Abstract: A component for an information display device has a transparent substrate having a surface that has a first refractive index. The surface is selectively coated in a pattern comprising a transparent electrically conductive layer disposed at least at a first region of the surface and at a second region of the surface. The first region of the surface is separated from the second region by a third region that is devoid of the transparent conductive layer. The transparent conductive layer has a second refractive index that is higher than the first refractive index. The first, second and third regions are commonly overcoated with a transparent layer comprising non-conductive nanoparticles, the overcoating layer being disposed over the transparent conductive layer at the first and second regions and also disposed over the third region that is devoid of the transparent conductive layer. The refractive index of the layer comprising nanoparticles is higher than the first refractive index.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5, as an amount of boron measured by fluorescence X-ray analysis, where the amount of boron is defined as a value obtained by an expression: (a peak height of B-K?/a peak height of X-K?) x 100000 and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Abstract: An object is to provide a process for producing a glass substrate provided with transparent electrodes, whereby in the case of producing a glass substrate provided with transparent electrodes by a laser patterning method, no scratches are formed on the surface of the glass substrate, the resistance value of the formed transparent electrodes is not increased, and the surface roughness is not increased.

Abstract: A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.

Abstract: An electronic component includes conductive pattern (2) on insulating substrate (1), a metal film formed by a plating method on a surface of conductive pattern (2), and metal oxide layer (3) formed by oxidizing the metal film on the surface of conductive pattern (2). This structure allows forming a thin and uniform insulating film on conductive pattern (2), so that the highly reliable electric component is obtainable although its conductive pattern (2) has a high aspect ratio.

Abstract: An electrical component includes a base. The base is made of a sintered ceramic, and at least one electrode that is inside the sintered ceramic. The at least one electrode has a surface that contains metal. The surface is adjacent to the sintered ceramic. In the component, a redox potential of the metal is less than or equal to a redox potential of copper.

Abstract: The present invention relates to a printing formulation comprising monodisperse particles and particles, wherein the particles have a largest dimension which is at least 6 times larger than the largest dimension of the monodisperse particles, as well as to the use of these formulations for printing and to substances printed with these formulations.

Abstract: The invention relates to a flexible decorative laminate comprising a core obtainable by impregnating a carrier with a thermosetting resin associated with a decorative layer and, if necessary, provided with a protective coating, wherein said laminate is characterised in that the carrier comprises cellulose and glass fibres which are bound to each other by a plasticiser.

Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method.

Abstract: Disclosed herein is a glass sheet substrate and process for making the same with a first wear surface, an obverse, second surface including a thermoset image receiving coating having a complete, unitary sublimated ink image that is viewable with minimal loss of resolution and clarity from the first side through the thickness of the glass sheet substrate.

Abstract: In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The ceramic base layer and the ceramic auxiliary layers are made of ferrite materials having substantially the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers is less than the linear expansion coefficient of the ceramic base layer.

Abstract: A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient less than that of the inner layer portion. At least one of the surface portions covers peripheries of main-surface conductive films arranged on a main surface of an inner portion so as to leave central portions of the main-surface conductive films exposed, so that the main-surface conductive films function as via conductors, thereby eliminating the need to provide a via conductor in the surface portions.

Abstract: A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first ceramic thin plate and the first pre-mold plate, and co-firing the first ceramic thin plate and the first pre-mold plate to commonly form the ceramic circuit board.

Abstract: Multi-layered cellular metallic glass structures and methods of preparing the same are provided. In one embodiment, the cellular metallic glass structure includes at least one patterned metallic glass sheet and at least one additional sheet. The at least one patterned metallic glass sheet may include multiple sheets connected together to form a group of sheets, and the structure may include a group of sheets sandwiched between two outer sheets. The patterned metallic glass sheets may be patterned by thermoplastically forming two- and/or three-dimensional patterns in the metallic glass sheets.

Abstract: Clear or tinted window panes of glass or plastic having a pattern or dots, vertical lines, horizontal lines or a combination of vertical and horizontal lines in a regular pattern on a surface of the pane, the pattern being visible to the avian eye to prevent birds from striking or colliding with the window pane and having optical characteristics of ultraviolet reflection separated by ultraviolet absorption.

Abstract: Provided are a process for producing a highly reliable ceramic sheet with stable quality by reducing voids, and a ceramic substrate using the sheet. A highly reliable ceramic sheet with stable quality is obtained by using hydroxypropylmethyl cellulose as an organic binder, kneading a powder material, preferably, with a twin screw extruder, and then forming a sheet by means of a single screw extruder equipped with a sheet die, and the sheet is suitably used for a ceramic substrate and a ceramic circuit board.

Abstract: A ceramic substrate composition is provided which can be co-fired with a low-melting metal and exhibits excellent dielectric characteristics at high frequencies, particularly tens of gigahertz. The ceramic substrate composition mainly contains a glass represented by aB2O3-bRe2O3-cZnO, wherein the molar ratios (a, b, and c) fall within a region defined in a ternary composition diagram by Point A (0.4, 0.595, 0.005), Point B (0.4, 0.25, 0.35), Point C (0.52, 0.01, 0.47), Point D (0.9, 0.005, 0.095), and Point E (0.9, 0.09, 0.01).

Abstract: A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer composed of a first glass material, and a second glass sublayer formed on the first glass sublayer and composed of a second glass material that is different from the second glass material defining the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.

Abstract: A laminated heated glazing including at least two superposed transparent and mechanically strong substrate panes with interposition of an interlayer made of a transparent plastic between two adjacent panes. The glazing further includes, in its thickness or on the surface, at least one thin transparent conductive film that extends over at least part of the glazing, the film or films being heated for deicing and/or demisting by Joule effect, at least one film having flow separation lines formed by etching to guide current from one band to the other. The width of the flow separation lines is small enough for them to be invisible to the naked eye in the laminated heated glazing.

Abstract: A method for treating the surface of aluminum components or components comprising aluminum includes anodizing the surface. Anodizing includes introducing at least one pigmenting substance, particularly fully pigmenting substance, into depressions or pores open toward the surface of a comb or pore structure of the surface created by the anodizing process, and/or introducing oxidizable substances into depressions or pores open toward the surface of a comb or pore structure of the surface created by the anodizing process and oxidizing these substances. The method further includes applying a ceramic thin-film coating or siliceous sol-gel coating onto the surface. The ceramic thin-film coating or the sol-gel coating comprises a pigment particularly serving refraction purposes.

Abstract: A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

Abstract: A glass-ceramic plate, and production methods and apparatuses in relation to the plate. The plate is designed for example to equip a cooktop, and includes, on at least one of its faces, a differentiated surface finish formed in the body of the bare glass-ceramic plate.

Abstract: A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.

Abstract: Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point metal portion 18 having a melting point higher than Au and Ag is provided between an Au wiring portion 15 and an Ag wiring portion 17. The higher the melting point of the first high melting point metal portion 18, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portion 19 functions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion 17. By providing the first high melting point metal portion 18 between the Au wiring portion 15 and the Ag wiring portion 17, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.

Abstract: A laser deposition system (10) for depositing a target material onto a substrate includes a target (12), a laser emitter (13), and a substrate (20). The laser emitter is configured to emit a laser beam (130). The target has a first surface (121), with the laser beam shining onto the first surface. The laser beam generates a vaporized target material (120) from the first surface of the target. The substrate is disposed between the laser emitter and the target so that the laser beam first transmits through the substrate and then projects onto the first surface of the target. The vaporized target material is cooled and deposited on the substrate. A method for depositing a target material onto a substrate and a housing are also provided.

Abstract: A ceramic green sheet of the invention contains an inorganic powder and an organic resin and is characterized in that the inorganic powder contains 72 to 98% by weight of aluminum oxide, 1 to 12% by weight of copper oxide, 0.1 to 3% by weight of titanium oxide, and 0.25 to 10% by weight of silicon oxide based on 100% by weight of the total weight of the inorganic powder.

Abstract: An image-bearing article comprising a film layer bearing an image and a polymeric interlayer sheet comprising an ionomer copolymer of an alpha-olefin and about 15 to about 30 wt % of an alpha, beta-ethylenically unsaturated carboxylic acid based on the total weight of the ionomer copolymer, wherein about 5 to about 90 percent of the carboxylic acids are neutralized with one or more metal ions. In addition, a process of preparing an image-bearing article comprising an image-bearing film layer and an ionomer interlayer sheet: (a) providing a film layer; (b) printing an image on the film layer so as to produce an image-bearing film layer containing an image-bearing side; and (c) laminating an ionomer interlayer sheet to the image-bearing side of the image-bearing film layer. Preferably the film layer is coated on the image-bearing side and over the image with an adhesion promoter.

Abstract: In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion.

Abstract: A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and Al2O3. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: A color toner for electro printing, whereby a ceramic color print excellent in adhesion can be printed on a glass plate surface by a simple process without using a screen plate. The color toner for electro printing comprises toner matrix particles containing from 10 to 50 parts by mass of fine inorganic pigment particles, from 5 to 40 parts by mass of a heat decomposable binder resin having a disappearance temperature T100 of from 350 to 575° C., and from 40 to 85 parts by mass of glass frit, per 100 parts by mass of the total solid content of the toner matrix particles.

Abstract: A metallic glass laminate of the present invention is characterized in that a metallic glass layer of amorphous phase is formed on the substrate surface, and there is no continuous pore (pinhole) through the metallic glass layer. The metallic glass laminate is preferably obtained by solidification and lamination of at least part of the metallic glass powder in the molten state or in the supercooled liquid state on the substrate surface. Because of the dense metallic glass layer of homogenous amorphous phase, the functionalities of metallic glass such as corrosion resistance and wear resistance can be satisfactorily provided. A thick and a large-area metallic glass layer can be formed. The metallic glass layer can also be formed into various shapes within the supercooled liquid temperature range. In addition, a metallic glass bulk can be obtained by removing the substrate.

Abstract: Ultrasonic pulser-receiver circuitry, for use with an ultrasonic transducer, the circuitry comprising a circuit board; ultrasonic pulser circuitry supported by the circuit board and configured to be coupled to an ultrasonic transducer and to cause the ultrasonic transducer to emit an ultrasonic output pulse; receiver circuitry supported by the circuit board, coupled to the pulser circuitry, including protection circuitry configured to protect against the ultrasonic pulse and including amplifier circuitry configured to amplify an echo, received back by the transducer, of the output pulse; and a connector configured to couple the ultrasonic transducer directly to the circuit board, to the pulser circuitry and receiver circuitry, wherein impedance mismatches that would result if the transducer was coupled to the circuit board via a cable can be avoided.

Abstract: The invention presents a strain sensor includes a substrate, a crystallized glass laminated on the substrate, a strain sensitive resistor laminated on the crystallized glass, in which the crystallized glass is formed by baking a plurality of types of crystallized glass powder having different thermomechanical constants. As a result, the fluctuation of sensor characteristic is decreased, and the cost is lowered.

Abstract: An image-bearing article comprising a rigid sheet bearing an image and a polymeric interlayer sheet comprising an ionomer copolymer of an alpha-olefin and about 15 to about 30 wt % of an alpha, beta-ethylenically unsaturated carboxylic acid based on the total weight of the ionomer copolymer, wherein about 5 to about 90 percent of the carboxylic acids are neutralized with a metal ion. In addition, a process of preparing an image-bearing article comprising an image-bearing rigid sheet and an ionomer interlayer sheet: (a) providing a rigid sheet; (b) printing an image on the rigid sheet so as to produce an image-bearing rigid sheet containing an image-bearing side; and (c) laminating an ionomer interlayer sheet to the image-bearing side of the image-bearing rigid sheet. Preferably the rigid sheet is coated on the image-bearing side and over the image with an adhesion promoter.

Abstract: In order to avoid haloing when burning in a decoration on a glass ceramic substrate, the invention provides a method for producing a decorated glass ceramic substrate, in which a glass substrate is produced or provided, a layer containing silicon oxide is deposited on the substrate, decorative ink is applied on the layer containing silicon oxide and the decorative ink is burned in, wherein the layer containing silicon oxide is flame-pyrolytically deposited by sweeping over at least one region of the surface of a substrate with a flame and hydrolyzing a silicon compound added to the flame.

Abstract: A metallized film and a process for making the film are disclosed. In general, the metallized film includes a polymeric film layer that is coated with a polyester coating composition. A metal layer is then formed on top of the polyester coating. The polyester coating acts as a tie layer between the metal layer and the underlying film. The polyester film composition may be formed from, in one embodiment, isophthalic acid, a sulfomonomer, and 2-methyl 1,3-propane diol. The above diol has been found to improve adhesion between the metal layer and the polymeric film layer.

Abstract: A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent, wherein the organic solvent contains at least one solvent selected from an alkylene glycol diacetate and an alkylene glycol dipropionate. A multilayer electronic component is obtained by firing at high temperature an unfired laminate prepared by alternately stacking ceramic green sheets and internal electrode paste layers in which each of the internal electrode paste layers is formed by the above conductive paste. The conductive paste has appropriate viscosity characteristics and long-term stability, which allows manufacturing highly reliable multilayer electronic components having excellent electrical characteristics, without causing sheet attack.

Abstract: A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one material selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and possibly Al2O3. The content of the borosilicate glass powder is about 3 percent by weight or more. The borosilicate glass powder further contains at least one additive selected from the group consisting of CaO, BaO and SrO.

Abstract: Provided is a ceramic powder for a green sheet that gives a low-temperature fired ceramic substrate that can be fired at a temperature of 900° C. or lower and has excellent dielectric properties in the higher frequency bands such as microwave and millimeter-wave bands, has a low hygroscopicity, and has minor warping and creasing even in the case of co-firing with a silver-based conductor paste, the ceramic powder for a green sheet including a glass powder and an alumina powder, in which the glass powder contains 35 to 39% by weight of SiO2, 9 to 17% by weight of Al2O3, 21 to 40% by weight of B2O3, 10 to 20% by weight of R?O, wherein R? is one or more kinds selected from the group consisting of Mg, Ca and Ba, 0.2 to 2% by weight of Li2O, and 0.5 to 2% by weight of MO2, wherein M is one or more kinds selected from the group consisting of Ti and Zr, so that the total is 100% by weight.

Abstract: A method for printing a data-carrying mark on a portion of an unfinished ceramic structure, such as the green body Of a ceramic honeycomb structure; is disclosed that is capable of producing a mark that maintains legibility even after being fired to temperatures above 1100° C. or higher, or even 1300° C. or higher. The data-carrying mark is formed from a deposit of colorant solids overlying a portion of the unfinished ceramic structure. The volume of colorant solids per unit area of marked wall portion that is at least twice as much as that required to obtain maximum pre-fired visual contrast between marked and unmarked portions of the structure (i.e., prior to firing). The colorant solids may include one or more of cobalt, nickel, iron, chromium, copper, manganese and titanium, either in metallic or oxide form, and are preferably deposited in particulate form via a high temperature ink composition that prints the data-carrying mark by way of an ink jet print head.

Abstract: Techniques for semiconductor processing are provided. In one aspect, a method for patterning one or more features in a semiconductor device comprises the following step. At least one critical dimension of the one or more features is reduced during etching of the antireflective material. A lithographic structure is also provided.

Abstract: A ceramic substrate composition is provided which can be co-fired with a low-melting metal and exhibits excellent dielectric characteristics at high frequencies, particularly tens of gigahertz. The ceramic substrate composition mainly contains a glass represented by aB2O3-bRe2O3-cZnO, wherein the molar ratios (a, b, and c) fall within a region defined in a ternary composition diagram by Point A (0.4, 0.595, 0.005), Point B (0.4, 0.25, 0.35), Point C (0.52, 0.01, 0.47), Point D (0.9, 0.005, 0.095), and Point E (0.9, 0.09, 0.01).

Abstract: A ceramic multilayer substrate exhibiting reduced pealing and breakage of an internal conductor disposed between a ceramic layer serving as a base member and a ceramic layer for restricting shrinkage includes a first ceramic layer 11, a second ceramic layer 12 laminated so as to come into contact with a principal surface of the first ceramic layer 11, and an internal conductor 13 disposed between the first ceramic layer 11 and the second ceramic layer 12, a phosphorus component layer 16a is disposed in the first ceramic layer 11 with a concentration gradient in which the concentration decreases in a direction away from the internal conductor 13.

Abstract: The invention concerns a web comprising an intimate mixture of mixed slivers of long reinforcing staple fibres (14) obtained by stretch-breaking and long thermoplastic matrix fibres (15), those different fibres being parallel in the mixture.

Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.

Abstract: The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite dielectric film, the composite dielectric film having a k value of about 1.5 or lower, the composite dielectric film having a Young's modulus of elasticity of about 25 GigaPascals or higher. The present invention further discloses a structure including: a substrate; a porous diamond-like carbon (DLC) film located over the substrate; an opening located in the porous DLC film; and a conductor located in the opening.

Abstract: The process for producing a metallized ceramic substrate of the present invention comprises a step (A) of preparing a raw material substrate comprising a ceramic substrate which may have on its surface a conductive layer or a conductor paste layer, a step (B) of preparing a metallized ceramic substrate precursor, said step (B) comprising a step of forming a ceramic paste layer on the raw material substrate and a step of forming a conductive paste layer on the ceramic paste layer, and a step (C) of firing the metallized ceramic substrate precursor obtained in the previous step. In the step (B), formation of a ceramic paste layer and formation of a conductive paste layer may be alternately repeated plural times. According to the present invention, running or spreading of the conductive paste is prevented, and a metallized ceramic substrate which has a high degree of freedom of wiring design and high reliability and has a fine metallization pattern can be produced.

Abstract: A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed.

Abstract: A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.