Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition) Patents (Class 427/443.1)
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Patent number: 7943199Abstract: A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.Type: GrantFiled: April 20, 2009Date of Patent: May 17, 2011Assignee: Fujifilm CorporationInventors: Takeyoshi Kano, Kazuki Yamazaki, Masataka Sato
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Publication number: 20110111182Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.Type: ApplicationFiled: June 25, 2009Publication date: May 12, 2011Inventors: Matthew S. Stay, Mikhail L. Pekurovsky, Cristin E. Moran, Matthew H. Frey
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Publication number: 20110104380Abstract: The present invention provides a method for producing a molded article which enables dissolution of a desired amount of a subject material in a molten resin without any limitation by the solubility of a high-pressure carbon dioxide in the molten resin and which is therefore suitable for commercial production of molded articles. The present invention pertains to a method for producing a molded article by molding a molten resin, and this method is characterized by including steps of supplying a high-pressure carbon dioxide and a subject material dissolved therein, into the molten resin; kneading the molten resin into which the high-pressure carbon dioxide and the subject material have been supplied; and exhausting the high-pressure carbon dioxide from the kneaded molten resin.Type: ApplicationFiled: June 9, 2009Publication date: May 5, 2011Applicant: HITACHI MAXELL, LTD.Inventors: Atsushi Yusa, Tetsuya Ano, Satoshi Yamamoto, Toshiyuki Ogano
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Publication number: 20110086165Abstract: A porous silicon zone is metallized by performing in situ reduction of metallic ions dissolved in an aqueous solution and fixing of the metallic particles obtained on said zone in a single step. This step consists in particular in bringing the solution containing the metallic ions into contact with the zone to be metallized, the surface whereof has previously been functionalized to enable in situ reduction of the metallic ions and fixing of the metallic particles. Functionalization of the porous silicon zone is achieved by grafting two particular and distinct types of chemical functions. The first function used is a chelating chemical function for the metallic ions and/or for the metal corresponding to the metallic ions, whereas the second function is a reducing chemical function for the metallic ions. Such a metallization can be used for producing an electrically conducting porous diffusion layer of a fuel cell.Type: ApplicationFiled: September 29, 2010Publication date: April 14, 2011Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Frédéric-Xavier GAILLARD, Olivier RACCURT
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Patent number: 7910164Abstract: Provided are bifunctional magnetic core-semiconductor shell nanoparticles and a manufacturing method thereof. The method includes mixing magnetic core material precursors and a reducing agent for the core material precursors; preparing a first mixture solution; heating and cooling the first mixture solution and preparing magnetic core materials; mixing the magnetic core materials with semiconductor shell material precursors and a reducing agent for the semiconductor shell material precursors; preparing a second mixture solution; and heating and cooling the second mixture solution and coating the magnetic core materials with the semiconductor shell materials.Type: GrantFiled: September 24, 2007Date of Patent: March 22, 2011Assignee: Korea University FoundationInventors: Young Keun Kim, Hong Ling Liu, Jun Hua Wu, Ji Hyun Min, Ju Hun Lee
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Patent number: 7897198Abstract: Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer (in the range of a few hundred angstroms). The components are typically a reducing agent and a metal source.Type: GrantFiled: September 3, 2002Date of Patent: March 1, 2011Assignee: Novellus Systems, Inc.Inventors: Heung L. Park, Eric G. Webb, Jonathan D. Reid, Timothy Patrick Cleary
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Publication number: 20110042050Abstract: A composite material can include a carrier material that is coated, at least over part of the surface, with a corrosion protection layer made of an aluminum alloy. The composite material can provide a defined, effective, durable corrosion protection and simultaneously have a high recycling potential. The aluminum alloy of the corrosion protection layer can have the following composition in % by weight: ? 0.8 ?Mn ? 1.8 Zn ? 0.05 Cu ? 0.05 Si ? 1.0 Cr ? 0.25 Zr ? 0.25 Mg ? 0.10 remainder aluminum and unavoidable impurities, individually a maximum of 0.05% by weight, in total a maximum of 0.15% by weight.Type: ApplicationFiled: January 14, 2009Publication date: February 24, 2011Applicant: Hydro Aluminium Deutschland GmbHInventors: Manfred Mrotzek, Raimund Sicking
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Patent number: 7875110Abstract: An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit cobalt metal in or on semiconductor substrate surfaces including vias, trenches, and interconnects.Type: GrantFiled: February 16, 2010Date of Patent: January 25, 2011Assignee: Micron Technology, Inc.Inventors: Rita J. Klein, Adam J. Regner, III
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Publication number: 20100310781Abstract: In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals.Type: ApplicationFiled: August 16, 2010Publication date: December 9, 2010Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventor: Takahiro Yurino
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Patent number: 7846503Abstract: The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom.Type: GrantFiled: October 3, 2003Date of Patent: December 7, 2010Assignee: Enthone Inc.Inventors: Franz-Josef Stark, Helmut Horsthemke, Ulrich Treuner
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Publication number: 20100291312Abstract: A substrate is immersed in a metal compound solution prepared by dissolving a plurality of metal compounds of metals differing from each other, to thereby form an alloy film having a desired alloy composition on the surface of the substrate.Type: ApplicationFiled: October 22, 2008Publication date: November 18, 2010Inventors: Hideyuki Murakami, Yukio Matsubara, Syunsuke Moriizumi, Hiromichi Murakami, Mikiyo Yoshida
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Patent number: 7833583Abstract: An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.Type: GrantFiled: March 27, 2007Date of Patent: November 16, 2010Inventors: Trevor Pearson, Paul Bray
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Patent number: 7829153Abstract: The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.Type: GrantFiled: March 13, 2009Date of Patent: November 9, 2010Assignee: Science Applications International CorporationInventors: Paul E. Schoen, Ronald R. Price, Joel M. Schnur, Daniel Zabetakis, Robert F. Brady, Jr., Ann Mera, Dana Leamann, Bor-Sen Chiou, Walter J. Dressick
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Patent number: 7829152Abstract: An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.Type: GrantFiled: October 5, 2006Date of Patent: November 9, 2010Assignee: Lam Research CorporationInventors: William Thie, John M. Boyd, Yezdi Dordi, Fritz C. Redeker
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Publication number: 20100247774Abstract: Partially aromatic polyamide compositions containing an aliphatic polyamide and an alkaline earth metal carbonate have excellent adhesion to metal coatings which are produced by electroless and/or electrolytic plating. Also described is a process for the electroless and/or electrolytic coating of these compositions. The resulting articles are useful as parts in automotive and industrial applications.Type: ApplicationFiled: November 24, 2008Publication date: September 30, 2010Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Andri E. Elia, Claudio Pierdomenico
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Publication number: 20100208412Abstract: Provided are a ferroelectric material having good ferroelectricity and good insulation property, and a ferroelectric device using the ferroelectric material. In the present invention, the ferroelectric material includes a metal oxide having a perovskite-type crystal structure, in which: the metal oxide contains bismuth ferrite whose iron is substituted by manganese, and at least one of a copper oxide and a nickel oxide; the bismuth ferrite is substituted by manganese at a substitution ratio of 0.5 at. % or more to 20 at. % or less with respect to a total amount of iron and manganese; and at least one of the copper oxide and the nickel oxide is added in an amount of 0.5 mol % or more to 20 mol % or less with respect to the bismuth ferrite whose iron is substituted by manganese.Type: ApplicationFiled: February 4, 2010Publication date: August 19, 2010Applicants: CANON KABUSHIKI KAISHA, TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATIONInventors: Kenji Takashima, Makoto Kubota, Soichiro Okamura, Takashi Nakajima, Tomosato Okubo, Yosuke Inoue
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Patent number: 7758681Abstract: A cobalt-based alloy electroless plating solution according to the present invention comprises a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dimethylamine borane (DMAB) or borohydride and the stabilizer is one or more compounds selected from a group consisting of imidazole, thiazole, triazole, disulfide and their derivatives; and which is stable enough for long-term reuse and prevents deterioration of metal thin-film quality by inhibiting the formation of a precipitate.Type: GrantFiled: December 29, 2006Date of Patent: July 20, 2010Assignee: LG Chem, Ltd.Inventors: Sang-chul Lee, Min-kyoun Kim, Min-jin Ko
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Patent number: 7727596Abstract: A method for fabricating a composite gas separation module includes depositing a preactivated powder over a porous substrate; depositing a binder metal onto the preactivated powder; and depositing a dense gas-selective membrane to overlie the preactivated powder and binder metal, thereby forming the composite gas separation module. The preactivated powder can be, for example, selected from the group consisting of preactivated metal powders, preactivated metal oxide powders, preactivated ceramic powders, preactivated zeolite powders, and combinations thereof. The preactivated powder can be deposited, for example, from a slurry such as a water-based slurry. In some embodiments, the dense gas-selective membrane is a dense hydrogen-selective membrane.Type: GrantFiled: July 21, 2004Date of Patent: June 1, 2010Assignee: Worcester Polytechnic InstituteInventors: Yi Hua Ma, Federico Guazzone
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Patent number: 7721425Abstract: A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic part; and carrying out connecting to the nickel plating coat through a lead-free solder, wherein a half-width of X-ray diffraction of a (111) plane of Ni crystal in the nickel plating coat is 5 degrees or less.Type: GrantFiled: July 30, 2003Date of Patent: May 25, 2010Assignee: The Furukawa Electric Co., Ltd.Inventor: Junya Hirano
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Patent number: 7704307Abstract: An electroless palladium plating liquid, with excellent bath stability, that can provide a film with excellent corrosion resistance, solder bondability, and wire bondability is provided. The invention is an electroless palladium plating liquid, containing: a water soluble palladium compound; at least one of ammonia, an amine compound, an aminocarboxylic acid compound, and carboxylic acid as a complexing agent; and bismuth or a bismuth compound as a stabilizer. Preferably the electroless palladium plating liquid further contains at least one of hypophosphorous acid, phosphorous acid, formic acid, acetic acid, hydrazine, a boron hydride compound, an amine borane compound, and salts thereof as a reducing agent.Type: GrantFiled: July 7, 2006Date of Patent: April 27, 2010Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Akihiro Aiba, Hirofumi Takahashi
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Patent number: 7704562Abstract: A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.Type: GrantFiled: August 14, 2006Date of Patent: April 27, 2010Inventor: John L. Cordani, Jr.
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Patent number: 7691189Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.Type: GrantFiled: April 17, 2007Date of Patent: April 6, 2010Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Publication number: 20100068615Abstract: A resin composition for metal plating provides a molded article exhibiting excellent metal plating adhesion strength and chemical resistance, while having excellent productivity. A metal-plated molded article can also be made from such a resin composition. The resin composition for metal plating includes 50-90% by mass of Component (A) and 10-50% by mass of Component (B), the total of Component (A) and Component (B) being 100% by mass, wherein Component (A) is a polypropylene resin, and Component (B) is a rubber-reinforced vinyl resin obtained by polymerizing a vinyl monomer in the presence of a rubber-like polymer, or a mixture of the rubber-reinforced vinyl resin and a (co)polymer of the vinyl monomer. The composition may further include 0.5-30 parts by mass of a compatibilizer (C) per 100 parts by mass of the total of Component (A) and Component (B). Component (B) is preferably a non-diene rubber-reinforced resin.Type: ApplicationFiled: November 20, 2007Publication date: March 18, 2010Applicant: Techno Polymer Co., LtdInventors: Hiroyoshi Kaito, Takashi Kurata, Toshiyuki Higashijima
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Patent number: 7666471Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.Type: GrantFiled: March 22, 2006Date of Patent: February 23, 2010Inventors: Mark Wojtaszek, James Watkowski, Gary B. Larson, Peter Kukanskis
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Publication number: 20100020153Abstract: Provided are an image drum and a method of manufacturing the image drum. The image drum includes multiple ring electrodes arranged along a longitudinal direction of a drum body and on an outer circumferential surface of the drum body. The ring electrodes are separated from each other. Between the ring electrodes there are ring insulator molds. The image drum can be manufactured by patterning a seed layer on the outer surface of the drum body, forming multiple ring insulator molds on the seed layer, and depositing a conductive material between the ring insulator molds to form the ring electrodes.Type: ApplicationFiled: May 8, 2009Publication date: January 28, 2010Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: EUNG-YEOUL YOON, Kae-Dong Back, Jin-Seung Choi
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Patent number: 7648913Abstract: A film formation method is provided which includes positioning an object within an electroless deposition apparatus having means for instantaneous temperature control of the object and electrolessly depositing a material upon the object. More specifically, the method includes instantaneously changing the temperature of the object by the means of instantaneous control at one or more predetermined times during the step of electrolessly depositing the material, wherein the predetermined times correspond to different film-growth stages of the material.Type: GrantFiled: September 19, 2006Date of Patent: January 19, 2010Assignee: Lam Research CorporationInventor: Igor C. Ivanov
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Publication number: 20100009206Abstract: A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H2N—X—R1??(1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R1 represents a nitrogen-containing heterocyclic group). H2N—X—R1??(1-2) (In the formula, X is as defined above, and R1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule). (In the formula, R represents a nitrogen-containing heterocyclic group). (In the formula, R represents a monovalent residue).Type: ApplicationFiled: July 25, 2007Publication date: January 14, 2010Applicant: UBE INDUSTRIES, LTD.Inventors: Kikuo Ataka, Tetsurou Tsuji
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Patent number: 7645370Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heavType: GrantFiled: September 10, 2002Date of Patent: January 12, 2010Assignee: Daicel Polymer Ltd.Inventors: Toshihiro Tai, Ippei Tonosaki
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Publication number: 20100003399Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.Type: ApplicationFiled: June 25, 2009Publication date: January 7, 2010Applicant: C. UYEMURA & CO., LTD.Inventors: TERUYUKI HOTTA, TAKAHIRO ISHIZAKI, TOMOHIRO KAWASE, MASAHARU TAKEUCHI
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Patent number: 7641781Abstract: In a method for coating a substrate, and a coated object, in a first step, in an external current-less or electrolytic manner, nickel and/or cobalt and/or platinum are deposited on a substrate in a deposition bath. In the deposition bath, particles are additionally suspended which contain at least one metal selected from Mg, Al, Ti, Zn and no Cr, the particles becoming occluded in the coating. In a second step, the actual protective layer is produced by heat treatment. The coating of component parts may be used for aircraft turbines or gas turbines or for garbage incineration systems having temperature-resistant protective layers against high temperature corrosion.Type: GrantFiled: November 3, 2003Date of Patent: January 5, 2010Assignee: MTU Aero Engines GmbHInventors: Andreas Dietz, Gebhard Klumpp, Juergen Olfe
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Publication number: 20090294088Abstract: The invention provides foams of desired cell sizes formed from metal or ceramic materials that coat the surfaces of carbon foams which are subsequently removed. For example, metal is located over a sol-gel foam monolith. The metal is melted to produce a metal/sol-gel composition. The sol-gel foam monolith is removed, leaving a metal foam.Type: ApplicationFiled: June 30, 2006Publication date: December 3, 2009Inventors: Richard L. Landingham, Joe H. Satcher, JR., Paul R. Coronado, Theodore F. Baumann
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Publication number: 20090274597Abstract: This invention relates to a method and device for catchment of platinum group metals (PGM) in a gaseous stream, where the method comprises using a catalyst comprising a porous ceramic body in which at least a part of the surface area is covered by one or more PGM-catching metal(s)/alloy(s), and where the device comprises the porous ceramic body in which at least a part of the surface area is covered by one or more PGM-catching metal(s)/alloy(s). In a further aspect, the invention also relates to a method for producing the inventive device.Type: ApplicationFiled: September 7, 2007Publication date: November 5, 2009Inventors: David Waller, David M. Brackenbury, Ketil Evjedal
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Patent number: 7611569Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.Type: GrantFiled: July 6, 2007Date of Patent: November 3, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Publication number: 20090257056Abstract: Disclosed herein is a structure having a spatially organized polymer nanostructured thin film and a metal coating on the film. The thin film is made by directing a monomer vapor or pyrolyzed monomer vapor towards a substrate at an angle other than perpendicular to the substrate, and polymerizing the monomer or pyrolyzed monomer on the substrate.Type: ApplicationFiled: June 3, 2009Publication date: October 15, 2009Applicant: The Government of the United States of America, as represented by the Secretary of the NavyInventors: Melik C. Demirel, Walter J. Dressick, David Allara
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Publication number: 20090224422Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.Type: ApplicationFiled: January 9, 2009Publication date: September 10, 2009Inventor: Valery M. Dubin
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Patent number: 7582334Abstract: A new treatment method for ion exchange membranes used in semi-fuel cells that accelerates the wetting of the membranes by aqueous electrolyte solutions, thus reducing the start up time for metal/hydrogen peroxide-based semi-fuel cells. Specifically, a NAFION® membrane that is intended for dry storage in a semi-fuel cell is treated with glycerin (glycerol) to enhance its rate of absorption of electrolyte solution when the semi-fuel cell is activated.Type: GrantFiled: August 11, 2004Date of Patent: September 1, 2009Assignee: The United States of America as represented by the Secretary of the NavyInventors: Louis G. Carreiro, Charles J. Patrissi, Steven P. Tucker
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Patent number: 7560016Abstract: To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region and a recessed region in said first non-plating region. Then, an accelerator film is applied globally on the workpiece. A portion of the accelerator film is selectively removed from the field region, and another portion of the accelerator film remains in the recessed acceleration region. Then, metal is deposited onto the workpiece, and the metal deposits at an accelerated rate in the acceleration region, resulting in a greater thickness of metal in the acceleration region compared to metal in the non-activated field region. Then, metal is completely removed from the field region, thereby forming the metal feature.Type: GrantFiled: November 7, 2008Date of Patent: July 14, 2009Assignee: Novellus Systems, Inc.Inventors: Steven T. Mayer, John Stephen Drewery
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Patent number: 7559979Abstract: A hydrogen separator is provided, including a porous substrate having a large number of pores communicating from a first surface to a second surface thereof, and having a hydrogen-separating layer disposed on the first surface so that the hydrogen-separating layer has a penetrated portion extending through the pores from the first surface to a particular depth. An average pore diameter at the first surface of the porous substrate is 0.02 to 0.5 ?m, a thickness of the hydrogen-separating layer is 1 to 5 ?m, and a penetration depth of the penetrated portion is 0.05 to 1 ?m, is at least equal to the average pore diameter at the one surface of the porous substrate, and is not larger than one half of the thickness of the hydrogen-separating layer. The hydrogen separator hardly generates defects such as cracks, peeling and the like in the hydrogen-separating layer, is superior in durability, and provides both good hydrogen-separating ability and good hydrogen permeability.Type: GrantFiled: January 27, 2006Date of Patent: July 14, 2009Assignee: NGK Insulators, Ltd.Inventors: Ken-ichi Noda, Osamu Sakai
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Publication number: 20090176028Abstract: The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.Type: ApplicationFiled: March 13, 2009Publication date: July 9, 2009Applicants: Science Application International Corporation, Department of the NavyInventors: Paul E. SCHOEN, Ronald R. Price, Joel M. Schnur, Daniel Zabetakis, Robert F. Brady, JR., Ann Mera, Dana Leamann, Bor-Sen Chiou, Walter J. Dressick
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Patent number: 7537799Abstract: An ink-jettable composition including a palladium aliphatic amine complex solvated in a liquid vehicle can be used in formation of electronic devices. The ink-jettable composition containing a palladium aliphatic amine complex can be jetted onto a substrate in a predetermined pattern. A second composition can also be applied to the substrate using ink-jet printing or other printing techniques, wherein the second composition is applied onto at least a portion of the predetermined pattern. The second composition can include a reducing agent which is capable of reducing the palladium aliphatic amine complex to palladium metal, typically upon the application of heat. The described ink-jettable palladium complex compositions can be stable over a wide range of conditions and allow for the formation electronic devices on a variety of substrates.Type: GrantFiled: July 11, 2003Date of Patent: May 26, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventor: Tom Etheridge
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Publication number: 20090130339Abstract: The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, using an electroless plating method of forming a metal plating layer on the surface of a base material made of resin powder in an electroless plating solution, wherein an ultrasonic treatment is performed at the time of forming the plating layer. The present invention has advantages in that an aggregation phenomenon, which is generated when the base material made of the resin powder is plated using an electroless plating method, does not occur and a plating reaction can be performed at low temperature, so that it is possible to obtain a compact plating layer and plating powder having improved uniformity and adherence with respect to resin powder.Type: ApplicationFiled: October 13, 2006Publication date: May 21, 2009Inventors: Won Il Son, Dong Ok Kim, Jeong Hee Jin, Seok Heon Oh
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Patent number: 7531215Abstract: A method of forming a hydrogen transport membrane to separate hydrogen from a hydrogen containing feed in which a porous ceramic support is formed to support a dense layer of palladium or an alloy of palladium serving as a hydrogen transport material. Isolated deposits of palladium, a palladium alloy or a component of such alloy are produced on a surface of the porous ceramic support that bridge pores within the porous ceramic support without penetrating the pores and without bridging regions of the surface defined between the pores. The isolated deposits of the metal are produced by an electroless plating process.Type: GrantFiled: November 15, 2005Date of Patent: May 12, 2009Assignee: Praxair Technology, Inc.Inventors: Prasad S. Apte, Joseph Michael Schwartz, Shawn W. Callahan
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Patent number: 7527681Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.Type: GrantFiled: July 6, 2007Date of Patent: May 5, 2009Assignee: Rohm and Haas Electronic Materials LLPInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Patent number: 7517555Abstract: A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.Type: GrantFiled: April 26, 2002Date of Patent: April 14, 2009Assignee: Hitachi Metals, Ltd.Inventors: Fumiaki Kikui, Kaoru Kojima, Yoriyoshi Oooka, Kohshi Yoshimura
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Patent number: 7510744Abstract: A process for producing a resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability includes providing a porous structure at least on the surface of the resin layer; and forming the metallic layer on the surface of the resin layer.Type: GrantFiled: May 4, 2005Date of Patent: March 31, 2009Assignee: Fuji Xerox Co., Ltd.Inventors: Hiroshi Tamemasa, Makoto Omata, Shigeo Ohta, Takahiro Okayasu
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Publication number: 20090075095Abstract: Methods for processing a substrate utilizing a backside layer are presented including: receiving a substrate, the substrate including a front side and a backside; forming the backside layer on the backside of the substrate; and performing at least one processing operation on the front side of the substrate, wherein the backside layer protects the backside of the substrate during the performing the at least one processing operation. In some embodiments, methods further include cross-linking the backside layer such that the backside layer is stabilized. In some embodiments, methods further include: functionalizing the backside layer, where the functionalizing alters a chemical characteristic of the backside layer, and where the functionalizing includes a functional group such as: a hydroxyl group, an amino group, a mercapto group, a fluorine group, a chlorine group, an alkene group, an aryle group, and a carboxy group.Type: ApplicationFiled: September 11, 2008Publication date: March 19, 2009Inventors: Igor Ivanov, Tony Chiang, Chi-I Lang
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Patent number: 7501014Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.Type: GrantFiled: July 6, 2007Date of Patent: March 10, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Patent number: 7498062Abstract: A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.Type: GrantFiled: May 26, 2004Date of Patent: March 3, 2009Assignee: WD Media, Inc.Inventors: Anthony Calcaterra, David Knox
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Publication number: 20090042021Abstract: A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.Type: ApplicationFiled: October 31, 2006Publication date: February 12, 2009Applicants: Nara Institute of Science and Technology, Nippon Mining & Metals Co., Ltd.Inventors: Jun-ichi Kikuchi, Yoshihiro Sasaki, Mineo Hashizume, Toru Imori
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Publication number: 20090025966Abstract: The present invention provides: a copper-clad laminate, facilitating the formation of highly reliable fine wires, in which copper foil has been formed firmly on a flat and smooth surface; a laminate; an electroless plating material; a fiber-resin composite; and a printed wiring board obtained with use of them. Further, the present invention provides a method for manufacturing a multilayer printed wiring board on which fine wires can be formed with high accuracy and a multilayer printed wiring board that is obtained by the method. A copper-clad laminate of the present invention includes a plated copper layer (1), a resin layer (2), and a fiber-resin composite layer (3), and is arranged at least such that the plated copper layer (1) and the resin layer (2) are laminated so as to make contact with each other. The copper-clad laminate (10) is arranged such that a plated copper layer is formed on a resin layer having good adhesive properties with respect to copper foil.Type: ApplicationFiled: April 19, 2006Publication date: January 29, 2009Inventors: Kanji Shimoosako, Takashi Ito, Shigeru Tanaka, Masaru Nishinaka, Mutsuaki Murakami