Abstract: A process for preparing a metal styrene polymer composite having nano metallic particles deposited thereon is disclosed, which includes a) undergoing free radical polymerization of styrene and an optional co-monomer in the presence of a persulfate initiator and a chain transfer agent; and b) contacting the resulting styrene oligomer or copolymer of styrene and the co-monomer from step a) with an aqueous solution containing a noble metal ion dissolved therein, so that the noble metal ion is reduced to element form particles and deposit on the styrene oligomer or copolymer of styrene and the co-monomer by sulfates on the oligomer or copolymer in the absence of a reducing agent.

Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heav

Abstract: There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.

Abstract: Methods and associated structures of forming a microelectronic structure are described. Those methods may comprise dissolving a metal precursor in a non-aqueous solvent in a bath; placing a substrate comprising an interconnect opening in the bath, wherein the metal precursor forms a monolayer within the interconnect opening; and placing the substrate in a coreactant mixture, wherein the coreactant reacts with the metal precursor to form a thin barrier monolayer.

Abstract: A method for reducing cure shrinkage of a thermoset resin includes forming a plurality of surface modified nanofibers. The surface modified nanofibers are formed by soaking nanofibers in an oxidizing acidic solvent. An oxidizing agent is added to the soaking nanofibers, thereby generating heat sufficient for at least one of in-situ oxidation and in-situ exfoliation of a subsurface of each of the nanofibers. Excess oxidizing agent and acidic solvent are removed from the nanofibers, which are then dried. The dried nanofibers have reduced surface hydrophobicity. The surface modified nanofibers are substantially uniformly dispersed into the thermoset resin. The surface modified nanofibers are adapted to reduce cure shrinkage of the thermoset resin during subsequent curing processes.

Abstract: An electrically conductive member (10) includes an elongate body (11) which has at least one electrically conductive region (20). The electrically conductive region (20) comprises a porous polymeric material coated with an electrically conductive material. A method of manufacturing the electrically conductive member (10) includes the steps of extruding an elongate body of polymeric material wherein at least one region of the elongate body is porous in nature; and coating said elongate body with an electrically conductive material such that the electrically conductive material substantially coats the pores of said at least one region.

Abstract: Disclosed is a multilayer film for plating comprising, on a surface of a first substrate, a plating receptive layer which contains a polymer having a polymerizable group and a functional group, wherein the plating receptive layer satisfies at least one of the following (1)-(4): (1) the saturated water absorption ratio is from 0.01 to 10% by mass in an environment of a temperature of 25° C. and relative humidity of 50%; (2) the saturated water absorption ratio is from 0.05 to 20% by mass in an environment of a temperature of 25° C. and relative humidity of 95%; (3) the water absorption ratio is from 0. 1 to 30% by mass after immersion in boiling water at 100° C. for one hour; and (4) the surface contact angle of distilled water is from 50° to 150° after 5 ?l of the distilled water is dropped onto the plating receptive layer and allowed to stand for 15 seconds in an environment of a temperature of 25° C. and relative humidity of 50%.

Abstract: A method for manufacturing a wiring substrate includes the steps of (a) providing a first surface-active agent in first and second areas and of a substrate, (b) providing a second surface-active agent in the first area of the substrate, (c) providing a catalyst on the second surface-active agent, and (d) depositing a metal layer on the catalyst to thereby form a wiring composed of the metal layer along the first area.

Abstract: A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b) removing residues of the surface-active agent in the second area by wet-etching with an alkali; (c) patterning a catalyst to be remained on one of the second area of the substrate and the surface-active agent; and (d) depositing a metal layer on the catalyst to thereby form a wiring.

Abstract: The present invention is a structured monolith reactor and method that provides for controlled Fischer-Tropsch (FT) synthesis. The invention controls mass transport limitations leading to higher CO conversion and lower methane selectivity. Over 95 wt % of the total product liquid hydrocarbons obtained from the monolithic catalyst are in the carbon range of C5-C18. The reactor controls readsorption of olefins leading to desired products with a preselected chain length distribution and enhanced overall reaction rate. And, liquid product analysis shows readsorption of olefins is reduced, achieving a narrower FT product distribution.

Abstract: The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.

Abstract: The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.

Abstract: A surface modification liquid for plastic that in pretreatment for metallization of a plastic surface by metal plating, solves the problems of etching treatment with the use of conventional etching liquid containing chromic acid, etc. There is provided a surface modification liquid for plastic characterized by containing permanganic acid, phosphoric acid and nitric acid.

Abstract: The present invention provides a method of manufacturing capable of readily obtaining a surface metal film material that has excellent adhesiveness of a metal film, reduced variability of adhesion due to humidity changes and excellent heat resistance and flexibility, and a method of manufacturing capable of readily obtaining a patterned metal material excellent in insulation reliability of a region where a patterned metal is not formed, and excellent in heat resistance and flexibility.

Abstract: A silver salt-containing layer containing a silver salt and provided on a support is exposed and developed to form a metal silver portion and a light-transmitting portion, and then the metal silver portion is further subjected to physical development and/or plating to form a conductive metal portion consisting of the metal silver portion carrying conductive metal particles. A method for producing a light-transmitting electromagnetic wave-shielding film which enables production of an electromagnetic wave-shielding material simultaneously having high EMI-shielding property and high transparency in a fine line pattern and also enables mass production of such films at a low cost, and a light-transmitting electromagnetic wave-shielding film obtained by the production method and free from the problem of moire are provided.

Abstract: An ink-jettable composition including a palladium aliphatic amine complex solvated in a liquid vehicle can be used in formation of electronic devices. The ink-jettable composition containing a palladium aliphatic amine complex can be jetted onto a substrate in a predetermined pattern. A second composition can also be applied to the substrate using ink-jet printing or other printing techniques, wherein the second composition is applied onto at least a portion of the predetermined pattern. The second composition can include a reducing agent which is capable of reducing the palladium aliphatic amine complex to palladium metal, typically upon the application of heat. The described ink-jettable palladium complex compositions can be stable over a wide range of conditions and allow for the formation electronic devices on a variety of substrates.

Abstract: A method of forming a hydrogen transport membrane to separate hydrogen from a hydrogen containing feed in which a porous ceramic support is formed to support a dense layer of palladium or an alloy of palladium serving as a hydrogen transport material. Isolated deposits of palladium, a palladium alloy or a component of such alloy are produced on a surface of the porous ceramic support that bridge pores within the porous ceramic support without penetrating the pores and without bridging regions of the surface defined between the pores. The isolated deposits of the metal are produced by an electroless plating process.

Abstract: A method for making an oxidation resistant article, including (a) depositing a layer of a Pt group metal on a substrate to form a platinized substrate; and (b) depositing on the platinized substrate layer of Pt group metal a layer of a reactive element selected from the group consisting of Hf, Y, La, Ce and Zr and combinations thereof to form a surface modified region thereon, wherein the surface modified region includes the Pt-group metal, Ni, Al and the reactive element in relative concentration to provide a ?-Ni+??-Ni3Al phase constitution.

Abstract: Methods and resulting structures are described in which a metal layer is adhered to a surface of a substrate. The methods involve applying a sacrificial acidic organic layer to the surface of the substrate prior to depositing the metal layer onto the substrate. During deposition of the metal layer, the sacrificial acidic organic layer is substantially consumed, thereby leaving behind a metal/substrate interface that has excellent adhesion properties.

Abstract: The present invention provides a composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts. The etching composition of the invention is a novel etching solution capable of forming a plating film having a good adhesion to various resin molded articles made of ABS resins or the like, and can be used in place of chromic acid mixtures. The composition is highly safe so that the liquid waste is easily disposed of.

Abstract: An electroless palladium plating liquid, with excellent bath stability, that can provide a film with excellent corrosion resistance, solder bondability, and wire bondability is provided. The invention is an electroless palladium plating liquid, comprising: a water soluble palladium compound; at least one of ammonia, an amine compound, an aminocarboxylic acid compound, and carboxylic acid as a complexing agent; and bismuth or a bismuth compound as a stabilizer. Preferably the electroless palladium plating liquid further comprises at least one of hypophosphorous acid, phosphorous acid, formic acid, acetic acid, hydrazine, a boron hydride compound, an amine borane compound, and salts thereof as a reducing agent.

Abstract: The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate.

Abstract: A material for forming electroless plate comprising a non-conductive substrate and a catalyst adhering layer provided on the substrate is constituted so that the catalyst adhering layer contains a hydrophilic ionizing radiation curable resin composition, a surface of the catalyst adhering layer shows a contact angle of 60° or smaller to purified water, and preferably the hydrophilic ionizing radiation curable resin composition is in a half-cured state for the portion of the catalyst adhering layer. A material for forming electroless plate shows favorable adhesion for catalyst, and the catalyst adhering layer hardly dissolves into a plating solution in the step of adhering catalyst, the step of development and other steps.

Abstract: The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized.

Abstract: A gas separation membrane and a method of manufacturing such gas separation membrane that comprises a porous substrate treated with a layer of metal-coated inorganic oxide particles and with the layer of such metal-coated inorganic oxide particles being coated with an overlayer of a gas-selective material.

Abstract: A method and apparatus for treating the surfaces of individual filaments in multifilament yarn. The method includes the steps of immersing the yarn into a liquid treatment solution and coating all exposed surface areas of each individual filament with the treatment solution, disrupting the orientation of the individual filaments and coating all newly exposed surface areas of each individual filament with the treatment solution, and repeating the previous steps until a predetermined treatment level is achieved. A filament orientation disruption assembly may include at least one roller having a roller profile such that for a given transverse section of the roller, a roller surface perimeter has a plurality of points located a plurality of distinct distances from a central axis of the roller, i.e., a non-cylindrical roller. The method is particularly effective in plating highly anisotropic uniaxially oriented polymer fibers, such as PBO.

Abstract: The invention provides a metallic pattern forming method comprising: forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide and has a functional group that interacts with either an electroless plating catalyst or a precursor thereof, is generated in a pattern shape; imparting either an electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape, wherein the polyimide has at least one structural unit represented by the following Formula (1) or Formula (2) and has a polymerization initiating site in a skeleton thereof. R1 represents a bivalent organic group. R2 is represented by one of Formulae (3) to (6). R3, R4, R5 and R6 independently represents a bivalent organic group.

Abstract: A method for forming an electroless plating film on surfaces of various types of polymer members is provided, the electroless plating film being formed economically with high adhesion strength. The method for forming the plating film on the polymer member comprises preparing a polymer member including a metal substance, in an internal portion of the polymer member, which serves as plating catalyst cores, the polymer member having a surface on which the plating film is to be formed and which is inactive to the electroless plating solution at an atmospheric pressure; and forming the plating film on the surface of the polymer member by bringing the polymer member in contact with the electroless plating solution to which the pressurized carbon dioxide has been added.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may include an electroless plating process, that may comprise an electroless plating bath, wherein the electroless plating bath comprises a stabilizer and a suppressor, separating the stabilizer and the suppressor by using a HPLC, determining the concentration of a UV/VIS detectable one of the stabilizer and the suppressor by using a UV/VIS, and determining the concentration of an ELSD detectable one of the suppressor and the stabilizer by using an ELSD.

Abstract: The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.

Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.

Abstract: Metallic substrates have a surface for receiving application of an adhesive that includes a precipitated coating of metallic nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion is in contact with the first portion. Also provided are adhered constructs. These constructs include a first substrate with a first surface that has a metallic precipitated coating of nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion contacts the first portion. The constructs include a second substrate that has a second surface; and an adhesive is applied between the first surface and the second surface.

Abstract: A method of fabricating nano-silver fibers is provided. An organic solution of a dispersant is prepared. Then, a silver salt and a reductant are added into the organic solution. The organic solution is stirred to let the silver salt and the reductant react to form silver nanoparticles dispersed in the organic solution uniformly. Next, a spinnable polymer resin is dissolved in the organic solution to form a spinning solution. A wet spinning method is performed to let the spinning solution form nano-silver fibers.

Abstract: A process for manufacturing a gas sensor including a detecting element having an electrode containing a precious metal formed on a surface of a solid electrolyte, comprising: a first step of applying a nuclei of a precious metal having a catalyzing action on a gas to be measured; and a second step of growing the nuclei, wherein the first step uses a physical vapor deposition method.

Abstract: Provided is a catalytic surface activation method for electroless deposition comprising a metallic aerosol nanoparticle generation step of generating metallic aerosol nanoparticles, which act as plating initiation catalyst; a metallic aerosol nanoparticle fixation step of fixing the resultant metallic aerosol nanoparticles on a plating surface; and an electroless deposition step of impregnating the material to be plated in an electroless deposition solution to form a plating layer on the plating surface on which the metallic aerosol nanoparticles have been fixed. The catalytic surface activation method for electroless deposition of the present invention is applicable to large-scale plating with simple process and superior applicability, improves the plating characteristics with little impurity generation, requires no post-treatment process for removing impurities and is environment-friendly with no wastewater generation by directly fixing metallic aerosol nanoparticles on the material to be plated.

Abstract: Methods for forming traces/lines and interconnects on substrates and devices and systems thereof of herein disclosed. In some embodiments, an activator layer is deposited on a surface of a substrate. Pick-up lithography using a pre-patterned lithographic stamp, ultraviolet lithography or like methods are used to selectively remove portions of the activator layer to form a pattern on the surface of the substrate. Electroless metal deposition is then applied to the surface of the substrate to form a metal pattern selectively on the remaining activator layer. Electroless plating can then be used to form traces/lines and interconnects in dimensions of less than 10 micrometers.

Abstract: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.

Abstract: A body structure has an inner region shape that defines a cavity within the body structure. The cavity within the body structure is designed to hold a fluid. A chuck includes a top that is capable of holding a substrate, and a body portion that has a complementary shape with respect to the inner region shape of the body structure. The complementary shape of the chuck body portion at least partially aligns with the inner region shape that defines the body structure cavity. The chuck body portion is designed to move into the cavity of the body structure and displace the fluid held within the cavity, so as to shift the fluid over the top of the chuck. The body portion of the chuck is also designed to move out of the cavity of the body structure, so as to remove the fluid from over the top of the chuck.

Abstract: A method of fabricating of a metal line by a wet process is provided. A catalytic adhesive layer is formed on an insulating substrate. A fist metal layer is formed by an electoless plating process, and then, a second metal layer is formed by an electoless plating process or an electoplating process. The first and the second metal layers are patterned to form a metal line.

Abstract: Electro-magnetic-energy absorbing materials are used to treat air filters, such as those used in association with electronic equipment thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are processes and materials for applying EMI-absorbing materials to air filters thereby improving EMI-shielding effectiveness in an economically efficient manner. In one embodiment, an absorptive solution is prepared using an absorptive material and a binding agent. A heavy coating of absorbing solution applied to an air filter substrate, for example by dipping or spraying. Excess absorbing material is subsequently removed and the absorbing material cured, such that the passage of air through the filter remains substantially unimpeded. The resulting absorptive air filter is then optionally treated with a flame retardant to meet a predetermined safety standard.

Abstract: A method for preparing a palladium-containing layer comprises the steps of cleaning a top surface of the porous substrate, modifying the top surface of the porous substrate to form a planar surface, performing a seeding process on the planar surface to adhere palladium nanoparticles on the planar surface and performing an electroless plating process to form the palladium-containing layer on the planar surface. The step of modifying the top surface of the porous substrate includes filling holes of the porous substrate with aluminum oxide particles, coating a sol-gel containing aluminum oxide or silicon oxide on the top surface of the porous substrate, The step of performing a seeding process on the planar surface includes exposing the planar surface of the porous substrate in a nanocolloidal solution having dispersed palladium nanoparticles derived from a palladium-containing species and a surfactant.

Abstract: Electrolytic plating can be carried out with a uniform thickness even when the resistance of a plating seed layer is comparatively high, thereby improving the formation precision of products and improving the yield of products. In a method of carrying out plating on a substrate, an insulating layer, which includes conductive parts that conduct electricity to the substrate, is formed on the substrate that is made of a resistor, a plating seed layer, which conducts electricity to the substrate via the conductive parts, is formed on the insulating layer, and a plating film is formed on the plating seed layer with the plating seed layer as a power supply layer.

Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.

Abstract: The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured.

Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.

Abstract: A flexible thin metal film system is made by directly depositing an electrically-conductive metal onto the metal surface of a self-metallized polymeric film.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.

Abstract: The present invention generally relates to an improved process for the hydrothermal conversion of coral into hydroxyapatite, a process for coating an object with hydroxyapatite, a process for coating an object with a divalent metal phosphate and uses of objects prepared by these processes. Following the processes according to the present invention, the resultant hydroxyapatite has greater strength and bioactivity than that of the coral prior to its conversion.

Abstract: An environmentally resistant gas turbine engine disk is disclosed. The disk includes a substrate metal having locally enriched surface regions, the locally enriched surface regions comprising alloying elements present in a higher percentage than found in the substrate metal. A method for making the disk and other articles is also disclosed. The method includes furnishing a plurality of powder particle substrates made of a substrate metal, providing a nonmetallic precursor of a metallic coating material, wherein the metallic coating material includes an alloying element that is thermophysically melt incompatible with the substrate metal, contacting the powder particle substrates with the nonmetallic precursor, and chemically reducing the nonmetallic precursor to form coated powder particles comprising the powder particle substrates having a surface-enriched layer of the metallic coating material thereon, wherein the step of chemically reducing is performed without melting the powder particle substrates.