Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes.

Abstract: A method and apparatus for manufacturing a magnetic recording medium uses a small-diameter insulating substrate. The apparatus includes a carrier for a special size of 3.5 inches for receiving a plurality of small-diameter insulating substrates. Seed layers are deposited on the substrates, then each substrate is rotated to shift the position of the substrate so that the movable claw contacts the deposited seed layer. A bias voltage is applied via the movable claw for subsequent deposition layers.

Abstract: A hand 1 is constituted by a hand base 4 serving as a base portion, a rocking hand 3 disposed to be superposed on the hand base 4 and serving to support a substrate 2, and a rocking mechanism 5 provided between the hand base 4 and the rocking hand 3 and serving to support the rocking hand 3 to be tiltable and movable in parallel with respect to the hand base 4.

Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6?, 6?, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6?, 6?, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

Abstract: A holding apparatus for holding a semiconductor wafer comprises a pneumatic cylinder, a plunger movably connected to the pneumatic cylinder, an inlet pipe connected to the pneumatic cylinder, and a relief valve connected to the inlet pipe. Clean dry air is pumped into the pneumatic cylinder through the inlet pipe to impel the plunger in a first direction to contact the wafer. A part of the air in the inlet pipe is discharged through the relief valve to regulate air pressure to the pneumatic cylinder.

Abstract: Quick changeover apparatus for wafer handlers capable of handling at least two sizes of wafer frames and methods of using such apparatus are disclosed.

Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

Abstract: A disk chucking mechanism constructed with first, second and third link members forms a slider crank mechanism and the third link member is rotated by a drive of a forward/rearward actuator such as an air cylinder and chucking nails are provided which protrude perpendicularly to a longitudinal direction of the first or second link member. A rotation of the chucking nail protruded perpendicularly is stopped by engagement with a disk and a spring member is bent by further forward or rearward movement of the second link member to energize a first chucking nail in a direction for maintaining an engagement with the disk. The disk is chucked with a predetermined force by only the drive of the forward/rearward actuator.

Abstract: In a first aspect, a first method is provided repositioning support provided by an end effector. The first method includes the steps of (1) employing the end effector to support a substrate carrier by a bottom of the substrate carrier; (2) transferring the substrate carrier from the end effector to an intermediate support location, wherein the intermediate support location supports the substrate carrier by a bottom of the substrate carrier; (3) repositioning the end effector proximate an overhead transfer flange of the substrate carrier; (4) employing the end effector to support the substrate carrier by the overhead transfer flange of the substrate carrier; and (5) transferring the substrate carrier from the intermediate support location. Numerous other aspects are provided.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: An improved stocker configuration for storing workpieces in a fabrication facility is disclosed, employing workpiece compartments arranged stationarily around a robot handling assembly. The robot handler can be designed with three degrees of freedom, to improve speed, throughput and minimum minimum particle generation. In addition, the stocker storage area is stationary with the movable components are the robot assembly, thus further contributing to the cleanliness of the storage stocker. The stocker configuration can be open storage area for fast access, space saving and ease of clean air purging. The stocker configuration can provide highly dense workpiece storage, utilizing a circumferential edge gripper robot handling assembly.

Abstract: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads.

Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Abstract: A carrier blade for transferring a semiconductor wafers into and out of a deposition chamber may include transition surfaces sloping downward from ledge surfaces. The transition surfaces slope from the corresponding ledges at angles that are greater than about 90 degrees so that the edges between the ledge surfaces and the transition surfaces are not sharp. The carrier blade may include bevels extending from the ledge surface(s) to upper lateral edges of the carrier blade.

Abstract: A front opening unified pod (FOUP) for holding wafers is invertible and compatible with process machines in an inverted orientation. The FOUP can safely transport and store wafers while in a non-upright orientation. The shelves within the FOUP are capable of collapsing and constraining the wafers. Further, a method of holding wafers for processing is provided.

Abstract: The present invention provides a substrate carrying and processing apparatus which is intended to reduce the size of the space for storing substrates in each substrate storing section as much as possible so as to downsize the apparatus and increase the number of substrates to be stored therein as well as to enhance the throughput. The substrate carrying and processing apparatus comprises a carrier block S1 which is adapted to position carriers 20 each receiving wafers W therein, a processing block S2 including processing units U1 to U4, 31 used for processing each wafer, a main arms A1 adapted to transfer each wafer to each processing unit, a rack unit U5 which is disposed between the carrier block and the processing block and able to store wafers to be processed, and a transfer arm D adapted to transfer each wafer to the rack unit.

Abstract: An autoloader system with modularization architecture and self-adaptive motion control ability for mass optical disks duplication includes four physical modules: a robot arm module with sensors and joints dedicates for delivering and picking up optical disks; an optical disk duplication tower has a number of optical drives in a stack, or a matrix for optical disk duplication; a motion control module has an embedded motion controller and a power source to synchronize the motion of robot arm and duplication; a platform module has a base frame to fix other modules and a user interface. Some disk stacks are situated on top of platform module. The use of a self-adaptive control algorithm, consisting of a Motion Strategy Database, Initial Process, Motion Planning Process, Motion Generation Process and Motion Monitor Process, to ascertain system configurations and components furthest satisfy the required flexibility for modifying/upgrading hardware or ever-changing user needs.

Abstract: A platform for securely mounting a wafer cassette holder thereon is provided which includes a wafer cassette holder that has a flat bottom surface and four sidewall panels, a platform that has a flat top surface larger than and for mating to the flat bottom surface of the wafer cassette holder, And a securing device mounted in the flat top surface of the platform juxtaposed to each side of the four sidewalls of the wafer cassette holder for preventing the holder from accidentally slipping off the platform, the securing device may include either a plurality of engagement pins that slidingly engages the wafer cassette holder for securely holding the holder on the platform, or a plurality of side panels mounted along the peripheral edge of the platform for preventing the holder from slipping off the platform.

Abstract: A method and apparatus for handling an article in semiconductor fabrication in which the article is completely separated from a gripper by a frozen liquid. The gripper includes a feeding device for introducing a liquid such as a high-purity water or a decontaminating liquid. The gripper also includes a cooling device for freezing the liquid. A suction take-in device applies negative pressure to hold the article against the frozen liquid.

Abstract: A gripper for use with a robot includes a support body for removably attaching the gripper to a moveable arm and a workpiece contact body having a groove extending along at least a portion of the contact body for engaging a curved outer edge of the workpiece. A coupling member connects the support body to the workpiece contact member and includes a flexure component that flexes to allow radial and/or tangential relative movement of the workpiece contact body with respect to the support body to diminish slippage between the workpiece and the contact body as the gripper engages the workpiece.

Abstract: It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.

Abstract: Provided are a single substrate cleaning apparatus, and a method for cleaning the backside of a substrate, where a substrate reversing device for cleaning the backside of a substrate is installed inside a processing chamber.

Abstract: A device for containing the catastrophic failure of a vacuum pumping system is described. The vacuum pumping system includes a turbo-molecular pump (TMP) configured to be coupled to a vacuum processing system at an inlet end. The TMP includes a longitudinal axis substantially parallel to an axis of rotation of the TMP and a first lateral axis substantially perpendicular to the longitudinal axis. The vacuum system also includes a containment device configured to mitigate the catastrophic failure of the TMP by impeding only one translational degree of freedom (DOF) and only one rotational DOF of the movement of the TMP. Impeding only one translational DOF includes impeding translational motion of the TMP in a first lateral direction substantially parallel to the first lateral axis. Impeding only one rotational DOF includes impeding rotation of the TMP about the longitudinal axis.

Abstract: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with respect to the wafer and the ESC to allow the wafer to be peeled off or removed section by section from the electrostatic clamp. The system and method allow the wafer to be removed with a much lower pull force than current systems and methods.

Abstract: A work holding mechanism for horizontally holding a flat work is incorporated in work transport equipment. The holding mechanism includes a base member for supporting the work and a plurality of guide members provided at the base member. Each guide member includes a shaft, a contact portion and a limit portion. The shaft is pivotally supported by the base member. The contact portion comes into contact with part of the lower surface of the perimeter of the work and is pushed down, with the shaft as a fulcrum, when the work is placed on the base member. The limit portion is raised, with the shaft as a fulcrum, to face part of the side surface of the perimeter of the work when the contact portion is lowered.

Abstract: A lithographic apparatus can include an illumination system that conditions a radiation beam, a patterning device that modulates the radiation beam, a substrate table that supports a substrate, and a projection system that projects the modulated radiation beam onto a target portion of the substrate. The lithographic apparatus can also include a substrate handler that loads and/or unloads a substrate on/from the substrate table. The substrate handler supports the substrate in a support plane and can include a conveyor device for moving the substrate in a direction substantially parallel to the support plane. The conveyor device can include a gripping device configured to push or pull the substrate in the indicated direction and a driving device for driving the gripping device in the indicated direction.

Abstract: A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.

Abstract: A robotic end effector or blade suitable for transferring a substrate in a processing system is provided. In some embodiments, an end effector can include a body having opposing mounting and distal end, the body fabricated from a single mass of ceramic. The body can include a pair of arcuate lips extending upward from an upper surface of the body. Each lip is disposed on a respective finger disposed at the distal end of the body. An arcuate inner wall extends upward from the upper surface at the mounting end of the body. The inner wall and lips define a substrate receiving pocket. A plurality of contact pads extend upward from the upper surface of the body for supporting the substrate thereon. A recess is formed in a bottom surface of the body to accommodate a mounting clamp.

Abstract: A center robot is fixed approximately in a central portion of a process part. A coating unit, a drying unit, a transfer unit, a peeling unit, a film supplying unit and a reversing unit are arranged around the center robot. The center robot comprises a hand-for-substrate and a hand-for-film which are allowed to directly access the respective units. Within a process part, the center robot transports a sheet film and/or a substrate between the coating unit, the drying unit, the transfer unit and the film supplying unit, and a thin film is formed on the substrate using the sheet film.

Abstract: A flat workpiece transport apparatus having a movable arm and an end effector. The end effector is connected to the arm. The end effector has a movable grip for holding a flat workpiece on the end effector. The end effector has a grip actuator operably connected to the movable grip. The grip actuator has more than one actuation members and a resiliently flexible member connecting the more than one actuation members. Each actuation member actuates at least one corresponding grip element of the movable grip to capture or release the workpiece. Flexure of the resiliently flexible member effects movement of at least one of the more than one actuation members for actuation of the at least one corresponding grip element. The resiliently flexible member is sandwiched by substantially rigid portions of the more than one actuation members.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: The present invention is a pod opener having an end effector which: a. grips and releases a reticle supported above the base of a pod; and b. while transferring the reticle between the base of the pod and an adjacent IC photolithography tool, reorients the reticle. In one embodiment, the pod opener reorients the reticle by rotating it about a single axis disposed substantially perpendicular to its patterned surface. In another embodiment, the present invention is a pod opener which while transferring the reticle between the base of the pod and an adjacent IC photolithography tool, in addition to effecting rotation substantially perpendicular to a reticle's patterned surface, also turns the reticle over so a patterned surface of the reticle is oriented for proper focus within the IC photolithography tool.

Abstract: A substrate transfer apparatus for loading and unloading substrates in a reaction chamber, includes: an arm having a distal end which is laterally movable in a straight line direction; and end-effectors for loading and unloading substrates in a reaction chamber, which include a lower end-effector and an upper end-effector. One of the lower end-effector or the upper end-effector is movably coupled to the arm at a distal end of the arm, and the other end-effector is fixed to the movably coupled end-effector. The fixed end-effector is fixed to the movably coupled end-effector.

Abstract: The present invention comprises a vacuum end effector having workpiece supports that work in conjunction with distorted workpiece surfaces. In one embodiment, each workpiece support has the ability to gimbal and conform the workpiece surface in contact with an outer edge of the support. Each workpiece support preferably provides a knife-like contact edge to minimize the contact area between the support and the workpiece while still providing an effective vacuum area to hold the wafer securely on the support. In another embodiment, each workpiece support is replaceable without having to remove the end effector from the robot assembly.

Abstract: A transfer chamber for a flat display device manufacturing apparatus is provided. The transfer chamber may combine functions of a transfer chamber and a load-lock chamber. A robot may be provided aside from a center of the transfer chamber, and a buffer may be provided so as to avoid interference with the robot. An aligner may adjust a position of a substrate mounted on the buffer.

Abstract: A semiconductor material handling system including a frame mounting a wafer cassette and a plurality of load ports thereon, and a wafer moving robot including a robot body which has a lifting member mounted in the frame and vertically moving along a predetermined lifting shaft, an articulated arm which has a driving link mounted in the lifting member and a plurality of driven links whose end part transversely moving along the frame having the load ports, a swing unit which is mounted in the end part of the driven links and rotates along a vertical rotation shaft, and a crossing arm which comprises a base mounted in the swing unit, a plurality of sliding units mounted in the base and reciprocating transversely, and a wafer hand mounted in the sliding units and picking up a wafer from the wafer cassette and storing the wafer back in the wafer cassette.

Abstract: A robot is provided which comprises a wafer blade (105) having a pocket (109) therein for receiving a semiconductor wafer, and a retractable protrusion (107) which is movable from a first position in which said protrusion prevents the removal of said wafer from said pocket, to a second position in which said protrusion permits the removal of said wafer from said pocket.

Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the tape. The combination includes a frame for holding edges of a tape carrying a plurality of singulated devices, and a vacuum chuck having upper surfaces for contacting an underside of a tape carrying a plurality of singulated devices. The vacuum chuck extends along a perimeter circumscribing the singulated devices, and at least one groove is defined in the upper surface of the vacuum chuck. Conduit for providing fluid communication between the groove and a vacuum source are provided. Upon evacuation of the volume defined between the groove and the tape, the tape is drawn down into the groove and stretched, thereby increasing the separation or gap between adjacent dice and reducing the risk of damage upon removal of the dice.

Abstract: A supporting structure is mounted on a hand body facing a circumferential edge of a substrate from below the substrate to support the substrate. First and second guiding members are mounted on the hand body, and having guiding surfaces in contact with an imaginary cylinder having an axis aligned with a reference axis of the hand body. First and second movable members are capable of moving in an imaginary plane perpendicular to the reference axis and are disposed on the radially outer-side of the circumferential edge of the substrate so as to face the circumferential edge. A driving unit simultaneously displaces the first and second movable members in the imaginary plane. The first and second guiding members and the first and second movable members are spaced apart on the circumference of the imaginary cylinder at intervals greater than the length of the arc of a segment in a substrate holding state.

Abstract: Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for supporting a quadrilateral substrate during substrate transfer includes an end effector having an inner edge support disposed on a first end and a first outer edge support disposed on a distal end. The first end of the end effector is adapted for coupling to a robot linkage. The first inner edge support has a face that is oriented parallel to and facing the face of the first outer edge support. This configuration of edge supports captures the substrate to the end effector thereby minimizing substrate slippage during transfer. In another embodiment, lateral guides may be utilized to further enhance capturing the substrate along the edges of the substrate open between the inner and outer edge supports.

Abstract: A transporting arm has two protruding support sections. Front ends of the support sections are formed such that a thickness of the support sections decreases toward the front ends of those. A surface of the transporting arm on which a wafer is placed is provided with a plurality of suction holes formed at equal intervals in a fan-shaped region. The wafer is fixed to the transporting arm through the suction holes. The wafer is charged with a large amount of static electricity. The transporting arm is charged with the static electricity. A surface of the transporting arm is coated with a conductive fluorinated graphite material. Therefore, an electrical discharge rate of the transporting arm into an atmosphere increases. Accordingly, elevation of a surface potential of the transporting arm in a floating state can be appropriately suppressed. Reduction of repulsive force due to the static electricity acting between the transporting arm and the wafer leads to reduction of vibration of the wafer.

Abstract: There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

Abstract: A wafer transfer apparatus may include a robot arm unit configured to be operated by a driving means, a blade configured to support a wafer and having a fix finger at a first end, and a clamping member attached to the robot arm. The clamping arm may also include a movable finger configured to hold a peripheral edge of the wafer, and a moving pusher attached to the movable finger and configured to guide the movable finger and the wafer on the blade towards the fix finger.

Abstract: A kinematic pin and a substrate carrier adapted to deter dislodgment of the substrate carrier from the kinematic pin are provided. A shear member on the kinematic pin interacts with a shear feature of the substrate carrier to deter lateral movement of the substrate carrier relative to the kinematic pin. A substrate carrier handler that employs the kinematic pin is also provided.

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

Abstract: A substrate transport apparatus comprising a drive section, an upper arm, a first forearm, and a second forearm. The upper arm is rotatably connected to the drive section at a first end of the upper arm. The upper arm is rotatably connected to the drive section for rotating the upper arm about an axis of rotation of the drive section. The first forearm is pivotably connected to the upper arm for pivoting relative to the upper arm. The first forearm has a first end effector depending therefrom. The second forearm is pivotably connected to the upper arm for pivoting relative to the upper arm. The second forearm has a second end effector depending therefrom.