Abstract: In an apparatus for producing flat plastic moldings, for example identity cards, the mold includes a conic core and a die-block member shaped in accordance with the core member. The opposing side surfaces of the core and die-block members, which are inclined to the opening direction of the mold, enclose a mold space on part of their surface. The core and die-block members are formed in such a way that the mold parts brace each other in the closed state.

Abstract: A method and apparatus for forming runners (47, 56) in a mold assembly (10, 50). The mold assembly (10, 50) has a cavity plate (11, 51) and a sealing plate (12, 52). The sealing plate (12, 52) has a sealing plate cavity (18) in which a resilient material (14) is placed. A floating seal (13) is movably mounted to the sealing plate (12) such that the floating seal (13) is on the resilient material (14). A workpiece (19) is placed on the resilient material (14) and the cavity plate (11, 51) is mated with the floating seal (13) thereby forming the runners (47, 56). The resilient material (14) imparts a force on the floating seal (13) and pushes the floating seal (13) against the cavity plate (11, 51) to prevent leakage of encapsulating material from the runners (47, 56).

Abstract: A mold for resin-packaging electronic components on a pair of leadframes includes an upper mold member and a lower mold member. The mold has two parallel rows of molding cavities, and a row of resin supplying portions arranged between the respective cavity rows. The respective molding cavities have corresponding corner portions formed with injection ports which communicate with the respective resin supplying portions through runners. The respective cavity rows together with the leadframes received in the mold are displaced relative to each other longitudinally thereof by a predetermined amount.

Abstract: An apparatus for molding electronic components. The single-strip molding apparatus has a mold die formed from two mold halves which are movable relative to each other and can be closed upon one another. A leadframe for the component to be molded is placed into a recess in one of the mold halves. Molding material is heated and forced under pressure into the recess containing the leadframe. After the component is molded the mold is opened and the upper half of the mold is cleaned by a combined cleaning-discharge unit. Upon the return stroke of the cleaning-discharge unit, the molded component is removed and the lower half of the mold is cleaned.

Abstract: According to this invention, there is disclosed a resin-seal apparatus for a semiconductor element, including cavity blocks arranged to be opposite to each other and having a semiconductor element to be molded, ejector plates arranged to correspond to the cavity blocks, respectively, ejector pins and support pins arranged between the ejector plates and the cavity blocks, a pair of first annular heat-plate molding die sets arranged to surround the ejector plates arranged to correspond to the cavity blocks, a second heat-plate molding die set arranged below a corresponding one of the ejector plates, a plate holder below the second heat-plate molding die set, a gap portion and an elastic member formed between the plate holder and the second heat-plate molding die set, vertically movable connecting rods arranged through the gap portion and each having one end connected to a side surface of the corresponding one of the ejector plates, a stepped bolt engaged with the other end of each of the connecting rods, and pu

Abstract: Apparatus for molding a strip of blind rivets, with each of the rivets having a pin within a sleeve and with the pin having a pulling head and shank, including a strip advance rod mounted in the apparatus for movement between first and second positions, a set of pin mold cavities and a set of sleeve mold cavities, a first runner for feeding the pin mold cavities and including a band around the rod, a second runner overlying the first runner for feeding the sleeve mold cavities, opposing mold members defining the sets of cavities and a sprue for feeding molding material to the runners, with the rod and strip moving together when the mold members are out of engagement for advancing the molded parts, and with the rod moving through the strip when the mold members are in engagement for returning the rod to the first position.

Abstract: A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.

Abstract: In casings for switch cross ties, the bottom plate 3 serves at the same time as a pattern for the position of the construction components. As a rule, a new casing is prepared for each series of cross-ties type. In small series with various positions of the construction components it is economical to use the bottom plate repeatedly. This is done by providing the bottom plate, prior to its insertion in the casing, with holes (A,B,C) for several types of finished parts, by provisionally closing the unnecessary holes by suitable means and by finding the combination of holes required for the production of a certain type of finished part through a certain searching procedure and freeing them of their provisional closing means.

Abstract: A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof.

Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.

Abstract: Method and apparatus are disclosed for injection molding an article having at least one sub-surface portion. The apparatus includes an article mold having at least one cavity with a wedge-receiving aperture and a wedge insertable within the wedge-receiving aperture for receiving the sub-surface portion of the article. The wedge is movable between a wedged position, wherein the wedge is firmly seated within the wedge-receiving aperture and an unwedged position, wherein the wedge is movable with respect to the article mold to free the sub-surface portion of the article when ejecting the article from the cavity. The sub-surface portion of the article can include a part to be held within the cavity during injection molding, or an injection molded portion of the article forming a normally die locked portion of the article. The apparatus can also include a multi-piece mold cavity removably engageable within aligned apertures of a separable mold base.

Abstract: A multiple transfer molding die for molding a plurality of semiconductor devices includes a plurality of resin paths between a pot and a plurality of cavities. Each resin path includes a first runner portion whose cross sectional area is determined according to the length between the center of the pot and the end of the first runner portion.

Abstract: Transfer molding equipment, used to encapsulate semiconductor die, is provided with clamps mounted to the mold base to position and align mold chases. Previous designs position and align the top and bottom mold chases using dowels on the mold base received in holes in the chases. The invention reduces the downtime of the mold equipment, and decreases the time required to replace the chases when a different package is to be produced.

Abstract: A resilient sheet of material is used between a cavity plate and a mold base in a sytem used to encapsulate items such as semiconductor devices. The resilient sheet of material compensates for any dimensional variations in the cavity plates. In addition, compensation is also made for dimensional variations of the item being encapsulated. In one embodiment, the sheet of resilient material is used to seal cavity openings in the cavity plate. A method for the use of such an arrangement is also provided.

Abstract: A process and apparatus for the production of bristle articles include introducing the plastic bristles in the form of individual bristles or bristle strands through channels and sleeves extending the latter in to a mould for the bristle carrier, followed by thermal melting on their end located on the mould for formation of a thickened portion and the thickened portion on the bristle ends formed during melting is then sealingly engaged on the opening of the sleeve projecting into the mould. During the filling of the mould, the bristles and sleeve are kept in position within the same and the sleeve and the thickened portion on the bristle end tightly engaging against the opening of the sleeve are enveloped by the bristle carrier material during mould filling and then the sleeve is removed from the bristle carrier.

Abstract: A mold for making articles that are interconnected by a lanyard, such as inflator parts. A mold base has a channel formed in it, and a first block is slidably mounted in that channel. A groove formed in the block defines the contour of a first article produced by the mold when plastic is injected into the groove and a mating groove formed in a mold cover that overlies the base. A stationary second block, also disposed in the channel, has a cavity formed in it that defines the contour of a second article. Opposite ends of the lanyard are positioned in the respective areas bounded by the grooves and cavity so that the opposite ends of the lanyard are embedded in the articles produced by the mold. The length of the interconnecting lanyard is adjusted by adjusting the position of the moveable block within the channel. The movable block may also be stationery.

Abstract: The invention describes an apparatus for the integral injection molding of a synthetic plastic top on a paper tube with an overall injection molding unit with a nozzle, a driven extruder worm (4), plasticising cylinder and a synthetic plastics injection unit, the nozzle being connected to the plasticising cylinder and being enclosed at least partially and externally by two movable outer mold parts, the inner mold part consisting of a movable mandrel.

Abstract: An apparatus for producing semiconductor devices includes a resin molding section for resin-molding semiconductor chips, a loading section for supplying a lead frame, to which the semiconductor chips are bonded, to the resin molding section, a tablet supplying device which supplies a resin tablet to the resin molding section, an unloading section which takes out the resin-molded semiconductor chips with the lead frame from the resin molding section, and a dust cover which covers the resin molding section, the tablet supplying device and the unloading section.

Abstract: Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices.Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

Abstract: A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.

Abstract: A blade of an exposure control such as an iris control device or a shutter control device is provided for use in cameras. A sheet of a resin or metallic material configured as desired into the final blade form is placed in an injection molding machine which has a pin-forming cavity on one side of the sheet. The sheet is broken and penetrated at its portions where pins are to be formed and fixed, such that portions of the material of the sheet are deformed to project into the cavity. A molten resin is injected through a sprue formed on the opposite side of the sheet to the cavity so that the injected resin fills the cavity to form a pin in such a manner that the deformed and projected portion of the material of the sheet is embedded in the pin-forming resin. Another pin is formed on the other side of the sheet simultaneously with the first-mentioned pin in the same manner in the same die apparatus.

Abstract: An apparatus for making multi-sectioned and multi-colored products having a predetermined geometric or other shape from different slurry mixtures requires a carrier with a predetermined sized and shaped peripheral wall optionally used with a flat or a contoured support surface, the carrier has; a latticed grid formed by intersecting and interconnected members which define random openings, and at least one or more dividing blade slots so connected in the carrier that the latticed grid is divided into spaced slurry receiving sections, and dividing blades adapted to be removably positioned and repositioned in said dividing blade slots provide means for alternatively and selectively isolating the respective spaced slurry receiving sections so that different slurry mixtures can be poured into each of the isolated spaced slurry receiving sections to harden therein about the carrier to form a furnished integral product.

Abstract: A strip for carrying a plurality of small size electronic parts such as LEDs enclosed hermetically in resin and a method of manufacturing the same. A grid-like conductor strip member is formed by interconnecting lead wires for the electronic parts in a grid-like pattern. The conductor strip member is partially embedded within resin to form a strip segment in which the plurality of electronic parts are mutually connected by runner member. The strip segment has a connecting portion formed integrally at least at one end thereof. By connecting together continuously a number of the strip segments by means of the connecting portions through repetitive cycles of molding operation, the electronic part carrying strip of any desired length up to a semi-endless length can be manufactured.

Abstract: An apparatus and a method of making brake pads (60) having the step of heat preforming a plurality of dosages (39) of a friction material for brake pads (60) to obtain a plurality of blanks (61) on which respective metal holders (53) are then placed, and the step of hot molding, individually and simultaneously, such blanks (61) to form a plurality of brake pads (60).

Abstract: A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.

Abstract: A transfer molding method and apparatus in which the internal pressure of a thermosetting resin in a mold is directly detected and is controlled constantly during the transfer molding.

Abstract: An apparatus for setting up a concrete form for the subsequent forming of a concrete member therein. The apparatus for setting up the concrete form includes a deck brush for cleaning the deck portions of an elongated concrete form, stem brushes for cleaning the stem portions of the concrete form, nozzles for spraying pressurized lubrication fluid onto the form, strand pulling and placing devices for placing reinforcing strands in the stem portions of the concrete form, rams for depressing the strands down into the stem portions after tensioning thereof, and a deck reinforcing material dispensing system which simultaneously straightens and dispenses deck wire onto the deck portion of the concrete form.

Abstract: An apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

Abstract: Extrudable pharmaceutical mixtures are tableted by a continuous method in which the mixture is extruded and the still deformable extrudate is pressed between two rollers which are driven in opposite directions and possess depressions opposite one another in the roller shell, the form of these depressions determining the tablet shape.

Abstract: An apparatus for sealing around an insert in a molded part to avoid the escape of flash including a mold cavity cooperatively defined by at least two mold blocks, at least one of the mold blocks having at least one insert opening communicating with the cavity. A plunger chamber is substantially co-axial to the insert opening and communicates with the cavity via the insert opening, the plunger chamber having generally greater radial dimensions than the insert opening, thereby defining a generally inwardly-directed flange with respect to the walls of the plunger chamber. The surface of the flange remote from the cavity constitutes a seating surface within the insert opening. A resilient seal is fitted within the plunger chamber against the seating surface in proximity to the insert. A plunger is positioned within the plunger chamber for relative movement generally towards and away from the cavity to compress the resilient seal against the seating surface.

Abstract: A die mold for the production of a fitting to be surrounded by a single-piece ring includes mold components separable along a plane extending parallel to the longitudinal axis of a fitting to be produced, the mold components having therein a recess into which is inserted the ring. A closure member closes the recess during molding and forms a wall of the die mold. The closure member is divided peripherally into plural portions each of which is of unitary and single-piece construction in a direction parallel to the longitudinal axis and which extends in such direction beyond at least one axial end of the recess.

Abstract: An apparatus for connecting a tear-off section of a sealing cap with a pulling member including positioning means for orienting the sealing cap relative to the mould parts with the attachment part enclosed within the mould cavity and a chamber to receive a quantity of plastic material and communicating with the mould cavity via passages so that when the mould parts close the plastic will flow from the chamber into the mould cavity and envelop the attachment part.

Abstract: This invention relates to a device for positioning a film of determined format, serving as at least a partial coating of the lateral surface of an object, between two pieces of a machine, at least one of said pieces being mobile with respect to the other in a first direction, the machine having a technique for taking the film from a magazine. According to the invention, the film-taking technique uses a member whose outside shape corresponds to the lateral surface of the object to be coated. It also includes a technique for applying the film onto the lateral surface. Further there is provided a technique for conveying the film-taking means, with the film applied on said member, between a position of taking the film from the magazine and a work position between the pieces of the machine.

Abstract: The present invention relates to a machine for molding objects, having male and female mold parts of which at least one is mobile with respect to the other. According to the invention there is included a device for conveying film and a device for conveying a molded object capable of moving in synchronism so that, when the film conveying device is in position of depositing the film between the mold parts, the object conveying device is in position of removal of the object from between the mold parts, and, when the film conveying device is in position of taking of a film for use in a further cycle, the molded object conveying device is in position of evacuation of the object from the mold.

Abstract: Mold and method for molding a plastic headrest core member which has an insert partially embedded therein. The mold comprises two halves one of which is integrally formed at its shaped inner surface with a projection which is constructed and arranged to contact an end of the insert to suppress undesirable inward movement of the same during cooling of the molded headrest core member in the closed mold.

Abstract: An injection mold is described for producing the housings of integrated circuits. The injection mold icludes a first mold half (30) in which are disposed a number of mold recesses (46) corresponding to the number of housings to be made simultaneously, having a depth corresponding to a portion of the height of the housings, and supply passages (48, 50, 52, 54, 56, 58) leading to the mold recesses (46). In a second mold half (32) which is adapted to be brought in the closure direction into engagement with the first mold half (30) a number of mold recesses (76) equal to the number in the first mold half (30) are disposed in corresponding arrangement, the depth thereof being equal to the remaining portion of the height of the housings to be made. The mold recesses (46) in one of the mold halves (32) are disposed groupwise in mold portions (64) which are held in the one mold half (32) displaceably in the closure and opening direction.

Abstract: Apparatus for encapsulating parts of elements into a plastic material to manufacture electronic components. The mould has one or more parallel rows of mould cavities, into which a plastic material is injected through one or more sprues. The elements are part of a strip of which the length is a multiplicity of the length of a row of cavities, which strip is step by step treated in said mould such that an uninterrupted strip of components is obtained.

Abstract: Apparatus for the manufacture of insulating building elements including at least one inner insulating panel and two outer spaced apart concrete slabs having well trimmed outer surfaces, and reinforcements to space apart the two slabs thus forming a continuous cavity. The apparatus rests on a working plane and includes a pair of opposed side boards and two vertically spaced rectangular frames supported by said side boards in superimposed parallel relationship. Connecting devices extend between the frames for positioning each one of the frames in adjustably spaced apart relationship at the level of each concrete slab, and define therebetween an opening through which reinforcements can be introduced or removed.

Abstract: A generally planar object 22 subject to dimensional variations is centrally held in a mold by a deformable suction ring 20, and inflatable seals 8, 9 are urged against its opposite peripheral surfaces to define a cavity 17 for the injection molding of a precisely dimensioned edge frame 23. The dimensions of the rigid mold halves 2, 3 and the elasticity of the ring and seals are such that a wide range of dimensional variations may be tolerated in the object, which may be a curved automobile glass panel, a printed circuit board, etc.

Abstract: Injection or transfer molding of plastic is performed in a manner that virtually eliminates flash. Deflection of the mold press is measured with the mold press in a clamping configuration. Then the support structure of the molds is arranged to apply an equal force to the mold face by configuring supporting pillars and bars such that they act as individual springs. Their spring constants and/or lengths are calculated to account for the actual deflection found in the mold press, thereby, producing a uniform pressure on the molds during clamping of the press.

Abstract: A runner structure composed of a runner and a sprue is discharged from an injection molding machine into a chopping apparatus having a first cutter mechanism and a second cutter mechanism. The runner structure is guided by a guide mechanism in the chopping apparatus toward the first and second cutter mechanisms. The sprue is cut off from the runner by the first cutter mechanism, and then the runner and the sprue are chopped by the second cutter mechanism. The first cutter mechanism has a lower cutter for stopping the runner structure by engagement with the sprue, and an upper cutter movable into coaction with the lower cutter for cutting off the sprue. The second cutter mechanism includes a feed roller for feeding the runner intermittently and a cutter reciprocably movable for chopping the runner on the feed roller. The chopped pieces are discharged through a hopper and delivered into the injection molding machine for recycling.

Abstract: Capsules in which histological tissue samples are prepared for embedding and in which the samples are embedded include a first and a second member, at least one of the members including a frame that defines an opening. The members have complementary surfaces for establishing peripheral contact between the members around the opening. A porous material is spread across the opening so that when the members are in peripheral contact with each other, a tissue-holding region is defined inward of the porous material. The porous material has a porosity that accesses processing liquids and liquified embedding material, such as molten paraffin, but prevents stray parts of the tissue from floating free of the region. Preferably, the second members also comprise a frame defining a second opening and porous material spread across the second opening.

Abstract: The invention comprises solid particulate filter bodies having so-called "sloppy" plugging configurations in which clusters of mutually adjoining cell ends are plugged at the two end faces of a honeycomb structure such that the clusters at each end face adjoin or partially overlap one another and at least some of the cells of the structure are closed at both end faces while the remaining cells of the structure are closed at only one end face. Preferably "sloppy" plugging is accomplished by providing a pair of masks each having a plurality of opening extending therethrough which are sufficiently large to expose clusters of mutually adjoining cell ends and are positioned so as to partially overlap one another when the two masks are aligned opposing one another on opposite end faces of a honeycomb structure. A flowable plugging material charged through the masks plugs the clusters of cell ends at each end face.

Abstract: The invention relates to a mould for encapsulating parts of elements into a plastic material to manufacture electric components. The mould comprises a number of steel blocks or rods with accurately finished surfaces for clamping them completely tight together in a holder, whereby recesses in said blocks or rods are forming the mould cavity or mould cavities and the sprues. A layer of high hardness, such as a nitride layer, is deposited by means of vapor deposition in vacuum at a high temperature onto at least those surfaces of said blocks or rods determining the mould cavity or mould cavities and the sprues. Furthermore the blocks or rods are concerning their dimensions and/or flexibility and/or structure and/or finishing of the surfaces turned away from the mould cavity embodied such that deformations in the position in which said blocks or rods are clamped into said holder, caused by the depositioning of said layer, are eliminated.

Abstract: An apparatus is described for moulding a plastics component onto a length of flexible web material, particularly a paper tube coated with thermoplastic synthetic material, the apparatus comprising a complete injection unit (5), a nozzle (26), an injecting head portion (12), external mould portions (11,11') and a core (14) which can be moved relative to these.

Abstract: In an apparatus for encapsulating objects in molded plastic packages, an improved removable cavity plate assembly comprises upper and lower cavity plates which fit together in an interlocking manner to define molding cavities having integral surfaces formed within a single cavity plate on all sides of the cavity but one. The fourth side of each cavity is defined by a surface formed by the interlocking juncture between the two cavity plates. Plastic packages molded in the cavities thus are formed without a seam or parting line along the sides formed on the integral molding surfaces, the seam or parting line being formed only on the surface defined by the juncture of the two cavity plates.

Abstract: Apparatus for enclosing semiconductors with resin by molding, including a stationary upper mold having a plurality of pots, and a movable lower mold opposed thereto.The upper and lower molds have cavities to which a resin material supplied to the pots is pressingly injected directly or only through gates.Disposed at the upper mold side is a resin material pressurizing mechanism having plungers fittable into the pots, and one or more cylinders and piston rods for actuating the plungers.

Abstract: An apparatus for manufacturing a continuous slide fastener stringer, including a plurality of longitudinally spaced rows of injection-molded coupling elements secured to a stringer tape along a longitudinal edge thereof with a plurality of element-free portions between the successive rows of the injection-molded coupling elements, includes a fixed feeler disposed on one of a pair of relatively movable mold members adjacent to a leading mold cavity therein for detecting a trailing end of the injection-molded coupling elements, and a movable feeler disposed on the one mold member downstream of the fixed feeler at a distance substantially equal to the length of the element-free portions of the stringer. The movable feeler is driven by a driving mechanism to selectively project or retract from a mold surface of the one mold member in interlocking relation with a feed mechanism which intermittently feeds the stringer tape by a predetermined distance.

Abstract: An apparatus for manufacturing a continuous slide fastener stringer including a row of injection-molded coupling elements secured to a stringer tape along a longitudinal edge thereof, includes a pair of fixed and movable mold members through which the stringer tape is fed by a tape advancing means, and a pair of upper and lower tape shifters mounted on the movable mold member for moving the stringer tape between a first position in which a part or portion of the stringer tape lies flatwise on a mold surface of the movable mold member and a second position in which the tape's part is spaced from the mold surface and held out of interference with a feeler projecting from the mold surface of the movable mold member. During the advancing movement of the movable mold member toward the fixed mold and in timed relation to the stringer-tape advancing means, the tape shifters are movable with respect to the movable mold member to place the tape's part in the first position.

Abstract: A lens for a light emitting diode is formed by inserting a pair of lead frames into a mold having grooves for snugly receiving the outer free ends of the lead frames. The outer-most edge of the lead frame free ends engage the base of the mold, thereby precisely locating the light emitting element, mounted on the lead frames, relative to the top surface of the lens. The snug fit for the outer free ends assures that the outer free ends are free of the resin to facilitate alignment of the finished product in an electro-optical circuit and to provide improved radiation of heat to the atmosphere.