Abstract: A cup-shaped closing material having a convex section is fitted on a protrusion-like engagement section of a distal end of a mandrel with a gap from the engagement section of the mandrel, a molten resin is then disposed in a cavity of a molding die and a holepin having an outer peripheral section of a distal end that is smaller than an outer periphery of the distal end surface of the convex section of the closing material is pressed against the distal end surface of the convex section of the closing material, whereby the distal end surface of the convex section of the closing material is pleated to form an annular protrusion section at the outer peripheral section, and the molten resin is caused to envelope the annular protrusion section, while being pushed and charged into the cavity, whereby the head part with the closing material attached thereto is formed.

Abstract: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: Rotary press machine including dies, pairs of upper and lower punches with a part of each lower punch being movable in a respective die to selectively enable formation of a cavity in the die, a feeding system for feeding powder material into the cavities, when present, in a feeding stage, a pressing system for pressing the upper and lower punches together in a pressing stage and a tablet ejection system for ejecting formed tablets from the dies in a tablet ejection stage. The upper and lower punches are rotated sequentially through the feeding stage, the pressing stage, and the tablet ejection stage to thereby enable formation of tablets if powder material is feed into the cavities in the dies. To enable selective formation of tablets and thereby optimize production thereof, an adjustment mechanism is provided and enables selective formation of the cavities in the dies.

Abstract: A method for producing a profiled bead made of a plastic, particularly of a polymer, on a piece, particularly on a window pane. In the method at least a partial portion of an edge region or lateral face region of a surface of the piece is brought into contact with a forming face. The plastic is deposited stuck to at least part of the periphery of a surface of the piece untouched by the forming face and the external dimensions of the profiled bead formed are also defined by the forming face. The forming face is pressed against the edge region or lateral face region of the fixed piece using a flat support, the shape of which can vary under the pressure of a fluid. This then gives a better matching of the forming face to the contour and to any dimensional discrepancies of the piece.

Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Abstract: The present invention is a system for molding a gasket to a membrane electrode assembly. The system comprises a cavity defined at least in part by closable mold blocks, at least one injection gate for injecting gasket material into the cavity, a mount for retaining the membrane electrode assembly adjacent to the cavity, and a mold insert independently movable relative to the closable mold blocks for applying pressure to the membrane electrode assembly retained on the mount.

Abstract: A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched between the upper die (12) and the lower die (14), wherein the plurality of middle dies (13a, 13b) are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies (13a, 13b) can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.

Abstract: An apparatus for in-mold-decoration includes a male mold, a female mold comprising a surface facing the male mold, a foil, a press member, and a supporting member. The surface of the female mold defines a cavity. The foil is applied to the surface of the female mold. The press member is positioned between the male mold and the female mold, and capable of hermetically pressing the foil on the surface of the female mold. The supporting member is movably mounted to the surface of the female mold to prop up the foil toward the male mold before the press member presses the foil on the surface of the female mold.

Abstract: A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semiconductor body and the leadframe, and then the leadframe and semiconductor body are encapsulated in a casting mold. Wherein provided in the part of the casting mold that faces the top of the semiconductor body are masking bodies, which extend from the top inner wall of the casting mold towards the optically active elements and cover the elements with their respective end face in a way that seals out casting material.

Abstract: Compression molding method for composites including the step of forming a dough under pressure, including an amalgam of non-woven fibers randomly mixed and associated, in a defined proportion, with a thermosetting or thermoplastic material. The preparation of the dough includes mixing the fibers and the thermosetting or thermoplastic material, in a vacuum, while the forming operation is carried out by introducing the dough into a mould shaped and dimensioned to withstand high pressures. There is a molding cavity in the form of a part to be produced and provided with at least one well configured so as to accommodate, tightly, a plunger piston, which, by sliding, can pressurize the dough in the cavity, and therefore form the latter in the mould.

Abstract: Described herein is a process and apparatus for the production of an article made of moulded plastic material with a first component and at least one second component overmoulded on the first component, in which, in the second injection step for overmoulding the second component, the moulding cavity is at least in part delimited by at least one resting surface that is independent of and mobile with respect to the mobile surface of mould and is set in contact with the first component.

Abstract: An apparatus for manufacturing a semiconductor device is provided. The semiconductor device includes a chip packaged with a resin mold. The apparatus includes a first mold, a second mold, and a buffer sheet. The first mold has a first cavity for forming the resin mold on a first side of the semiconductor device, and a convex part for forming an exposed area of the chip. The second mold has a second cavity for forming the resin mold on a second side of the semiconductor device. The buffer sheet is disposed between the convex part and the chip for covering the exposed area.

Abstract: In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals.

Abstract: A stamper having a patterned layer composed of a hard material and a compressible material back plane layer. The back plane layer may be composed of an elastomer. The stamper may be used to imprint an embossable layer disposed above a substrate for the production of a magnetic recording disk.

Abstract: A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which has a top surface which faces the cavity and which projects from the bottom surface of the lower half toward a substantial center point of the substrate mounting plate, wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.

Abstract: Division members (31, 32) separately molded to form a hollow component are brought into contact with each other and are arranged in dies (14, 24). The peripheral edge of the contact parts is formed with a peripheral edge path (330) to be filled with a molten resin. In the peripheral edge path (330), protrusions (316, 326) are projected from the division members (31, 32) continuously over the whole periphery of the peripheral edge path (330). The molten resin is filled in the peripheral edge path 330, and is welded with the protrusions (316, 326). As a result, a weld structure is obtained in which portions having a high welding strength are continuously formed over the whole periphery of the peripheral edge path (330).

Abstract: A two-shot injection molding assembly is provided where the tooling that creates the mold for the first material can be retracted and the tooling that creates the mold for the second material can be inserted. The first material tool blocks the mold area that is intended for the second material to be injected. After the first material is injected into the mold, the first material tool can be retracted and replaced with the second material tool. The second material tool creates a side for the mold that is used to form the second material injected into the mold, and a spring based wedge forms the other side of the mold. By having the first material tool retracted and replaced with the second material tool, the core plate does not have to be rotated.

Abstract: A method of indicating an open/close state of a check valve of an injection molding machine simply and more accurately. The method detects screw rotational force during injection and displays in wave form on the screen of a display device changes in detected rotational force. An open/close state of the check valve can be indicated based on the waveform pattern displayed on the display screen because the screw rotational force waveform pattern changes when the check valve closes. From the fact that the screw rotational force waveform pattern changes when the check valve closes, the open/close state of the check valve can be indicated from the displayed waveform.

Abstract: The problem of a conventional press molder is insufficient rigidity of an annular cushion ring receiving inward force, which cannot prevent a lower portion of the cushion ring from deforming, i.e., bending and expanding outward. A press molder (1) according to the present invention comprises a die (2), a punch (3) and a cushion ring (5). The cushion ring (5) has a rib (51) which is a reinforcing structure so as to be prevented from being bent at the time of press molding, and the punch (3) is formed therein with a recess (31) which is a reinforcing structure a escape part so as to prevent the punch 3 from interfering with the rib (51) of the cushion ring (5).

Abstract: A spike mold structure includes a first male mold base having a plurality of male molds and at least one firing pin, and a female mold base having a first fixing board, a second fixing board, a plurality of outer female molds and inner female mold. The second fixing board has at least one sliding rod, and the sliding rod has an actuating block. One surface of the first fixing board has a plurality of convex blocks. A plurality of concave slots are located at the surface of the sliding rod. The thimbles push the actuating block to make the sliding rod slidingly move so that the first fixing board and second fixing board are closely embedded or have a gap. Therefore, there is a displacement between the outer and the inner female mold. The spike mold structure is used to mold a bi-colored spike having increased strength.

Abstract: The present invention relates to a method and apparatus for fabricating a reinforced concrete cylinder, and more specifically to a method for centering a reinforcing frame within a form used during the placement of a concrete slurry. One embodiment of the present invention includes a plurality of centering arms that are adapted for selective engagement with the reinforcing frame, thus maintaining it in the predetermined radial location during the fabrication process.

Abstract: In at least certain embodiments, the present invention relates to a trim panel and an apparatus and method of making the same. In at least one embodiment, the trim panel comprises a first portion and a second portion with a transition portion extending therebetween with the first portion and the second portion having curved portions having radii of less than 5 mm.

Abstract: A resin sealing method includes the steps of providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction.

Abstract: Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. The molding equipment provides one or more selectively positionable knock-out pins along the surface of the molding chamber. These pins are specially tailored such that subsequent to molding, the resulting voids are traditional or deep dimples. The molding equipment and related processes are particularly useful when forming the various layers by reaction injection molding.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: Methods and assemblies related to a rotary automatic transfer rail for injection molding are disclosed. In one aspect, the invention includes a mold assembly. The mold assembly may include first, second, and third mold plates. The mold plates may be positioned generally parallel to one another. The mold assembly may include an automatic transfer rail assembly. The automatic transfer rail assembly may include a rail. The automatic transfer rail assembly may include a carrier. The carrier may have first and second members. The carrier may be translatable along the rail between a first closed position and an open position. The carrier may be rotatable about the rail. In some embodiments, molded articles need not be transferred from mold components to a robot and then back to different mold components.

Abstract: At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7, is sandwiched between the top mold member 10 and bottom mold member 20, a movable disc 12 is urged by a spring device 13, into close engagement with the bottom mold member 20. While the movable disc 12 is closely engaged with the bottom mold member 20, the stack 2 of the resolver is sandwiched between the bottom mold member 20 and the top mold member 10. This method prevents the generation of gaps between the stator stack 2 and mold 10, 20 due to unevenness of the thickness in the stator stack 2.

Abstract: An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void and a second, separate mould void; and injecting material into the first and second mould voids.

Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.

Abstract: A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.

Abstract: Systems, methods and apparatuses for manufacturing dosage forms, and to dosage forms made using such systems, methods and apparatuses are provided. Novel compression, injection molding, and thermal setting molding modules are disclosed. One or more of such modules may be linked, preferably via a transfer device, into an overall system for making dosage forms. The injection molding module having at least one mold shell with an interior surface capable of producing non-uniform coatings over compressed cores or molded inserts contained therein.

Abstract: A device including, and a method for producing, an electric insulator made of plastic, the insulator having a centrally arranged core made of glass fiber reinforced plastic, and having a plurality of insulation screens arranged coaxially around the core in an offset manner in an axial direction of the core. The method steps include: positioning a casting mold in an axial position around a vertically arranged core; producing a sealing connection between the core and the casting mold; injecting a liquid plastic material under pressure into an axial area of the casting mold; curing the liquid plastic material in the casting mold, thereby creating an insulation screen; deactivating the sealing connection; displacing the casting mold axially in a downward direction along a defined displacement path; and repeating the above steps until an insulator is produced having a desired number of insulation screens.

Abstract: An improvement to concrete casting machines of the casting bed type in which the side forms are constructed and arranged to stay in an upright position at all times but may be raised and lowered.

Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.

Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: A process and a production installation for producing shell-shaped, fiber-reinforced plastic parts are provided. The plastic parts can be produced efficiently, in an automated manner which is flexible with respect to the process and workpiece and is operationally reliable. A blank of the endless fiber mat corresponding to a workpiece is placed in an automated manner by industrial robots onto a clamping frame surrounding the female mold and is taken over by the clamping frame in a clamping manner and in such a way that it can slide after itself against a defined resistance. Wide-ranging accessibility required for this is created by a horizontally movable unit, comprising a female mold and a clamping frame, being temporarily moved completely out from the forming press and moved back again into the forming press after completion of loading.

Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.

Abstract: A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding contact portion by a second injection. The manufacturing device includes an ejecting mechanism which moves the second split assembly member in a die opening/closing direction, a rotating mechanism which rotates the third split assembly member around a shaft center in the die opening/closing direction, and a sliding mechanism which slides the second split assembly member and the third split assembly member in a direction perpendicular to the die opening/closing direction.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.

Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

Abstract: The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the pin through which trapped air and gasses can escape from the mold. The present invention may also be used to assist in ejecting an object from the mold. The pins can have circular or non-circular cross-sections and also may have dimple-forming projections to conform to a golf ball dimple pattern.

Abstract: A rotor 1 can prevent from cracking a magnet when molding the rotor and a molding die for the rotor can prevent from reducing yield of rotors. The rotor 1 formed into disk shape includes a rotor body 12 and an annular shape magnet 13. The rotor body 12 has inner and outer cover portions 18, 19 for covering respectively inner and outer surfaces 13a, 13b of the magnet 13, and first and second end cover portions 20, 21 for covering respectively one end face 13c and the other end face 13d of the magnet 13. The rotor 1 is formed by injection molding with the molding die, whose a cavity receives the magnet 13.

Abstract: The present invention provides a molding system as well as a method for encapsulating semiconductor packages, wherein a cavity plate is kept at a desired temperature during molding. The system includes a mold comprising a first mold piece and a second mold piece adapted to define a mold cavity for enclosing one or more semiconductor devices for molding, and a cavity plate adapted for mounting in the cavity to introduce encapsulation material to the semiconductor device(s). The system also includes retaining means adapted selectively to hold the cavity plate against the first mold piece or the second mold piece whereby to maintain the cavity plate at the desired temperature.

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.