Abstract: A transfer/injection molding apparatus is defined that includes a charge forming unit, a molding unit and a charge overflow unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity.

Abstract: An automated method for controlling the amount of charge introduced in a mold having a mold cavity and associated overflow assembly by adjusting the amount of charge introduced into the mold cavity in subsequent moldings using a measurement of the amount of excess charge material received by the overflow assembly. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity. The pin displacement is measured by a sensing transducer.

Abstract: A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower mol

Abstract: An improved mold system (20) is provided. The mold system (20) includes a mold (30) having at least one mold cavity (28). A pot (22) is connected to each of the mold cavities (28) through a runner system (24). A bellows container (50) containing a molding material (60) is disposed with the pot (22). A plunger (31) applies a compressive load to the molding material (60) contained with the bellows container (50) to force the molding material (60) through the runner system (24) into the mold cavities (28).

Abstract: Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises:one or more pressing devices for encapsulating the products at increased pressure and/or temperature;a first carriage device for transferring the products from supply means to the pressing device; anda second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means.

Abstract: In a method of injection molding elements, a first step is to charge a molding compound into an injection nozzle via a side hole defined in the nozzle under the control of a mini-plunger which is selectively reciprocally movable within a bore of the injection nozzle. In a second step, the mini-plunger is reciprocally moved in the bore of the nozzle for injecting substantially the entire molding compound in the bore of the injection nozzle into at least one cavity of a mold via a separate gate passage defined in the mold. Each gate passage is a narrow capillary aperture that connects the bore of the injection nozzle with a different one of the at least one cavity of the mold. In a third step, the nozzle and the mold are separated after the molding compound in the gate passage is cured but before the molding compound in the at least one cavity of the mold is cured. In a fourth step the molded element is removed from the at least one cavity of the mold once the molding compound therein is cured.

Abstract: In the resin molding machine of the present invention, molding dies, which are included in at least one of press units, can be exchanged, repaired or cleaned, or molding executed by respectively controlling the press unit can be executed by said molding dies without stopping the operation of the machine. Workpieces are conveyed from a work supplying section to the press units. And molded products are conveyed from the press units to a product accommodating section. A base unit includes the work supplying section, the product accommodating section and a loader and an unloader. The loader and the unloader convey the works and the products. The press units are detachably attached to said base unit.

Abstract: A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and a device for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: Methodology for reducing the warpage in thinly packaged electrical components, and electrical components packaged according to the method. The method taught herein is to make the gates themselves compliant, or flexible, thereby absorbing the stresses which would otherwise cause package deformation, including warpage. The present invention teaches two preferred embodiments for attaining this novel solution, including the adoption of wide, thin gates and the use of serpentine gates.

Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.

Abstract: This invention provides an improved apparatus and method for encapsulating the solder ball interconnections of an integrated circuit assembly which accommodates the use of high viscosity encapsulating materials and enables flush molding to be accomplished without substantially altering the exposed surface of the integrated circuit chip. In accordance with the preferred embodiment of this invention, an integrated circuit chip assembly including an integrated circuit chip mounted on a chip carrier or directly on a circuit board in a standoff relationship by solder ball connections is provided. A mold is placed over the integrated circuit chip. The mold of one embodiment has a compliant material disposed on the molding surface of the mold cavity. The mold also has at least one inlet hole for dispensing encapsulant into the mold, at least one opening for applying a vacuum to the mold and at least one vent.

Abstract: The injection of synthetic resin into the cavities of a plastic molding press is provided by a plurality of electrically driven plunger mechanisms each of which includes an elongated rotary screw connected to the output of an electric motor. The screw is threaded operatively to an elongated plunger which extends into the fixed mold and is arranged to support a pill or preform for injection into the runner leading to one or more mold cavities. The electric motor of each plunger mechanism is controlled by a computer program which is capable of varying the velocity and pressure delivery of material to the mold, as well as adjusting the temperature of the mold.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using liquid mold compound. A prepackaged liquid mold compound insert 11 is placed in a rectangular receptacle 43 in a bottom mold chase 31. The receptacle 43 is coupled to a plurality of die cavities 37 by runners 39. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 31 such that the integrated circuit dies are each centered over a bottom mold die cavity 35. A top mold chase 53 is placed over the bottom mold chase 31 and the mold compound package 11. The top mold chase 53 has die cavities 57 corresponding to those in the bottom mold chase 31. The prepackaged liquid mold compound is packaged in a plastic film which has heat sealed edges 15. The mold compound is forced through the heat seals 15 during the molding process by the pressure applied by a rectangular plunger 61.

Abstract: A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section has a second conduit for pushing molding compound into a mold cavity in at least one of the mold sections. The second conduit has a side opened to the first mold section when the first and section mold sections are closed on the circuit board. A piston extends through the first conduit to close the side of the second conduit.

Abstract: A mold set for encapsulating semiconductor chips on lead frame strips with a molding compound supplied in tablets, includes a pot where molding compound tablets are loaded and pressed to form a fluid molding compound (FMC), and a main runner connected to the pot, through which the FMC passes from the pot. A plurality of sub-runners are connected to the main runner and are oriented substantially radially from a center region of the main runner. Each sub-runner has a proximal end, where it joins the main runner, and a distal end. A plurality of cavities are disposed on both sides of the main runner. Each of the plurality of cavities is in flow to communication with the distal end of a respective one of the plurality of sub-runners. The present invention allows the FMC to be introduced into all cavities at nearly the same time and at nearly a constant velocity.

Abstract: A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Abstract: A manual loader for use in bypassing an automatic pellet feeder for an automold machine used to encapsulate integrated circuit assemblies in plastic. The loader has a support mounted adjacent the mold section of the machine. The loader also has at least one pellet boat which moves relative to the support into and out of said mold section. The pellet boat includes one or more pellet pots which are adapted to receive and hold a solid pellet of material. The loader has a release mechanism which is movable between a blocking position and a release position. The release mechanism retains the pellets in the pellet pots in the blocking position and releases the pellets from the pots when manipulated to the release position for dropping the pellets into a mold of the machine's mold section.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: An automated transfer/injection molding apparatus and process is defined that includes a charge forming unit, a shuttle unit, and a molding unit. The charge is formed from one or more slabs of reinforcing fibers and a resinous material. Once formed, the charge is preheated in the charge shuttle unit and is delivered to the molding unit, whereupon the preheated charges are forced by the pressure of a movable platform under vacuum into a mold cavity for polymerization. The fibers within the slabs are randomly oriented in parallel horizontal planes such that they are always parallel to the direction of initial flow into the cavity.

Abstract: A mold for encapsulating semiconductor device packages provides improved reliability by reducing air traps in the encapsulant. The mold has an upper mold die and a lower mold die which together form a cavity where the package is encapsulated by the molding compound. Air traps are reduced by equipping the lower mold die with projections formed along edges of the cavity extending in the direction of the molding compound flow. The mold allows a reduction of the formation air traps around or at the positions where the lead frame and chip are located so that the reliability of the resulting package is improved.

Abstract: The automatic molding machine of the present invention comprises: molding dies; a press mechanism to which the molding dies are attached, the press mechanism clamping and molding a work piece which is set in the molding die; a film feeding mechanism linking with molding action of the press mechanism, the film feeding mechanism feeding release film, which is formed into a long belt form, prescribed length so as to correspond a setting position of the work piece, which is set in the molding die; and a conveying mechanism linking with the molding action of the press mechanism, the conveying mechanism feeding the work piece and resin for molding into the molding die and taking out a molded product therefrom, wherein the work piece is molded by the molding dies whose molding sections are covered with the release film.

Abstract: An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

Abstract: A device for encapsulating a plurality of semiconductor die comprises a form having first and second halves such that as the first half contacts the second half the first and second halves have a plurality of cavities therein. The first and second halves each comprise a conduit therein for receiving a heated liquid. The device further comprises a runner block having a hole therein, a separate runner for each cavity, and a conduit therein for receiving a heated liquid. The runners have a rectangular cross section and a width to height ratio of at least 3:1. The device further comprises a mounting plate for mating with the runner block. The mounting plate comprises a concave recess and a hole in the mounting plate at the recess. The hole in the mounting plate passes through the mounting plate to align with the hole in the runner block such that an encapsulation material can be passed between the mounting plate and the runner block.

Abstract: An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.

Abstract: A molding die set includes an upper die having an upper cavity; and a lower die including a lower cavity to be arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity. The lower cavity is provided with a projection region which is projecting inwardly. The gate is arranged to be extending in the projection region.

Abstract: Real time distance and pressure data of a plunger (35) relative to a mold compound is provided by a compensation assembly (29) in a mold press (10). The compensation assembly has a sliding block assembly (30) which moves substantially in the same direction as the plungers (35). The sliding block assembly (30) has pressure control cylinders (33) which limit the pressure plungers (35) can apply. If the pressure on the plungers (35) should exceed this limit, the plungers (35) retract towards the sliding block assembly (30). A sensor (37) is coupled between the sliding block assembly (30) and the plungers (35) to measure the distance the plungers have moved towards the sliding block assembly (30). In one application, the sensor (37) is formed from a linear voltage displacement transducer (LVDT) so the mold press (10) can have real time pressure and distance data.

Abstract: A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.

Abstract: In an apparatus for molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. Using this apparatus, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the insert-member set in the dies. A film member is set between a parting face of the die and the insert-member. The film member covers a part of the insert-member corresponding to the resin path. An edge of the film member coincides with at least one of side edges of the cavity. The insert-member is clamped by the dies together with the film member when molding occurs.

Abstract: Method and apparatus for manufacturing void free products using vacuum transfer molding. The method comprises evacuating gas from a preheated resin mixture in an injection accumulator assembly before injection into a mold. The apparatus includes a fixed upper platen assembly supporting an injection accumulator assembly having appended thereto a gas exhausting means and a feed material holding canister on its upper surface and an upper match mold portion on its lower surface. The movable lower platen assembly supports a lower match mold portion on its upper surface and is supported by a plurality of hydraulic cylinders of a bottom plate assembly. The platen assemblies include a sandwich of a press plate, an insulating fiber board and an internally heated platen.

Abstract: An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: A mold tool (40) includes a lower platen (10) and an upper platen (18) which have modified surfaces (16) and (20), respectively. The modified surfaces are formed by implanting an implant species (14) at least into areas of the platens which will be in contact with a molding compound resin. By modifying the surface of the molding tool by ion implantation, the need for cleaning the mold tool is reduced due to lower surface friction and wettability of the modified surfaces. These surface characteristics also facilitate easier release of the molded package from the tool. At the same time, wear resistance of the mold tool is improved due to increased surface hardness.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section.

Abstract: It is generally known that the most common reason for replacing rotary electric machines is failure of field windings. Vibrations and primary overheating of field windings is the main reason for motor and generator repair. Consequently field windings have been fan cooled, externally ventilated, and totally enclosed. To solve this failure problem stators have been completely encapsulated, drip coated, and entirely coated. But all of these procedures are subject to certain disadvantages. The method and apparatus herein overcome such disadvantages. The apparatus includes structural members for embedding in a solid material field windings of stators of rotary electric machines in order to insulate and cool electric machines in which the stators are employed.

Abstract: An automated transfer/injection process is defined that includes a charge forming unit, a shuttle unit, and a molding unit. The charge is formed from one or more slabs of reinforcing fibers and a resinous material. Once formed, the charge is preheated in the charge shuttle unit and is delivered to the molding unit, whereupon the preheated charges are forced by the pressure of a movable platform under vacuum into a mold cavity for polymerization. The fibers within the slabs are randomly oriented in parallel horizontal planes such that they are always parallel to the direction of initial flow into the cavity.

Abstract: A fixture for fixing an annular upper air isolation member which is provided around an outer side of an upper mold section to an upper mounting plate is released, thereby rotating the air isolation member by a rotational member and fixing the same by a rotational position regulating member. An upper chase unit is exchanged through an upper opening which is defined by the upper mounting plate and the rotated air isolation member. A lower chase unit is also exchanged in a similar manner. Due to this structure, a sealing mechanism for a resin sealing/molding apparatus for electronic parts which can readily and quickly exchange a mold in response to small lot production of various types of products is provided.

Abstract: A mold device for resin-packaging semiconductor devices is provided which includes a first cavity block having a first molding cavity, a second cavity block having a second molding cavity in corresponding relation to the first molding cavity, and a gate for injecting a resin material into the first and second cavities through a runner. The gate is defined between an opposed pair of first and second gate pins at a corresponding corner portion of each molding cavity. The first gate pin is removably insertable into the first cavity block, whereas the second gate pin is removably insertable into the second cavity block. Further, the gate is directly open to both of the first and second molding cavities.

Abstract: A mold for molding a semiconductor package which is capable of guiding a resin material for encapsulating a semiconductor device uniformly into the cavity and prevents the island portion of the support member from being exposed from the molding main body, the mold comprising a pair of mold members for encapsulating a semiconductor device held on the support member, and a gate for guiding a molding resin material into the cavity, the gate being provided in the parting face of parting face of at least one of the mold members, wherein the gate is defined by a U-shape groove including the slanted bottom face inclined at an elevation angle toward the cavity to orient the flow of the resin material, supplied to the gate, toward the half of the cavity defined by the other mold member from the gate, and wherein in the slanted bottom face, there is provided an auxiliary groove for making the resin material, generally guided along the slanted bottom face, partially oriented to a direction different from the direction o

Abstract: An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with the nozzle. The shape of the gate passage permits a rapid curing of any residual molding material, and permits separation of the mold and the nozzle before the molding material in each cavity is cured. The nozzle is then used for a subsequent procedure or molding process while the molding material in the cavity cures. The nozzle defines a first bore and a second bore arranged longitudinally in sequence, and a side hole for introducing the molding material into the first bore. The nozzle includes a first plunger which is selectively reciprocally movable in the first bore, and a second plunger which is selectively reciprocally movable in the second bore and in a central bore defined in the first plunger.

Abstract: The invention relates to a system for dosed conveying and selecting of pellets for a moulding apparatus for lead frames, with which it is possible to prevent crumbled pellets or fragments and/or dust thereof being able to reach the molding apparatus arranged in a so-called clean room. For this purpose the system has structure for successively conveying pellets one by one, structure for selecting to length and feeding pellets to a transporting path, structure for reducing the transporting speed of conveyed pellets, structure for separating the pellets one by one and tranferring the pellets to a transport carrier, and means for transferring pellets from the transport carrier to a conveying device to a mold of a molding apparatus.

Abstract: An apparatus is provided for molding lead frames. The apparatus has a mold formed by two mold halves. An assembly for introducing a lead frame into one of the mold halves, an assembly for carrying encapsulating material into the cavities of the mold and an assembly for removing an encapsulated product from the mold are arranged on a carriage movable along a guide relative to the mold halves.

Abstract: A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to form a cavity block and a center block. Opposing surfaces of the cavity block halves include a polytetrafluoroethylene layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.