Abstract: A method for manufacturing a printed wiring board includes forming metal posts on a conductor circuit formed on a resin insulating layer, forming the outermost resin layer on the resin insulating layer such that the metal posts is embedded in the outermost resin layer, forming a mask at a dam formation site for a dam structure of the outermost resin layer to surround at least part of a pad group including the metal posts on the outermost resin layer, and reducing a thickness of the outermost resin layer exposed from the mask such that end portions of the metal posts are exposed from the outermost resin layer, that the metal posts form the pad group, and that the outermost resin layer has the dam structure forming part of the outermost resin layer and formed to surround at least part of the pad group including the metal posts.

Abstract: Embodiments provide a polyamide-imide polymer film, which comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and silica particles, wherein the number of aggregates having an average diameter of 150 to 200 nm observed in a cross-section cut in the thickness direction of the polyamide-imide film is less than 0.5/?m2, and a process for preparing the same.

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.

Abstract: The object,—to create a printed circuit board for an implant having improved properties in connection with the electrical contacting via the contact points of the conductor tracks on the printed circuit board,—is achieved, according to the present invention, by means of a device for contacting and/or electrostimulation of living tissue cells or nerves with having a printed circuit board having with at least one contact point for electrical contacting, the printed circuit board encompassing comprising a flexible multilayer system with at least one conductor track. In accordance with the invention, the contact points for the conductor track in the multilayer system are galvanically reinforced. To this end, a galvanically reinforced layer is grown onto the already preprocessed contact point, for example by means of a galvanic process.

Abstract: A MEMS device comprises a first layer (1), a second layer (2) and a third layer (3) sealed together. A mobile structure (7.1, 7.2) in the second layer (2) is defined by openings (8.1, 8.2) in the second layer (2). In the first layer (1), there is at least one first-layer cavity (6.1, 6.2) with an opening towards the mobile structure (7.1, 7.2) of the second layer (2). In the third layer (3), there is at least one third-layer cavity (9) with an opening towards the mobile structure (7.1, 7.2) of the second layer (2). Therefore, the third-layer cavity (9) and the second layer (2) define a space within the MEMS device, A getter layer (10.1, 10.2) arranged on a surface of said space. The getter layer (10.1, 10.2) is preferably arranged on a surface of the second layer (2) and in particular, the getter layer (10.1, 10.2) is arranged on a static part of the second layer (2). Alternatively, the MEMS device has a third-layer cavity (24) with at least two recesses (25.1, 25.2, 25.3) and the getter layer (26.1, 26.

Abstract: Method and system to coat an expandable member of a medical device comprising a support structure to support the expandable member and an applicator positioned with at least one outlet proximate a surface of an expandable member. A drive assembly establishes relative movement between the at least one outlet and the surface of the expandable member to apply fluid on the surface of the expandable member along a coating path. A tracking mechanism maintains a substantially fixed distance between the at least one outlet and the surface of the expandable member during relative movement therebetween by displacing the at least one outlet relative to the expandable member.

Abstract: An array substrate, comprising: a base substrate (100), a pixel array layer (200) located on the base substrate (100) and a grating layer for 3D display that is formed by a plurality of light blocking strips (400) separated at a preset interval. The grating layer is located at a side of the base substrate (100) facing the pixel array layer (200), or is located at a side of the base substrate (100) away from the pixel array layer (200), and the light blocking strips (400) have a property of reflecting light, and is configured to reflect light that is to be emitted through the base substrate (100) to the pixel array layer (200). With the array substrate, the display brightness of the display device can be enhanced.

Abstract: A layer stack for a touch panel is described. The layer stack includes a substrate including a polymer for depositing one or more layers on the substrate; a patterned transparent conductive oxide (TCO) layer provided over the substrate, which comprises areas of TCO and gaps between the areas of TCO; a first dielectric material provided in the gaps of the patterned TCO layer and a dielectric layer being deposited directly on the TCO areas of the TCO layer and directly on the first dielectric material. Further, a touch panel including a layer stack and a method for forming a layer stack for a touch panel is described.

Abstract: Embodiments of the present disclosure digital microfluidic arrays that may be fabricated by a printing method, whereby digital microfluidic electrodes arrays are printed, via a printing method such as inkjet printing, onto a suitable substrate. In some embodiments, a substrate and/or ink is prepared or modified to support the printing of electrode arrays, such as via changes to the surface energy. In some embodiments, porous and/or fibrous substrates are prepared by the addition of a barrier layer, or, for example, by the addition or infiltration of a suitable material to render the surface capable of supporting printed electrodes. Various example embodiments involving hybrid devices formed by the printing of digital microfluidic arrays onto a substrate having a hydrophilic layer are disclosed.

Abstract: Disclosed herein are systems methods for using ink comprising organometallics in a flexographic printing process using engraved anilox rolls to transfer ink to an impression roll that prints a pattern on a substrate. A banded anilox roll with more than one geometry and/or volume of cells may be used in these production systems and methods. The pattern printed may comprise a plurality of lines which are each from 1 micrometer-25 micrometers wide and may be part of an electronics application such as a touch screen sensor or an RF antenna that requires microscopic conductive patterns such as touch screen displays or antennas.

Abstract: A fully additive method for forming multilayer electrical interconnects for printed electronic and/or optoelectronic devices is disclosed. Electrical interconnects are fabricated by directly ink-jet printing a dielectric material with selective interconnection holes, and then ink jet printing conductive patterns and filling the interconnection holes with conductive material to form multilayer interconnects. A method for manufacturing a multilayer printed electronic system utilizing the invention is also disclosed. Other embodiments are described and claimed.

Abstract: A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed.

Abstract: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract: A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.

Abstract: A touch panel has an active area and a non-active area disposed at an outer side of the active area defined therein. The touch panel includes a support member and a conductive layer formed on the support member and including an electrode part in the active area to sense touch and a wiring part disposed in the non-active area to be connected to the electrode part. In the non-active area, the wiring part is disposed on the support member and the electrode part is partially disposed on the wiring part.

Abstract: A circuit structure is disclosed, wherein the circuit structure comprises: a substrate comprising a top surface, a bottom surface and lateral surfaces connecting the top surface and the bottom surface; a plurality of conductive layers disposed over the top surface of the substrate, wherein a dielectric layer is disposed between each two adjacent conductive layers, wherein at least one capacitor is formed by a first portion of the plurality of conductive layers with the dielectric layers therebetween, and wherein at least one first inductor is formed by a second portion of the plurality of conductive layers; and at least one conductive pattern layer disposed over at least one of the lateral surface to form at least one second inductor, wherein a third portion of the plurality of conductive layers electrically connects with said at least one capacitor, said at least one first inductor and said at least one second inductor.

Abstract: A particular device includes a substrate and a spiral inductor coupled to the substrate. The spiral inductor includes a first conductive spiral and a second conductive spiral overlaying the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate that is greater than the first thickness. A portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.

Abstract: A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application.

Abstract: Provided is a foldable display apparatus that is foldable along a folding line. The foldable display apparatus includes a first display panel for displaying a first image, a second display panel for displaying a second image, wherein the second display panel is spaced apart from the first display panel, and a flexible electric connection unit disposed between the first and second display panels and electrically connecting the first and second display panels, the flexible electric connection unit comprising a groove overlapping with the folding line.

Abstract: Disclosed is a white costing layer-formed touch screen panel. The coating layer includes a glass substrate, a white coating layers selectively formed on an edge portion of the glass substrate, a black color coating layer selectively formed on an edge portion, and a transparent conductive layer formed on the glass substrate including the edge portion.

Abstract: Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.

Abstract: A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (240) on the substrate that diffuse molecules of the functional material into the imaged areas and wherein the functional material is in a form of liquid; and applying electro-less copper coating that builds conductive material traces on the imaged areas on the substrate.

Abstract: A method for producing a laminated ceramic electronic component includes the steps of preparing ceramic green sheets, transferring an inner conductor pattern layer and a lead conductor pattern layer formed on a support on the ceramic green sheets to form the inner conductor and the lead conductor on the ceramic green sheets, laminating the ceramic green sheets to cover the inner conductor and the lead conductor, and firing the ceramic laminated product. In the step of forming the inner conductor and the lead conductor, the inner conductor pattern layer is transferred onto the ceramic green sheet a plurality of times so as to overlap each other, thereby forming the inner conductor, and the lead conductor pattern layer is transferred onto the ceramic green sheet, wherein the number of times of the transferring is less than the number of times of the transferring of the inner conductor pattern layer.

Abstract: A printed electronic device and a coating composition for forming a printed electronic device comprising an ink jet-receptive coating on a paper substrate.

Abstract: A touch panel includes a substrate, a first patterned conductive layer, a patterned passivation layer, and a second patterned conductive layer. The first patterned conductive layer is located on the substrate, and the first patterned conductive layer includes a plurality of first sensing pads and a plurality of second sensing pads, wherein a gap is formed between adjacent first and second sensing pads. The patterned passivation layer is located on the first patterned conductive layer, and the patterned passivation layer covers the gap and exposes at least a portion of each first sensing pad and at least a portion of each second sensing pad. The second patterned conductive layer is located on the patterned passivation layer.

Abstract: An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

Abstract: The present invention discloses a touch panel, having a light transmission touch sensing region and a peripheral region adjacent to at least one side of the light transmission touch sensing region. The touch panel includes a substrate, a patterned decoration frame, a decoration layer, and at least one touch sensing element. The patterned decoration frame is disposed on a surface of the substrate and in the peripheral region. The decoration layer is disposed on the patterned decoration frame, and the touch sensing element is disposed in the light transmission touch sensing region.

Abstract: Methods of forming garments having one or more stretchable conductive ink patterns. Described herein are method of making garments (including compression garments) having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.

Abstract: Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape.

Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.

Abstract: A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open and an opposite end has a sidewall that acts as a seed sidewall. A first material is deposited on the seed sidewall. A second material is deposited on the deposited first material. The deposition of the first and second materials is alternated, thereby forming alternating rows of the first and second materials in the interior volume. The mold and seed layer are subsequently selectively removed. In addition, one of the first or second materials is selectively removed, thereby forming a pattern including free-standing rows of the remaining material. The free-standing rows can be utilized as structures in a final product, e.g., an integrated circuit, or can be used as hard mask structures to pattern an underlying substrate. The mold and rows of material can be formed on multiple levels.

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract: An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed over at least a portion of a surface of the substrate and the conductive layer can be disposed over a portion of the surface of the substrate and in between the patterned conductive material. The conductive layer can be disposed over at least a portion of the patterned conductive material. The patterned conductive material can have a resistivity that is lower than a resistivity of the conductive layer.

Abstract: In a method of manufacturing a touch screen panel, first sensing electrodes are formed in an active area of a substrate and are connected in a first direction, and second sensing electrodes are connected in a second direction that intersects the first direction. The method includes forming outside wiring lines for connecting the first and second sensing electrodes to an external driving circuit in units of lines in a non-active area positioned outside an active area of the substrate, forming bridge patterns for electrically connecting the first sensing electrodes in the active area of the substrate, forming insulating layer patterns for insulating the second sensing electrodes and the bridge patterns from each other on the bridge patterns, and forming the first and second sensing electrodes on the substrate where the outside wiring lines, the bridge patterns, and the insulating layer patterns are formed.

Abstract: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.

Abstract: Provided is a conductive structure body comprising: a substrate; a conductive pattern; and a darkened pattern comprising CuOx (0<x?1), and a method for manufacturing the same. The conductive structure body may prevent reflection due to a conductive pattern without affecting the conductivity of the conductive pattern, and may improve the concealment of the conductive pattern by improving the absorbance of the conductive structure body. Therefore, a display panel with improved visibility may be developed using the conductive structure body.

Abstract: A conductive film includes a substrate, a first matrix layer, a first conductive layer, a second matrix layer, and a second conductive layer. The substrate includes a first surface and an oppositely arranged second surface. The first matrix layer is attached to the first surface. The first conductive layer is embedded in the first matrix layer. The second matrix layer is attached to a side of the first matrix layer away from the substrate. The second conductive layer is embedded in the second matrix layer. Due to the capacitor formed between the first conductive layer and the second conductive layer, it just needs to attach the conductive film to a glass panel when the conductive film is adopted to manufacture a touch screen, without bonding two pieces of conductive films. Therefore, the touch screen using the conductive film has a smaller thickness. In addition, a method for manufacturing the conductive film and a touch screen including the conductive film are also provided by the present disclosure.

Abstract: The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 ??m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Abstract: A method of fabricating copper-nickel mesh conductors includes printing a patterned ink seed layer on a substrate. Electroless copper is plated on the printed patterned ink seed layer. A predetermined thickness of electroless nickel is plated on the plated electroless copper.

Abstract: A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a first plated image. The first plated image is electroless plated with a second metal forming a second plated image. The second metal passivates the first metal. The second plated image is bathed in an immersion bath comprising a darkening material.

Abstract: An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a dielectric layer; exposing the photoresist dielectric layer to define a predetermined position of the metal structure; removing the photoresist layer at the predetermined position to undercut an edge of the photoresist layer adjacent to the predetermined position by a horizontal distance of at least 0.1 ?m between a top and a bottom of the edge; forming the metal structure at the predetermined position; and forming at least one top-cover metal layer to cover a top surface and two side surfaces of the metal structure. The present invention can form a cover metal layer covering the top surface and the two side surfaces by one single photomask.

Abstract: The present invention pertains to: a base material for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter, and a holding region for holding a fluid body for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter and exhibiting a proper wettability for the fluid body. The holding region has at least a first linear group including a plurality of first lines extending in parallel with each other along a first direction, and a second linear group including a plurality of second lines extending in parallel with each other along a second direction, and a grid shape is formed by the first linear group and second linear group.

Abstract: A method of manufacturing a submillimetric electroconductive grid coated with an overgrid on a substrate includes: the production of a mask having submillimetric openings by the deposition of a solution of colloidal polymeric nanoparticles that are stabilized and dispersed in a solvent, the polymeric particles having a glass transition temperature Tg and the drying of the masking layer at a temperature below the Tg until the mask, with straight edges, is obtained, the formation of the electroconductive grid by a deposition of electroconductive material, referred to as grid material, a heat treatment of the masking layer with the grid material at a temperature greater than or equal to 0.

Abstract: The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.

Abstract: A system and method for forming a conductive pattern. In the illustrative embodiment, the system includes an applicator for applying a conductive substance onto a surface of a structure and a mechanism for precisely moving the applicator such that the conductive substance is applied in a desired pattern. In an illustrative embodiment, the mechanism includes a robotic arm driven by commands from a computer, and the conductive pattern is designed to manipulate the electromagnetic properties of the structure. The system can be used to apply a conductive pattern directly onto an electromagnetic component, such as a radome, IR dome, multi-mode dome, or flat plate EM window, or to apply a conductive pattern onto a component mold during the component fabrication process. In the latter case, the conductive pattern is an integrated part of the component.

Abstract: Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct copper sections. The uppermost copper section can have a thickness of approximately 1 micrometer or less, which inhibits surface roughening in that uppermost section, and helps to enhance cap adhesion with overlying layers.

Abstract: Product packages and methods of making same, and unpowered conductive circuits for use, for example, as game pieces and methods of making the same. The product package includes a paperboard blank configured to be formed into a box. An electrical circuit is printed with conductive ink pattern onto a surface of the blank. A user may interact with the electrical circuit by, for example, pressing tabs cut into the box. The tabs may include conductive contacts that activate sections of the electrical circuit, thereby producing one or more desirable effects in response to various combinations of tabs being pressed by the user. The electrical circuit may be powered by a battery inserted into a battery compartment of the product package. The blank may include a removable section with a printed electrical circuit, or a portion thereof, that may be separated from the blank and used separately from the product package.