Abstract: A method for manufacturing an electrode for use in an electrical storage device includes bringing a porous material into contact with an oxidizing agent, then bringing the porous material into contact with a polymerizable monomer, so that the porous material is modified with an electrically-conductive polymer formed by a polymerization reaction of the polymerizable monomer and the oxidizing agent, and forming, on a surface of a collector, an active material layer containing the porous material modified with the electrically-conductive polymer.

Abstract: An electricity-storing device includes a first electrode, a second electrode of opposite polarity as the first electrode, and a separator.

Abstract: A capacitor structure includes at least two capacitors. A first electrode includes a bottom conductive plane and first vertical conductive structures. The bottom conductive plane is disposed over a substrate. The bottom conductive plane has a first area and a first shape. At least two second electrodes include top conductive planes and second vertical conductive structures. A combined area of the top conductive planes and a gap area between adjacent top conductive planes has a second area and a second shape. The first area and the second area are about the same and the first shape and the second shape are about the same. An insulating structure is disposed between the first electrode and the second electrodes. The first vertical conductive structures and the second vertical conductive structures are interlaced with each other. The capacitors share the bottom conductive plane and have separate top conductive planes.

Abstract: A method of patterning an elastomeric polymer material includes: (a) dissolving a precursor of the elastomeric polymer material in a solvent to give an elastomeric polymer precursor solution; and (b) forming a pattern from the elastomeric polymer precursor solution on a base by using a printer, wherein a temperature of the base is maintained to be about 10° C.-30° C. higher than a boiling point of the solvent.

Abstract: Compact touch sensors for touch sensitive devices and processes for forming the touch sensors are disclosed. The touch sensor structure can include a substrate, one or more underlying layers disposed on the substrate, one or more blocking layers disposed on the substrate or on one or more underlying layers, and one or more patterned layers disposed on the underlying layers or blocking layers. The one or more blocking layers can be configured to block underlying layers from exposure to certain wavelengths of light or from penetration of a laser beam that can cause damage. Additionally, the one or more underlying layers can be multi-functional, including the ability to block one or more light sources.

Abstract: A specific embodiment of the present invention is a process for continuously producing a porous solid film of spacer-modified nano graphene platelets for supercapacitor electrode applications. This process comprises: (a) dissolving a precursor material in a solvent to form a precursor solution and dispersing multiple nano graphene platelets into the solution to form a suspension; (b) continuously delivering and forming the suspension into a layer of solid film composed of precursor material-coated graphene platelets overlapping one another, and removing the solvent from the solid film (e.g., analogous to a paper-making, mat-making, or web-making procedure); (c) continuously converting the precursor material into nodules bonded to surfaces of graphene platelets to form a porous solid film composed of spacer-modified graphene platelets; and (d) continuously collecting the porous solid film on a collector (e.g., a winding roller).

Abstract: Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor.

Abstract: Capacitive touch device styluses, comprising tips coated with an electrically conductive coating.

Abstract: A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B.

Abstract: In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).

Abstract: Capacitors and methods of forming capacitors are disclosed, and which include an inner conductive metal capacitor electrode and an outer conductive metal capacitor electrode. A capacitor dielectric region is received between the inner and the outer conductive metal capacitor electrodes and has a thickness no greater than 150 Angstroms. Various combinations of materials of thicknesses and relationships relative one another are disclosed which enables and results in the dielectric region having a dielectric constant k of at least 35 yet leakage current no greater than 1×10?7 amps/cm2 at from ?1.1V to +1.1V.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.

Abstract: A carbon-based electrode includes activated carbon, carbon black, and a binder. The binder is fluoropolymer having a molecular weight of at least 500,000 and a fluorine content of 40 to 70 wt. %. A method of forming the carbon-based electrode includes providing a binder-less conductive carbon-coated current collector, pre-treating the carbon coating with a sodium napthalenide-based solution, and depositing onto the treated carbon coating a slurry containing activated carbon, carbon black and binder.

Abstract: A method for producing a ferroelectric thin film comprising: coating a composition for forming a ferroelectric thin film on a base electrode of a substrate having a substrate body and the base electrode that has crystal faces oriented in the (111) direction, calcining the coated composition, and subsequently performing firing the coated composition to crystallize the coated composition, and thereby forming a ferroelectric thin film on the base electrode, wherein the method includes formation of an orientation controlling layer by coating the composition on the base electrode, calcining the coated composition, and firing the coated composition, where an amount of the composition coated on the base electrode is controlled such that a thickness of the orientation controlling layer after crystallization is in a range of 35 nm to 150 nm, and thereby controlling the preferential crystal orientation of the orientation controlling layer in the (100) plane.

Abstract: This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.

Abstract: A method for producing a ferroelectric thin film comprising: coating a composition for forming a ferroelectric thin film on a base electrode of a substrate having a substrate body and the base electrode that has crystal daces oriented in the (111) direction, calcining the coated composition, and subsequently performing firing the coated composition to crystallize the coated composition, and thereby forming a ferroelectric thin film on the base electrode, wherein the method includes formation of an orientation controlling layer by coating the composition on the base electrode, calcining the coated composition, and firing the coated composition, where an amount of the composition coated on the base electrode is controlled such that a thickness of the orientation controlling layer after crystallization is in a range of 5 nm to 30 nm, and thereby controlling the preferential crystal orientation of the orientation controlling layer to be in the (110) plane.

Abstract: Polyimides derived from a primary aromatic diamine and aromatic dianhydride mono-mer moieties, wherein one or more of said moieties contain at least one substituent on the aromatic ring selected from propyl and butyl, especially from isopropyl, isobutyl, tert.butyl, show good solubility and are well suitable as dielectric material in electronic devices such as capacitors and organic field effect transistors.

Abstract: A touch screen panel includes a substrate, first sensing patterns, second sensing patterns, and an insulating layer. The first sensing patterns may be configured to include a plurality of first sensing cells separated from one another as independent patterns. The second sensing patterns may be configured to include a plurality of second sensing cells formed on the substrate. The insulating layer may be interposed between the first and second connecting patterns at intersection portions of the first connecting patterns and the second connecting patterns. The insulating layer may be an island-shaped independent pattern at each intersection portion. End portions of each first connecting pattern may electrically connect adjacent first sensing cells. A width of a first region of each first connecting pattern may be wider than that of a second region.

Abstract: A supercapacitor electrode mechanism comprising an electrically conductive, porous substrate, having one or more metallic oxides deposited on a first surface and a chemically reduced graphene oxide deposited on a second surface, to thereby provide an electrical double layer associated with the substrate. The substrate may be carbon paper or a similar substance. The layers of the supercapacitor are optionally rolled into an approximately cylindrical structure.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: Provided are a method and device for marking an article for security, tracking or authentication. The method includes depositing a solution comprising a nucleic acid marker onto at least a portion of the article. The nucleic acid marker may be activated, for example, by adding a functional group to the nucleic acid marker. The activation of the nucleic acid marker may be performed by exposure to alkaline conditions. The method is well suited for marking fibers and textiles, as well as many other items.

Abstract: Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.

Abstract: Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.

Abstract: The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.

Abstract: A method of manufacturing a variable capacitor includes forming a capacitor conductor. The method also includes forming a phase change material adjacent the capacitor conductor. The method further includes forming a first contact on the capacitor conductor. The method additionally includes forming a second contact and a third contact on the phase change material.

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

Abstract: New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.

Abstract: A method of producing an electrode for an electricity storage device includes producing a paste to form an electrode active material layer, in which aggregates of a solids fraction material that contains at least an electrode active material and a binder are dispersed in a solvent, coating the paste on a surface of a current collector, and drying the current collector coated with the paste, to form the electrode active material layer formed of the solids fraction material. The paste is produced in such a manner that a content ratio of the solids fraction material in the paste is 60 to 80 mass %, an abundance ratio for the aggregates with a particle size that is equal to or smaller than 20 ?m is at least 99%, and a viscosity at 25° C. and a shear rate of 40 s?1 is 200 to 5,000 mPa·s.

Abstract: A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO2 in the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiO2 in a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 ?m or less.

Abstract: A method for collectively fabricating a reconstituted wafer comprising chips exhibiting connection pads on a front face of the chip, comprises: positioning the chips on an initial adhesive support, front face on the support, vapor deposition at atmospheric pressure and ambient temperature, of an electrically insulating layer on the initial support and the chips, having a mechanical role of holding the chips, transfer of the chips covered with the mineral layer onto a provisional adhesive support, rear face of the chips toward this provisional adhesive support, removal of the initial adhesive support, overlaying the chips onto a support of “chuck” type, front faces of the chips toward this support, removal of the provisional adhesive support, deposition of a resin on the support of “chuck” type to encapsulate the chips, and then polymerization of the resin, removal of the support of “chuck” type, production of an RDL layer active face side.

Abstract: A composite electrode structure and methods of making and using thereof are disclosed. The structure has a metal substrate with a metal oxide layer. The average thickness of the metal oxide layer is less than 150 nm, and comprises at least a first metal and a second metal, wherein the first metal and the second metal are different elements. A plurality of carbon nanotubes is disposed on a first surface of the metal oxide layer. At least a portion of the carbon nanotubes are disposed such that one end of the carbon nanotube is positioned at least 5 nm below the surface of the metal oxide layer.

Abstract: Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Abstract: A method of forming a capacitor comprises forming a first electrode of the capacitor over a substrate. The first electrode includes a bottom conductive plane and a plurality of first vertical conductive structures on the bottom conductive plane. The method also comprises forming an insulating structure over the first electrode. The method further comprises forming a second electrode of the capacitor over the insulating structure. The second electrode includes a top conductive plane and a plurality of second vertical conductive structures under the top conductive plane. The first vertical conductive structures of the plurality of first vertical conductive structures and the second vertical conductive structures of the plurality of second vertical conductive structures are interlaced with each other.

Abstract: A method of making an ion optics component includes providing an electrically isolating substrate and machining away material of the substrate from at least one major surface thereof to form features of a first electrode sub-assembly. The formed features include a first surface for supporting integration of a first electrode body and a second surface for supporting integration of a second electrode body. Subsequent plating and masking steps result in the formation of a first electrode body on the first surface and a second electrode body on the second surface. A bridge is integrally formed in the electrically isolating material, so as to electrically isolate the first electrode body from the second electrode body.

Abstract: One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. A least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material. The contact body to be manufactured at least partially from a sintered material, which is introduced into the breaks in the insulator layers in an unsintered, malleable state.

Abstract: A capacitor for a hydrogen sensor includes a dielectric substrate, a first electrode on the dielectric substrate, a second electrode on the dielectric substrate, and palladium islands on the dielectric substrate and between the first and second electrodes. The palladium islands are electrically isolated from the first and second electrodes and from each other.

Abstract: A method of manufacturing a scratch resistant, touch sensor comprising: (1) applying a non-polymer protective coating solution to a touch sensor; and (2) forming a cross-linked polymer structure by curing the protective coating solution.

Abstract: Disclosed are methods of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A first dielectric layer is formed over the metal foil by physical vapor deposition, and a dielectric precursor layer is formed over the first dielectric layer by chemical solution deposition. The metal foil, first dielectric layer and dielectric precursor layer are prefired at a prefiring temperature in the range of 350 to 650° C. The prefired dielectric precursor layer, the first dielectric layer and the base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C.

Abstract: A method of making a single-side touch-screen device includes providing a substrate and forming a patterned arrangement of micro-wires on the substrate. A patterned dielectric insulator is formed over one or more middle portions of at least some of the micro-wires forming insulated micro-wire portions and exposed micro-wire portions. A plurality of patterned transparent conductors is conformally coated in an array over at least a part of the patterned dielectric insulator, at least a part of the insulated micro-wire portions, and at least a part of the exposed micro-wire portions. The at least a part of the exposed micro-wire portions are electrically connected to at least a portion of the patterned transparent conductors and form an array of electrically connected horizontal electrodes and an array of electrically connected vertical electrodes electrically isolated from the horizontal electrodes.

Abstract: An exemplary embodiment of the present invention provides a passive electrical component comprising a substrate, a first electrically conductive layer, a first dielectric layer, and a second electrically conductive layer. The first electrically conductive layer can be additively deposited on the substrate. The first dielectric layer can be additively deposited on the first conducive layer. The first dielectric layer can comprise a cross-linked polymer. The second electrically conductive layer can be additively deposited on the first dielectric layer. The resonant frequency of the passive electrical component can exceed 1 gigahertz.

Abstract: Disclosed is a composition for ferroelectric thin film formation which is used in the formation of a ferroelectric thin film of one material selected from the group consisting of PLZT, PZT, and PT. The composition for ferroelectric thin film formation is a liquid composition for the formation of a thin film of a mixed composite metal oxide formed of a mixture of a composite metal oxide (A) represented by general formula (1): (PbxLay)(ZrzTi(1-z))O3 [wherein 0.9<x<1.3, 0?y<0.1, and 0?z<0.9 are satisfied] with a composite oxide (B) or a carboxylic acid (B) represented by general formula (2): CnH2n+1COOH [wherein 3?n?7 is satisfied]. The composite oxide (B) contains one or at least two elements selected from the group consisting of P (phosphorus), Si, Ce, and Bi and one or at least two elements selected from the group consisting of Sn, Sm, Nd, and Y (yttrium).

Abstract: Methods and compositions for the deposition of a film on a substrate. In general, the disclosed compositions and methods utilize a precursor containing calcium or strontium.

Abstract: Mutual capacitance touch sensor circuits are used in manufacturing displays, including touch screen displays, such as LED, LCD, plasma, 3D, and other displays used in computing as well as stationary and portable electronic devices. A flexographic printing process may be used, for example, in a roll to roll handling system to print geometric patterns on a substrate, for example, a flexible dielectric substrate. These patterns may then be coated with a conductive material by, for example, an electroless plating process.

Abstract: A method is provided for making a high permittivity dielectric material for use in capacitors. Several high permittivity materials in an organic nonconductive media with enhanced properties and methods for making the same are disclosed. A general method for the formation of thin films of some particular dielectric material is disclosed, wherein organic polymers are utilized to produce low conductivity dielectric coatings. Additionally, a method whereby the formation of certain transition metal salts as salt or oxide matrices is demonstrated at low temperatures utilizing mild reducing agents. Further, a circuit structure and associated method of operation for the recovery and regeneration of the leakage current from the long-term storage capacitors is provided in order to enhance the manufacturing yield and utility performance of such devices.

Abstract: This LaNiO3 thin film-forming composition includes: LaNiO3 precursors; and acetic acid, wherein a ratio of an amount of the LaNiO3 precursors to 100 mass % of an amount of the LaNiO3 thin film-forming composition is in a range of 1 mass % to 20 mass % in terms of oxides, and the composition further includes a stabilizer containing N-methyl formamide in an amount of more than 0 mol to 10 mol or less per 1 mol of the total amount of the LaNiO3 precursors in the composition.

Abstract: Disclosed is a fractional order capacitor comprising a dielectric nanocomposite layer of thickness t, comprising a first side, and a second side opposite the first side, a first electrode layer coupled to the first side of the dielectric nanocomposite layer, a second electrode layer coupled to the second side of the dielectric nanocomposite layer, a complex impedance phase angle dependent on at least a material weight percentage of filler material in a dielectric nanocomposite layer.

Abstract: The invention provides a super capacitor, comprising: a bottom electrode, made of metal that has a sponge-like porous bicontinuous structure wherein the porous bicontinuous structure comprises a plurality of continuous nano pores; a dielectric layer, made of material with high dielectric constant and disposed on the bottom electrode wherein the dielectric layer has a thickness of 0.5˜15 nm; and a top electrode, comprising single layer or multiple layers of conductive layers and having a thickness more than 10 nm.

Abstract: The invention provides a method of marking an item with a naturally-derived or synthetic non-natural polymeric marker molecules, such as a DNA or Peptide marker in conjunction with optional visible or rapid scan reporters for authenticating or tracking, in which the method includes providing an item for marking, and applying a medium including a DNA marker to the item. The invention also provides a method of marking an item with a DNA marker for authenticating or tracking, in which the method includes providing a medium including a DNA marker, and molding the medium including the DNA marker to provide all or part of the item. The DNA marker encodes information unique to the item and/or the model of the item as desired.

Abstract: In a method for manufacturing an electronic component, when conductive paste used to form outer electrodes is applied to a component body, a side surface of the component body is subjected to an affinity-reducing process to reduce an affinity for solvent, and then an end surface of the component body is dipped into the conductive paste. Accordingly, spreading of the conductive paste stops at ridge portions of the component body, and the conductive paste is applied to a large thickness. After that, the end surface of the component body is dipped deeper into the conductive paste. Also in this step, the affinity-reducing process prevents upward spreading of the conductive paste along the side surface.

Abstract: The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 ??m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.