Abstract: A single component liquid heat-curable adhesive formulation that is stable at room temperature. The formulation includes from about 5 to about 70 wt % of at least one acrylate monomer, from about 5 to about 94 wt % of an acrylate oligomer, and from about 0.1 to about 10 wt % of a thermal initiator selected from the group consisting of diacyl peroxides, benzoyl peroxides and peroxy esters. A photo initiator may be included thereby rendering the stable liquid formulation to be both heat-curable and UV-curable.

Abstract: The present invention is a coating unit for coating a substrate with a coating solution, comprising a coating solution discharge member for discharging the coating solution to the substrate which is positioned in a downward part. A lower surface of the coating solution discharge member is in a shape having a length longer, at least, than the radius of the substrate and having a narrow width. A coating solution discharge port is disposed in a portion of the coating solution discharge member, facing the center of the substrate, while a solvent mist discharge port for discharging a solvent mist of the coating solution is disposed in a portion facing a peripheral portion including an outer edge potion of the substrate, when the coating solution discharge member is positioned above the radius of the substrate.

Abstract: In aluminum-based metal pigments produced by physical vapor deposition of a metal film and subsequent crushing of the metal film metal surfaces which are exposed after the operation of crushing the metal film and in particular fracture surfaces thereof are covered with a passivting protective layer to afford corrosion stability of those metal pigments.

Abstract: A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.

Abstract: In one embodiment, a spin coating process comprises: dispensing a solution of a solution solvent and about 3 to about 30 wt % thermoplastic polymer, based upon the total weight of the solution, wherein the solution solvent has a boiling point at atmospheric pressure of about 110° C. to about 250° C., a polarity index of greater than or equal to about 4.0, a pH of about 5.5 to about 9; spinning the substrate; and removing the solution solvent to produce a coated substrate comprising a coating having less than or equal to 10 asperities over the entire surface of the coated substrate.

Abstract: This invention relates to a method for imparting soil-resistant and water-repellent properties to fibrous polyamide substrates (such as carpet fibers) by applying an acidic aqueous treating solution containing a silsesquioxane. This invention also relates to the treating solution used to impart soil resistance, and water repellency to the fibrous polyamide. This invention also relates to treated fibrous substrate made according to the method of this invention.

Abstract: A method for coating a micro-electromechanical system (MEMS) device is provided. A coating material, such as a ceramic slurry, may be utilized to form a gas permeable enclosure or shell around the device after the coating material hardens. A vacuum may be applied near the device to exert an attractive force on the coating material to aid in homogenously distributing the coating material over the device. In addition, a vibration may be applied to the device to aid in distributing the coating material. If the device is attached to a substrate, a hole may be formed through the substrate with one opening near the device and a second opening located elsewhere. The vacuum may then be applied to the second opening to draw the coating material over the device and towards the first opening.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: A process for coating a solid surface (42) with a conditioned liquid composition of substantially uniform thickness is provided. A liquid composition is conditioned by a) degassing either via vacuum or by sparging with a high kinematic viscosity gas; and b) substantially maintaining the viscosity of the liquid composition. The conditioned liquid may then be dispensed onto a solid surface (42) positioned in a sub-atmospheric environment (37) or in a helium-rich environment (37). The solid surface (42) is rotated so that the liquid composition forms a uniformly thick coating free from bubbles on the solid surface (42) and thereby produces a thin film of uniform thickness.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: A coated film forming method is capable of readily forming a coated film of a thermoplastic material on a coated region of an inner peripheral surface of a cylinder. A nozzle, through which a molten paste of a thermoplastic material kept molten is discharged, is disposed toward an inner peripheral surface of a cylinder. The nozzle is moved along a rotational central line of the cylinder while rotating the cylinder and discharging the molten paste from the nozzle. Centrifugal force acting on the cylinder being rotated leads to spreading of the molten paste applied to the inner peripheral surface of the cylinder. Viscosity of the molten paste, a rotational speed of the cylinder and a speed of movement of the nozzle are set so as to keep the molten paste discharged from the nozzle from being scattered to a region other than the coated region.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A method of applying a matching layer to a transducer includes placing the transducer on a fixture and covering the transducer with a stencil so that an opening in the stencil allows access to a metal-coated, piezoelectric surface of the transducer, and so that the stencil is affixed to the transducer surface. A roughly cylindrically shaped bead of epoxy is extruded onto the stencil at a predetermined distance from the opening, and a blade is positioned upstanding relative to the transducer surface and located so that the bead lies between the blade and the opening. The fixture is moved laterally so that the blade rolls the bead across the exposed transducer surface to form a layer of epoxy thereon. The fixture can then be moved back in the opposite direction to its initial position if desired. The assembly can also be subjected to a vacuum before the fixture is returned to its initial position. If desired, the fixture can be designed to vibrate during movement.

Abstract: A leaf coater, in which a constant quantity of a coating solution is supplied intermittently from a coating solution supply source through a predetermined coating solution quantity intermittent supply means and a coating solution applying means to a blank substrate, for coating blank substrates one by one with the coating solution, characterized in that a coating solution filtration means is provided in the coating solution flow pipeline from said coating solution supply source to the coating solution applying means, and the Young's modulus of the filter medium in the coating solution filtration means is not less than 200 MPa, while the pore size of the filter medium is in the range of 0.05 &mgr;m to 100 &mgr;m; and a method for producing coated substrates using said leaf coater.

Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.

Abstract: An evaporation-induced self-assembly method to prepare a porous, surfactant-templated, thin film by mixing a silica sol, a solvent, a surfactant, and an interstitial compound, evaporating a portion of the solvent to form a liquid, crystalline thin film mesophase material, and then removal of the surfactant template. Coating onto a substrate produces a thin film with the interstitial compound either covalently bonded to the internal surfaces of the ordered or disordered mesostructure framework or physically entrapped within the ordered or disordered mesostructured framework. Particles can be formed by aerosol processing or spray drying rather than coating onto a substrate. The selection of the interstitial compound provides a means for developing thin films for applications including membranes, sensors, low dielectric constant films, photonic materials and optical hosts.

Abstract: A plurality of production line recipes and film thickness measurement recipes that recite the same type of coating solution, but different target film thickness are prepared in a coating unit. Recipes that recite the same types of coating solution and the same film thickness are linked to a common spin curve. A film thickness measurement recipe is executed so as to calculate a compensated value for a revolving speed for each measured data of the film thickness. The designated values of revolving speeds of individual recipes can be compensated using the compensated value at a time.

Abstract: A sealant dispensing system is disclosed which is capable of applying sealant material to irregularly shaped, i.e., non-circular, closure members. To accomplish this, the closure member is loaded onto a rotary chuck in a conventional manner. The sealant applying gun, however, is moveable relative to the end. In this manner, through a combination of rotation of the closure member and movement of the gun, the gun is able to follow the outline of a closure member of any shape. In order to allow non-circular closure members to be loaded onto a chuck, the chuck must first be stopped. After the closure member is loaded, chuck rotation is then initiated. In order to allow this selective chuck rotation, the chuck may be attached to a servo motor. An electromagnet may be located in proximity to each chuck of the sealant dispensing system.

Abstract: Disclosed is a film-forming method, comprising dispensing from a dispenser nozzle a coating solution, which is prepared by adding a solid component to a solvent and controlled to be spread on the substrate in a predetermined range, onto a target substrate to be processed while relatively moving the dispenser nozzle and the target substrate so as to form a liquid film on the entire surface of the target substrate, and arranging a sucking nozzle above and apart from the target substrate such that the sucking nozzle is not in contact with the surface of the liquid film so as to permit the sucking nozzle to suck the solvent vapor right under the sucking nozzle while moving the sucking nozzle relative to the target substrate, thereby removing the solvent from the liquid film and, thus, forming a coated film.

Abstract: A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: A method and apparatus is provided for preparing an optical information medium comprising a disk-shaped substrate having a center hole, an information recording layer thereon, and a resin-based light-transmitting layer thereon by which recording/reading laser beam is transmitted. The apparatus includes a rotating table (2) for holding and rotating the substrate (100) having the information recording layer borne thereon, a plug means (3) including a disk member (31) for closing the center hole (101) and an integral support shaft (32), and a nozzle (4) for feeding a coating fluid containing the resin to the outer periphery of the support shaft (32), wherein the coating fluid is flowed from the support shaft to the disk member, then over the substrate, thereby forming the light-transmitting layer having a minimized thickness variation.

Abstract: A recording medium based on the organic dye having excellent storage reliability is to be produced. In producing an optical recording medium having on a substrate a recording layer containing an organic dyestuff and a metal layer, the metal layer is first formed, and the atmosphere of a transport path used for transferring the resulting product to the next stage is set to the relative humidity of 40% or less. The metal layer may e.g., be a reflective layer. In controlling the relative humidity, a shielding plate is provided around the transport path and the relative humidity of an area encircled by this shielding plate is controlled by an air conditioner.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: An information layer for an optical information storage medium is formed in a centrifuge. A photopolymerizable composition is applied to a solid base having a relief pattern, and a flexible, transparent film layer is applied on top of the composition. The three are spun in a centrifuge to cause a thin, even distribution of the photopolymerizable composition, which is photopolymerized. The resulting replica is separated from the relief pattern and has a fluorescent material applied thereto. Alternatively, the replica has a non-fluorescent material applied thereto, and the non-fluorescent material is made fluorescent through diffusion. Multiple information layers thus formed can be glued together to form a multilayer optical information storage medium.

Abstract: A method for coating an electric coil of a workpiece. A step of the method includes applying a curable coating material to the electric coil of the workpiece. Another step includes externally vibrating the workpiece before the applied curable coating material has cured. An embodiment of apparatus for coating an electric coil of a workpiece includes a mechanism for applying a curable coating material to the electric coil of the workpiece and also includes a mechanism for externally vibrating the workpiece before the applied curable coating material has cured.

Abstract: This pertains generally to precursors and deposition methods suited to aerogel thin film fabrication of nanoporous dielectrics. An aerogel precursor sol is disclosed. This aerogel precursor sol contains a metal alkoxide (such as TEOS) and a solvent, but no gelation catalyst. By a method according to the present invention, such a precursor sol is applied as a nongelling thin film 14 to a semiconductor substrate 10. This substrate may contain patterned conductors 12, gaps 13, or other structures. An independent gelation catalyst (preferably, vapor phase ammonia) is added to promote rapid gelation of the thin film sol 14 at the desired time. One advantage is that it allows substantially independent control of gelation and pore fluid evaporation. This independent catalyst introduction allows additional processing steps to be performed between sol deposition and the onset of substantial gelation. One potential step is to evaporate a portion of the pore fluid solvent.

Abstract: A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: This invention relates to a semiconductor substrate processing apparatus and method for forming interconnects by filling a circuit pattern groove and/or a hole formed in a semiconductor substrate with a plated metal film, and removing the plated metal film while leaving the metal film at the filled portion. The apparatus comprises a carry-in and carry-out section for carrying in and carrying out a semiconductor substrate, which has a circuit formed on a surface thereof, in a dry state; a plated metal film forming unit for forming a plated metal film on the semiconductor substrate which has been carried in; a bevel etching unit for etching a peripheral edge portion of the semiconductor substrate; a polishing unit for polishing at least part of the plated metal film on the semiconductor substrate; and a transport mechanism for transporting the semiconductor substrate between the above units.

Abstract: A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.

Abstract: A method for removing contaminants from a semiconductor wafer having a spin on coating of material. Contaminants are removed by applying a cleaning solution to the periphery, and preferably, the exposed backside of the wafer after the edge bead has been dissolved and removed. The cleaning solution is formulated to react chemically with unwanted coating material residue to form a compound that may be ejected from the periphery of the spinning wafer. Any residual solution or precipitate that is not ejected from the wafer may be rinsed away with water, preferably deoinized water. One exemplary use of this method is the removal of metallic contaminants that may be left on the periphery and backside of a wafer after the formation of ferroelectric film coatings. A cleaning solution comprising a mixture of hydrochloric acid HCl and water H2O or ammonium hydroxide NH4OH and water H2O is applied to the periphery of the spinning wafer.

Abstract: Methods and apparatuses for efficiently forming a homogeneous glass layer having uniform thickness and a homogeneous metal layer having uniform thickness are provided. A workpiece is accommodated in a screened container which is rotatable in a predetermined direction. The workpiece in the container is sprayed with an atomized glass slurry or an atomized metal slurry while the container is rotated in order to form a green glass layer or a green metal layer on the workpiece. Simultaneously, hot air is supplied to the workpiece so as to dry the green glass layer or the green metal layer. Thus, the workpiece, typically a ferrite core, can be provided with a homogeneous layer having a uniform thickness. A method for manufacturing an electronic component using the above-described methods and apparatuses is also provided.

Abstract: A device and method for planarizing a film layer device on a silicon wafer. The device has a circular track whose surface faces the track center, a carrier capable of moving along the track and carrying wafers around with their front surfaces facing the center, and a set of heating elements for heating the film layers on the wafers to make them fluid. Utilizing the centrifugal force on the film layer generated by the circular movement and the fluidity of the film layer provided by heating, planarization of the film layer is achieved.

Abstract: In a plating method for successively treating a plating target from a pre-treatment step until a plating treatment, (A) a vibrationally stirring apparatus for a treatment bath, (B) an aeration apparatus for the treatment bath, (C) an apparatus for swinging an electrode bar for suspending the plating target thereon, and (D) an apparatus for applying vibration to the electrode bar, are operated in a cleaning tank and at least one of an electroless plating tank and an electroplating tank used as a treatment tank in the pre-treatment step and the plating step.

Abstract: A resist film having a thickness of 5500Å or less is coated on the wafer having a large diameter of 8 inches or more by the spin coat process. A resist is dripped while allowing the wafer to be rotated at a rotation speed of 500 rpm to 1200 rpm and the dripping of the resist is suspended at the time of spreading the resist on the whole surface of the wafer. The rotation speed is raised to the predetermined rotation speed which regulates the thickness of the resist film and is determined from the correlation of the predetermined rotation speed and the thickness of the resist film. The wafer is rotated for 1 second to 5 seconds at the predetermined rotation speed. Then, the wafer is rotated for 15 seconds or more at the rotation speed which is lower than the predetermined rotation speed.

Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.

Abstract: A liquid coating nozzle is provided with a first block which has an inner liquid reserving section that extends in the longitudinal direction and an inner discharge section which includes a plurality of small holes formed in the longitudinal direction at a bottom portion of the liquid reserving section. The nozzle is also provided with a second block which has an inner space defining a gas reserving section that extends in the longitudinal direction outside the first block and an outer discharge section formed in the longitudinal direction at a bottom portion of the inner space. The outer discharge section includes a plurality of small holes and produces a gas flow that externally surrounds a linear or curtain-shaped liquid flow that flows downward from the small holes. This results in the formation of a thin coating film in a short time and reduces the consumption of liquid and coating nonuniformities.

Abstract: The invention provides an adhesive cooling gel composition which stably contains a large amount of water and which is excellent in cooling effect and/or coolness-preserving effect, and a process for preparing the same. The composition comprises a polyacrylic acid compound, a polyvalent metal component and water, wherein the content of water is 75 to 95% by weight based on the cooling composition.

Abstract: A dielectric interlayer is formed over a semiconductor substrate comprising at least one active region. The exposed upper surface of the dielectric interlayer is treated with nitrogen to form a nitrided barrier layer thereon. At least one hydrogen-containing dielectric layer is formed over the dielectric interlayer having the nitrided barrier layer thereon. The nitrided barrier layer serves as a barrier to diffusion of hydrogen from the at least one hydrogen-containing dielectric layer into the dielectric interlayer, thereby preventing a decrease in hot carrier injection reliability.

Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.

Abstract: A presentation is given of an improved method for coating lamp tubes for gas discharge lamps and for drying the coating, as well as of a device designed for the method, in the case of which method and device, during coating and drying, the lamp tubes are arranged at an oblique angle to the horizontal.

Abstract: A method and apparatus is provided for more efficiently application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating to accommodate the application of solvent tot he center of the wafer surface. The method also describes incorporating a new solvent comprising DI-Acetone Alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.

Abstract: Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an array of tacky and non-tacky areas with particles adhered thereon for a period of time and at a temperature to allow the particles to adhere and center to the tacky areas. The surface containing the array of tacky and non-tacky areas can be heated either prior to, during or after a step of contacting the array with particles. Either discrete sheets or a continuous moving web of material having a surface containing an array of tacky and non-tacky areas can be employed. Each tacky area of an array of tacky and non-tacky areas has a size and bonding strength suitable for adhesion of one particle thereto in formation of an array.

Abstract: Method and apparatus for applying a protective coating to the surfaces of air vents in a vented brake rotor wherein the method includes the steps of rotating the rotor, directing coating material along with a stream of air toward the inlets of the vents to flood the vents with coating material to coat the surfaces, applying a suction to the outlets of the vents to remove and recover the excess material, and curing the coating. The apparatus includes fixtures for mounting the rotors that are driven to rotate the rotors during the coating operation, and for automatic operation a conveyer for advancing the rotors through a vent coating station, an exterior coating station for coating exterior rotor surfaces, and a curing station.

Abstract: A system for removing resin from the stator core of a stator of a motor involves means for removing resin (1) from an inner circumferential surface surrounding the bore of the stator core; (2) from the outer circumferential surface of the stator core; and (3) from between the windings along the end surfaces of the stator core. The circumferential surfaces have resin removed from them by moving the surfaces relative to a series of wipers. The wipers push the resin off the surfaces as they sweep the surfaces. Resin is removed from the end surfaces by blowing the resin radially inward, where it either drips off the core or is deposited on the inner circumferential surface, from which it is removed by wipers.

Abstract: A manufacturing method for electronic devices including applying photosensitive or non-photosensitive resin onto a substrate by a slit-type dropping nozzle method. A slit-type dropping nozzle for performing resin application is scanned to apply resin while maintaining a scanning direction of the nozzle in an inclined condition relative to the substrate at a specified angle in substantially a same direction as a rotating direction of the substrate after resin has been applied thereto. With the above method, even in a case in which clogging of a part of the nozzle due to foreign matter and dropping defects have occurred, the uniformity in film thickness typically will not be affected unless the defect has occurred in the center of the substrate.

Abstract: A semiconductor memory device and method of fabricating same is provided that has a plurality of ferroelectric memory cells and reference cells. The semiconductor memory device includes a capacitor of each memory cell being the same size as that of each reference cell. A voltage applied to each reference cell is higher than a voltage applied to each memory cell to read data out of the semiconductor memory device. A method of fabricating a ferroelectric substance for a semiconductor memory device includes dissolving zirconium n-butoxide and titanium iso-proxide in 2-methoxyethanol; chelating a resultant, obtained by dissolution, with acetylacetone; adding lanthanium (La) iso-proxide to the resultant and refluxing the resultant; adding lead (Pb) acetate trihydrate to the resultant, and stirring the resultant, using a nitric acid as a catalyzer; and carrying out spin-coating and thermal treatment processes on the resultant.

Abstract: A method for coating a substrate with a radioisotope comprising is disclosed. The method comprises immersing the substrate within a solution containing a .gamma., .beta..sup.+, .alpha. or .beta..sup.- emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation (i.e. ultrasonic) to produce a coated substrate, followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate. Following this step, the substrate is rinsed and dried. Substrates coated using the method of this invention exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications.