizontal motion of the chuck. For example, an unprocessed substrate is loaded onto the top supporting elements of the buffer station, while processed substrates are unloaded from the bottom supporting element of the buffer station. The movable chuck is used to remove the unprocessed substrates from the buffer station and to place the processed substrates on the buffer station.

Abstract: A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.

Abstract: An expandable width cassette for storing and transporting thin planar objects of different widths is provided. The cassette 10 includes two side panels 12 of fixed height opposite and parallel to one another having a series of elongated slots on the inner surface of the side panels for supporting planar objects, a sliding bar assembly 13 on the bottom side of the cassette, and an adjustable length panel 14 on the top side of the cassette. Spring loaded press screws 143 disengaged from locator holes at predefined locations in the top panel allow the cassette width to be altered by pushing or pulling the side panels. A wafer film frame cassette includes a back stop mechanism which further serves to align with a frame notch.

Abstract: A transfer apparatus includes a multi-arm apparatus, a controller, and a vacuum part. The multi-arm apparatus has a plurality of blades for vacuum-absorbing or vacuum-retaining a semiconductor substrate, a fixed body joined to each of blades, and a positioning apparatus joined to each fixed body for rotational or straight-line movement of the fixed body and the blades. The apparatus further includes vacuum lines that are formed within the multi-arm apparatus. The vacuum lines are selectively opened and closed. Even when there is a vacant slot in the FOUP, a plurality of wafers can be concurrently unloaded.

Abstract: An apparatus for handling and positioning wafers or other flat objects. The apparatus has an XY stage with an X-drive and a Y-drive, and a bed attached to the XY stage. A chuck (e.g. a vacuum chuck) is disposed on the bed and an effector is attached to the bed. The effector can rotate about an axis of rotation extending in the Z-direction. The effector can pick up objects and place the objects onto the chuck. The effector can also pick up objects from the chuck. Preferably, the chuck has a recessed region for accommodating the effector so that the effector can be inserted under a flat object on the chuck. The X-drive or Y-drive of the XY stage provides linear motion for the effector so that the effector can pull wafers from a cassette such as used in the semiconductor industry. Alternatively, the effector is attached to a linear actuator disposed on the bed.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing to the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed larger than the width of the vacuum processing block, and the plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing to the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed larger than the width of the vacuum processing block, and the plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: A pusher 13 has a leaf spring 12, a driving section 22, a direction changing section 23, and guides 24. The driving section 22 nips the leaf spring to longitudinally advance and retract it. Advancement of a fore end of the leaf spring 12 in a pushing direction causes the object facing the leaf spring to be pushed from a first position to a second position. A direction changing section 23 bends the tail end of the leaf spring relative to the fore end so as to change the direction of advancement and retraction. Guides 24 guide the fore and tail ends with respect to the direction changing section.

Abstract: A robot wherein the condition for a work and a sequence of movements to be performed may be set in connection with positions. In addition to setting a position at which a work is performed, the robot sets the conditions for performance of a work at a set position and of a sequence of movements between set positions. The set conditions may be memorized in connection with the set positions so as to be performed as are read out.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A substrate-handling robot comprises an arm drive mechanism with a first arm connected to it. A multiple substrate batch loader is connected to the first arm. The multiple substrate batch loader includes a set of vertically stacked substrate-handling paddles. A control circuit is connected to the arm drive mechanism. A vacuum control system is connected to the multiple substrate batch loader and the control circuit. The vacuum control system includes a set of vacuum control valves corresponding to the set of vertically stacked substrate-handling paddles. The set of vacuum control valves includes a selected vacuum control valve for a selected substrate-handling paddle. A set of vacuum sensors is connected to the set of vacuum control valves. The set of vacuum sensors includes a selected vacuum sensor corresponding to the selected vacuum control valve. The selected vacuum sensor provides a substrate-absent signal when a substrate is not present at the selected substrate-handling paddle.

Abstract: The invention includes a method and a device for transferring storage containers, especially cassettes for printing plates, in order to reliably and accurately receive both manually inserted cassettes and cassettes from upstream transport systems and upstream storage devices, such as MCLs. The invention enables these cassettes to be supplied to other devices constructed, for example, for separating printing plates. The storage containers are aligned in a holder provided for them, and are positioned and secured against inadvertent withdrawal. In this case, the transport of the storage containers within the device is carried out in a damped manner and can be assisted automatically. A pneumatic drive system is preferably used for this purpose.

Abstract: An apparatus for transporting a flat object from one position to another position. The apparatus includes an end effector having a base portion and at least one finger extending from the base portion. The finger having a top surface and a bottom surface, and the finger including a free end. The top surface includes a substantially flat portion extending from the base portion, and wherein the finger includes a tapered portion extending from the substantially flat portion towards the free end.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: Apparatus for teaching robot station location relative to a work piece apparatus includes an attachment that can be temporarily coupled to the apparatus and positioned in known relationship to the robot station location. A plurality of positional sensors are mounted on the attachment ring, the sensors each configured to produce a signal when a work piece carried by a robot arm is positioned a predetermined distance from the sensor. A signal receiver is configured to receive signals from the sensors and to indicate which of the sensors has produced the signal. The indication may be the activation of an LED display that indicates to an operator what the next movement of the robot arm should be in order to center the work piece with respect to the robot station location.

Abstract: An alignment apparatus which obtains an amount of correction for centering a semiconductor wafer from four points of a wafer edge detected by noncontact proprioceptors in a wafer delivery position P1 where the semiconductor wafer is passed to a wafer carrying unit from a wafer carrying robot and centers the semiconductor wafer.

Abstract: A method and apparatus for minimizing the surface contamination of semiconductor wafers (11) during the semiconductor device manufacturing process. Semiconductor wafers (11) are stored in a storage cassette (12) with their face sides (17) facing downward and their back sides (16) facing upward. Particulate contamination present on the back sides of the wafers is thereby secured to the wafers by the force of gravity, and the faces of the wafers are shielded from falling debris. An automated wafer handling device (19) is provided with a rotary joint (22) to accomplish the wafer flipping motion before inserting a wafer into a cassette and after removing the wafer from the cassette.

Abstract: A wafer handling device includes a platform having a plurality of movable grippers. A driver is mounted on the platform and selectively couples to at least one of the plurality of grippers to selectively move at least one of the plurality of grippers with regard to the platform. The driver may be magnetically coupled to at least one gripper to move it between a first proximal position and a first distal position. The driver may be mounted on the platform with a track assembly that effectuates a linear magnetic propulsion field to move the driver between the first axial position and the second axial position.

Abstract: A robot alignment system (10) includes a sensor system (12). The sensor system (12) is designed to attach to an end effector of a robot arm (14). A rough alignment target (16) is attached to a work station. A fine alignment target (22) is placed on a work surface of the work station. The sensor system (12) first determines the rough alignment target (16). The robot arm (14) is then moved to detect the fine alignment target (22).

Abstract: A material distribution system for stick-like objects such as railroad spikes includes a rake for peeling the stick-like objects from the top of a pile, and transferring them to another location, for example, where they might be reached by a human operator. Use of the rake to peel the object from the top of the pile, with minimized downward pressure applied by the rake, minimizes the tendency of the objects to entangle with each other.

Abstract: The objective of the present invention is to provide a transfer device for substrate capable of preventing deformation or breakage of substrate due to bending stress, by reducing the amount of dead weight deflection of substrate, such as large mother glass boards, etc.

Abstract: The present invention discloses an exchanger for a tray feeder for transferring and exchanging a tray plate comprising: first and second support frames; a guide support unit including a support frame installed between the first and second support frames; a vacuum generator provided with a side of the first support frame; a nozzle support unit including a pitting unit for transferring a vacuum suction force by connecting it to the vacuum generator, a plurality of vacuum pad for performing a grasp of the tray plate with the vacuum suction force transferred from the pitting unit, and a plurality of stopper capable of supporting the tray plate; a head block connected to a side of the nozzle support unit; a guide block installed to a second belt as a state connected to the head block, thereby capable of guiding the nozzle support unit; a transfer means for transferring the guide block; a driving means for driving the transfer means.

Abstract: A substrate processing apparatus comprises a processing section for performing processing for a substrate, a substrate carrier transfer section into/out of which a substrate carrier holding a plurality of substrates is carried, and a substrate transfer mechanism for taking an unprocessed substrate out of the substrate carrier carried into the substrate carrier transfer section to deliver it to the processing section and for receiving a processed substrate from the processing section to deliver it into the substrate carrier placed on the substrate carrier transfer section. The substrate carrier transfer section shifts the position of the substrate carrier between a first position at which the substrate carrier is carried to/from the outside and a second position at which the substrate in the substrate carrier is delivered to/from the substrate transfer mechanism.