Abstract: Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path.

Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.

Abstract: An exposure method, which exposes a pattern of a mask carried on a mask stage onto a substrate, includes transferring the mask to the mask stage by a transfer device, and moving the transfer device to a position in which it does not hinder an exposure.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: A wafer to be processed is loaded into a processing chamber in the same operation in which a processed wafer is unloaded from the processing chamber. As part of this operation, a set of lift pins lifts the processed wafer from a processing platform. A set of storage pins is extended above the lifted wafer and defines an upper wafer transfer position. A robot arm having a stacked set of wafer handling blades is inserted into the processing chamber with a wafer to be processed on the upper blade. The storage pins may lift the wafer to be processed off the upper blade at the same time that the lift pins lower the processed wafer onto the lower blade of the robot arm. The robot arm retracts, withdrawing the processed wafer from the processing chamber. The wafer to be processed may be lowered to the processing platform by the storage pins.

Abstract: An apparatus for transferring a movable body comprises a rack having flexibility, a pinion for driving the rack and a guide device for guiding the rack. The guide device has a curved portion. The pinion may locate along the curved portion of the guide device. The movable body comprises a disc.

Abstract: A system and method for improved throughput of semiconductor wafer processing. In one aspect, a wafer carrier is provided having a flat zone capable of holding an additional lot of wafers for processing. In addition, a multiple fork wafer transfer mechanism is provided having a plurality of wafer forks for loading and unloading wafers in the wafer carrier at a reduced fork pitch.

Abstract: A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system. In one embodiment, the holding chamber has a transfer robot which holds a stack of wafers for subsequent transfer to the processing chambers of the mainframe processing system.

Abstract: A substrate processing apparatus comprises a processing section for performing processing for a substrate, a substrate carrier transfer section into/out of which a substrate carrier holding a plurality of substrates is carried, and a substrate transfer mechanism for taking an unprocessed substrate out of the substrate carrier carried into the substrate carrier transfer section to deliver it to the processing section and for receiving a processed substrate from the processing section to deliver it into the substrate carrier placed on the substrate carrier transfer section. The substrate carrier transfer section shifts the position of the substrate carrier between a first position at which the substrate carrier is carried to/from the outside and a second position at which the substrate in the substrate carrier is delivered to/from the substrate transfer mechanism.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: An adapter device is placed on a movable plate of a base of an interface device to position a carrier pod at a preset height enabling a standard interfacing system with equipment machines to be used. A side wall of the adapter device comprises a guiding aperture enabling the carrier pod to pass to bring the first door and its lock into alignment with a front support plane of the side wall. A controller is provided to couple the first door with a second door and to unlock the first door when the side wall accosts against a front face of the interface device.

Abstract: A slide transfer system is provided for transferring semiconductor wafers from a first carrier cassette to a second process cassette. The system includes a base, a transfer mechanism, and a locking mechanism. The base has a first surface for supporting the first cassette, and a second surface for supporting the second cassette adjacent to the first cassette. The transfer mechanism has a wafer engaging member supported by a slidable support member for reciprocating movement of the wafer engaging member across the first surface of the base. The locking mechanism has an actuator element positioned for engagement by the second cassette placed on the second surface, and a locking element. The locking element has a first position in which sliding movement of the transfer mechanism is prevented, and a second position in which sliding movement of the transfer mechanism is permitted. The actuator element is operable to move the locking element between the first and second positions.

Abstract: A cassette sensing mechanism and a method for detecting the unevenness of a surface by detecting the difference between two paths on the surface. The mechanism contains two pawls connected to a connector at one end. The second end of one pawl contacts a portion of one path on the surface, and the second end of the other pawl contacts a portion of the other path on the surface. One path is smooth, and the other path contains grooves. A sensor on one pawl senses the relative position of the other pawl. The unevenness of the surface can be detected by monitoring the relative positions of the two pawls as the two pawls travel along the two paths. The sensing mechanism may be used for monitoring the position on a cassette in a sterilization system.

Abstract: A system and method for improved throughput of semiconductor wafer processing. In one aspect, a wafer carrier is provided having a flat zone capable of holding an additional lot of wafers for processing. In addition, a multiple fork wafer transfer mechanism is provided having a plurality of wafer forks for loading and unloading wafers in the wafer carrier at a reduced fork pitch.

Abstract: The processing status of a plurality of semiconductor wafers undergoing processing is positively identified by the use of indicator flags associated with cassettes containing the wafers. The flags are moved between at least two processing state indicating positions during processing of the wafers by a robotic arm that also transfers the wafers between the cassettes and a wafer processing station.

Abstract: Placement element release device and release system for placement elements having at least one multiple placement element belt which has, transversely with respect to its transport direction at least two tracks along which placement elements are arranged in openings. A transport apparatus is provided, by which the multiple placement element belt can be transported in the transport direction and the openings can be positioned in a collection position. In this case, in the collection position a plurality of placement elements corresponding to the number of tracks are arranged next to one another transversely with respect to the transport direction, and, in the region of the collection position, a screen which can be displaced relative to the placement elements is arranged above the multiple placement element belt in such a way that the placement elements can be covered, and can be released by the screen.

Abstract: A handling robot control method is disclosed for a handling robot disposed in a transfer chamber (1) having a plurality of process chamber stations (2e) arranged around it in communication therewith via respective gates (6), the robot having a first and a second carrier tables (8a, 8b) that are deviated in turning angular position from one to the other about a center of turning, the robot performing an operation to move the first and second carrier tables to turn jointly in the transfer chamber and also an operation to move the first and second carrier tables individually either to project through a said gate into a said process chamber station or to retract into the transfer chamber. The method comprises: overlapping the operation to move the carrier tables to project and to retract with the operation to move the first and second carrier tables to turn jointly.

Abstract: A processing system includes a transfer part (4) having a container disposed therein for performing taking out therefrom of a not-yet-processed object and loading therein the already-processed object; processing parts (11 through 18) for performing predetermined processing on the object; and a plurality of conveying units (21, 22) conveying the object between a first position for delivery of the object with the container disposed in the transfer part and a second position for delivery of the object with the processing part, wherein: each of the plurality of conveying units can move between the first position and second position; a moving path of the conveying units includes a plurality of paths each along an arrangement of the processing parts; and each of the conveying units can solely perform delivery of the object with the processing part on both sides or the transfer part.

Abstract: Disclosed is an apparatus for unloading substrates. The apparatus includes a handling station, a conveying robot, and a process apparatus controller. The handling station arranges substrates having different sizes and processed by a prior process apparatus. The conveying robot lifts the substrate arranged on the handling station and loads the substrate to a predetermined position on a cassette or a subsequent process apparatus. The process apparatus controller controls the arrangement of the substrate or motions of the conveying robot so that the substrate is loaded on the predetermined position of the cassette or the subsequent process apparatus. The unloading apparatus according to the present invention adjusts the position on which the substrate is placed in the handling station according to the size of the substrate or adjusts a rotational arc of the conveying robot so that the substrate is loaded to a secure position on the cassette or subsequent process apparatus.

Abstract: Parts P are fed from a tray parts feeder 1 in which trays 3 loaded with parts P in rows thereon are accommodated. Mount head 18 mounts the parts P onto a substrate 5 that is carried in along guide rails 6 of a substrate transfer section 4. A tray 3 is drawn out from the tray parts feeder 1 by a given pitch and positioned at a predetermined location. The apparatus has a construction such that the tray 3, as it is pulled out, passes under guide rails 6 of the substrate transfer section 4.

Abstract: A self-teaching robot arm positioning method that compensates for support structure component alignment offset entails the use of a component emulating fixture preferably having mounting features that are matable to support structure mounting elements. Robot arm mechanism motor angular position data measured relative to component emulating fixture features are substituted into stored mathematical expressions representing robot arm vector motion to provide robot arm position output information. This information indicates whether the actual relative alignment between the robot arm mechanism and a semiconductor wafer carrier is offset from a nominal relative alignment. The robot arm mechanism position output information can be used to effect either manual or automatic correction of an offset from the nominal relative alignment.

Abstract: A plate feeding apparatus includes a slide mechanism for horizontally moving one of a plurality of cassettes, a lift mechanism for supporting and vertically moving the cassette horizontally moved by the slide mechanism, to a plate feed position for feeding plates to an image recording apparatus, a transport mechanism for transporting the plates to the image recording apparatus from the cassette moved to the plate feed position by the lift mechanism, and a strip sheet discharge mechanism for discharging strip sheets each disposed between an adjacent pair of the plates.

Abstract: A wafer transfer apparatus loads and unloads wafers into and from a wafer cassette. The apparatus includes an arm for picking up a wafer, a motor-driven mechanism connected to the arm for moving the arm vertically and horizontally, and a sensor for sensing when the lower surface of the arm contacts an upper surface of a wafer already seated in the wafer cassette. The sensor is made up of a sensor body, a controller, and an amplifier. The arm can be made of metal, in which case the sensor body includes an elastic layer coated on the lower surface of the arm, and an electrically conductive metal layer formed on the elastic layer. When the lower surface of the arm presses against a wafer, the metal layer contacts the metal arm and electrical signals indicative of such contact can thus be produced. Alternatively, the arm may be made of a ceramic.

Abstract: An automated feed mechanism (2) for retrieving a desired wafer assembly (20). The automated feed mechanism (2) has an elevator assembly (12) for storing a plurality of wafer assemblies (20) and the elevator assembly (12) is driven to facilitate retrieval of the desired wafer assembly (20). A pick and place assembly (16) retrieves electronic components (22), from a retrieved wafer assembly (20), and transports each retrieved electronic component (22) to a shuttle assembly (18). The shuttle assembly (18) comprises first and second shuttle platforms (34, 36), with one of the shuttle platforms (34 or 36) located adjacent the pick and place assembly (16) for loading electronic components (22) thereon, and the second shuttle platform (36 or 34) located at a dispensing position (D) for retrieval of the previously loaded electronic components (22) by an automated assembly machine (3).

Abstract: A semiconductor fabricating apparatus having a vertical reaction furnace, a boat for holding plural wafers in a multi-layered fashion and being loaded into the vertical reaction furnace, a storage disposed at a location corresponding to the boat for storing at least one of the wafer cassettes, a wafer transfer device for transferring the wafer between the storage and the boat, a cassette transfer unit for transferring the wafer cassettes between the apparatus and outside thereof, a cassette transfer device for effecting the transfer of the wafer cassettes between the cassette transfer unit and the storage, and a plurality of cassette shelves disposed within a range allowing transfer of the wafer cassettes from the cassette transfer device for receiving the wafer cassettes in upwardly-oriented positions.

Abstract: This invention related to a substrate transfer apparatus having an arm holder moving into and out of a cassette while a substrate is mounted thereon, a forward and backward driving mechanism for moving the arm holder forward and backward, and a contact support member for supporting the substrate in contact with a lower surface peripheral portion of the substrate placed on the arm holder, said contact support member comprising a first defining portion for defining a front end of the substrate placed on the arm holder, and a second defining portion facing the first defining portion, for defining a rear end of the substrate placed on the arm holder.

Abstract: A substrate processing apparatus substrate transport and load lock assembly comprising a first load lock, a first substrate elevator, and a transport robot. The substrate elevator has a first vertical drive and a first substrate support connected to the vertical drive. The support is vertically movable by the vertical drive along a path including a first position outside of the load lock and a second position inside the load lock. The transport robot has a movable arm for supporting at least one substrate thereon. The arm is movable into and out of the path while the support is located in the load lock.

Abstract: A transfer system 7 for carrying a wafer W into/out of a process chamber 4 is provided in a box 10 defining a load-lock chamber 3. The box 10 is divided into a first chamber 11 and a second chamber 12. A transfer arm 21 for carrying the wafer W is provided in the first chamber 11. A linearly moving system 14 for linearly moving the transfer arm 21 is provided in the second chamber 12. The internal pressure in the first chamber is set to be higher than the internal pressure in the second chamber.

Abstract: A substrate detection sensor is operatively connected to a door moving mechanism for opening/closing a front door with respect to a sealed container accommodating therein a plurality of substrates. The substrate detection sensor enters the sealed container and detects the substrates successively as it is lowered integrally with the front door, and retracts from the sealed container when all of the substrates have been detected.