Abstract: A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.

Abstract: Automatically monitoring pads of material deposited on a surface of a workpiece using an inspection system that senses a deposited pad of material and determines pad height values at a plurality of locations across the pad, and a shape classifier that receives the pad height values as inputs and outputs a plurality of three-dimensional shape attributes related to pad deposit conditions.

Abstract: A method for computerized control of vapor deposition processes, including chemical vapor deposition and electron beam physical vapor deposition processes, uses optical imaging sensors and/or laser interferometers or infrared ellipsometers focused on the substrate being coated or on a nearby test blank to provide information which is computer analyzed to yield optimum control points for the coating process. A method is also disclosed for shaping or contouring one or more surfaces of an object(s) using the techniques disclosed here.

Abstract: A process for blending paint to match an existing finish. A first color imparting component is first provided, in an amount proportionate to a paint formulation, and mixed with a base coat reducer to obtain a first reduced component. A second color imparting component is also provided, in an amount proportionate to the amount of the first color imparting component according to the paint formulation, and mixed with a base coat reducer to obtain a second reduced component. A portion of the first reduced component is then mixed with a portion of the second reduced component to obtain a base paint. The base paint is tested by applying the base paint onto a surface and allowing it to dry to obtain a painted surface, and comparing the painted surface with an existing finish after simulating a clear coat finish with a lustrous liquid.

Abstract: An apparatus for monitoring a moving filamentary product having a device for monitoring the centering of the filamentary product relative to the coating, and a device for monitoring the quality of the coating. The centering monitoring device includes two light sources positioned at 90.degree. to each other in a plane perpendicular to the filamentary product. The coating quality monitoring device includes an optical receiver disposed between the two light sources in the same plane, and at 45.degree. to each of them, to receive the light beams reflected by the coating.

Abstract: A reactor for processing a substrate includes a first housing defining a processing chamber and supporting a light source and a second housing rotatably supported in the first housing and adapted to rotatably support the substrate in the processing chamber. A heater for heating the substrate is supported by the first housing and is enclosed in the second housing. The reactor further includes at least one gas injector for injecting at least one gas into the processing chamber onto a discrete area of the substrate and a photon density sensor extending into the first housing for measuring the temperature of the substrate. The photon density sensor is adapted to move between a first position wherein the photon density sensor is directed to the light source and a second position wherein the photon density sensor is positioned for directing toward the substrate. Preferably, the communication cables comprise optical communication cables, for example sapphire or quartz communication cables.

Abstract: Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.

Abstract: The present invention relates to a test pattern group and a method for measuring an insulation film thickness utilizing the same, and to the test pattern group comprising at least 3 (three) test patterns having a construction of a capacitor and a method for more precisely measuring the insulation film thickness utilizing the test pattern group, in a method for electrically measuring a capacitance of the insulation film applied to a semiconductor device and converting the measured capacitance to a thickness of the insulating film.

Abstract: A temperature measurement system for use in a thin film deposition system is based on optical pyrometry on the backside of the deposition substrate. The backside of the deposition substrate is viewed through a channel formed in the susceptor of the deposition system. Radiation from the backside of the deposition substrate passes through an infrared window and to an infrared detector. The signal output by the infrared detector is coupled to electronics for calculating the temperature of the deposition substrate in accordance with blackbody radiation equations. A tube-like lightguide shields the infrared detector from background radiation produced by the heated susceptor.

Abstract: A system for evaluating the reflectance of an object (e.g., a CRT) that is coated with an anti-reflective coating material is disclosed. The quality and/or uniformity of the coating is evaluated by a reflectometer. The reflectometer is positioned relative to the object by non-contact sensors. Reflectance data gathered by the reflectometer is analyzed to determine to what extent the actual coating differs from the optimal (i.e., ideal) coating. A feedback system modifies the coating process for subsequent objects in an attempt to fine-tune the coating process and achieve optimal anti-reflective coatings for later objects passing through the system.

Abstract: A substrate such as a semiconductor wafer is transferred to a plurality of process chambers so as to perform prescribed processes. An inspection chamber is air-tightly connected to each of the process chambers. The inspection chamber is provided with a handler which loads and unloads the substrate. A gate valve is disposed between each process chamber and the inspection chamber. By this gate valve, each chamber is air-tightly closed.

Abstract: A cup with a top opening is disposed in an open-air space, and an atmospheric pressure sensor is disposed externally to the cup. A CPU calculates a control value which compensates for a variation in the thickness of a coating film which is formed on a surface of a substrate, based on an atmospheric pressure value which is measured by the atmospheric pressure sensor. An air-conditioner is controlled in accordance with the control value, whereby the temperature and the humidity of clean air which is supplied around the cup are adjusted and the variation in the thickness of the coating film is prevented without laborious work.

Abstract: A narrow-band antireflective coating is comprised of a multilayer dielectric film formed on a dielectric substrate. The antireflective coating is initially formed so that its outer layer has a thickness greater than the thickness required for antireflection. The reflectivity is monitored while outer layer is reduced in thickness to reduce the thickness of the outer layer to reduce the reflectivity.

Abstract: A process for measuring the thickness of a layer of powder upon the surface of a workpiece comprises depositing a layer of powder on the surface of the workpiece and simultaneously on the surface of an adjacent wire, directing the powder coated wire past a sensor capable of measuring the diameter of the powder coated wire, and comparing the diameter of the powder coated wire to the diameter of the uncoated wire.

Abstract: The present invention provides a sheet thickness measuring apparatus comprising electrostatic capacity measure means for measuring the electrostatic capacity of a sheet, resistance measure means for measuring a resistance value of the sheet, and calculation means for calculating a thickness of the sheet on the basis of the electrostatic capacity measured by the electrostatic capacity measure means and the resistance value measured by the resistance measure means.

Abstract: Copper lines or molybdenum lines on a substrate are inspected for defects by coating a metallized substrate with an inspection layer followed by imaging the substrate, and removing the inspection layer after the imaging. The inspection layer can be a light reflecting metal or a combination of a light reflecting metal and light-absorbing organic compound.

Abstract: A deposition rate monitor based on the measurement of optical attenuation is described for use in deposition equipment such as sputtering systems used to deposit thin metal films on semiconductor devices. A beam of light is passed through the region between a deposition source and the deposition substrate. The beam of light is attenuated by the material being transported from the source to the substrate before the light is detected at a detector. The level of attenuation of the light passing through the deposition environment can be empirically related to the rate at which material is being deposited on the substrate. The optical absorption deposition rate monitor can be used to adjust processing variables to maintain a constant deposition rate.

Abstract: A method for the electron beam deposition of a multicomponent evaporant to ensure a consistent layer quality with constant composition and thickness in a defined manner. The X-radiation emitted from the evaporant on the point of electron beam impingement is measured in situ, using the obtained signal as reference input to control the parameters of the evaporation process and therefore to control the deposition rate and material composition of the deposited layer. The method is used for the production of corrosion resistant, high-temperature resistant, hard-wearing or optical layers on, for example, strip steel or plastic film.

Abstract: A method for determining the instantaneous and cumulative mass rate of change of a conductive body in a deposition, densification or etching process through the use of a gaseous, liquid or particulate solids precursor. In one application, porous solid structures are densified by thermally decomposing a gaseous precursor to deposit an electrically and thermally conductive deposit within the structure. The rate of densification is determined by measuring the change of the electrical conductivity of the structure over time as the structure increases in mass.

Abstract: A method for irradiating a substrate such as a semiconductor substrate, coated with a photoresist, with light to measure variations in optical properties such as reflectivity, refractive index, transmittance, polarization, spectral transmittance, for determining an optimum photoresist coating condition, an optimum photoresist baking condition, an optimum developing condition or an optimum exposure energy quantity, and forming a photoresist pattern according to the optimum condition. A system for the exposure method, a controlling method of forming a photoresist film by use of the exposure method, and a system for the controlling method, are useful for stabilization of the formation or treatment of the photoresist film, and ensure less variations in the pattern size.

Abstract: In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position.

Abstract: The biocompatibility of polymeric and metallic articles used in contact with blood can be substantially improved by coating the articles as described. The coating materials are triblock copolymers of the polylactone-polysiloxane-polylactone type. Optimum biocompatibility is provided by a coating of optimum surface concentration. Porous membranes can be coated as described, providing improved biocompatibility of blood oxygenators, hemodialyzers and the like.

Abstract: The apparatus has a container which contains a first filter. During operation, this separates the first interior region containing particulate material from a second interior region. The latter is connected to a downstream dust separator. This has a housing which contains a second filter. The apparatus furthermore has a fan, at least one dust concentration sensor and a control device connected to this and to the fan. During fluidization and treatment of the particulate material in the first interior region of the container, the dust concentration in the oxygen-containing gas flowing from the first filter to the second filter and usually consisting of air is measured. If the dust concentration is at least equal to a predetermined limit below the lower explosion limit, the control device switches off the fan. This makes it possible to keep the pressures generated by any dust explosion relatively small.

Abstract: A coating control system is provided enabling continuous operations, free of interruption for coating control purposes, while achieving desired coating weight and thickness profile for the various gages, widths and coating specifications encountered on a given continuous strip production line. In each of a pair of elongated pneumatic dies, a pressurized gas jet is controllably shaped and directed by flow-control means internally-mounted of each pneumatic die to impinge against its respective substrate coated surface with its major directional component of force being controlled to be perpendicularly transverse to the travel path of the coated strip across its full width. Adjustment of such internally-mounted means is coordinated with control of gas pressure supply and/or adjustment of die positioning means to maintain desired coating weight and coating profile across the width of the strip.

Abstract: A method for manufacturing thin film magnetic media disks entailing the improvement arising from causing spaced electrical probes to engage spaced portions of an exposed outer surface of a disk overcoat layer; creating a voltage across the spaced electrodes; measuring a function of electrical resistance between the ends of the probes in engagement with the exposed outer surface of the overcoat layer; and employing this measured resistance function generally as a measure of wear properties of the overcoat layer.

Abstract: A system (10) for run-to-run control of semiconductor wafer processing is provided. An input/output device (12) receives a desired quality characteristic for a particular semiconductor fabrication process. A generating circuit (22) uses a model to generate appropriate process parameters for a processing unit (20) and an expected quality characteristic. An adjusting circuit (16) functions to adjust process parameter inputs of the processing unit (20). In-situ sensor (18) functions to measure a quality characteristic of the process in the processing unit (20) on a real-time basis. A comparing circuit (24) functions to compare the measured quality characteristic with the expected quality characteristic. A model adjusting circuit (26) may adjust the model of the generating circuit (22) if the measured quality characteristic varies from the expected quality characteristic by more than a predetermined statistical amount.

Abstract: Method and apparatus for adjusting the electrical parameters of monolithic crystal filters having an electrode pattern that includes resonator electrodes and inter-resonator gap and constitutes two coupled resonators, based on thin-film deposition on the electrode pattern of one side of the filter through a single-aperture mask, with mask and filter movable relatively to each other during the adjustment process, such as to be able to guide said deposition in response to measurements of said electrical parameters to any area of said electrode pattern for the purpose of adjusting said parameters to their target values.

Abstract: A process for measuring the coating weight of a dried-in-place non-chromate polyacrylamide based conversion coating is disclosed. An ammonium hexafluorotitanate tracer added to such a conversion coating was found to not adversely affect coating properties. The tracer was found to remain proportional to the polymer matrix when the coating was analyzed by X-ray fluorescence.

Abstract: A new method for the manufacture of glass films on substrates involves the flame reaction of an aerosol comprised of droplets of a solution containing all the precursors for the glass. A solution containing the precursors for all oxide components is atomized, and the resulting droplets are reacted in a flame to form spherical glass particles which are deposited on a heated substrate. By moving the substrate through the flame, a homogeneous deposit is achieved. Subsequent heat treatment in a furnace sinters the porous particle layer into a clear glass. The method has been successfully employed for the formation of sodium borosilicate glass films on silicon substrates and rare earth-doped multicomponent glass films for active devices.

Abstract: A method and apparatus for measuring an anodic capacity of a thermally sprayed coating are described. Eddy current techniques are used to probe the coating and resulting RMS voltages are translated into anodic capacity indications which can be standardized or absolute. Recalibration can be achieved using single point measurement.

Abstract: A method for applying a coating to a substrate comprises a gas distributor having an outlet disposed adjacent to the substrate for directing a gaseous reactant mixture to the surface of the substrate. A plurality of drop tubes are provided which communicate with and are spaced along the length of the distributor for supplying the gaseous reactant mixture to the distributor. The uniformity of the thickness of the coating which is applied to the substrate along its width is determined. Finally, one or more of the reactants or an inert gas is supplied to one or more of the drop tubes to alter the concentration of one or more of the reactants in the gaseous reactant mixture flowing through one or more drop tubes. The rate of deposition of the coating in the proximity of such drop tubes is thereby altered to improve the uniformity of the coating deposited.

Abstract: Methods and apparatuses for measuring and controlling the edge positions of a vapor deposited film, and the positions and widths of vapor deposited zones and margin zones of the film, and also the positions of heavy edges, if any, without requiring a skilled operator, are provided. A vapor deposited film on which vapor deposited zones and margin zones are formed in stripes in the longitudinal direction and alternately in the transversal directly by a margin forming device and a metal evaporator is carried by a film carrier system, while being illuminating with the light emitted from a light source, and the light transmittance distribution of the film in the transversal direction of the film is detected by a line sensor camera, to be used for measuring the edge positions of the film, and the positions and widths of the vapor deposited zones and the margin zones, and also the positions of the heavy edges, and for controlling the margin forming device, the metal evaporator, etc.

Abstract: An apparatus includes a first waveguide having a first surface having a first hole through which a fiber passes, and a second surface having a second hole through which an object passes and opposing the first surface, a magic tee connected to the first waveguide, and an adjustable short plunger connected to the magic tee.

Abstract: A method and structure for sensing data such as temperature with respect to objects such as silicon wafers undergoing fabrication or other processes involve the use of a monitor element of material and configuration similar to that of the objects being processed. A structure such as a closed loop or segment of a spiral may be formed on the surface of the monitor element, and acts as a secondary coil when brought into operative relation with a transformer structure which includes a primary coil, a current source and a sensing device. The sensing device senses variations in the electrical characteristics in the primary coil, caused by the presence of the monitor element, and can thereby determine the temperature or other desired data relating to the monitor element, which is substantially the same as comparable data for the objects being processed.

Abstract: Deposition or etching of a layer on a substrate is monitored by impinging P-polarized light on the layer during deposition at an angle which is approximately the Brewster's angle for the substrate, and detecting radiation which is reflected from the structure during deposition. In heterodeposition, a quarter wavelength interference signal having a predetermined periodicity is monitored. Maxima and/or minima in the quarter wavelength ratio are monitored and an amplitude modulated fine signal which is superimposed on the quarter wavelength interference signal is also monitored. The deposition process is controlled based on the monitored quarter wavelength interference signal, ratio of the maxima and/or minima, fine signal, fine signal amplitude modulation and/or combinations thereof by comparing the signals to a reference derived from mathematical models or empirical data. A heterodeposition or etching can also be used to calibrate a homodeposition or etching.

Abstract: A dispensed bead (10) of material is disposed between a sensor pair (14) for monitoring the bead. The sensor pair (14) transmits a beam of light towards the bead of material. A signal is generated which corresponded to the amount of light received. By utilizing this signal, gaps or other discontinuities can be found. This signal can also be used to determine the height of the bead and generate a profile thereof. The signal can be used in a closed loop feedback control system to control the amount of material dispensed from the dispenser.

Abstract: A method of providing particle deposition on a semiconductor wafer or other surface first provides a flow of clean gas into a deposition chamber that purges the chamber prior to introduction of the wafer, and after introduction, continues the flow of clean gas. An aerosol is mixed into the clean gas flow for a desired length of time, so that as the combined flow passes through the deposition chamber particles are deposited on the wafer supported in the chamber. After the deposition has continued for either a desired particle count or a length of time, the flow of aerosol is discontinued, and a clean gas flow sheath is provided over the wafer as it is removed from the chamber. The apparatus carries out this method by providing a source of a clean gas, valves for controlling aerosol introduction into the clean gas, and a support for the wafer in the path of gas introduced into the chamber.

Abstract: An apparatus for epitaxially growing a chemical-compound crystal, a plurality of raw-material gases are alternately introduced into a closed chamber of a crystal growing device to grow the crystal placed within the closed chamber. At growing of the crystal, a light from a light source is emitted to a crystal growing film of the crystal. Intensity of a light reflected from the crystal growing film and received by a photo detector is measured. Charge amounts of the respective raw-material gases are controlled by a control system on the basis of a change in the reflected-light intensity, thereby controlling a growing rate of the growing film.

Abstract: A process for depositing diamond on a substrate using a microwave plasma generator including introducing a feed which includes diamond forming constituents in a desired ratio to the microwave plasma generator, and providing sufficient microwave power to the microwave plasma generator to produce a greenish-colored plasma which emits a spectrum monitored to maintain a relative emission intensity ratio of two of the constituents in a predetermined range, for depositing high quality diamond at an extremely high rate on the substrate placed proximate or in the plasma.

Abstract: A composite body, especially for use as a cutting tool, for the lining of combustion chambers or for movable parts intended to have low wear which has a substrate of hard metal, steel, cermet or nickel or cobalt alloy. The substrate is provided with at least one fine-crystalline alpha-Al.sub.2 O.sub.3 layer deposited by plasma activated CVD at 400.degree. to 750.degree. C. With plasma activation by pulsed direct voltage with the substrate connected as the cathode.

Abstract: In accordance with one aspect of the present invention, a method is provided for predicting the endpoint time of a semiconductor process for a layer of a wafer (14). The endpoint time is the time at which a predetermined thickness of the layer occurs. A layer thickness, calculated for a first sample time, is received. It is then determined whether or not the layer thickness lies within a predetermined range. If the layer thickness does lie within the predetermined range, it is used to update a forecasted process rate. The forecasted process rate is used to predict the endpoint time. The endpoint time is used to control the semiconductor process so that the layer of wafer (14) is formed having the predetermined thickness.

Abstract: In a system for monitoring and controlling the thickness of a laminate, an apparatus is provided to apply material for forming a material layer onto a web so that a laminate is formed. The tip of a knife and the surface of the web upon which the material is applied define a space, and the knife is movable relative to the web to vary the size of the space. The web coated with the material layer is drawn past the knife to form a desired thickness material layer. A measuring apparatus measures whether the thickness of the material layer plus the thickness of the web is equal to a predetermined value. The tip of the knife is moved relative to the web to adjust the thickness of the material layer in response to a signal from the measuring apparatus. A method of monitoring and controlling the thickness of a laminate is also described.

Abstract: An ellipsometric method for process control in the context of device fabrication is disclosed. An ellipsometric signal is used to provide information about the device during the fabrication process. The information is used to better control the process. An ellipsometric signal of a particular wavelength is selected. The signal is selected based on the composition and thickness of the films on the substrate through which the ellipsometric signal will pass before it is reflected from the substrate. Once the appropriate wavelength is determined, the ellipsometric signal is used to monitor the thickness of the films on the substrate over time, to assist in controlling the deposition and removal of films on the substrate, and to perform other process control functions in the context of device fabrication. The ellipsometric method is used to control the deposition and removal of films that underlie patterned masks with aspect ratios of 0.

Abstract: A sheet thickness measuring apparatus includes an electrostatic capacity measuring device for measuring the eletrostatic capacity of a sheet, a resistance measuring device for measuring a resistance value of the sheet, and a calculator for calculating a thickness of the sheet on the basis of the electrostatic capacity measured by the electrostatic capacity measuring device and the resistance value measured by the resistance measuring device.

Abstract: Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.

Abstract: A method for producing a narrow band anti-reflective film on a substrate, and the film produced by that method. The improved method being the concept of trimming the outer layer in order to correct for its thickness layers as well as those of the inner layer.

Abstract: An apparatus for monitoring a film growth is disclosed, in which, when a crystalline thin film is grown by applying an MOCVD (metalorganic chemical vapor deposition method), the variation of the thickness and composition due to certain factors can be detected with real time during the film growing process, and an in-situ adjustment is possible. As the optical detector for detecting two sets of reflected beams which are reflected from the film, a silicon detector and a germanium detector are used, the former being suitable for detecting short wavelength laser beams, and the latter being suitable for detecting long wavelength laser beams. Thus two different wavelengths are detected with real time, thereby measuring the thickness and composition of the film.

Abstract: Plasma processing treatment characteristics of an object are determined nondestructively, prior to plasma processing the object, by placing an indicator layer over at least a portion of the plasma processing surface of the object, so as to generally conform to the shape of the surface. An electrically conductive grid is placed over the indicator layer, and made electrically common with the object. The indicator layer is implanted through the conductive grid, and changes properties responsive to the plasma processing treatment. The implanted indicator layer is thereafter analyzed to determine the treatment characteristics of the indicator layer. Plasma processing spatial distribution and total dosage are determined nondestructively from this information and used to establish the plasma processing program for the object and adjust the plasma processing apparatus as needed.

Abstract: A mirror for SOR includes a base (1) made of a heat resistant ceramic material having a surface, a first SiC coating (2, 3) formed on the surface of the base (1), which has a first smoothed surface, and a second SiC coating (4, 5) formed on the first smoothed surface of the first SiC coating (2, 3), which has a second smoothed surface. A third SiC coating can be formed on the smoothed surface of the second SiC coating (4).

Abstract: A method and apparatus for applying a coating design to selected portions of a surface (13) of a structure (14) including the steps of applying a maskant (18) to the surface (13), positioning a plurality of sensors (20) on the structure (14) around the surface (13), positioning a laser (22) at a distance from the surface (13), directing a laser beam (32) from the laser (22) to each of the sensors (20) as input to the sensors, and using output from the sensors (20) based on the input to determine the position of the laser (22) relative to the surface (13), scanning the perimeter of the selected portions (36) with a laser beam (34), including using the determined relative positions of the laser and the surface to guide the laser beam, to cut into the maskant (18) around the perimeter, peeling the maskant (18) away from the selected portions (36), and applying the coating to the selected portions.