Abstract: A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.

Abstract: Division members (31, 32) separately molded to form a hollow component are brought into contact with each other and are arranged in dies (14, 24). The peripheral edge of the contact parts is formed with a peripheral edge path (330) to be filled with a molten resin. In the peripheral edge path (330), protrusions (316, 326) are projected from the division members (31, 32) continuously over the whole periphery of the peripheral edge path (330). The molten resin is filled in the peripheral edge path 330, and is welded with the protrusions (316, 326). As a result, a weld structure is obtained in which portions having a high welding strength are continuously formed over the whole periphery of the peripheral edge path (330).

Abstract: An apparatus for compression molding sealing liners in premade closure shells includes a shell loader for presenting premade closure shells in sequence, a mold charge placement device for placing charges of liner material into the premade shells, and a vertical wheel molding machine for receiving the closure shells in sequence from the loader and compression molding the mold charges to form sealing liners within the closure shells. The vertical wheel molding machine preferably includes a wheel mounted for rotation around a horizontal axis and a plurality of angularly spaced molds disposed around the wheel. Each of the molds preferably includes a first mold segment and a second mold segment disposed radially outwardly of the first mold segment. One of the first and second mold segments, preferably the second mold segment, includes a nest for receiving a premade closure shell.

Abstract: A machine for compression molding plastic articles includes a turret constructed for rotation around a vertical axis. A first array of compression molds and a second array of compression molds are mounted on the turret for movement through respective first and second mold paths as the turret rotates around the vertical turret axis. A first mold charge placement mechanism is disposed adjacent to the first path for placing mold charges into molds of the first array in sequence as the turret rotates. A second mold charge placement mechanism is disposed adjacent to the second path for placing mold charges into molds of the second array in sequence as the turret rotates and independently of the first mechanism. The first and second mold paths may be spaced from each other radially of the turret axis and/or longitudinally of the turret axis.

Abstract: An object of the present invention is to provide a die and a method for manufacturing a core, wherein the core includes a ring-shaped supporting member 16 that is formed by a plate-like member, that is disposed inside a pneumatic tire, and that supports a pneumatic tire by allowing an inner side of a tread portion of the pneumatic tire to be brought into contact with an outer peripheral surface of the supporting member at the time of a deformation of the pneumatic tire due to a decrease of an internal pressure of the tire, and ring-shaped rubber portions that are joined respectively to both widthwise direction edge portions of the supporting member.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: Disclosed are: (i) a platen of a molding-system having anti-tilt structure, (ii) a molding system having a platen including an anti-tilt structure, (iii) a component of a platen of a molding system having a frame, the component including an anti-tilt structure, (iv) a clamp of a molding system, the clamp having platens each including an anti-tilt structure, (v) a molded article manufactured by usage of a platen of a molding system having an anti-tilt structure, (vi) a molded article manufactured by usage of a molding system having a platen including an anti-tilt structure, (vii) a molded article manufactured by usage of a component of a platen of a molding system having a frame, the component including an anti-tilt structure, and (viii) a molded article manufactured by usage of a clamp of a molding system, the clamp having platens each including an anti-tilt structure.

Abstract: A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die, lower-die pins arranged in the lower die to be movable up and down and springs arranged in the die to urge the pins upwardly. In molding, a hollow primary molded piece is accommodated in a cavity defined by the upper die and the lower die. Then, the piece is mounted on the pins with retained apart from a concave bottom surface of the lower die. Before closing the molding die, it is started to inject molten resin into the cavity. As a result, the molten resin enters a space between the primary molded piece and the concave bottom surface of the lower die. Even after completing to close the molding die, the injection of the molten resin is continued.

Abstract: A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.

Abstract: An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void and a second, separate mould void; and injecting material into the first and second mould voids.

Abstract: A tablet press (1) of the type with a rotary turret (3) for the production of tablets comprises a hopper (2) containing the pharmaceutical product in powder or granular form to be compressed; a rotary disc (4) equipped with matrices (5) designed to contain defined quantities of the pharmaceutical product fed to them by the hopper (2); reciprocating punches (8, 9) for compressing the powdered product and constituting a plurality of compressing operating stations (10); at least one set (A) f operating stations (10a) having a modified structure to inhibit operation, each modified structure station (10a) comprising barrier means (11) designed to be fitted at the matrices (5) in such a way as to prevent the passage of the product from the hopper (2) to the matrices (5), and opposing elastic means (12) designed to be coupled to, and act in conjunction with, the reciprocating punches (8, 9) and with the barrier means (11) in order to simulate the presence of powdered product.

Abstract: An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen mutually removably connected and configured and arranged to substantially secure an electronic component assembly in position therebetween. At least one of the platens is configured such that a portion of electronic components of a carrier substrate secured by the double platen assembly is viewable for exposure to an energy beam such as a laser beam used to cure a liquid into an associated dielectric stereolithographic packaging structure. Another embodiment includes the use of an adhesive-coated film for holding, locating and securing a plurality of individual electronic components for processing. A method of forming solder balls is also disclosed.

Abstract: A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with the top runner and the top runner extends into a space between the mold cavities. The mold cavities for accommodating the semiconductor devices are connected to the top runner. The bottom mold has a bottom runner and at least a second dummy runner. The second dummy runner connects with the bottom runner. The second dummy runner is above but separated from the first dummy runner by the package substrate.

Abstract: A method and apparatus for producing a fastener product having a multiplicity of fastener elements extending from a sheet-form material. Molten resin is extruded through an extrusion nozzle and gas is introduced into the resin within the extruder to provide an interrupted flow of resin from the nozzle to deposit discrete regions of molten resin onto the sheet-form material. The discrete regions of molten resin are spread apart along a longitudinal direction of the sheet-form material. The molten resin is permanently bonded to the sheet-form material, and a multiplicity of fastener elements are molded from each discrete region of resin.

Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.

Abstract: A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture maybe constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.

Abstract: An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled by a liquid dispenser in contact with the bottom of the cavity and a running channel at the bottom of the cavity to receive the liquid dispenser for even dispersion of epoxy in the cavity from the bottom of the cavity upward to the top of the cavity.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: Apparatus for manufacturing a multicolor slide fastener includes an upper die 110, a lower die 120, and a plurality of unit fastening teeth-forming slots 101 formed in a lengthwise direction. Molding material-injecting passages and a plurality of sprue holes 102 are provided for injecting the molding materials S into the slots 101. Inclined passages 201 and 202 are connected to the molding material injecting passages respectively, for carrying the molding materials S from a raw material source. Heaters 240 and heat sensors 241 heat the passages 201 and 202. Pressing means 300 press the molding materials S into the inclined passages 201 and 202. Valves 400 control injection of the molding materials S into the sprue holes 102 of the upper die 110.

Abstract: In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.

Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.

Abstract: A mold apparatus for making multi-component products includes (i) a rotatable turret with a plurality of product connector pairs attached to opposite sides of the turret, (ii) a first mold disposed proximate to the turret and (iii) a second mold disposed on the opposite side of the turret. The first mold has a plurality of cavities for molding a first molded layer of the multi-component product, and the second mold has a plurality of cavities for molding a second layer onto the first molded layer. Each product connector is rotatable about its longitudinal axis to allow the mold apparatus to make multi-component products having first molded layers and second molded layers with indentations and/or protuberances disposed in a variety of orientations.

Abstract: A mold assembly (100) formed of a pair of molds (102, 104) and a pair of release plates (118, 120). The molds (102, 104) have holes (126) which extend from outer surfaces into the mold cavities (106). The release plates (118, 120) have pins (122, 124) which pass into the holes (126, 128). When molding is finished, the molds (102, 104) are moved toward the release plates (118, 120). The pins (122, 124) contact the molded article(s) (134) and hold them in position as the molds (102, 104) are withdrawn.

Abstract: A method for treating workpieces (307, 801, 802, 803) to be injection moulded in a production process comprises a step for forming a workpiece (307, 801, 802, 803) by injection moulding so that during the injection moulding, the workpiece is fastened to a given elongated transport arrangement (301, 302, 304, 305, 306). The workpiece (307, 801, 802, 803) is moved forwards in the production process by means of the elongated transport arrangement (301, 302). Subsequently the fastening (311) of the workpiece (307, 801, 802, 803) is partly detached from the elongated transport arrangement (305, 306) and the workpiece (307, 801, 802, 803) is fastened, supported by the fastening remaining between itself and the transport arrangement, into a position where it is substantially outside a plane (800) defined by the transport arrangement.

Abstract: A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

Abstract: A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).

Abstract: The present invention provides a method of making a golf ball with an interior layer having a plurality of outwardly extending protrusions. A plurality of protrusion depressions are machined or otherwise formed on an inner surface of a mold. A center assembly is molded within the mold cavity. The center assembly may be a core comprising a plurality of protrusions on its outer surface or an intermediate layer comprising a plurality of protrusions disposed about a spherical core. A single or multi-layered cover is disposed about the center assembly having the plurality of protrusions.

Abstract: A mold apparatus for making multi-component products includes (i) a rotatable turret with a plurality of product connector pairs attached to opposite sides of the turret, (ii) a first mold disposed proximate to the turret and (iii) a second mold disposed on the opposite side of the turret. The first mold has a plurality of cavities for molding a first molded layer of the multi-component product, and the second mold has a plurality of cavities for molding a second layer onto the first molded layer. Each product connector is rotatable about its longitudinal axis to allow the mold apparatus to make multi-component products having first molded layers and second molded layers with indentations and/or protuberances disposed in a variety of orientations.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: A method of flowing resin from an inlet opening into a sealed mold and a lay up which is comprised of at least one top layer of absorbent or reinforcing material which defines a passage or hole from the inlet opening to a non-absorbent layer which non-absorbent layer lies above at least one bottom layer of reinforcing material. This process flows the resin from the inlet opening into the mold then through the passage defined by the top reinforcing layer through the non-absorbent layer and then through channels defined by the non-absorbent layer throughout the lay up.

Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.

Abstract: A system for molding a jointed linkage support system with joints that allow movement and bending in many directions and degrees of freedom. A chain-like linkage system made up of a series of joints is molded in a single step from materials having different melting temperatures in a series of alternating communicating mold cavities. The jointed linkage support system emerges from the mold fully assembled. An electrical switch may be provided within one of the joints between sleeves and rods whereby movement of the rod relative to the sleeve actuates the switch.

Abstract: The present invention comprises apparatus for the manufacture improved structural panel with synthetic ingredients, such as vermiculite and fibers. The improved structural panel achieves enhanced lateral and surface integrity by the use of fibers within the core of the structural panel and adhesives and smooth materials (such as foil) as a surface coating. The apparatus is particularly suited for manufacture of the structural panel at low cost and high efficiency.

Abstract: A process for forming a molded plastic layer on a metal plate includes the steps of forming a plurality of posts that extend through and that are bonded to the metal plate in a first mold, placing the metal plate with the posts in a mold cavity of a second mold such that the posts abut against inner wall of the second mold and such that the metal plate partitions the second mold cavity into upper and lower mold sub-cavities, and introducing a resin into the upper and lower mold sub-cavities to form the molded plastic layer which encloses the metal plate.

Abstract: In a method of reinforcing an existing concrete electric pole having an annular side wall, an inner hollow portion provided therein and an opening portion formed to a position of the annular side wall to be penetrated therethrough, at least one of a predetermined amount of mortar, a predetermined amount of sand and a predetermined amount of gravel is injected into the inner hollow portion of the electric pole through the opening portion. A reinforcing member for reinforcing the electric pole is injected into the inner hollow portion of the electric pole through the opening portion.

Abstract: A mold assembly (100) formed of a pair of molds (102, 104) and a pair of release plates (118, 120). The molds (102, 104) have holes (126) which extend from outer surfaces into the mold cavities (106). The release plates (118, 120) have pins (122, 124) which pass into the holes (126, 128). When molding is finished, the molds (102, 104) are moved toward the release plates (118, 120). The pins (122, 124) contact the molded article(s) (134) and hold them in position as the molds (102, 104) are withdrawn.

Abstract: A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

Abstract: A process and an apparatus for making a papermaking belt are provided, the belt comprising a reinforcing structure and a resinous framework joined together. The preferred continuous process comprises the steps of depositing a flowable resinous material onto a patterned molding surface; continuously moving the molding surface and the reinforcing structure at a transport velocity such that at least a portion of the reinforcing structure is in a face-to-face relationship with a portion of the molding surface; applying a fluid pressure differential to transfer the flowable resinous material from the molding surface onto the reinforcing structure and causing the flowable resinous material and the reinforcing structure to join together; and solidifying the resinous material thereby forming the resinous framework joined to the reinforcing structure.

Abstract: The invention relates to a method for producing a two-chamber tube with a dividing wall (9) that extends into the tube head.

Abstract: An injection molding apparatus for manufacturing dental floss holders has at least one strand of dental floss from a supply spool extended through the space between mating mold pieces and thereafter to a take-up device. From each injection stage of the molding cycle a rack of connected dental floss holders is produced. Tension of the floss is maintained from the upstream supply spool by a first tensioning device through the mold to the downstream end by the take-up device. During each injection cycle the take-up device engages another rack of molded parts and moves it to a downstream position where it is severed from the strand of floss while it maintains the tension in the floss upstream of the severed rack. This is achieved by the take-up device engaging at least two successive racks downstream of the mold and using the rack closest to the mold to maintain tension.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold.

Abstract: Contacts connected to wires are set in a lower mold and an upper mold is then fitted on the lower mold. The upper and lower molds include contact restraining portions and wire restraining portions, and upper mold holding members and lower mold holding members extending into the cavity at opposite positions enabling these holding members to restrain the wires. The upper and lower molds further include elastic members arranged to urge the upper and lower mold holding members into the cavity of the upper and lower molds for restraining the wire before an insulating plastic material is poured into the cavity. Either of the upper and lower mold is provided with a contact positioning portion adapted to abut against distal ends of the contacts for positioning the contacts relative to the molds.

Abstract: A method and apparatus for continuously forming flexible mat structure in the form of spaced, interconnected concrete panels. The mat structure can serve as an erosion control mat along the banks of waterways and within drainage ditches and channels, and can also be utilized to provide temporary or permanent walkways and roadways. A rotatable drum includes peripherally-positioned mold cavities that receive concrete mix from a trough supplied from a source of concrete mix. A grid is fed against the drum periphery and over the mold cavities before the concrete mix is introduced, and after the mix is introduced a web of fibrous material is brought into contact with the concrete-mix-containing mold cavities to overlie the concrete-containing surface of the drum. As the drum rotates the fibrous material with overlying, interconnected concrete panels is deposited on the ground to provide the finished mat structure.

Abstract: An apparatus for manufacturing a multi-color slide fastener is disclosed, in which a plurality of unit meshing teeth are coupled to a pair of supporting tapes so as to be slide-coupled or separated. The plurality of the unit meshing teeth are made to have diversified colors, and the patterns of the unit meshing teeth are continuously harmonized with the patterns of the base fabric of a garment. A plurality of groups of the meshing teeth are formed with different colors by one shot, so that the meshing teeth could form various patterns. Therefore, the pitches and gaps between the unit meshing teeth are uniform. Accordingly, not only the multi-color slide fasteners can be mass-produced, but also their quality and reliability can be upgraded. Further, various patterns and colors can be formed on the slide fastener.

Abstract: A method and apparatus for inserting elements to be adhered to a plastic article being blow molded includes an insertion device having an insert arm for carrying a carpet intended to be affixed to one mold section and a second inserter for inserting nuts intended to be supported in the opposing mold section for molding on the opposite side of the article. The carpet inserted utilizes an arm having a pair of pins which extend through elongated slots formed in the carpet. The mold is provided with pins to receive the carpet from the inserter pin after the carpet is stripped from the inserter pins. The nut inserter utilizes a nest having a small magnet. The mold section is provided with pins and a stronger magnet behind such pins. Upon movement of the nest with the nuts thereon to the mold section, the arm is properly aligned and moved to position the nuts over a pin extending from the molding surface of the mold section.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: The invention seeks to provide an improved method for producing umbrella-type insulators comprising a core which is configured as a full body or a hollow cavity and umbrellas connected thereto, whereby problem-free de-moulding of said umbrella-type elements is guaranteed despite the fact that a vacuum is formed. This is achieved by fact that the mould (5) is used with at least one valve (8) which is arranged laterally and which extends as far as the surface (4.2) of the umbrella elements or sleeve (4). Immediately after the beginning or during axial movement of the mould (5) away from the umbrella-type element (3) with a sleeve (4), a gas medium is automatically introduced into the cavity (9) which is formed between the core (2) and umbrella-type element (3) with a sleeve (4) and the mould (5) or the valve (S) opens under the effect of traction or pressure and the gaseous medium is thus introduced into the hollow cavity (9).

Abstract: For molding a synthetic resin-made hollow member with an intermediate element incorporated therein, the invention provides method and apparatus improved in assemblability, assembly precision and productivity. The molding apparatus for slide type injection molding includes: a stationary molding die having first and second hollow-member use stationary die portions and a stationary-side intermediate-element use die portion; a movable molding die having first and second hollow-member use slidable die portions and a movable-side intermediate-element use die portion; and intermediate-element moving mechanism for moving an intermediate element Wf longitudinally, wherein the stationary and movable molding dies are openable and closable to each other and the first and second hollow-member use slidable die portions are slidable longitudinally relative to the first and second hollow-member use stationary die portions, respectively, while the movable-side intermediate-element use die portion is non-slidable.

Abstract: The method includes the steps of a tape arranging step for arranging a support tape of a slide fastener on a mold having a capacity having a plurality of unit fastening element molding material grooves for molding a plurality of unit fastening elements, a molding material heating and discharge step for separating a molding material of more than two colors from a source material supply unit by the colors by a molding material injection means and then heating and discharging the same, a moving step for grouping external molding material flow paths from the molding material supply unit to an injection port of the mold into more than two groups and then moving different colors molding material by the colors, and an injection step for injecting the molding material into the unit fastening element molding material groove through a plurality of inject-on ports formed in the mold.