Abstract: Provided are atomic layer deposition methods to deposit a tungsten film or tungsten-containing film using a tungsten-containing reactive gas comprising one or more of tungsten pentachloride, a compound with the empirical formula WCl5 or WCl6.

Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.

Abstract: Provided is a strain gauge including a substrate, a resistive body, and a metal sheet. The resistive body includes a sensing portion, a first connection portion, and a second connection portion. The metal sheet covers at least the substrate that is exposed between two connection sites to which wirings to an external circuit are respectively connected and provided respectively in the first connection portion and the second connection portion and the sensing portion.

Abstract: A method of protecting a wind turbine having a set of blades, each blade having a set of loci suitable for placement of a corresponding set of lightning receptors, against lightning strikes, includes applying to each blade a coating that surrounds at least one lightning receptor locus of the set, wherein the coating comprises paint in which has been mixed a conductive powder having a concentration by weight in the coating sufficiently low as to prevent formation of a conductive path through the coating but sufficiently high as to foster ionization of air along the coated exposed surface.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact is formed above the first device layer. A first capping layer is formed at an upper end of the first bonding contact. The first capping layer has a conductive material different from a remainder of the first bonding contact. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact is formed above the second device layer. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact by the first capping layer.

Abstract: In one embodiment, a semiconductor device includes a substrate, and a plurality of insulating layers provided on the substrate. The device further includes a plurality of electrode layers provided on the substrate alternately with the plurality of insulating layers and including metal atoms and impurity atoms different from the metal atoms, lattice spacing between the metal atoms in the electrode layers being greater than lattice spacing between the metal atoms in an elemental substance of the metal atoms.

Abstract: A heating device for a domestic appliance includes a planar carrier having a carrier surface. Thermally sprayed onto the carrier surface is a layer structure, and a first solder volume is applied to the layer structure. The solder volume is an ultrasonically soldered-on solder volume. The layer structure can hereby be a heating conductor layer.

Abstract: Electrochemical sensors can include at least two electrodes, over which an electrolyte is formed. The electrodes can be isolated from one another in order for reduction/oxidation reactions to occur at the electrodes and for an electric current to flow therebetween. The present disclosure describes the use of a barrier in the electrochemical sensor that is configured to isolate electrodes from one another for the purpose of preventing electrode shorting. Additionally, the physical structure of the barrier can also act as a stencil for shaping the electrodes.

Abstract: The present disclosure relates to a method and device for decreasing generation of surface oxide of aluminum nitride. In a physical vapor deposition process, the aluminum nitride is deposited on a substrate in a deposition chamber to form an aluminum nitride coated substrate. A cooling chamber and a cooling load lock module respectively perform a first stage cooling and a second stage cooling on the aluminum nitride coated substrate in vacuum environments, so as to prevent the aluminum nitride coated substrate with the high temperature from being exposed in an atmosphere environment to generate the surface oxide. The method and device for decreasing the generation of the surface oxide of the aluminum nitride can further eliminate crystal defects caused by that gallium nitride is deposited on the surface oxide of the aluminum nitride in the next process.

Abstract: A method of forming a high temperature sensor includes preparing a substrate having a surface from an electrically insulative material having a first coefficient of thermal expansion (CTE), preparing an electrical conductor from a metal material having a second CTE that is different from the first CTE, and creating an interface between the electrical conductor and the substrate with a CTE blending medium that is provided between the substrate and the electrical conductor. The CTE blending medium accommodates differing thermal expansion rates of the substrate and the electrical conductor at temperatures of at least 700° C.

Abstract: A condensation assembly includes a condensation plate and a plurality of sumps. The condensation plate includes a plate body and a plurality of protrusions on a surface of the plate body, and the plurality of protrusions are spaced apart. The plurality of sumps are disposed at a side of the plurality of protrusions away from the plate body. Each sump of the plurality of sumps is disposed opposite to at least one of the plurality of protrusions, and has an opening facing the at least one protrusion disposed opposite to the sump. There is a gap between the plurality of sumps and the condensation plate.

Abstract: Methods of depositing platinum group metal films of high purity, low resistivity, and good conformality are described. A platinum group metal film is formed in the absence of an oxidant. The platinum group metal film is selectively deposited on a conductive substrate at a temperature less than 200° C. by using an organic platinum group metal precursor.

Abstract: Disclosed are methods of synthesizing and using Titanium-containing film forming compositions comprising titanium halide-containing precursors to deposit Titanium-containing films on one or more substrates via vapor deposition processes.

Abstract: Methods for depositing protective coatings on aerospace components are provided and include sequentially exposing the aerospace component to a chromium precursor and a reactant to form a chromium-containing layer on a surface the aerospace component by an atomic layer deposition process. The chromium-containing layer contains metallic chromium, chromium oxide, chromium nitride, chromium carbide, chromium silicide, or any combination thereof.

Abstract: In one embodiment, an adapter plate for a deposition chamber is provided. The adapter plate comprises a body, a mounting plate centrally located on the body, a first annular portion extending longitudinally from a first surface of the mounting plate and disposed radially inward from an outer surface of the mounting plate, a second annular portion extending longitudinally from an opposing second surface of the mounting plate and disposed radially inward from the outer surface of the mounting plate, and a mirror-finished surface disposed on the interior of the second annular portion, the mirror-finished surface having an average surface roughness of 6 Ra or less.

Abstract: An organotitanium compound selected from the group consisting of: (i) organotitanium compounds of Formulae (I): wherein: each of R0, R1 and R2 is the same as or different from the others, and each is independently selected from organo substituents containing olefinic or alkynyl unsaturation; and each of R3, R4, R5, R6, and R7 is the same as or different from the others, and each is independently selected from H, C1-C12 alkyl, and substituents containing olefinic or alkynyl unsaturation; (ii) organotitanium compounds including at least one tris(alkylaminoalkyl)amine ligand and at least one dialkylamine ligand, wherein alkyl is C1-C6 alkyl; and (iii) organotitanium compounds including a cyclopentadienyl ligand, and a cyclic dienyl or trienyl ligand other than cyclopentadienyl Such organotitanium compounds are usefully employed in vapor deposition processes for depositing titanium on substrates, e.g., in the manufacture of microelectronic devices and microelectronic device precursor structures.

Abstract: A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

Abstract: Protective coatings on an aerospace component and methods for depositing the protective coatings are provided. A method for depositing a coating on an aerospace component includes exposing an aerospace component to a first precursor and a first reactant to form a first deposited layer on a surface of the aerospace component by a chemical vapor deposition (CVD) process or a first atomic layer deposition (ALD) process and exposing the aerospace component to a second precursor and a second reactant to form a second deposited layer on the first deposited layer by a second ALD process, where the first deposited layer and the second deposited layer have different compositions from each other.

Abstract: In one embodiment, an adapter plate for a deposition chamber is provided. The adapter plate comprises a body, a mounting plate centrally located on the body, a first annular portion extending longitudinally from a first surface of the mounting plate and disposed radially inward from an outer surface of the mounting plate, a second annular portion extending longitudinally from an opposing second surface of the mounting plate and disposed radially inward from the outer surface of the mounting plate, and a mirror-finished surface disposed on the interior of the first annular portion, the mirror-finished surface having an average surface roughness of 6 Ra or less.

Abstract: A method for manufacturing a NdFeB rare earth permanent magnetic device with composite plating includes steps of: firstly melting alloy, casting the alloy in a melted state onto a rotation copper roller with a water cooling function, so as to be cooled for forming alloy flakes; hydrogen decrepitating; mixing after hydrogen decrepitating; jet milling after mixing; mixing under nitrogen protection before molding in a nitrogen protection magnetic field pressing machine, and then packing in a protection tank before being moved out of the protection tank and isostatic pressing; sintering in a sintering device and aging for forming a NdFeB rare earth permanent magnet; machining for forming a NdFeB rare earth permanent magnetic device; and plating the NdFeB rare earth permanent magnetic device, wherein three layers of plated films are formed.

Abstract: Molybdenum (IV) amide complexes are disclosed herein corresponding in structure to Formula (I): wherein: L is —NR1R2; R1 and R2 are C1-C6-alkyl or hydrogen; R is C1-C6-alkyl; and n is zero, 1, 2 or 3. Further, methods of forming MoO2 films by atomic layer deposition (ALD) using Formula (I) complexes and Mo[N(Me)(Et)]4 are disclosed herein.

Abstract: A component can include a substrate having an opening extending between first and second surfaces thereof, and an electrically conductive via having first and second portions. The first portion can include a first layer structure extending within the opening and at least partially along an inner wall of the opening, and a first principal conductor extending within the opening and at least partially overlying the first layer structure. The first portion can be exposed at the first surface and can have a lower surface located between the first and second surfaces. The second portion can include a second layer structure extending within the opening and at least partially along the lower surface of the first portion, and a second principal conductor extending within the opening and at least partially overlying the second layer structure. The second portion can be exposed at the second surface.

Abstract: A negative electrode 1 for lithium secondary batteries, which can increase the charge/discharge capacity of a lithium secondary battery, includes a negative electrode current collector, a negative electrode active material layer, and a lithium layer. The negative electrode active material layer is disposed on regions and of the respective surfaces and of the negative electrode current collector. The lithium layer is disposed on uncovered regions and, which are regions of the respective surfaces and of the negative electrode current collector on which the negative electrode active material layer is not disposed. The lithium layer includes lithium.

Abstract: A method of forming an electrode active material by reacting a metal fluoride and a reactant. The method includes a coating step and a comparatively low temperature annealing step. Also included is the electrode formed following the method.

Abstract: Provided is a method for manufacturing a liquid crystal display device that includes a photoalignment film. The photoalignment film is formed from a liquid crystal alignment agent, and aligns liquid crystal molecules horizontally to the main face of the at least one of the substrates. The liquid crystal alignment agent contains a solvent and at least two kinds of polyamic acids or their derivatives obtained by reacting diamine and tetracarboxylic dianhydride. At least two of the diamines and at least one of the tetracarboxylic dianhydrides are compounds represented by predetermined formulas. The method includes the steps of: (1) forming the film of the liquid crystal alignment agent; (2) pre-baking the film; (3) irradiating the pre-baked film with light; and (4) post-baking the irradiated film, the step (4) including an operation of post-baking the film multiple times at temperatures ranging from low to high temperatures.

Abstract: A method for making multiple single molecule receptors in a nanopore structure includes depositing a first material and a second material by a physical vapor deposition (PVD) technique onto different selected interior surfaces of a nanochannel and functionalizing a surface of the first material, the second material, or both the first and second materials with a chemical compound having at least two functional groups. The first and second materials can be the same or different and form patches having diameters of about 1 to about 100 nanometers (nm). Also disclosed are embodiments of a nanopore structure including multiple single molecule receptors.

Abstract: The present invention provides a method for manufacturing an electrode of a lithium battery electrode, comprising: (a) providing a substrate; (b) coating a paste on a portion of the substrate; (c) plating a metal film onto the paste or the substrate; (d) disposing a welding point at an end of the substrate; wherein the advantages of the present invention are to conduct current in three-dimensional direction and reduce the problem of electric conductivity because of thermal effect. In addition, the present invention can further avoid the problem of the electrode oxidation.

Abstract: The electrical and optical performance of silver LED reflective contacts in III-V devices such as GaN LEDs is limited by silver's tendency to agglomerate during annealing processes and to corrode on contact with silver-reactive materials elsewhere in the device (for example, gallium or aluminum). Agglomeration and reaction are prevented, and crystalline morphology of the silver layer may be optimized, by forming a diffusion-resistant transparent conductive layer between the silver and the source of silver-reacting metal, (2) doping the silver or the diffusion-resistant transparent conductive layer for improved adhesion to adjacent layers, or (3) doping the silver with titanium, which in some embodiments prevents agglomeration and promotes crystallization of the silver in the preferred <111> orientation.

Abstract: A method of making an electrical conductor includes depositing an ultra-thin layer including aluminum-doped zinc oxide layer on a surface and using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide.

Abstract: The invention relates to a method for the functionalisation of metal nanowires and the use of said nanowires. The functionalisation method of the invention includes a step comprising the formation of a self-assembled monolayer on at least part of the external surface of metal nanowires, using a compound of formula R1—Zn—R2, wherein Z is S or Se, and n is equal to 1 or 2, and R1 is a hydrogen atom or an acyl group or a hydrocarbon group comprising between 1 and 100 carbon atoms and R2 is an electron-attracting or -donating group. The method if the invention is particularly suitable for use in the field electrode production.

Abstract: A method for making an anode active material is described. The anode active material includes a phosphorus composite material. In the method, a solid-state red phosphorus and a porous conductive carbon material are provided. The solid-state red phosphorus and the porous conductive carbon material are spaced disposed in a vessel and the vessel is sealed. The solid-state red phosphorus is sublimed by heating the vessel to make the sublimed red phosphorus diffused in the porous conductive carbon material. The sublimed red phosphorus is condensed. The condensed red phosphorus adsorbs in the porous conductive carbon material to form the phosphorus composite material.

Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.

Abstract: A method of manufacturing an organic light emitting display apparatus, the method includes loading a substrate on a moving unit, determining an angle formed between a side of the substrate and an opening in a patterning slit sheet, rotating the patterning slit sheet by two X motors so that the side of the substrate and the opening in a patterning slit sheet extend along the same direction and forming a layer on the substrate while conveying the substrate on the moving unit in the first direction in a chamber. The patterning slit sheet moves along a direction perpendicular to the first direction during the forming the layer on the substrate so that a deposition layer having a linear pattern that extends along the first direction is formed on the substrate.

Abstract: A method for fabricating articles for use in optics, electronics, and plasmonics includes large scale lithography or other patterning and conformal deposition such as by atomic layer deposition.

Abstract: The present invention provides a process for producing a graphene-enhanced anode active material for use in a lithium battery. The process comprises (a) providing a continuous film of a graphene material into a deposition zone; (b) introducing vapor or atoms of a precursor anode active material into the deposition zone, allowing the vapor or atoms to deposit onto a surface of the graphene material film to form a sheet of an anode active material-coated graphene material; and (c) mechanically breaking this sheet into multiple pieces of anode active material-coated graphene; wherein the graphene material is in an amount of from 0.1% to 99.5% by weight and the anode active material is in an amount of at least 0.5% by weight, all based on the total weight of the graphene material and the anode active material combined.

Abstract: A method of manufacturing a solenoidal magnet structure, comprising the steps of providing a collapsible mold in which to wind coils; winding wire into defined positions (88) in the mold to form coils (34); placing a preformed tubular mechanical support structure (102, 120) over the coils (34) so wound; impregnating the coils and bonding them to the mechanical support structure by applying a thermosetting resin and allowing the thermosetting resin to harden; and collapsing the mold and removing the resultant solenoidal magnet structure comprising the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.

Abstract: In the present invention, a copper electrode having a nanohole structure is prepared by using a polymer substrate in the form of nanopillars in order to avoid fatigue fracture that causes degradation of electrical and mechanical properties of a flexible electrode during repetitive bending of a typical metal electrode. The nanohole structure may annihilate dislocations to suppress the initiation of fracture and may blunt crack tips to delay the propagation of damage. Therefore, the nanohole electrode exhibits very small changes in electrical resistance during a bending fatigue test.

Abstract: A method for depositing a thin film of a coating material onto an electrically conductive particle surface via supercritical fluid deposition includes providing electrically conductive particles, providing a precursor of a coating material, dissolving the precursor of the coating material into a supercritical fluid solvent to form a supercritical solution of the precursor and subsequently exposing the conductive particles to the supercritical solution in a reactor under conditions at which supercritical fluid deposition of a thin film of the coating material onto surfaces of the conductive particles occurs.

Abstract: Transparent conductive coatings are polished using particle slurries in combination with mechanical shearing force, such as a polishing pad. Substrates having transparent conductive coatings that are too rough and/or have too much haze, such that the substrate would not produce a suitable optical device, are polished using methods described herein. The substrate may be tempered prior to, or after, polishing. The polished substrates have low haze and sufficient smoothness to make high-quality optical devices.

Abstract: Exemplary embodiments provide materials and methods for forming monodisperse particles. In one embodiment, the monodisperse particles can be formed by first spraying a nanoparticle-containing dispersion into aerosol droplets and then heating the aerosol droplets in the presence of a shell precursor to form core-shell particles. By removing either the shell layer or the nanoparticle core of the core-shell particles, monodisperse nanoparticles can be formed.

Abstract: Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof.

Abstract: An infrared light sensor chip comprises a substrate (2), an infrared light sensor (9), which has a base electrode (10) that is in direct contact with one side (8) of the substrate (2) and which is used to attach the infrared light sensor (9) to the substrate (2), and a resistance thermometer (13), which has a resistance path (14) in direct contact with the side (8) of the substrate (2) adjacent to the infrared light sensor (9) and configured to measure the temperature of the substrate (2) via the resistance thermometer (13). The resistance path (14) is made of the same material of which the base electrode (10) is made.

Abstract: A substrate assembly includes a first hexagonal boron nitride sheet directly bonded to a surface of a substrate, and a metal layer on the first hexagonal boron nitride sheet.

Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract: Provided herein are energy storage device cathodes with high capacity electrochemically active material including compounds that include iron, fluorine, sulfur, and optionally oxygen. Batteries with active materials including a compound of the formula FeFaSbOc exhibit high capacity, high specific energy, high average discharge voltage, and low hysteresis, even when discharged at high rates. Iron, fluorine, and sulfur-containing compounds may be ionically and electronically conductive.

Abstract: Battery systems using coated conversion materials as the active material in battery cathodes are provided herein. Protective coatings may be an oxide, phosphate, or fluoride, and may be lithiated. The coating may selectively isolate the conversion material from the electrolyte. Methods for fabricating batteries and battery systems with coated conversion material are also provided herein.

Abstract: A current collector is covered with sodium metal through: (1) applying a sodium dispersion containing sodium metal and at least one substance selected from the group consisting of an imide salt and a binder, on a current collector in an inert gas environment (with an oxygen concentration of not more than 0.01% and a dew point of not more than ?10° C.), followed by heating and drying; (2) pressure bonding a piece of solid sodium metal having a surface which exhibits a metallic luster onto a current collector in the aforementioned inert gas environment; (3) vapor-depositing sodium metal on a current collector in a reduced pressure environment; or (4) immersing a current collector having a surface fired at a temperature ranging from 150 to 300° C. in molten sodium metal after removing a coating film which is generated on a surface and formed from impurities, in the aforementioned inert gas environment.