Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.

Abstract: A multiple transfer molding die for molding a plurality of semiconductor devices includes a plurality of resin paths between a pot and a plurality of cavities. Each resin path includes a first runner portion whose cross sectional area is determined according to the length between the center of the pot and the end of the first runner portion.

Abstract: Transfer molding equipment, used to encapsulate semiconductor die, is provided with clamps mounted to the mold base to position and align mold chases. Previous designs position and align the top and bottom mold chases using dowels on the mold base received in holes in the chases. The invention reduces the downtime of the mold equipment, and decreases the time required to replace the chases when a different package is to be produced.

Abstract: A resin sealing apparatus that has separable molds having a pot in which resin is injected. The pot communicates with cavities, in which semiconductor chips are set, by runners. The runners lead the resin injected in the pot to the cavities. A recess is provided at the distal end of each runner to hold the resin and air pressed out from the runner.

Abstract: A resin transfer molding core has an outer surface and internal communication passages. One internal communication passage has an inlet opening and at least one discharge opening extending through the outer surface of the core. At least a second internal communication passage has a discharge opening extending through the outer surface of the core and at least one inlet opening. A preform comprises the core with fiber reinforcement material on the outer surface.

Abstract: A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.

Abstract: It has been found that when layered preforms are being injection molded utilizing at least two materials, it is possible to maintain the same horizontal and vertical pitch of adjacent cavities as is possible when each mold cavity is being filled with a single material. Most particularly, it has been found that when the percentage of the material to be injected into a mold cavity is relatively high, it is possible to utilize a single metering pot for four adjacent mold cavities. On the other hand, if one of the materials to be injected into a mold cavity constitutes a relatively low percentage of the volume of a mold cavity, it has been found that a small metering pot must be provided for each of the cavities of the four cavity mold.

Abstract: A lead frame assembly is disclosed which interfaces with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is used in the charging system. The lead frame assembly has side rails, between which a temporary and a permanent support structure is formed. The temporary support structure is removed from the bonded integrated circuits after the bonding process is completed, while the permanent structure is made a part of the bonded integrated circuit package.

Abstract: An injection apparatus of a plunger type for injecting reinforced materials such as BMC is of a single barrel type or a double barrel type having a rotatable plunger disposed in the barrel. A check valve device for preventing a back flow of the materials in a metering process is provided such that it is closed when the plunger is actuated to move axially for injection.

Abstract: An impingement mixing device is provided comprising a mixing chamber housing, a control piston axially displaceable with said mixing chamber housing between an extended position and a retracted position, a mixing chamber within the housing defined by an end face of the control piston when in the retracted position and a mixing chamber discharge outlet coextensive with an end face of said control piston when in the extended position, means to feed first and second components to the mixing chamber in opposing relationship, a discharge tube housing defining a quieting chamber having an opening at a discharge end and in fluid communication with the mixing chamber, with said discharge tube housing including a sealing means adapted to at least partially close the opening of the quieting chamber at the discharge end.

Abstract: To avoid contaminating the sprue runner which leads from the mixing device to the molding cavity of a molding tool for the production of molded plastic, especially foam plastic, parts, an insertable lining is placed in the sprue runner and can be removed along with the molded part.

Abstract: The mold described has walls disposed about the mold plates and vent pin retainer plates to permit a vacuum to be generated. The vent pins have been designed to be self cleaning. A pin having a generally cylindrical shape is used. A first portion of the pin has a face defined by a chord of the cylinder. The face leaves a small space between the pin and the opening wall which permits the atmosphere to be removed from the cavity. Below the first portion is a second portion, smaller in diameter than the first portion. Below the second portion is a third portion of essentially the same design as the first portion rotated 45.degree.. This portion cleans the walls of the opening when the pin is raised to eject the parts.

Abstract: A toy (10) for forming modeling compound includes a base (12), a turntable (16) rotatable on the base, a receptacle (22) on the turntable for receiving the modeling compound, a ram member (34), and a rotary actuator (44) for driving a peripheral drive gear (20) of the turntable to provide screw actuated movement of the ram member for forcing modeling compound from the receptacle (22) through a forming component (32) for forming. In one embodiment, the rotary actuator (44) includes a hand operated crank (74) and in another embodiment is power operated and includes an electric motor (102) and gear drivetrain (108) for providing the screw operated movement of the ram member for the forming. The forming component (32) may be embodied by an extruder (162) or a mold (170) to provide either extrusion or mold forming of the modeling compound.

Abstract: A molding system and process is disclosed to interface with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is use in the charging system.

Abstract: A technique including an apparatus for injection molding fiber-reinforced thermoset plastic articles is disclosed. The technique includes forming a mixture of short lengths of reinforcing fibers with a thermosetting resin in a predetermined fiber-to-resin ratio and introducing the mixture to an injection molding cylinder. The volume of mixture introduced is at least a multiple of two of the volume of the mold chamber so that the injection plunger traverses the intersection between the molding cylinder and a stuffer cylinder a single time for a multiplicity of molding shots to minimize fiber breakage and balling. The injection plunger is adapted to precompact the mixture by being forced forward until a predetermined high pressure is sensed, indicating a hydraulically locked condition of the plunger wherein substantially all entrapped gases have been expressed from the mixture and there exists no substantial forward movement of the plunger.

Abstract: A seating apparatus for sealing a semiconductor element in a resin has a plunger which injects a resin pellet into the cavities of an upper and lower mold. The plunger is driven by a reciprocating mechanism through a flexible transmission member so that the directions of movement of the plunger and the reciprocating mechanism need not be parallel. In preferred embodiments, the reciprocating mechanism is a ball screw mechanism which is driven by a servomotor, and the flexible transmission member is a roller chain which is slidably disposed within a lower mold. The lower mold may be longitudinally divided into a plurality of sections which are detachably secured to one another to enable easy manufacture and disassembly. A ventilating mechanism for passing cooling air along the length of the roller chain during molding may be provided to prevent the roller chain from being damaged by the heat of molding.

Abstract: In the progressive forming and laying of an undersea pipeline the welded joints between the ends of pipes pre-coated with a corrosion protection coating and an outer concrete weighting coating are protected by a mastic coating applied by clamping a mould around the pipeline joint to form a cavity between the joint and the mould, filling the cavity with mastic by forcing into it under pressure a charge of mastic at a temperature of not more than 70.degree. C., releasing the pressure and opening and removing the mould. The mastic coating is applied up to the level of the concrete coating adjacent the joint.

Abstract: A molding apparatus for enclosing semiconductor chips with resin has a plurality of plungers for applying pressure to a resin material, at least one transfer channel holding each of resin material supplying pots in communication with corresponding one of cavities for transferring the resin material in a molten state, a communication bore formed in the vicinity of the transfer channel in communication therewith, slide members each intimately fitting in the communication bore and slidable forward or backward, pressing-pushing members for pushing each slide member toward the corresponding transfer channel with a uniform pressure, and a pressure sensor operable by the retraction of each slide member for detecting the internal pressure of the transfer channel.

Abstract: An evacuating device for a plunger molding apparatus including a material cylinder for receiving a blank to be extruded, a ram head slidably engageable in the material cylinder, a hydraulic plunger having a piston connected to the ram head, an evacuating cap provided slidably in an air-tight manner on the piston and having evacuating pipes, and a blowdown valve provided in the ram head for closing and opening an air blow aperture formed in the ram head. The ram head has a flat surface which is in contact with the blank in the material cylinder. An O-ring is arranged in the flat surface of the ram head about the air blow aperture. The blowdown valve consists of a stem and a head which is brought into contact with the flat surface of the ram head through the O-ring when the ram head is being advanced, thereby improving the air-tightness between the ram head and the blowdown valve to prevent the ceramic batch from entering the air blow aperture.

Abstract: A plunger is used for a multi-plunger type resin mold device which is adapted to be slidably inserted into a pot to permit a resin in the pot into a mold. The plunger includes a forward end member whose forward end edge portion is formed of silicon nitride, silicon carbide or zirconia, the forward end edge portion of said forward end pot member being in contact with the resin in the pot, and a plunger body to which the forward end member is fixed. The forward end member is fixed to the plunger body by threadably inserting an insertion section of the forward end member into a recess formed in the plunger body.

Abstract: In a horizontal mold clamping and vertical injection type die cast or injection molding machine of the type wherein stationary and movable metal molds are secured to stationary and movable platens and molten metal or plastic resin is injected into a mold cavity defined by metal molds from an injection cylinder, the stationary platen has a vertical member and a horizontal member integral therewith which extends beneath the stationary metal mold, and the injection cylinder is suspended from the horizontal member. This construction prevents leakage of molten metal and provides a large space for mounting the metal molds.

Abstract: Disclosed is an injection press for use in a transfer molding system for fiber reinforced thermo-setting resins, comprising an injection piston, an injection cylinder in which the injection piston moves, a feed bore which traverses the injection cylinder, a sprue orifice which leads into the mold, a telescoping sleeve which serves to seal off the feed bore when the piston travels toward the sprue orifice, wherein the injection piston seals the transfer bore at the end of the stroke near the sprue orifice, and wherein said feed bore is open when the piston is in a position a stroke length away from the sprue orifice.

Abstract: Injection molding a tread on an annular tire casing (44) positioned in a mold (10') by introducing a fluid molding compound (76',78') at high pressures and high temperatures into a tread molding space (105) through runner passages (114) extending from an edge (116) to a centerplane (20'--20') of the mold (10') and having gates (118) opening into the tread molding space (105). Alternatively the runner passages (56,58) may be defined by annular runner surfaces (60,62,64,66) in communication with the tread molding space (48) through annular gates (52,54). The fluid molding compound (76,78) may be ejected from annular transfer recesses (68,70) in the mold (10) by squeeze rings (84,86) movable into the transfer recesses (68,70) to introduce the fluid molding compound (76,78) into the runner passages (56,58).

Abstract: There is provided a hydraulic motor-driven extruder having raw rubber stock fed from coiled continuous strips into the extrusion portion thereof. The extruder includes a screw shaft and housing having decreasing diameter as material is transported toward the discharging extremity thereof. Surrounding this screw extruder there is provided heating bands of controlled temperature to impart additional heat. On discharge from the extruder the prepared rubber is deposited within an expandable cavity for selecting the desired volume of prepared rubber material. Once measured the prepared rubber is lifted from the cavity for insertion into the molding press.

Abstract: The disclosure is directed to an encapsulation molding apparatus to be used for subjecting small-sized electrical elements to encapsulation molding by a synthetic resin material. The present invention has been presented for the purpose of shortening the cycle time required for the encapsulation molding, and also, reducing cost necessary for molding metal molds, and installation cost for a molding press, etc., with a simultaneous reduction of a loss in the synthetic resin material. More specifically, in the apparatus of the present invention, for subjecting small-sized electrical elements to encapsulation molding by the synthetic resin material, pots (30) for charging the synthetic material thereinto are provided at preferably equal intervals with respect to a plurality of cavities provided in an upper mold (11) and a lower mold (12) for the formation of encapsulation molded portions, while extruding plungers (31) are provided for the respective pots for effecting the encapsulation molding.

Abstract: A multipart mold assembly for removably receiving a casing unit and positioning the casing so as to form, in combination with at least one of the mold parts, a cavity having the shape of an element to be formed in the mold and bonded to the casing. One mold part has a surface defining part of the shape of said cavity, and a casing skirt support surface forms another part of the cavity. A flash barrier is formed along a part of the skirt casing when a clamping ring formed from a plurality of individual clamping ring elements engages the surface of said casing skirt and urges it into fluid-tight relation with the casing support surface.

Abstract: Apparatus for enclosing semiconductors with resin by molding, including a stationary upper mold having a plurality of pots, and a movable lower mold opposed thereto.The upper and lower molds have cavities to which a resin material supplied to the pots is pressingly injected directly or only through gates.Disposed at the upper mold side is a resin material pressurizing mechanism having plungers fittable into the pots, and one or more cylinders and piston rods for actuating the plungers.

Abstract: Apparatus for encapsulating electronic components in plastic includes a press with upper and lower press members, upper and lower flat plastic carrier plates, and transfer injection means. The plates from a closed cavity and support the electronic component.

Abstract: An improved means and method is provided for encapsulating electronic devices and other objects by transfer molding. The mold cavities are arranged in rows, disposed adjacent to and parallel with slot-shaped encapsulant reservoirs, and coupled to the reservoirs by short feeder channels of uniform length. Preferably, a row of cavities is located in a mirror symmetric fashion on either side of and parallel with each slot-shaped reservoir. A tightly fitting blade moves in each slot-shaped reservoir to compress and liquify the plastic encapsulant charge, injecting it into the mold cavities containing the component to be encapsulated. Plastic utilization can exceed 90%, and better control over molding conditions can be obtained because the plastic material reaches each mold cavity at the same stage of the liquification-solidification cycle. More cavities can be fitted in a given mold area because the usual central material pot and runner-tree are eliminated.

Abstract: In molding a number of articles of plastics at the same time with use of an upper mold and a lower mold having a multiplicity of cavities in the fitting surfaces thereof, a process for molding plastics by supplying the molding material to a plurality of pots each provided for one pair of cavities in proximity thereto, and injecting the material into the cavities from the pots through gates without passing the material through any runner. An apparatus for practicing the process is also disclosed. The waste of the molding material can be reduced at least by the amount conventionally needed for filling the main and auxiliary runners.

Abstract: A molding machine for encapsulation including a transfer molding die provided with a plurality of pots which comprises a transfer molding press, a molding die including a plurality of pots allowing for the passage of plungers integrally formed with the rods of the cylinders, a plurality of runners branched off from the pots, a plurality of cavities connected to the runners through the corresponding gates, and displacement transducers for detecting the rate of the displacement of the plungers, variable flow rate control valves communicating with lines connected to the cylinders, and a control circuit for controlling the operation of the variable flow rate control valve in accordance with output signals from the displacement transducers, thereby causing the plungers corresponding to cylinders to be moved exactly at the same speed.

Abstract: This invention relates to a molding apparatus capable of producing flashless molded parts due to a perfect surface-to-surface mating of a pair of molds. The molding apparatus comprises an upper holding means for holding at least one upper mold having a path in which a moldable material is passable, and a lower holding means for holding at least one lower mold having a cavity, wherein a certain amount of fluid substance is filled between a bottom surface of the lower mold and the lower holding means, thereby the lower mold being floatable on the fluid substance and movable along the lower holding means, subsequently a joint between the upper mold bottom surface and the lower mold top surface being realized perfectly due to a back pressure of the fluid substance.

Abstract: Molding apparatus including an upper and lower mold half and having a plurality of mold cavities is improved by eliminating runners and gates. An open bore adjacent each mold cavity serves as a separate pot for each cavity. A plunger moveable in each bore is used to inject plastics material directly from the bore into the mold cavity into which the bore opens. A molding method is similarly improved by injecting the plastics material directly from the separate bores into the individual mold cavities into which the bores open.

Abstract: The transfer press has a blank-supply mechanism for supplying blanks which are materials for every kind of part to be manufactured by pressing, one by one to a press, a blank-transport mechanism for carrying blanks from the blank-supply mechanism to the press, a transfer feed mechanism for feeding blanks that have been supplied to the press one by one to dies of each stage along the bed of the press, a die exchange mechanism for exchanging dies when different parts are to be manufactured, a feed bar exchange mechanism for removing and exchanging feed bars which are a part of the transfer feed mechanism, when dies are to be changed, a die cooling oil circuit connecting mechanism for connecting a cooling circuit to a newly placed die in order to cool it, a pressure adjusting mechanism for die cushioning mounted on the bed of the press, and a program control mechanism for the automatic operation of the press, which controls the above-described mechanisms as well as the press in relation to blank supplying and ma

Abstract: An apertured insulation unit is disclosed for interposition between a mold having at least one cavity in which elastomeric stock can be cured in the form of said cavity and an injection unit from which elastomeric stock can be expelled and transferred through the insulation unit to the mold cavity, the mold and injection unit being movable axially relative to one another into and out of pressing association with respective opposite side-faces of the insulation unit. The insulation unit serves to prevent curing of elastomeric stock remaining in the injection unit with the curing of the portion of such stock transferred to the cavity, without separation of either the mold or the injection unit from the insulation unit. The insulation unit is at least in part in the form of a thin, flexible, apertured plate constituted of a thermal-insulatory material which is engageable and forms a parting line with the mold.

Abstract: A body having rubber material thereon is positioned on a lower member, and an upper member is moved toward the lower member, such relative movement causing tread-forming shoes to move to inward positions to form a tread on the rubber material. As an alternative, the upper and lower members may be brought together, and rubber material may be injected into position to have a tread formed thereon. Upon movement of the upper and lower member relatively apart, the rubber material is made to remain in contact with the shoes, and the body is removed, whereupon an annular core having rubber material thereon is disposed on the lower member, and the upper and lower members are again brought together to deposit the rubber material in contact with the shoes onto the rubber material on the core.

Abstract: Apparatus for molding elastomeric articles is disclosed, the apparatus including an injection unit having an open-ended chamber in which elastomeric stock is disposable and from which such stock can be expelled, a multi-cavity mold having cavities aligned with corresponding ones of the apertures of the end plate, a device for moving the injection unit and mold relative to one another to engage the mold with the end plate, and a pneumatic venting system for evacuating fluid entrapped in each of the mold cavities preparatory to filling the latter with elastomeric stock from the injection unit. The foregoing abstract is neither intended to define the invention disclosed in the specification, nor is it intended to limit the scope of the invention in any way.

Abstract: Apparatus for pressure molding a shaped article such as a food patty from moldable food material comprising a supply means such as a hopper for the material, a pressure chamber, a movable ram in the pressure chamber to pressurize the material therein, a receiver chamber such as a cylinder communicating with the pressure chamber to receive the pressurized material, a wall member such as a piston movable in the receiver chamber displaced by the force of the material entering thereinto, a mold having a mold opening adapted to register with the material in the receiver chamber, and mold filling means for forcibly moving this wall member to apply pressure to the material in the receiver chamber thereby forcing the moldable material into the mold opening.