Iron, Cobalt, Or Nickel Containing Patents (Class 420/550)
  • Patent number: 10888926
    Abstract: A method can include pressing material to form a billet where the material includes aluminum and one or more metals selected from a group consisting of alkali metals, alkaline earth metals, group 12 transition metals, and basic metals having an atomic number equal to or greater than 31; extruding the billet to form extrudate; and forming a degradable component from the extrudate.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 12, 2021
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Indranil Roy, Gregoire Jacob
  • Patent number: 9922807
    Abstract: A sputtering target according to the disclosure includes 5 wtppm to 10,000 wtppm of Cu and the balance of In and has a relative density of 99% or more and an average grain size of 3,000 ?m or less.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: March 20, 2018
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Yousuke Endo
  • Patent number: 9551065
    Abstract: Film-formation rate can be increased in the pre-sputtering and in the subsequent sputtering onto a substrate or the like, and sputtering failures such as splashes can be inhibited, by making an Al-based alloy or Cu-based alloy spurting target fulfill the following requirements (1) and/or (2) when the total area ratio of crystal orientations <001>±15°, <011>±15°, <111>±15°, <112>±15°, and <012>±15° in the sputtering surface normal direction in the depth within 1 mm from the uppermost surface of the sputtering target is referred to as a P value: (1) the area ratio PA of <011>±15° to the P value: 40% or lower; and (2) the total area ratio PB of <001>±15° and <111>±15° to the P value: 20% or higher.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: January 24, 2017
    Assignees: Kobe Steel, Ltd., KOBELCO RESEARCH INSTITUTE, INC.
    Inventors: Katsushi Matsumoto, Junichi Nakai, Toshiaki Takagi
  • Publication number: 20150132182
    Abstract: An electrical cable (100A, 100B, 100C) has an elongate electrically conductive element (10A, 10B, 10C) made of aluminum alloy having aluminum (Al) and erbium precipitates (Al3Er), where the aluminum alloy additionally has an element chosen from iron (Fe), copper (Cu) and a mixture thereof; and unavoidable impurities.
    Type: Application
    Filed: September 25, 2014
    Publication date: May 14, 2015
    Inventor: Emilien Comoret
  • Patent number: 8974729
    Abstract: Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20° C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1): (Bi1-xMx)NiO3 (1), where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02?x?0.15.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: March 10, 2015
    Assignees: Canon Kabushiki Kaisha, Kyoto University
    Inventors: Makoto Kubota, Kaoru Miura, Hisato Yabuta, Yoshihiko Matsumura, Yuichi Shimakawa, Masaki Azuma
  • Publication number: 20140308155
    Abstract: An efficient polishing method for polishing an alloy material to have an excellent mirror surface is provided. The alloy material contains a main component and 0.1% by mass or more of an element that has a Vickers hardness (HV) different from the Vickers hardness of the main component by 5 or more. A polishing composition used in the polishing method contains abrasive grains and an oxidant. The alloy material is preferably an aluminum alloy, a titanium alloy, a stainless steel, a nickel alloy, or a copper alloy. It is also preferable that the alloy material is subjected to preliminary polishing before being subjected to polishing in which the polishing composition is used.
    Type: Application
    Filed: November 19, 2012
    Publication date: October 16, 2014
    Inventors: Hitoshi Morinaga, Hiroshi Asano, Maiko Asai, Shogo Tsubota, Kazusei Tamai
  • Publication number: 20140170018
    Abstract: Provided are an aluminum alloy including an iron-manganese complete solid solution and a method of manufacturing the same. According to an embodiment of the present invention, iron-manganese alloy powder is provided. The iron-manganese alloy powder is introduced into an aluminum melt. An aluminum alloy including an iron-manganese complete solid solution is manufactured by die casting the aluminum melt.
    Type: Application
    Filed: July 26, 2012
    Publication date: June 19, 2014
    Applicant: KOREA AUTOMOTIVE TECHNOLOGY INSTITUTE
    Inventors: Si Young Sung, Beom Suck Han
  • Publication number: 20130309123
    Abstract: A transition element-doped aluminum powder metal and a method of making this powder metal are disclosed. The method of making includes forming an aluminum-transition element melt in which a transition element content of the aluminum-transition element melt is less than 6 percent by weight. The aluminum-transition element melt then powderized to form a transition element-doped aluminum powder metal. The powderization may occur by, for example, air atomization.
    Type: Application
    Filed: December 14, 2011
    Publication date: November 21, 2013
    Applicant: GKN SINTER METALS, LLC
    Inventors: Donald Paul Bishop, Richard L. Hexemer, JR., Ian W. Donaldson, Randy William Cooke
  • Publication number: 20120328472
    Abstract: A forged devitrified aluminum alloy of forging devitrified aluminum alloys having a desired shape. The alloy is forged in a plane strain forging die with the axis of extrusion being parallel to the direction of forging.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas J. Watson, Venkatarama K. Seetharaman
  • Publication number: 20120321507
    Abstract: An aluminum alloy conductor, containing: 0.4 to 0.9 mass % of Fe, with the balance being Al and inevitable impurities, wherein the conductor contains two kinds of intermetallic compounds A and B, in which the intermetallic compounds A and B have a particle size of 0.1 ?m or more but 2 ?m or less, and 0.03 ?m or more but less than 0.1 ?m, respectively, and area ratios a and b of the intermetallic compounds A and B, in an arbitrary region in the conductor, satisfy: 1%?a?6%, and 1%?b?5%.
    Type: Application
    Filed: August 24, 2012
    Publication date: December 20, 2012
    Inventors: Shigeki SEKIYA, Kyota Susai
  • Patent number: 8226781
    Abstract: A heat exchanger use high strength aluminum alloy fin material having a high strength and excellent in thermal conductivity, elusion resistance, sag resistance, sacrificial anodization effect, and self corrosion resistance, characterized by containing Si: 0.8 to 1.4 wt %, Fe: 0.15 to 0.7 wt %, Mn: 1.5 to 3.0 wt %, and Zn: 0.5 to 2.5 wt %, limiting the Mg as an impurity to 0.05 wt % or less, and having a balance of ordinary impurities and Al in chemical composition, having a metal structure before brazing of a fibrous crystal grain structure, a tensile strength before brazing of not more than 240 MPa, a tensile strength after brazing of not less than 150 MPa, and a recrystallized grain size after brazing of 500 ?m or more.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: July 24, 2012
    Assignee: Nippon Light Metal Company, Ltd.
    Inventors: Hideki Suzuki, Yoshito Oki, Tomohiro Sasaki, Masae Nagasawa
  • Publication number: 20120107228
    Abstract: There is provided a hydrogen gas generating member which safely facilitates the hydrogen gas generation reaction by bringing an Al alloy which is subjected to rolling treatment or powdering treatment into contact with water. A hydrogen gas generating member 20 includes a texture in which Al is finely dispersed in a metal matrix, where hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water. A fixing member 14 for mounting the hydrogen gas generating member 20 is provided in a hydrogen generating apparatus 10 and is brought into contact with a water 15 that is stored inside. The hydrogen gas generated from the surface is supplied outside through a hydrogen gas collecting, pipe 12 and stored in a storage tank (not shown).
    Type: Application
    Filed: August 11, 2008
    Publication date: May 3, 2012
    Applicant: Japan Science and Technology Agency
    Inventors: Kiyohito Ishida, Ryosuke Kainuma, Ikuo Ohnuma, Toshihiro Omori, Yoshikazu Takaku, Takehito Hagisawa
  • Patent number: 8163143
    Abstract: The present invention relates to an Al—Ni—La—Si system Al-based alloy sputtering target including Ni, La and Si, in which, when a section from (¼)t to (¾)t (t: thickness) in a cross section vertical to a plane of the sputtering target is observed with a scanning electron microscope at a magnification of 2000 times, (1) a total area of an Al—Ni system intermetallic compound having an average particle diameter of 0.3 ?m to 3 ?m with respect to a total area of the entire Al—Ni system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni system intermetallic compound being mainly composed of Al and Ni; and (2) a total area of an Al—Ni—La—Si system intermetallic compound having an average particle diameter of 0.2 ?m to 2 ?m with respect to a total area of the entire Al—Ni—La—Si system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni—La—Si system intermetallic compound being mainly composed of Al, Ni, La, and Si.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: April 24, 2012
    Assignees: Kobe Steel, Ltd., Kobelco Research Institute, Inc.
    Inventors: Katsutoshi Takagi, Yuki Iwasaki, Masaya Ehira, Akira Nanbu, Mototaka Ochi, Hiroshi Goto, Nobuyuki Kawakami
  • Patent number: 8142575
    Abstract: [PROBLEMS] To provide an aluminum alloy fin material for a heat exchanger, which has high strength and high heat conductivity after brazing, and is excellent in the resistance to sagging, erosion and self-corrosion and the in the sacrificial anode effect. [MEANS FOR SOLVING PROBLEMS] A method for producing an aluminum alloy fin material for a heat exchanger which comprises providing a molten aluminum alloy having a chemical composition, in wt %, that Si: 0.5 to 1.5%, Fe: 0.15 to 1.00%, Mn: 0.8 to 3.0%, Zn: 0.5 to 2.5%, with the proviso that the content of Mg as an impurity is limited to 0.05 wt % or less, and the balance: Al and inevitable impurities, casting the molten alloy continuously into a thin slab having a thickness of 5 to 10 mm by the use of a twin belt casting machine, winding up the slab into a roll, cold-rolling the slab into a sheet having a thickness of 0.05 to 2.0 mm, subjecting the sheet to an inter annealing at 350 to 500° C.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: March 27, 2012
    Assignee: Nippon Light Metal Company, Ltd.
    Inventors: Yoshito Oki, Hideki Suzuki, Haruo Sugiyama, Toshiya Anami, Tomohiro Sasaki
  • Publication number: 20120020829
    Abstract: Disclosed is a heat-resistant aluminum alloy including aluminum and two types of alloy elements which are combined while forming a homogeneous solid solution reinforcing phase. The disclosed heat-resistant aluminum alloy includes the alloy elements that form a homogeneous solid solution and do not have a solvus line with respect to aluminum as a matrix metal and, therefore, the formed homogeneous solid solution reinforcing phase does not react with aluminum even at a temperature up to 300° C., thus not becoming coarse or undergoing phase decomposition. Consequently, the disclosed aluminum alloy may have remarkably enhanced heat resistance.
    Type: Application
    Filed: January 25, 2010
    Publication date: January 26, 2012
    Applicant: KOREA AUTOMOTIVE TECHNOLOGY INSTITUTE
    Inventors: Si Young Sung, Beom Suck Han, Young Jig Kim, Bong Jae Choi, Yung Mun Ryu, Dong Ok Kim, Sang Ho Noh, Chang Su Hahn
  • Patent number: 8017072
    Abstract: An improved L12 aluminum alloy having magnesium or nickel; at least one of scandium, erbium, thulium, ytterbium, and lutetium; at least one of gadolinium, yttrium, zirconium, titanium, hafnium, and niobium; and at least one ceramic reinforcement. Aluminum oxide, silicon carbide, aluminum nitride, titanium boride, titanium diboride and titanium carbide are suitable ceramic reinforcement particles. These alloys derive strengthening from mechanisms based on dislocation-particle interaction and load transfer to stiffen reinforcements.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: September 13, 2011
    Assignee: United Technologies Corporation
    Inventor: Awadh B. Pandey
  • Patent number: 8002912
    Abstract: High temperature aluminum alloys that can be used at temperatures from about ?420° F. (?251° C.) up to about 650° F. (343° C.) are described. The alloys are strengthened by dispersion of particles based on the L12 intermetallic compound Al3X. These alloys comprise aluminum, at least one of nickel, iron and chromium; at least one of scandium, erbium, thulium, ytterbium, and lutetium, and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, and niobium.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: August 23, 2011
    Assignee: United Technologies Corporation
    Inventor: Awadh B. Pandey
  • Patent number: 8003218
    Abstract: With respect to a reflection-type display device, an Al-based alloy material for a reflective film, which has excellent reflective characteristics and can be directly bonded to a transparent electrode layer such as ITO and IZO is provided. The present invention is Al—Ni—B alloy material for a reflective film, comprising aluminum containing nickel and boron, wherein a nickel content is 1.5-4 at %, a boron content is 0.1-0.5 at %, and the balance is aluminum. It is more preferable if the nickel content is 1.5-3 at %, and the boron content is 0.1-0.4 at %.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: August 23, 2011
    Assignee: Mitsui Mining & Smelting Co., Ltd
    Inventors: Yoshinori Matsuura, Ryoma Tsukuda, Hironari Urabe, Takashi Kubota
  • Publication number: 20110198602
    Abstract: Disclosed is an Al alloy film which can be in direct contact with a transparent pixel electrode in a wiring structure of a thin film transistor substrate that is used in a display device, and which has improved corrosion resistance against an amine remover liquid that is used during the production process of the thin film transistor. Also disclosed is a display device using the Al alloy film. Specifically disclosed is an Al alloy film for a display device, said Al alloy film being directly connected with a transparent conductive film on a substrate of a display device, and containing 0.05-2.0 atom % of Ge, at least one element selected from among element group X (Ni, Ag, Co, Zn and Cu), and 0.02-2 atom % of at least one element selected from among element group Q consisting of the rare earth elements. A Ge-containing deposit and/or a Ge-concentrated part is present in the Al alloy film for a display device. Also specifically disclosed is a display device comprising the Al alloy film.
    Type: Application
    Filed: November 5, 2009
    Publication date: August 18, 2011
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Akira Nanbu, Hiroshi Goto, Aya Miki, Hiroyuki Okuno, Junichi Nakai, Tomoya Kishi, Toshiaki Takagi, Shigenobu Namba, Mamoru Nagao, Nobuhiro Kobayashi
  • Publication number: 20110158845
    Abstract: To provide an Al—Ni alloy wiring electrode material, which has flexibility suitable for organic EL, can be directly bonded to a transparent electrode layer of ITO or the like, and is excellent in corrosion resistance against developers. An Al—Ni alloy wiring electrode material containing aluminum, nickel and boron, wherein the material contains a total of 0.35 at % to 1.2 at % of nickel and boron with the balance being aluminum. It is also preferred that the Al—Ni alloy wiring electrode material contain 0.3 at % to 0.7 at % of nickel and 0.05 at % to 0.5 at % of boron.
    Type: Application
    Filed: March 13, 2009
    Publication date: June 30, 2011
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shigeki Tokuchi, Ryoma Tsukuda, Tomoyasu Yano, Yoshinori Matsuura, Takashi Kubota
  • Patent number: 7910053
    Abstract: A semiconductor device includes a semiconductor layer, an Al alloy film electrically connected to the semiconductor layer, and a transparent electrode layer directly contacting with the Al alloy film at least over an insulating substrate. The Al alloy film includes one or more kinds of elements selected from Fe, Co and Ni in total of 0.5 to 10 mol %, and a remaining substantially comprises Al.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: March 22, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazunori Inoue, Nobuaki Ishiga, Kensuke Nagayama, Kazumasa Kawase
  • Publication number: 20110064599
    Abstract: A method for producing a high strength aluminum alloy brackets, cases, tubes, ducts, beams, spars and other parts containing L12 dispersoids from an aluminum alloy powder containing the L12 dispersoids. The powder is consolidated into a billet having a density of about 100 percent. The billet is extruded using an extrusion die shaped to produce the component.
    Type: Application
    Filed: September 15, 2009
    Publication date: March 17, 2011
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventor: Awadh B. Pandey
  • Publication number: 20110019350
    Abstract: Disclosed is an Al alloy film for a display device that, even when low-temperature heat treatment is applied, can realize satisfactorily low electric resistance, can realize a satisfactory reduction in contact resistance between the Al alloy film and a transparent pixel electrode connected directly to the Al alloy film, and has excellent corrosion resistance. The Al alloy film is connected directly to a transparent electroconductive film on the substrate in the display device. The Al alloy film comprises 0.05 to 0.5 atomic % of Co and 0.2 to 1.0 atomic % of Ge and satisfies the requirement that the content of Co and the content of Ge in the Al alloy film have a relationship represented by formula (1): [Ge]??0.25×[Co]+0.2 (1) In formula (1), [Ge] represents the content of Ge in the Al alloy film, atomic %; and [Co] represents the content of Co in the Al alloy film, atomic %.
    Type: Application
    Filed: April 23, 2009
    Publication date: January 27, 2011
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Junichi Nakai, Akira Nanbu, Hiroshi Goto, Hiroyuki Okuno, Aya Miki
  • Patent number: 7875131
    Abstract: An improved amorphous aluminum alloy having high strength, ductility, corrosion resistance and fracture toughness is disclosed. The alloy has an amorphous phase and a coherent L12 phase. The alloy has nickel, cerium, at least one of scandium, erbium, thulium, ytterbium, and lutetium; and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, niobium and iron. The volume fraction of the amorphous phase ranges from about 50 percent to about 95 percent and the volume fraction of the coherent L12 phase ranges from about 5 percent to about 50 percent.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: January 25, 2011
    Assignee: United Technologies Corporation
    Inventor: Awadh B. Pandey
  • Patent number: 7850796
    Abstract: An aluminum alloy fin material for brazing, characterized by comprising an aluminum alloy comprising more than 1.4% by mass but not more than 1.8% by mass of Fe, 0.8% by mass or more but 1.0% by mass or less of Si, and more than 0.6% by mass but not more than 0.9% by mass of Mn, with the balance being Al and inevitable impurities, wherein 80% or more of the surface area, as viewed from the surface layer of the fin plane, is occupied by recrystallized grains with a length of 10 mm or more, in a direction rolled.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: December 14, 2010
    Assignees: Denso Corporation, Furukawa-Sky Aluminum Corp.
    Inventors: Kyoji Inukai, Tomohiro Ito, Akira Kawahara, Akio Niikura
  • Publication number: 20100254850
    Abstract: A method for producing high strength aluminum alloy consolidated billets containing L12 dispersoids by Ceracon forging is disclosed. The method comprises forming an aluminum alloy powder compact preform containing L12 dispersoid forming elements therein and encompassing the preform in a flowable pressure transmitting medium in a die in a hydraulic press. The die, pressure transmitting medium and preform are then heated and the preform is forged by applying pressure to the pressure transmitting medium by the ram of the hydraulic press. The unequal axial and radial strain resulting from this type of forging results in improved mechanical properties of L12 aluminum alloys.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 7, 2010
    Applicant: United Technologies Corporation
    Inventor: Awadh B. Pandey
  • Publication number: 20100247858
    Abstract: The invention concerns a system, in particular suitable for high power engines, comprising at least a rotor and means comprising active sections fit for making the rotor(s) rotate by their synchronised deformation, characterised in that the rotor material comprises an Al, Fe alloy with at least one other element, the alloy comprising at least more or less 80% in weight of Al and at least between 0.1 and 15.0% in weight in Fe.
    Type: Application
    Filed: May 30, 2006
    Publication date: September 30, 2010
    Inventors: Oscar D'Almeida, Mathias Woydt, Jean-Thierry Audren
  • Publication number: 20100244032
    Abstract: An Aluminum-Nickel alloy wiring material includes Aluminum, Nickel, Cerium, and Boron. A thin film transistor includes the Aluminum-Nickel alloy wiring material. A sputtering target comprises Aluminum, Nickel, Cerium and Boron. A method of manufacturing a thin film transistor substrate comprises disposing a thin film transistor on a substrate, wherein the thin film transistor includes a wiring circuit layer comprising Aluminum, Nickel, Cerium, and Boron. The Nickel, Cerium and Boron satisfy the following inequalities; 0.5?X?5.0, 0.01?Y?1.0, and 0.01?Z?1.0, respectively, wherein X represents an atomic percentage of Nickel content, Y represents an atomic percentage of Cerium content, and Z represents an atomic percentage of Boron content.
    Type: Application
    Filed: March 31, 2010
    Publication date: September 30, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pil Sang YUN, Byeong-Beom KIM, Changoh JEONG, Yangho BAE, Shigeki TOKUCHI, Ryoma TSUKUDA, Yoshinori MATSUURA, Takashi KUBOTA
  • Publication number: 20100202280
    Abstract: There are provided an aluminum-alloy reflection film for optical information-recording, having low thermal conductivity, low melting temperature, and high corrosion resistance, capable of coping with laser marking, an optical information-recording medium comprising the reflection film described, and an aluminum-alloy sputtering target for formation of the reflection film described. The invention includes (1) an aluminum-alloy reflection film for optical information-recording, containing an element Al as the main constituent, 1.0 to 10.0 at. % of at least one element selected from the group of rare earth elements, and 0.5 to 5.0 at. % of at least one element selected from the group consisting of elements Cr, Ta, Ti, Mo, V, W, Zr, Hf, Nb, and Ni, (2) an optical information-recording medium comprising any of the aluminum-alloy reflection films described as above, and (3) a sputtering target having the same composition as that for any of the aluminum-alloy reflection films described as above.
    Type: Application
    Filed: April 26, 2010
    Publication date: August 12, 2010
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Junichi NAKAI, Yuuki TAUCHI, Katsutoshi TAKAGI
  • Publication number: 20090285716
    Abstract: A manufacturing process for a remelt block containing aluminum designed for making aluminum alloy for the aircraft industry in which scrap containing mainly aluminum alloys used in the aircraft industry is supplied during a supply stage, the scrap is melted in a smelting furnace in order to obtain an initial molten metal bath during a smelting stage, the initial molten metal bath is subjected to purification by fractional crystallization in order to obtain a solidified mass and a bath of residual liquid during a segregation stage, and the solidified mass is recovered in order to obtain a remelt block during a recovery stage. The invention is particularly useful for the recycling of aluminum alloys used in the aircraft industry as it makes it possible to purify scrap of series 2XXX or series 7XXX alloys for iron and silicon, without eliminating additive elements such as zinc, copper and magnesium.
    Type: Application
    Filed: June 18, 2007
    Publication date: November 19, 2009
    Applicant: ALCAN RHENALU
    Inventors: Jean-Francois Verdier, Jean-Remi Butruille, Michel Leroy, Didier Valax
  • Publication number: 20090263266
    Abstract: An improved amorphous aluminum alloy having high strength, ductility, corrosion resistance and fracture toughness is disclosed. The alloy has an amorphous phase and a coherent L12 phase. The alloy has nickel, cerium, at least one of scandium, erbium, thulium, ytterbium, and lutetium; and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, niobium and iron. The volume fraction of the amorphous phase ranges from about 50 percent to about 95 percent and the volume fraction of the coherent L12 phase ranges from about 5 percent to about 50 percent.
    Type: Application
    Filed: April 18, 2008
    Publication date: October 22, 2009
    Applicant: United Technologies Corporation
    Inventor: Awadh B. Pandey
  • Publication number: 20090246072
    Abstract: The present invention has been made by the fact that the wettability with lubricant increases when tin grains are broken within a certain range. In an aluminum-based bearing alloy containing from 2 to 20 mass % of tin, the tin grains in a sliding surface have a size not less than 20 ?m2 but not more than 50 ?m2 expressed in region partitioned areas of the tin grains measured in accordance with a region partitioning method.
    Type: Application
    Filed: March 24, 2009
    Publication date: October 1, 2009
    Applicant: DAIDO METAL COMPANY LTD.
    Inventors: Tomoyuki NIRASAWA, Naohisa KAWAKAMI, Yukihiko KAGOHARA, Shigeru INAMI
  • Publication number: 20090230416
    Abstract: With respect to a reflection-type display device, an Al-based alloy material for a reflective film, which has excellent reflective characteristics and can be directly bonded to a transparent electrode layer such as ITO and IZO is provided. The present invention is Al—Ni—B alloy material for a reflective film, comprising aluminum containing nickel and boron, wherein a nickel content is 1.5-4 at %, a boron content is 0.1-0.5 at %, and the balance is aluminum. It is more preferable if the nickel content is 1.5-3 at %, and the boron content is 0.1-0.4 at %.
    Type: Application
    Filed: August 30, 2007
    Publication date: September 17, 2009
    Inventors: Yoshinori Matsuura, Ryoma Tsukuda, Hironari Urabe, Takashi Kubota
  • Patent number: 7572521
    Abstract: The invention relates to an aluminium alloy used as a coating for surfaces subjected to extreme friction stress, with an aluminium matrix incorporating at least a soft phase and a hard phase, as well as a process for producing the coating. The soft phase and/or the hard phase is essentially finely distributed in the aluminium matrix (20) and at least 80%, preferably at least 90%, of the soft phase or soft phase particles (18) have a mean diameter of a maximum of 3 ?m. The aluminium alloy is produced by depositing it on the base (11) by a process of deposition from a gas phase.
    Type: Grant
    Filed: August 3, 2005
    Date of Patent: August 11, 2009
    Assignee: Miba Gleitlager GmbH
    Inventors: Robert Mergen, Walter Gärtner
  • Publication number: 20080253925
    Abstract: Provided are a target material for manufacturing an electrode film of a semiconductor device, methods of manufacturing the target material and manufacturing the electrode film. The target material comprises Al-RE alloy or Al—Ni-RE alloy, in which RE is a mixture of rare earth elements comprising La, Ce, Pr, and Nd.
    Type: Application
    Filed: December 17, 2007
    Publication date: October 16, 2008
    Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Jianshe XUE, Ke LIANG
  • Publication number: 20080138239
    Abstract: Aluminum alloys having improved strength at 300° C. characterized by formation from an intermediate amorphous state to a final fcc matrix hardened by optimal 25 nm-diameter Ll2 precipitates with an interphase misfit less than about 4% in all three dimensions and Al23Ni6M4 precipitates where M is one or more elements selected from the group consisting of Y and Yb. An appropriate melt of aluminum with selected transition metals (Co, Cu, Fe, Ni, Ti, Y) and Ll2 stabilizers (Sc, Yb) in amounts of about 2 to 12 and 2 to 15 atomic percent, respectively, is processed to achieve an intermediate amorphous state to dissolve Ll2-forming components. The amorphous alloys are then thermo-mechanically devitrified to a final crystalline microstructure. The alloys have good ductility and a short-term tensile strength exceeding about 275 MPa (40 ksi) at 300° C., and are useful for applications such as high-temperature turbine engine components or aircraft structural components.
    Type: Application
    Filed: August 3, 2007
    Publication date: June 12, 2008
    Applicant: QuesTek Innovatioans LLC
    Inventors: Gregory B. Olson, Weijia Tang, Caian Qiu, Herng-Jeng Jou
  • Patent number: 7169478
    Abstract: Multinary alloys, in particular for use as coatings, if appropriate in combination with other types of layers, for components which are exposed to high temperatures and corrosive gases. The alloys are of the general form: Al—Ni—Ru-M, where at least one B2 phase is present, the aluminum content being in the range from 26–60 atomic percent and where M may be one or more metals and/or semimetals selected from the group consisting of: precious metal, transition metal, rare earths, semimetal. Multinary alloys of this type are very stable with respect to oxidation, have a low thermal conductivity and in particular have similar coefficients of thermal expansion to superalloys, which are usually used as substrates for protective coatings of this type in gas turbine components.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: January 30, 2007
    Assignee: Alstom Technology Ltd.
    Inventors: Anton Kaiser, Valery Shklover, Walter Steurer, Ivan Victor Vjunitsky
  • Patent number: 6974510
    Abstract: High strength, high ductility aluminum base alloys containing from 3 to 18.5 atomic percent nickel and 3 to 14.0 atomic percent yttrium, said alloy being in the devitrified state and containing less than 40 percent intermetallic phases.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: December 13, 2005
    Assignee: United Technologies Corporation
    Inventor: Thomas J. Watson
  • Patent number: 6929726
    Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 ?m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: August 16, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichi Watanabe, Takashi Ishigami
  • Patent number: 6896749
    Abstract: The invention concerns a rolled or extructed product, in particular a tube, made of an alloy composition (expressed in wt. %) comprising: Si<0.30; Fe 0.20-0.05; Cu<0.05; Mn 0.5-1.2; Mg<0.05; Zn<0.50; Cr 0.10-0.30; Ti<0.05; Zr<0.05; the balance consisting of aluminium and unavoidable impurities. The invention also concerns a method for making extruded tubes of said composition comprising casting a billet, optionally homogenizing it, extruding a tube, drawing said tube in one or several passes and continuous annealing at a temperature ranging between 350 and 500° C. with a temperature increase of less than 10 seconds. The inventive products are designed for pipes and heat exchangers for motor vehicles, and exhibit good corrosion resistance.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: May 24, 2005
    Assignee: Pechiney Rhenalu
    Inventors: Bruce Morere, Isabelle Ronga, Jean-Louis Querbes
  • Publication number: 20040261916
    Abstract: An aluminum casting alloy includes at least about 0.5 wt % Ni and 1-3 wt % Mn. It further includes zirconium or scandium for precipitation hardening during T5 heat treatment.
    Type: Application
    Filed: July 15, 2004
    Publication date: December 30, 2004
    Inventors: Jen C. Lin, Vadim S. Zolotorevsky, Michael V. Glazoff, Shawn J. Murtha, Nicholas A. Belov
  • Publication number: 20040182482
    Abstract: There is disclosed a DC cast alloy of composition (in wt %): Fe 0.8-1.5 Si 0.7-0.95 Mn 0.2-0.5 Zn 0.2-0.8 Mg up to 0.2 Cu up to 0.2 Ti<0.1 B<0.01 C<0.01. Unavoidable impurities up to 0.05 each, 0.15 total AI balance. Also disclosed is a method of DC casting the alloy to form an ingot.
    Type: Application
    Filed: March 9, 2004
    Publication date: September 23, 2004
    Inventors: Alan Gray, Andrew David Howells
  • Patent number: 6783730
    Abstract: There is claimed an Al—Ni—Mn based alloy for die casting, squeeze casting, permanent mold casting, sand casting and/or semi-solid metal forming. The composition of this alloy includes, by weight percent: about 2-6% Ni, about 1-3% Mn, less than about 1% Fe, less than about 1% Si, the balance Al, incidental elements and impurities. It is suitable for aerospace and automotive cast parts.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: August 31, 2004
    Assignee: Alcoa Inc.
    Inventors: Jen C. Lin, Vadim S. Zolotorevsky, Michael V. Glazoff, Shawn J. Murtha, Nicholas A. Belov
  • Publication number: 20040140197
    Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 &mgr;m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichi Watanabe, Takashi Ishigami
  • Patent number: 6736947
    Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 &mgr;m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: May 18, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichi Watanabe, Takashi Ishigami
  • Patent number: 6736911
    Abstract: An aluminum alloy contains at least 0.0001 mass % and not more than 0.03 mass % of copper, at least 0.0005 mass % and not more than 0.2 mass % of silicon, at least 0.5 mass % and not more than 4 mass % of manganese and at least 0.5 mass % and not more than 3 mass % of iron, and the rest contains aluminum and unavoidable impurities. The aluminum alloy further contains at least one of at least 0.01 mass % and not more than 0.5 mass % of chromium, at least 0.01 mass % and not more than 0.5 mass % of titanium and at least 0.01 mass % and not more than 0.5 mass % of zirconium. An aluminum alloy foil is prepared by heating up the aluminum alloy to a temperature of at leas 350° C. and not more than 580° C., holding the same immediately after the heating up or retaining an ingot of the aluminum alloy at a temperature of at least 350° C. and not more than 530° C. for not more than 15 hours, thereafter performing hot rolling at a starting temperature of at least 350° C. and not more than 530° C.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: May 18, 2004
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Akinori Ro, Masaaki Abe, Yoshiki Hashizume
  • Patent number: 6733726
    Abstract: An aluminum-based die casting alloy exhibiting improved corrosion resistance and good die-castability contains from about 4.5 to about 12 percent silicon by weight, at least 87 percent aluminum by weight, from about 0.25 percent to about 0.6 percent manganese by weight, and a maximum of 0.2 percent copper by weight. The alloys preferably contain iron in an amount sufficient to improve hot tear resistance and to decrease the tendency for die sticking or soldering during die casting.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: May 11, 2004
    Assignee: Delphi Technologies, Inc.
    Inventor: Kurt F. O'Connor
  • Publication number: 20040022664
    Abstract: The present invention intends to provide an aluminum alloy thin film that has an electrode potential of the same level as the electrode potential of an ITO film, does not diffuse silicon, has a low resistivity, and excels in heat resistance. The present invention is characterized in an aluminum alloy thin film containing 0.5 to 7.0 at % at least one or more element among nickel, cobalt, and iron, 0.1 to 3.0 at % carbon, and the balance being aluminum. Furthermore, the aluminum alloy thin film further contains 0.5 to 2.0 at % silicon.
    Type: Application
    Filed: May 16, 2003
    Publication date: February 5, 2004
    Inventors: Takashi Kubota, Hiroshi Watanabe
  • Patent number: 6673168
    Abstract: An aluminum-based material for anti-friction bearings composed of an aluminum alloy with 10-25 wt % tin or 5-25 wt % lead, impurity-caused components characterized by 0.75-2.5 wt % iron and an alloy additive capable of forming an intermetallic compound having a spherical phase homogeneously distributed in the aluminum alloy. The alloy additive is one of: a) manganese and silicon, in which the weight percentage fractions of manganese and silicon are at least half the weight percentage fraction of the iron and for manganese, at most 3 wt %, and for silicon, at most 2 wt %; b) 0.1-0.5 wt % cobalt; and c) 0.1-0.5 wt % molybdenum.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: January 6, 2004
    Assignee: KS Gleitlager GmbH
    Inventors: Karl-Heinz Matucha, Thomas Steffens, Werner Schubert
  • Patent number: 6638375
    Abstract: An aluminum bearing alloy includes, by mass, 3 to 40% Sn, 0.5 to 7% Si, 0.05 to 2% Fe, balance of Al, and unavoidable impurities. In the alloy, a ternary-element intermetallic compound of Al—Si—Fe and Si particles are contained as hard particles.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: October 28, 2003
    Assignee: Daido Metal Company Ltd.
    Inventors: Masahito Fujita, Yukihiko Kagohara, Koichi Yamamoto, Takayuki Shibayama